@article{hardin_shih_lemaster_2004, title={Diamond wire machining of wood}, volume={54}, number={11}, journal={Forest Products Journal}, author={Hardin, C. W. and Shih, A. J. and Lemaster, R. L.}, year={2004}, pages={50–55} }
 @article{hardin_qu_shih_2004, title={Fixed abrasive diamond wire saw slicing of single-crystal silicon carbide wafers}, volume={19}, ISSN={["1532-2475"]}, DOI={10.1081/AMP-120029960}, abstractNote={Abstract This article investigates the slicing of single-crystal silicon carbide (SiC) with a fixed abrasive diamond wire. A spool-to-spool rocking motion diamond wire saw machine using a 0.22 mm nominal diameter diamond wire with 20 µm average size diamond grit was used. The effect of wire downfeed speed on wafer surface roughness and subsurface damage was first investigated. The surface marks generated by loose diamond grit and stagnation of the wire during the change of the wire-cutting direction were studied. The use of scanning acoustic microscopy (SAcM) as a nondestructive evaluation method to identify the subsurface damage was explored. Effects of using a new diamond wire on cutting forces and surface roughness were also investigated. Scanning electron microscopy has been used to examine the machined surfaces and wire wear. This study demonstrated the feasibility of fixed abrasive diamond wire cutting of SiC wafers and the usage of a SAcM to examine the subsurface damage.}, number={2}, journal={MATERIALS AND MANUFACTURING PROCESSES}, author={Hardin, CW and Qu, J and Shih, AJ}, year={2004}, pages={355–367} }
 @article{clark_shih_hardin_lemaster_mcspadden_2003, title={Fixed abrasive diamond wire machining - part I: process monitoring and wire tension force}, volume={43}, ISSN={["0890-6955"]}, DOI={10.1016/S0890-6955(02)00215-8}, abstractNote={The process monitoring and mechanics of fixed abrasive diamond wire saw machining are investigated in this study. New techniques to affix diamond particles to a steel wire core have advanced to make this process feasible for the machining of ceramics, wood, and foam materials. Developments in fixed abrasive diamond wire machining are first reviewed. Advantages of using fixed abrasive diamond wire machining are then introduced. The process monitoring and signal processing techniques for measuring the cutting forces, wire speed, down feed rate, and wire bow angle in diamond wire saw machining are developed. The application of a capacitance sensor to measure the wire bow and a procedure to convert the wire bow to vertical cutting force in a rocking motion wire saw machine are developed. The tension force of the wire during cutting is also derived and discussed.}, number={5}, journal={INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE}, author={Clark, WI and Shih, AJ and Hardin, CW and Lemaster, RL and McSpadden, SB}, year={2003}, month={Apr}, pages={523–532} }