@article{bishop_reynolds_liliental-weber_uprety_ebert_stevie_park_davis_2008, title={Sublimation growth of an in-situ-deposited layer in SiC chemical vapor deposition on 4H-SiC(1 1 (2)over-bar 0)}, volume={311}, ISSN={["1873-5002"]}, DOI={10.1016/j.jcrysgro.2008.09.200}, abstractNote={Homoepitaxial growths of 4H-SiC(1 1 2¯ 0) epitaxial layers have been achieved using chemical vapor deposition from 1250 to 1600 °C and two process routes: (1) with and (2) without the addition of SiH4 and C2H4 to the growth ambient. An activation energy of 3.72 eV/atom (359 kJ/mol) was determined for the former route and associated with either reactions in the gas phase or the potential barrier associated with the temperature-dependent sticking coefficient. The activation energy for the latter route was 5.64 eV/atom (544 kJ/mol), which is consistent with published values for SiC sublimation epitaxy. Sublimation dominated the growth process at temperature ⩾1600 °C. The same effect resulted in the in-situ deposition of a thin film during the heating stage of route (1). At 1450 °C this layer was ∼100 nm thick and exhibited a specular surface microstructure with a roughness of 0.31 nm RMS. The in-situ-deposited layer was thus employed as an intermediate layer prior to epitaxial layer growth using route (1) at ∼1450 °C. Regions free of one- and two-dimensional defects were observed using cross-sectional transmission electron microscopy. Distinct interfaces were not observed between the substrate and the epitaxial layers.}, number={1}, journal={JOURNAL OF CRYSTAL GROWTH}, author={Bishop, S. M. and Reynolds, C. L., Jr. and Liliental-Weber, Z. and Uprety, Y. and Ebert, C. W. and Stevie, F. A. and Park, J. -S. and Davis, R. F.}, year={2008}, month={Dec}, pages={72–78} }
 @article{bishop_park_gu_wagner_reltmeier_batchelor_zakharov_liliental-weber_davis_2007, title={Growth evolution and pendeo-epitaxy of non-polar AlN and GaN thin films on 4H-SiC (11(2)over-bar0)}, volume={300}, ISSN={["1873-5002"]}, DOI={10.1016/j.jcrysgro.2006.10.207}, abstractNote={The initial and subsequent stages of growth of AlN on 4H–SiC (1 1 2¯ 0) and GaN on AlN (1 1 2¯ 0) have been investigated using atomic force microscopy and X-ray photoelectron spectroscopy. The AlN nucleated and grew via the Stranski–Krastanov mode. Densely packed, [0 0 0 1]-oriented individual islands were observed at 10 nm. Additional deposition resulted in the gradual reorientation of the growth microstructure along the [1 1¯ 0 0]. GaN formed via the Volmer–Weber mode with rapid growth of islands along the [1 1¯ 0 0] to near surface coverage at a thickness of 2 nm. Continued deposition resulted in both faster vertical growth along [1 1 2¯ 0] relative to the lateral growth along [0 0 0 1] and a [1 1¯ 0 0]-oriented microstructure containing rows of GaN. Fully dense GaN films developed between 100 and 250 nm of growth, and the preferred in-plane orientation changed to [0 0 0 1]. Lateral growth of GaN films reduced the dislocation density from ∼4×1010 to ∼2×108 cm−2. The high concentration of stacking faults (∼106 cm−1) was also reduced two orders of magnitude.}, number={1}, journal={JOURNAL OF CRYSTAL GROWTH}, author={Bishop, S. M. and Park, J. -S. and Gu, J. and Wagner, B. P. and Reltmeier, Z. J. and Batchelor, D. A. and Zakharov, D. N. and Liliental-Weber, Z. and Davis, R. F.}, year={2007}, month={Mar}, pages={83–89} }
 @article{wagner_reitmeier_park_bachelor_zakharov_liliental-weber_davis_2006, title={Growth and characterization of pendeo-epitaxial GaN(11(2)over-bar0) on 4H-SiC(11(2)over-bar0) substrates}, volume={290}, ISSN={["1873-5002"]}, DOI={10.1016/j.jcrysgro.2006.02.011}, abstractNote={Abstract Growth on AlN/4H–SiC ( 1 1 2 ¯ 0 ) substrates of coalesced, non-polar GaN ( 1 1 2 ¯ 0 ) films having volumes of material with reduced densities of dislocations and stacking faults has been achieved from etched stripes via the statistical and experimental determination of the effect of temperature and V/III ratio on the lateral and vertical growth rates of the GaN{0 0 0 1} faces combined with pendeo-epitaxy. AFM of the uncoalesced GaN(0 0 0 1) and GaN ( 0 0 0 1 ¯ ) vertical faces revealed growth steps with some steps terminating at dislocations on the former and a pitted surface without growth steps, indicative of decomposition, on the latter. Coalescence was achieved via (a) a two-step route and the parameters of (1) T = 1100 ° C and V / III = 1323 for 40 min and (2) 1020 °C and V / III = 660 for 40 min and (b) a one-step route that employed T = 1020 ° C and a V/III ratio = 660 for 6 h. The densities of dislocations in the GaN grown vertically over and laterally from the ( 1 1 2 ¯ 0 ) stripes were ∼4×10 10  cm −2 and ∼2×10 8  cm −2 , respectively; the densities of stacking fault in these volumes were ∼1×10 6  cm −1 and ∼2×10 4  cm −1 , respectively. The defects in the wing material were observed primarily at the bottom of the film where lateral growth of the GaN occurred from the AlN and the SiC. Plan view AFM also revealed different microstructures and a reduction in the RMS roughness values from 1.2 to 0.95 nm in these respective regions.