Works (2)

Updated: July 5th, 2023 16:04

2004 article

Chip-package co-implementation of a triple DES processor

Schaffer, T., Glaser, A., & Franzon, P. D. (2004, February). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 194–202.

By: T. Schaffer n, A. Glaser n & P. Franzon n

co-author countries: United States of America 🇺🇸
author keywords: CMOS; DES processor; IC; I/O; MCM package
Sources: Web Of Science, ORCID
Added: August 6, 2018

1997 journal article

The delay vernier pattern generation technique


By: G. Moyer n, M. Clements n, W. Liu, T. Schaffer n & R. Cavin*

co-author countries: United States of America 🇺🇸
author keywords: delay circuits; delay-locked loops; delay verniers; signal generators; wave pipelining
Source: Web Of Science
Added: August 6, 2018

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