adam J. Morgan
Works (8)
Updated: July 5th, 2023 15:35
2022 journal article
SPICE Modeling and Circuit Demonstration of a SiC Power IC Technology
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 10, 129–138.
co-author countries:
United States of America 🇺🇸
author keywords: Silicon carbide; MOSFET; Integrated circuits; Semiconductor device modeling; SPICE; Integrated circuit modeling; Silicon; SiC MOSFETs; CMOS circuits; smart power IC; SPICE modeling; trapped interface charges
ieeexplore.ieee.org (publisher PDF)
Source: Web Of Science
Added: March 14, 2022
2021 conference paper
Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices
2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2351–2356.
co-author countries:
United States of America 🇺🇸
Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC)
author keywords: Power Module Design; Silicon Carbide; SiC; Bare-Die; Characterization; Electrical Test
Sources: Web Of Science, Crossref, ORCID
Added: September 4, 2021
2018 conference paper
6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications
Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1288–1293.
co-author countries:
United States of America 🇺🇸
Sources: NC State University Libraries, ORCID
Added: August 6, 2018
2018 journal article
Design, Package, and Hardware Verification of a High-Voltage Current Switch
IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441–450.
co-author countries:
United States of America 🇺🇸
Contributors: A. De*, n, V. Mahadeva Iyer n , H. Ke n, X. Zhao n, K. Vechalapu n, S. Bhattacharya n , D. Hopkins n
author keywords: Current switch; high voltage (HV); IGBT and series diode; packaging; silicon carbide (SiC); wide bandgap
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018
2017 conference paper
Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Presented at the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems.
co-author countries:
United States of America 🇺🇸
Event: ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
Sources: NC State University Libraries, ORCID, Crossref
Added: August 6, 2018
2016 conference paper
Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module
Apec 2016 31st annual ieee applied power electronics conference and exposition, 2141–2146.
co-author countries:
United States of America 🇺🇸
Sources: NC State University Libraries, ORCID
Added: August 6, 2018
2016 conference paper
Design, package, and hardware verification of a high voltage current switch
Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, 2016-May, 295–302.
co-author countries:
United States of America 🇺🇸
Contributors: A. De n, n, V. Iyer n, H. Ke n, X. Zhao n, K. Vechalapu n, S. Bhattacharya n , D. Hopkins n
Sources: NC State University Libraries, ORCID
Added: August 6, 2018
2015 conference paper
Design considerations of packaging a high voltage current switch
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, vol 3.
Source: NC State University Libraries
Added: August 6, 2018
