@article{zhang_wilson_bashirullah_luo_xu_franzon_2009, title={A 32-Gb/s On-Chip Bus With Driver Pre-Emphasis Signaling}, volume={17}, ISSN={1063-8210 1557-9999}, url={http://dx.doi.org/10.1109/tvlsi.2008.2002682}, DOI={10.1109/TVLSI.2008.2002682}, abstractNote={This paper describes a differential current-mode bus architecture based on driver pre-emphasis for on-chip global interconnects that achieves high-data rates while reducing bus power dissipation and improving signal delay latency. The 16-b bus core fabricated in 0.25-mum complementary metal-oxide-semiconductor (CMOS) technology attains an aggregate signaling data rate of 32 Gb/s over 5-10-mm-long lossy interconnects. With a supply of 2.5 V, 25.5-48.7-mW power dissipation was measured for signal activity above 0.1, equivalent to 0.80-1.52 pJ/b. This work demonstrates a 15.0%-67.5% power reduction over a conventional single-ended voltage-mode static bus while reducing delay latency by 28.3% and peak current by 70%. The proposed bus architecture is robust against crosstalk noise and occupies comparable routing area to a reference static bus design.}, number={9}, journal={IEEE Transactions on Very Large Scale Integration (VLSI) Systems}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Zhang, Liang and Wilson, John M. and Bashirullah, Rizwan and Luo, Lei and Xu, Jian and Franzon, Paul D.}, year={2009}, month={Sep}, pages={1267–1274} }
 @inproceedings{chandrasekar_wilson_erickson_feng_xu_mick_franzon_2008, title={Inductively coupled connectors and sockets for multi-Gb/s pulse signaling}, volume={31}, DOI={10.1109/tadvp.2008.2005465}, number={4}, booktitle={IEEE Transactions on Advanced Packaging}, author={Chandrasekar, K. and Wilson, J. and Erickson, E. and Feng, Z. P. and Xu, J. and Mick, S. and Franzon, Paul}, year={2008}, pages={749–758} }
 @article{wilson_mick_xu_luo_bonafede_huffman_labennett_franzon_2007, title={Fully integrated AC coupled interconnect using buried bumps}, volume={30}, DOI={10.1109/TADVP.2007.896920}, number={2}, journal={IEEE Transactions on Advanced Packaging}, author={Wilson, J. and Mick, S. and Xu, J. and Luo, L. and Bonafede, S. and Huffman, A. and LaBennett, R. and Franzon, Paul}, year={2007}, pages={191–199} }
 @article{xu_liu_cui_gerhold_wang_nagel_lippert_2007, title={Laser-assisted forward transfer of multi-spectral nanocrystal quantum dot emitters}, volume={18}, number={2}, journal={Nanotechnology}, author={Xu, J. and Liu, J. and Cui, D. H. and Gerhold, M. and Wang, A. Y. and Nagel, M. and Lippert, T. K.}, year={2007} }
 @article{voitenko_muth_gerhold_cui_xu_2007, title={Tunable photoluminescence of polymer doped with PbSe quantum dots}, volume={27}, DOI={10.1016/j.msec.2006.09.018}, number={5-8}, journal={Materials Science & Engineering. C, Biomimetic Materials, Sensors and Systems}, author={Voitenko, I. and Muth, J. F. and Gerhold, M. and Cui, D. and Xu, J.}, year={2007}, pages={1078–1081} }
 @article{zhang_wilson_bashirullah_luo_xu_franzon_2007, title={Voltage-mode driver preemphasis technique for on-chip global buses}, volume={15}, DOI={10.1109/TVLSI.2007.893588}, number={2}, journal={IEEE Transactions on Very Large Scale Integration (VLSI) Systems}, author={Zhang, L. and Wilson, J. M. and Bashirullah, R. and Luo, L. and Xu, J. and Franzon, Paul}, year={2007}, pages={231–236} }
 @article{cui_xu_xu_paradee_lewis_gerhold_2006, title={Infrared photodiode based on colloidal PbSe nanocrystal quantum dots}, volume={5}, DOI={10.1109/TNANO.2006.877432}, number={4}, journal={IEEE Transactions on Nanotechnology}, author={Cui, D. H. and Xu, J. and Xu, S. Y. and Paradee, G. and Lewis, B. A. and Gerhold, M. D.}, year={2006}, pages={362–367} }
 @article{xu_mick_wilson_luo_chandrasekar_erickson_franzon_2004, title={AC coupled interconnect for dense 3-D ICs}, volume={51}, DOI={10.1109/TNS.2004.834712}, number={5}, journal={IEEE Transactions on Nuclear Science}, author={Xu, J. and Mick, S. and Wilson, J. and Luo, L. and Chandrasekar, K. and Erickson, E. and Franzon, Paul}, year={2004}, pages={2156–2160} }