}, number={2}, journal={JOURNAL OF CRYSTAL GROWTH}, author={Wagner, BP and Reitmeier, ZJ and Park, JS and Bachelor, D and Zakharov, DN and Liliental-Weber, Z and Davis, RF}, year={2006}, month={May}, pages={504–512} }
 @article{park_reitmeier_fothergill_zhang_muth_davis_2006, title={Growth and fabrication of AlGaN-based ultraviolet light emitting diodes on 6H-SiC(0001) substrates and the effect of carrier-blocking layers on their emission characteristics}, volume={127}, ISSN={["0921-5107"]}, DOI={10.1016/j.mseb.2005.10.019}, abstractNote={Abstract Growth, fabrication, and the electrical and optical characterization of ultraviolet light emitting diodes and their components, including AlxGa1−xN films, quantum wells (QWs), and ohmic contacts, and the problems encountered in the process integration of these components have been investigated. Ni/Au ohmic contacts with specific contact resistivities of 2.2 × 10−4 and 2.0 × 10−2 Ω cm2 were achieved on annealed, Mg-doped ([Mg] ∼ 5 × 1019 cm−3), p-type GaN layers that had been cleaned in HCl at 85 °C and on the backside of the SiC substrates after annealing in nitrogen, respectively. The emission intensity of the diodes increased with an increase in the number of Al0.06Ga0.94N/Al0.10Ga0.90N QWs and with the use of Si-doped n-type barrier layers. The highest intensities of the principle emission at 353 nm were measured at all values of the injection current in the device with a p-type carrier-blocking layer at the top of the QWs; this device also exhibited the highest values of light output power. Growth of an n-type carrier-blocking layer at the bottom of the QWs had an adverse effect on their characteristics. A broad peak centered at ∼540 nm exhibited yellow luminescence and was present in the spectra acquired from all the devices. This peak is attributed to absorption of the ultraviolet emission by and re-emission from the p-GaN and/or to the luminescence from the AlGaN within QWs by current injection.}, number={2-3}, journal={MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY}, author={Park, JS and Reitmeier, ZJ and Fothergill, D and Zhang, XY and Muth, JF and Davis, RF}, year={2006}, month={Feb}, pages={169–179} }
 @article{park_fothergill_zhang_reitmeier_muth_davis_2005, title={Effect of carrier blocking layers on the emission characteristics of AlGaN-based ultraviolet light emitting diodes}, volume={44}, ISSN={["0021-4922"]}, DOI={10.1143/jjap.44.7254}, abstractNote={AlGaN-based thin film heterostructures suitable for ultraviolet light emitting diodes have been grown and fabricated into working devices with and without p-type and n-type AlGaN carrier-blocking layers at the top and the bottom of the quantum wells, respectively. The principal emission from each device occurred at 353 nm. The highest intensities of this peak were measured at all values of the injection current in the device with a p-type carrier-blocking layer at the top of the quantum well; this device also exhibited the highest values of light output power. Growth of an n-type carrier-blocking layer at the bottom of the quantum wells had an adverse effect on the light emitting diode characteristics. A broad peak centered at ∼540 nm exhibited yellow luminescence and was present in the spectra acquired from all the devices. This peak is attributed to absorption of the UV emission by and re-emission from the p-GaN and/or to the luminescence from the AlGaN within quantum wells by current injection. The intensity of this peak increased and saturated by the same order of magnitude as the intensity of the UV emission at 353 nm.}, number={10}, journal={JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS}, author={Park, JS and Fothergill, DW and Zhang, XY and Reitmeier, ZJ and Muth, JF and Davis, RF}, year={2005}, month={Oct}, pages={7254–7259} }