adam J. Morgan

Liu, T., Zhang, H., Isukapati, S. B., Ashik, E., Morgan, A. J., Lee, B., … