Jian Xu

Works (8)

Updated: July 5th, 2023 15:57

2009 journal article

A 32-Gb/s On-Chip Bus With Driver Pre-Emphasis Signaling

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(9), 1267–1274.

By: L. Zhang n, J. Wilson  n, R. Bashirullah*, L. Luo n, J. Xu n & P. Franzon n 

author keywords: Interconnects; low power; on-chip; pre-emphasis
TL;DR: A differential current-mode bus architecture based on driver pre-emphasis for on-chip global interconnects that achieves high-data rates while reducing bus power dissipation and improving signal delay latency is described. (via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: Web Of Science, Crossref, NC State University Libraries
Added: August 6, 2018

2008 conference paper

Inductively coupled connectors and sockets for multi-Gb/s pulse signaling

IEEE Transactions on Advanced Packaging, 31(4), 749–758.

By: K. Chandrasekar n, J. Wilson n, E. Erickson n, Z. Feng n, J. Xu n, S. Mick n, P. Franzon n 

UN Sustainable Development Goal Categories
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2007 article

Fully integrated AC coupled interconnect using buried bumps

Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007, May). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 30, pp. 191–199.

By: J. Wilson n, S. Mick n, J. Xu n, L. Luo n, S. Bonafede*, A. Huffman*, R. LaBennett*, P. Franzon n 

author keywords: AC coupled interconnect (ACCI); buried bumps; capacitive coupling; MCM; pulse signaling; noncontacting I/O; chip and package co-design
UN Sustainable Development Goal Categories
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2007 journal article

Laser-assisted forward transfer of multi-spectral nanocrystal quantum dot emitters

Nanotechnology, 18(2).

By: J. Xu, J. Liu, D. Cui, M. Gerhold, A. Wang, M. Nagel, T. Lippert

Source: NC State University Libraries
Added: August 6, 2018

2007 journal article

Voltage-mode driver preemphasis technique for on-chip global buses

IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 15(2), 231–236.

By: L. Zhang  n, J. Wilson n, R. Bashirullah*, L. Luo n, J. Xu n & P. Franzon n 

author keywords: global buses; low-power; on-chip; preemphasis; repeater insertion
TL;DR: This paper demonstrates that driver preemphasis technique can be used for on-chip global buses to increase signal channel bandwidth and reduces power consumption by 12%-39% for data activity factors above 0.1. (via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2006 journal article

Infrared photodiode based on colloidal PbSe nanocrystal quantum dots

IEEE TRANSACTIONS ON NANOTECHNOLOGY, 5(4), 362–367.

By: D. Cui*, J. Xu*, S. Xu*, G. Paradee*, B. Lewis* & M. Gerhold n

author keywords: infrared detectors; photoconductivity; photodiode; photovoltaic effects; semiconductor materials
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Source: Web Of Science
Added: August 6, 2018

2006 article

Tunable photoluminescence of polymer doped with PbSe quantum dots

Voitenko, I., Muth, J. F., Gerhold, M., Cui, D., & Xu, J. (2007, September). MATERIALS SCIENCE & ENGINEERING C-BIOMIMETIC AND SUPRAMOLECULAR SYSTEMS, Vol. 27, pp. 1078–1081.

By: I. Voitenko n, J. Muth n, M. Gerhold*, D. Cui* & J. Xu*

author keywords: polymer composite; semiconductor quantum dots; photoluminescence
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Source: Web Of Science
Added: August 6, 2018

2004 article

AC coupled interconnect for dense 3-D ICs

Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October). IEEE TRANSACTIONS ON NUCLEAR SCIENCE, Vol. 51, pp. 2156–2160.

By: J. Xu n, S. Mick n, J. Wilson n, L. Luo n, K. Chandrasekar n, E. Erickson n, P. Franzon n 

author keywords: AC coupled; inductive coupling; spiral inductor; three-dimensional integrated circuits (3-D ICs); through vias; vertical interconnect
TL;DR: This paper presents the potential application of AC coupled interconnect (ACCI) for dense three-dimensional (3-D) integrated circuits (ICs) and concludes that inductive ACCI can provide small pitch vertical interconnects, as well as an excellent thermal solution for dense 3-D ICs. (via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

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