Works (6)

2009 journal article

A 32-Gb/s on-chip bus with driver pre-emphasis signaling

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(9), 1267–1274.

By: L. Zhang, J. Wilson, R. Bashirullah, L. Luo, J. Xu & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2007 journal article

Fully integrated AC coupled interconnect using buried bumps

IEEE Transactions on Advanced Packaging, 30(2), 191–199.

By: J. Wilson, S. Mick, J. Xu, L. Luo, S. Bonafede, A. Huffman, R. LaBennett, P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2007 journal article

Voltage-mode driver preemphasis technique for on-chip global buses

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 15(2), 231–236.

By: L. Zhang, J. Wilson, R. Bashirullah, L. Luo, J. Xu & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2006 journal article

3 Gb/s AC, coupled chip-to-chip communication using a low swing pulse receiver

IEEE Journal of Solid-State Circuits, 41(1), 287–296.

By: L. Luo, J. Wilson, S. Mick, J. Xu, L. Zhang & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2004 journal article

AC coupled interconnect for dense 3-D ICs

IEEE Transactions on Nuclear Science, 51(5), 2156–2160.

Source: NC State University Libraries
Added: August 6, 2018

2004 journal article

Buried bump and AC coupled interconnection technology

IEEE Transactions on Advanced Packaging, 27(1), 121–125.

By: S. Mick, L. Luo, J. Wilson & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018