@article{dunbar_omiatek_thai_kendrex_grotzinger_boyko_weinstein_skaf_bessel_denison_et al._2006, title={Use of substituted bis(acetylacetone) ethylenediimine and dialkyldithiocarbamate ligands for copper chelation in supercritical carbon dioxide}, volume={45}, ISSN={["0888-5885"]}, DOI={10.1021/ie060947v}, abstractNote={Chemical−mechanical planarization (CMP) is a process of oxidizing and chelating the copper overburden present in an interconnect device while mechanically polishing the surface of the wafer. Because the use of condensed CO2 as the solvent for CMP would be environmentally and technically advantageous, several substituted bis(acetylacetonate)ethylenediimine (R4BAE, where R = CH3 or CF3) and lithium or sodium dialkyldithiocarbamate (M+(R2DTC-), where M+ = Li+ or Na+ and R = ethyl, n-propyl, n-butyl, or 1,1,1-trifluoroethyl) ligands were used with t-butylperacetate (t-BuPA, as oxidant) for the oxidative dissolution of copper(0) in supercritical (sc) CO2 at 40 °C and 170−210 bar or in hexanes at 40 °C and atmospheric pressure. The reaction products from the copper etching were determined to be Cu(R4BAE) or Cu(R2DTC)2, respectively. The R2DTC- ligands had higher etch rates than the R4BAE ligands with comparable substituents, and the lithium dialkyldithiocarbamate salts gave higher copper etching rates than thei...}, number={26}, journal={INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH}, author={Dunbar, Andrew and Omiatek, Donna M. and Thai, Susan D. and Kendrex, Christopher E. and Grotzinger, Laurel L. and Boyko, Walter J. and Weinstein, Randy D. and Skaf, Dorothy W. and Bessel, Carol A. and Denison, Ginger M. and et al.}, year={2006}, month={Dec}, pages={8779–8787} }
 @article{rolland_hagberg_denison_carter_desimone_2004, title={High-resolution soft lithography: Enabling materials for nanotechnologies}, volume={43}, ISSN={["1433-7851"]}, DOI={10.1002/anie.200461122}, abstractNote={The availability of commercially viable nanofabrication processes is key to realizing the potential of nanotechnologies, especially in the fields of photonics, electronics, and proteomics. The imprint lithographic (IL) technique is a case in point, an alternative to photolithography for manufacturing integrated circuits, nanofluidic and other devices with sub100-nm features. However, it is becoming increasingly clear that new materials are needed to advance IL methods to their putative limits. We recently reported the fabrication of organic-solvent resistant, microfluidic devices with features on the order of hundreds of microns made from photocurable perfluoropolyethers (PFPEs). PFPE-based materials are liquids at room temperature and can be photochemically cross-linked to yield highly fluorinated, solvent resistant, chemically robust, durable, elastomers with a modulus of 4.0 MPa. Herein we report the successful use of PFPE-based materials in high-resolution imprint lithography. Imprint lithography can be roughly broken into two areas: 1) so-called soft lithographic techniques, such as solventassisted micro-molding (SAMIM), micro-molding in capillaries (MIMIC), and microcontact printing (MCP), and 2) rigid imprint techniques, such as nanocontact molding (NCM), “step and flash” imprint lithography (S-FIL), and nanoimprint lithography (NIL). Polydimethylsiloxane (PDMS)}, number={43}, journal={ANGEWANDTE CHEMIE-INTERNATIONAL EDITION}, author={Rolland, JP and Hagberg, EC and Denison, GM and Carter, KR and DeSimone, JM}, year={2004}, pages={5796–5799} }