2004 journal article

Chip-package co-implementation of a triple DES processor

IEEE Transactions on Advanced Packaging, 27(1), 194–202.

By: T. Schaffer, A. Glaser & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

1997 journal article

The delay Vernier pattern generation technique

IEEE Journal of Solid-State Circuits, 32(4), 551–562.

By: G. Moyer, M. Clements, W. Liu, T. Schaffer & R. Cavin

Source: NC State University Libraries
Added: August 6, 2018