Lei Luo

Zhang, L., Wilson, J. M., Bashirullah, R., Luo, L., Xu, J., & Franzon, P. D. (2009). A 32-Gb/s On-Chip Bus With Driver Pre-Emphasis Signaling. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(9), 1267–1274. https://doi.org/10.1109/TVLSI.2008.2002682

Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007, May). Fully integrated AC coupled interconnect using buried bumps. IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 30, pp. 191–199. https://doi.org/10.1109/TADVP.2007.896920

Zhang, L., Wilson, J. M., Bashirullah, R., Luo, L., Xu, J., & Franzon, P. D. (2007). Voltage-mode driver preemphasis technique for on-chip global buses. IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 15(2), 231–236. https://doi.org/10.1109/TVLSI.2007.893588

Luo, L., Wilson, J. M., Mick, S. E., Xu, J., Zhang, L., & Franzon, P. D. (2006). 3 Gb/s AC Coupled Chip-to-Chip Communication Using a Low Swing Pulse Receiver. IEEE Journal of Solid-State Circuits, 41(1), 287–296. https://doi.org/10.1109/JSSC.2005.859881

Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October). AC coupled interconnect for dense 3-D ICs. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, Vol. 51, pp. 2156–2160. https://doi.org/10.1109/TNS.2004.834712

Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February). Buried bump and AC coupled interconnection technology. IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 121–125. https://doi.org/10.1109/TADVP.2004.825482