Lei Luo

Works (6)

Updated: April 11th, 2023 10:13
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2009 journal article

A 32-Gb/s On-Chip Bus With Driver Pre-Emphasis Signaling

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(9), 1267–1274.

By: L. Zhang, J. Wilson n, R. Bashirullah*, L. Luo, J. Xu & P. Franzon 

author keywords: Interconnects; low power; on-chip; pre-emphasis
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018

2007 article

Fully integrated AC coupled interconnect using buried bumps

Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007, May). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 30, pp. 191–199.

By: J. Wilson, S. Mick, J. Xu, L. Luo, S. Bonafede n, A. Huffman n, R. LaBennett n, P. Franzon 

author keywords: AC coupled interconnect (ACCI); buried bumps; capacitive coupling; MCM; pulse signaling; noncontacting I/O; chip and package co-design
Sources: Web Of Science, ORCID
Added: August 6, 2018

2007 journal article

Voltage-mode driver preemphasis technique for on-chip global buses

IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 15(2), 231–236.

By: L. Zhang  n, J. Wilson, R. Bashirullah, L. Luo, J. Xu & P. Franzon 

author keywords: global buses; low-power; on-chip; preemphasis; repeater insertion
Sources: Web Of Science, ORCID
Added: August 6, 2018

2006 journal article

3 Gb/s AC Coupled Chip-to-Chip Communication Using a Low Swing Pulse Receiver

IEEE Journal of Solid-State Circuits, 41(1), 287–296.

By: L. Luo, J. Wilson, S. Mick n, J. Xu n, L. Zhang n & P. Franzon 

author keywords: AC coupled interconnect; bandlimited communications; buried bump technology; capacitive coupling; multichip modules; pulse receiver; pulse signaling
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018

2004 article

AC coupled interconnect for dense 3-D ICs

Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October). IEEE TRANSACTIONS ON NUCLEAR SCIENCE, Vol. 51, pp. 2156–2160.

By: J. Xu, S. Mick, J. Wilson, L. Luo, K. Chandrasekar, E. Erickson, P. Franzon 

author keywords: AC coupled; inductive coupling; spiral inductor; three-dimensional integrated circuits (3-D ICs); through vias; vertical interconnect
Sources: Web Of Science, ORCID
Added: August 6, 2018

2004 article

Buried bump and AC coupled interconnection technology

Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 121–125.

By: S. Mick, L. Luo, J. Wilson & P. Franzon 

author keywords: capacity-coupled circuits; coupled interconnections; integrated circuits; I/O; solder bumps
Sources: Web Of Science, ORCID
Added: August 6, 2018