2022 article

Bias Temperature Instability on SiC n- and p-MOSFETs for High Temperature CMOS Applications

2022 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS).

By: E. Ashik n, S. Isukapati*, H. Zhang*, T. Liu*, U. Gupta*, A. Morgan*, V. Misra n, W. Sung* ...

author keywords: CMOS; reliability; field-effect mobility; threshold voltage; transconductance
UN Sustainable Development Goal Categories
Source: Web Of Science
Added: February 27, 2023

The circuit functionalities of Complementary Metal-Oxide-Semiconductor (CMOS) devices on 4H-SiC for digital and analog circuit applications beyond 200°C have been extensively studied, however, the reliability of the devices on SiC needs to be demonstrated due to the traps at/near the dielectric interface. In this report, the reliability of n- and p- Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) has been studied on three different gate oxide conditions – thick thermally grown, ultrathin thermal + thick CVD oxide and ultrathin thermal + thin CVD oxide in terms of their bias temperature instability (BTI) measurement. The MOSFETs were stressed at various constant bias voltages at 150°C and up to 105s. The threshold voltage shift due to positive bias on n-MOSFET is <0.5V after 105s at +25Vwhile p-MOSFET shows a larger shift of -1.9V shift after 105s at -25V and 150°C for ultrathin + thick CVD oxide. The report also establishes improvement in reliability of p-MOSFETs with ultrathin + CVD oxides over thermally grown oxides.