2022 journal article

Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning

IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

By: T. Nigussie*, J. Schabel *, S. Lipa n, L. McIlrath*, R. Patti* & P. Franzon 

author keywords: Split-manufacturing; partitioning; design obfuscation; hybrid bonding; 3-D integrated circuit (3DIC)
Source: ORCID
Added: August 15, 2022