2018 conference paper

Performance optimization of A 1.2kV SiC high density half bridge power module in 3D package

Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1266–1271.

By: X. Zhao, B. Gao, L. Zhang, D. Hopkins & A. Huang

Source: NC State University Libraries
Added: August 6, 2018