@article{kononchuk_bondarenko_rozgonyi_1998, title={Combined MOS/EBIC and TEM study of electrically active defects in SOI wafers}, volume={63-4}, number={1998}, journal={Diffusion and Defect Data. [Pt. B], Solid State Phenomena}, author={Kononchuk, O. and Bondarenko, I. and Rozgonyi, G.}, year={1998}, pages={61–67} }
 @article{beaman_agarwal_kononchuk_koveshnikov_bondarenko_rozgonyi_1997, title={Gettering of iron in silicon-on-insulator wafers}, volume={71}, ISSN={["1077-3118"]}, DOI={10.1063/1.119741}, abstractNote={Gettering of Fe in silicon-on-insulator material has been investigated on both the bonded and separation by implantation of oxygen (SIMOX) platforms. Reduction of electrically active iron in intentionally contaminated and annealed wafers has been measured by deep level transient spectroscopy. These data, coupled with structural characterization techniques, such as transmission electron microscopy and preferential chemical etching, provide evidence that structural postimplantation damage below the buried oxide (BOX) in SIMOX wafers is an effective site for gettering of iron with the iron gettering efficiency varying with the SIMOX processing. Gettering was not observed in bonded wafers, and the lower BOX interface did not provide any iron gettering in either bonded or SIMOX wafers.}, number={8}, journal={APPLIED PHYSICS LETTERS}, author={Beaman, KL and Agarwal, A and Kononchuk, O and Koveshnikov, S and Bondarenko, I and Rozgonyi, GA}, year={1997}, month={Aug}, pages={1107–1109} }
 @article{brown_kononchuk_bondarenko_romanowski_radzimski_rozgonyi_gonzalez_1997, title={Metallic impurity gettering and secondary defect formation in megaelectron volt self-implanted Czochralski and float-zone silicon}, volume={144}, ISSN={["0013-4651"]}, DOI={10.1149/1.1837910}, abstractNote={Megaelectron volt (MeV) self‐implantation has been investigated as a means of producing buried defect layers for gettering metallic impurities in Czochralski (CZ) and float‐zone (FZ) silicon. The properties of implanted and annealed wafers were studied by generation lifetime (Zerbst) analysis of transient capacitance data, capacitance‐voltage measurements, deep‐level transient spectroscopy, scanning electron‐beam‐induced current microscopy, transmission electron microscopy, optical microscopy with preferential chemical etching, and secondary ion mass spectroscopy. We found that metallic contaminants such as Fe and Cu were effectively gettered to buried extended defect layers formed by implantation of ion fluences . For example, the concentration of iron in regions near the buried defects can be reduced to below in samples annealed at 900°C. The region above the damage layer appears to be free of electrically active defects, having very high generation lifetime values, and is therefore suitable for device processing. However, the structure and width of the buried defect band is sensitive to the implanted ion fluence and the oxygen content of the wafers. For example, the defect layers formed by high ion fluences are wider in FZ wafers than in CZ wafers. For fluences , dislocations extend from the buried damage band in both directions during annealing and are observed at depths up to 10 μm. These dislocations intersect the wafer surface in both CZ and FZ wafers, making fluences lower than unsuitable for device fabrication.}, number={8}, journal={JOURNAL OF THE ELECTROCHEMICAL SOCIETY}, author={Brown, RA and Kononchuk, O and Bondarenko, I and Romanowski, A and Radzimski, Z and Rozgonyi, GA and Gonzalez, F}, year={1997}, month={Aug}, pages={2872–2881} }