Robert R. Reeber

Modeling of residual stresses for thermally strained GaN/Al2O3 heterostructures

JOURNAL OF CRYSTAL GROWTH, 266(4), 415–422.

Fourth-order elastic constants of magnesium oxide

Physica Status Solidi. B, Basic Solid State Physics, 228(3), 837–845.

High temperature elastic constant prediction of some group III-nitrides

MRS Internet Journal of Nitride Semiconductor Research, 6(3), 1–5.

Thermal expansion and elastic properties of InN

APPLIED PHYSICS LETTERS, 79(11), 1602–1604.

Lattice parameters and thermal expansion of GaN

JOURNAL OF MATERIALS RESEARCH, 15(1), 40–44.

Mode Gruneisen parameters and negative thermal expansion of cubic ZrW2O8 and ZrMo2O8

APPLIED PHYSICS LETTERS, 76(16), 2203–2204.

The perfect crystal, thermal vacancies and the thermal expansion coefficient of aluminium

Philosophical Magazine. A, Physics of Condensed Matter, Defects and Mechanical Properties, 80(7), 1629–1643.

Thermal residual stress modeling in AlN and GaN multilayer samples

MRS Internet Journal of Nitride Semiconductor Research, 4S1(G3.18).

Thermophysical properties of alpha-tungsten carbide

Journal of the American Ceramic Society, 82(1), 129–135.

Finite element modeling of thermal residual stress in Tungsten/Tungsten-carbide composites

Ceramic Engineering and Science Proceedings, 19(4), 177–184.

The role of defects on thermophysical properties: thermal expansion of V, Nh, Ta, Mo and W

[Review of ]. MATERIALS SCIENCE & ENGINEERING R-REPORTS, 23(3), 101–137.

Thermal expansion of GaN and AlN

Nitride semiconductors: Symposium held December 1-5, 1997, Boston, Massachusetts, U.S.A. (Materials Research Society Symposium proceedings; v. 482)., 863–868. Warrendale, Pa.: Materials Research Society, 1998.

Surface modification of boron carbide to form pockets of solid lubricant

Washington, DC: U.S. Patent and Trademark Office.

Gradient lens fabrication

Reeber, R. R., Chu, W. K., & Bedair, S. M. Washington, DC: U.S. Patent and Trademark Office.