Yi Lou

Works (3)

Updated: April 11th, 2023 10:13
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2012 journal article

Comparing Through-Silicon-Via (TSV) Void/Pinhole Defect Self-Test Methods

JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 28(1), 27–38.

By: Y. Lou, Z. Yan n, F. Zhang & P. Franzon 

author keywords: TSV; 3D stacking yield; On-chip capacitor bridge; Test-before-stacking
Sources: Web Of Science, ORCID
Added: August 6, 2018

2010 journal article

Fabrication of Nanoshell Arrays Using Directed Assembly of Nanospheres

IEEE SENSORS JOURNAL, 10(3), 617–620.

By: Y. Lou, L. Lunardi  & J. Muth

author keywords: Hexagonal nanoshell arrays; nanosphere lithography; surface plasmon enhanced transmission
Sources: Web Of Science, ORCID
Added: August 6, 2018

2009 journal article

Patterned Hybrid Nanohole Array Surfaces for Cell Adhesion and Migration

LANGMUIR, 25(19), 11236–11238.

By: N. Westcott*, Y. Lou, J. Muth & M. Yousaf*

Source: Web Of Science
Added: August 6, 2018