Characterization of Novel Materials for Thin Flexible Power Substrates for High-Density Power Electronics

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems : August 29-September 1, 2017, San Francisco, California, USA. Presented at the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA.