2022 journal article
SPICE Modeling and Circuit Demonstration of a SiC Power IC Technology
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 10, 129β138.
2021 conference paper
Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices
2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2351β2356.
Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC)
2018 conference paper
6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications
Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1288β1293.
2018 journal article
Design, Package, and Hardware Verification of a High-Voltage Current Switch
IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441β450.
Contributors: A. De*, n, V. Mahadeva Iyer nβ, H. Ke n, X. Zhaoβ n, K. Vechalapu n, S. Bhattacharya nβ, D. Hopkins nβ
2017 conference paper
Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Presented at the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems.
Event: ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
2016 conference paper
Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module
Apec 2016 31st annual ieee applied power electronics conference and exposition, 2141β2146.
2016 conference paper
Design, package, and hardware verification of a high voltage current switch
Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, 2016-May, 295β302.
Contributors: A. De n, n, V. Iyerβ n, H. Ke n, X. Zhao n, K. Vechalapu n, S. Bhattacharya nβ, D. Hopkins nβ
2015 conference paper
Design considerations of packaging a high voltage current switch
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, vol 3.