2016 journal article
Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers
Journal of Electronic Materials, 45(11), 5877–5884.
Contributors: K. Jagannadham n
author keywords: Adhesion; porous polymer; modulus; thermal conductivity
UN Sustainable Development Goal Categories
6. Clean Water and Sanitation
(Web of Science)
Source: ORCID
Added: January 8, 2020