@inproceedings{priyadarshi_choudhary_dwiel_upreti_rotenberg_davis_franzon_2013, title={Hetero(2) 3d integration: A scheme for optimizing efficiency/cost of chip multiprocessors}, DOI={10.1109/isqed.2013.6523582}, abstractNote={Timing the transition of a processor design to a new technology poses a provocative tradeoff. On the one hand, transitioning as early as possible offers a significant competitive advantage, by bringing improved designs to market early. On the other hand, an aggressive strategy may prove to be unprofitable, due to the low manufacturing yield of a technology that has not had time to mature. We propose exploiting two complementary forms of heterogeneity to profitably exploit an immature technology for Chip Multiprocessors (CMP). First, 3D integration facilitates a technology alloy. The CMP is split across two dies, one fabricated in the old technology and the other in the new technology. The alloy derives benefit from the new technology while limiting cost exposure. Second, to compensate for lower efficiency of old-technology cores, we exploit application and microarchitectural heterogeneity: applications which gain less from technology scaling are scheduled on old-technology cores, moreover, these cores are retuned to optimize this class of application. For a defect density ratio of 200 between 45nm and 65nm, Hetero2 3D gives 3.6× and 1.5× higher efficiency/cost compared to 2D and 3D homogeneous implementations, respectively, with only 6.5% degradation in efficiency. We also present a sensitivity analysis by sweeping the defect density ratio. The analysis reveals the defect density break-even points, where homogeneous 2D and 3D designs in 45nm achieve the same efficiency/cost as Hetero2 3D, marking significant points in the maturing of the technology.}, booktitle={Proceedings of the fourteenth international symposium on quality electronic design (ISQED 2013)}, author={Priyadarshi, S. and Choudhary, N. and Dwiel, B. and Upreti, A. and Rotenberg, E. and Davis, R. and Franzon, P.}, year={2013}, pages={1–7} }
 @article{choudhary_wadhavkar_shah_mayukh_gandhi_dwiel_navada_najaf-abadi_rotenberg_2012, title={FABSCALAR: AUTOMATING SUPERSCALAR CORE DESIGN}, volume={32}, ISSN={["1937-4143"]}, DOI={10.1109/mm.2012.23}, abstractNote={Providing multiple superscalar core types on a chip, each tailored to different classes of instruction-level behavior, is an exciting direction for increasing processor performance and energy efficiency. Unfortunately, processor design and verification effort increases with each additional core type, limiting the microarchitectural diversity that can be practically implemented. FabScalar aims to automate superscalar core design, opening up processor design to microarchitectural diversity and its many opportunities.}, number={3}, journal={IEEE MICRO}, author={Choudhary, Niket K. and Wadhavkar, Salil V. and Shah, Tanmay A. and Mayukh, Hiran and Gandhi, Jayneel and Dwiel, Brandon H. and Navada, Sandeep and Najaf-Abadi, Hashem H. and Rotenberg, Eric}, year={2012}, pages={48–59} }
 @article{choudhary_wadhavkar_shah_mayukh_gandhi_dwiel_navada_najaf-abadi_rotenberg_2011, title={FabScalar: Composing synthesizable RTL designs of arbitrary cores within a canonical superscalar template}, DOI={10.1145/2000064.2000067}, abstractNote={A growing body of work has compiled a strong case for the single-ISA heterogeneous multi-core paradigm. A single-ISA heterogeneous multi-core provides multiple, differently-designed superscalar core types that can streamline the execution of diverse programs and program phases. No prior research has addressed the “Achilles' heel” of this paradigm: design and verification effort is multiplied by the number of different core types. This work frames superscalar processors in a canonical form, so that it becomes feasible to quickly design many cores that differ in the three major superscalar dimensions: superscalar width, pipeline depth, and sizes of structures for extracting instruction-level parallelism (ILP). From this idea, we develop a toolset, called FabScalar, for automatically composing the synthesizable register-transfer-level (RTL) designs of arbitrary cores within a canonical superscalar template. The template defines canonical pipeline stages and interfaces among them. A Canonical Pipeline Stage Library (CPSL) provides many implementations of each canonical pipeline stage, that differ in their superscalar width and depth of sub-pipelining. An RTL generation tool uses the template and CPSL to automatically generate an overall core of desired configuration. Validation experiments are performed along three fronts to evaluate the quality of RTL designs generated by FabScalar: functional and performance (instructions-per-cycle (IPC)) validation, timing validation (cycle time), and confirmation of suitability for standard ASIC flows. With FabScalar, a chip with many different superscalar core types is conceivable.}, journal={ISCA 2011: Proceedings of the 38th annual international symposium on computer architecture}, author={Choudhary, N. K. and Wadhavkar, S. V. and Shah, T. A. and Mayukh, H. and Gandhi, J. and Dwiel, B. H. and Navada, S. and Najaf-abadi, H. H. and Rotenberg, E.}, year={2011}, pages={11–22} }