2008 conference paper

Improving behavioral IO buffer modeling based on IBIS

IEEE Transactions on Advanced Packaging, 31(4), 711–721.

By: A. Varma, M. Steer & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2005 journal article

CAD flows for chip-package coverification

IEEE Transactions on Advanced Packaging, 28(1), 96–101.

By: A. Varma, A. Glaser & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018