2012 journal article

Comparing Through-Silicon-Via (TSV) Void/Pinhole Defect Self-Test Methods

JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 28(1), 27–38.

By: Y. Lou n, Z. Yan n, F. Zhang n & P. Franzon n

author keywords: TSV; 3D stacking yield; On-chip capacitor bridge; Test-before-stacking
Sources: Web Of Science, ORCID
Added: August 6, 2018

2010 journal article

Fabrication of Nanoshell Arrays Using Directed Assembly of Nanospheres

IEEE SENSORS JOURNAL, 10(3), 617–620.

By: Y. Lou n, L. Lunardi n & J. Muth n

Contributors: Y. Lou n, L. Lunardi n & J. Muth n

author keywords: Hexagonal nanoshell arrays; nanosphere lithography; surface plasmon enhanced transmission
Sources: Web Of Science, ORCID
Added: August 6, 2018

2009 journal article

Patterned Hybrid Nanohole Array Surfaces for Cell Adhesion and Migration

LANGMUIR, 25(19), 11236–11238.

By: N. Westcott*, Y. Lou n, J. Muth n & M. Yousaf*

MeSH headings : 3T3 Cells; Animals; Cell Adhesion; Cell Movement; Fibroblasts / cytology; Glass / chemistry; Gold / chemistry; Ligands; Mice; Microscopy; Microscopy, Electron, Scanning; Nanostructures / chemistry; Nanotechnology; Stress Fibers / metabolism; Surface Properties; Time Factors
Source: Web Of Science
Added: August 6, 2018

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