Works (3)
2011 article
Comparing Through-Silicon-Via (TSV) Void/Pinhole Defect Self-Test Methods
Lou, Y., Yan, Z., Zhang, F., & Franzon, P. D. (2011, November 2). Journal of Electronic Testing, Vol. 28, pp. 27–38.
2010 article
Fabrication of Nanoshell Arrays Using Directed Assembly of Nanospheres
Lou, Y., Lunardi, L. M., & Muth, J. F. (2010, March 1). IEEE Sensors Journal, Vol. 10, pp. 617–620.
Contributors: n, L. Lunardi n & J. Muth n
2009 article
Patterned Hybrid Nanohole Array Surfaces for Cell Adhesion and Migration
Westcott, N. P., Lou, Y., Muth, J. F., & Yousaf, M. N. (2009, September 1). Langmuir.