2018 conference paper

6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications

Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1288–1293.

By: B. Gao, A. Morgan, Y. Xu, X. Zhao & D. Hopkins

Source: NC State University Libraries
Added: August 6, 2018

2018 journal article

Design, package, and hardware verification of a high-voltage current switch

IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441–450.

By: A. De, A. Morgan, V. Iyer, H. Ke, X. Zhao, K. Vechalapu, S. Bhattacharya, D. Hopkins

Source: NC State University Libraries
Added: August 6, 2018

2017 conference paper

Numerical and experimental determination of temperature distribution in 3D stacked power devices

Exhibition on packaging and integration of electronic and photonic.

By: A. Morgan, L. Choobineh, D. Fresne & D. Hopkins

Source: NC State University Libraries
Added: August 6, 2018

2016 conference paper

Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module

Apec 2016 31st annual ieee applied power electronics conference and exposition, 2141–2146.

By: A. Morgan, Y. Xu, D. Hopkins, I. Husain & W. Yu

Source: NC State University Libraries
Added: August 6, 2018

2016 conference paper

Design, package, and hardware verification of a high voltage current switch

Apec 2016 31st annual ieee applied power electronics conference and exposition, 295–302.

By: A. De, A. Morgan, V. Iyer, H. Ke, X. Zhao, K. Vechalapu, S. Bhattacharya, D. Hopkins

Source: NC State University Libraries
Added: August 6, 2018

2015 conference paper

Design considerations of packaging a high voltage current switch

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, vol 3.

By: A. De, A. Morgan, S. Bhattacharya & D. Hopkins

Source: NC State University Libraries
Added: August 6, 2018