Works (6)
Updated: July 5th, 2023 15:58
2009 journal article
A 32-Gb/s On-Chip Bus With Driver Pre-Emphasis Signaling
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(9), 1267–1274.
co-author countries:
United States of America 🇺🇸
author keywords: Interconnects; low power; on-chip; pre-emphasis
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018
2007 article
Fully integrated AC coupled interconnect using buried bumps
Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007, May). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 30, pp. 191–199.
co-author countries:
United States of America 🇺🇸
author keywords: AC coupled interconnect (ACCI); buried bumps; capacitive coupling; MCM; pulse signaling; noncontacting I/O; chip and package co-design
citeseerx.ist.psu.edu (repository)
Sources: Web Of Science, ORCID
Added: August 6, 2018
2007 journal article
Voltage-mode driver preemphasis technique for on-chip global buses
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 15(2), 231–236.
co-author countries:
United States of America 🇺🇸
author keywords: global buses; low-power; on-chip; preemphasis; repeater insertion
Sources: Web Of Science, ORCID
Added: August 6, 2018
2006 journal article
3 Gb/s AC Coupled Chip-to-Chip Communication Using a Low Swing Pulse Receiver
IEEE Journal of Solid-State Circuits, 41(1), 287–296.
co-author countries:
United States of America 🇺🇸
author keywords: AC coupled interconnect; bandlimited communications; buried bump technology; capacitive coupling; multichip modules; pulse receiver; pulse signaling
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018
2004 article
AC coupled interconnect for dense 3-D ICs
Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October). IEEE TRANSACTIONS ON NUCLEAR SCIENCE, Vol. 51, pp. 2156–2160.
co-author countries:
United States of America 🇺🇸
author keywords: AC coupled; inductive coupling; spiral inductor; three-dimensional integrated circuits (3-D ICs); through vias; vertical interconnect
Sources: Web Of Science, ORCID
Added: August 6, 2018
2004 article
Buried bump and AC coupled interconnection technology
Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 121–125.
co-author countries:
United States of America 🇺🇸
author keywords: capacity-coupled circuits; coupled interconnections; integrated circuits; I/O; solder bumps
Sources: Web Of Science, ORCID
Added: August 6, 2018
