adam J. Morgan

Works (8)

Updated: April 11th, 2023 10:13
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2022 journal article

SPICE Modeling and Circuit Demonstration of a SiC Power IC Technology

IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 10, 129–138.

By: T. Liu*, H. Zhang*, S. Isukapati *, E. Ashik, A. Morgan, B. Lee, W. Sung, A. Fayed*, M. White*, A. Agarwal*

author keywords: Silicon carbide; MOSFET; Integrated circuits; Semiconductor device modeling; SPICE; Integrated circuit modeling; Silicon; SiC MOSFETs; CMOS circuits; smart power IC; SPICE modeling; trapped interface charges
Source: Web Of Science
Added: March 14, 2022

2021 conference paper

Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices

2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2351–2356.

By: U. Mehrotra, A. Morgan & D. Hopkins 

Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC)

author keywords: Power Module Design; Silicon Carbide; SiC; Bare-Die; Characterization; Electrical Test
Sources: Web Of Science, Crossref, ORCID
Added: September 4, 2021

2018 conference paper

6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications

Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1288–1293.

By: B. Gao n, A. Morgan, Y. Xu n, X. Zhao n & D. Hopkins 

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2018 journal article

Design, Package, and Hardware Verification of a High-Voltage Current Switch

IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441–450.

By: A. De*, A. Morgan, V. Iyer n, H. Ke n, X. Zhao n, K. Vechalapu n, S. Bhattacharya , D. Hopkins 

author keywords: Current switch; high voltage (HV); IGBT and series diode; packaging; silicon carbide (SiC); wide bandgap
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018

2017 conference paper

Numerical and experimental determination of temperature distribution in 3D stacked power devices

Exhibition on packaging and integration of electronic and photonic.

By: A. Morgan, L. Choobineh *, D. Fresne* & D. Hopkins 

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module

Apec 2016 31st annual ieee applied power electronics conference and exposition, 2141–2146.

By: A. Morgan, Y. Xu, D. Hopkins , I. Husain & W. Yu

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

Design, package, and hardware verification of a high voltage current switch

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, 2016-May, 295–302.

By: A. De, A. Morgan, V. Iyer n, H. Ke, X. Zhao, K. Vechalapu, S. Bhattacharya , D. Hopkins 

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2015 conference paper

Design considerations of packaging a high voltage current switch

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, vol 3.

By: A. De, A. Morgan, S. Bhattacharya  & D. Hopkins 

Source: NC State University Libraries
Added: August 6, 2018