1997 article

Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints

Hacke, P. L., Sprecher, A. F., & Conrad, H. (1997, July). JOURNAL OF ELECTRONIC MATERIALS, Vol. 26, pp. 774–782.

By: P. Hacke n, A. Sprecher n & H. Conrad n

author keywords: coarsening; cracked area; phase size; plastic deformation kinetics; stress exponent; stress relaxation
Source: Web Of Science
Added: August 6, 2018

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