adam J. Morgan

Works (8)

Updated: July 5th, 2023 15:35

2022 journal article

SPICE Modeling and Circuit Demonstration of a SiC Power IC Technology

IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 10, 129–138.

By: T. Liu *, H. Zhang *, S. Isukapati *, E. Ashik n, A. Morgan*, B. Lee n, W. Sung*, A. Fayed*, M. White*, A. Agarwal *

author keywords: Silicon carbide; MOSFET; Integrated circuits; Semiconductor device modeling; SPICE; Integrated circuit modeling; Silicon; SiC MOSFETs; CMOS circuits; smart power IC; SPICE modeling; trapped interface charges
UN Sustainable Development Goal Categories
Source: Web Of Science
Added: March 14, 2022

2021 conference paper

Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices

2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2351–2356.

By: U. Mehrotra n, A. Morgan* & D. Hopkins n 

Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC)

author keywords: Power Module Design; Silicon Carbide; SiC; Bare-Die; Characterization; Electrical Test
UN Sustainable Development Goal Categories
Sources: Web Of Science, Crossref, ORCID
Added: September 4, 2021

2018 conference paper

6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications

Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1288–1293.

By: B. Gao  n, A. Morgan n, Y. Xu  n, X. Zhao  n & D. Hopkins n 

TL;DR: Electrical and multi-physics simulations show improvements in dynamic response, and improved electro-thermal performance that exceed state-of-the-art Si-IGBT power module technology. (via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2018 journal article

Design, Package, and Hardware Verification of a High-Voltage Current Switch

IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441–450.

By: A. De *, A. Morgan n, V. Iyer  n, H. Ke n, X. Zhao  n, K. Vechalapu n, S. Bhattacharya n , D. Hopkins n 

Contributors: A. De *, A. Morgan n, V. Mahadeva Iyer n , H. Ke n, X. Zhao  n, K. Vechalapu n, S. Bhattacharya n , D. Hopkins n 

author keywords: Current switch; high voltage (HV); IGBT and series diode; packaging; silicon carbide (SiC); wide bandgap
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (Web of Science; OpenAlex)
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018

2017 conference paper

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Presented at the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems.

By: A. Morgan n, L. Choobineh*, D. Fresne* & D. Hopkins n 

Event: ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems

UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: NC State University Libraries, ORCID, Crossref
Added: August 6, 2018

2016 conference paper

Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module

Apec 2016 31st annual ieee applied power electronics conference and exposition, 2141–2146.

By: A. Morgan n, Y. Xu n, D. Hopkins n , I. Husain n & W. Yu n 

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

Design, package, and hardware verification of a high voltage current switch

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, 2016-May, 295–302.

By: A. De n, A. Morgan n, V. Iyer  n, H. Ke n, X. Zhao n, K. Vechalapu n, S. Bhattacharya n , D. Hopkins n 

Contributors: A. De n, A. Morgan n, V. Iyer  n, H. Ke n, X. Zhao n, K. Vechalapu n, S. Bhattacharya n , D. Hopkins n 

TL;DR: Detailed design considerations for packaging an HV current switch module are enumerated to minimize the parasitic inductance and low-voltage and HV converter prototypes are developed and tested to ensure thermal stability. (via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2015 conference paper

Design considerations of packaging a high voltage current switch

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, vol 3.

By: A. De, A. Morgan, S. Bhattacharya  & D. Hopkins 

Source: NC State University Libraries
Added: August 6, 2018

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