1997 article

Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints

Hacke, P. L., Sprecher, A. F., & Conrad, H. (1997, July). JOURNAL OF ELECTRONIC MATERIALS, Vol. 26, pp. 774–782.

By: P. Hacke n, A. Sprecher n & H. Conrad n

author keywords: coarsening; cracked area; phase size; plastic deformation kinetics; stress exponent; stress relaxation
UN Sustainable Development Goal Categories
Source: Web Of Science
Added: August 6, 2018

Citation Index includes data from a number of different sources. If you have questions about the sources of data in the Citation Index or need a set of data which is free to re-distribute, please contact us.

Certain data included herein are derived from the Web of Science© and InCites© (2024) of Clarivate Analytics. All rights reserved. You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.