2011 journal article
Comparing Through-Silicon-Via (TSV) Void/Pinhole Defect Self-Test Methods
JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 28(1), 27–38.
2010 journal article
Fabrication of Nanoshell Arrays Using Directed Assembly of Nanospheres
IEEE SENSORS JOURNAL, 10(3), 617–620.
Contributors: L. Lunardi n & J. Muth n n,
2009 journal article
Patterned Hybrid Nanohole Array Surfaces for Cell Adhesion and Migration
LANGMUIR, 25(19), 11236–11238.
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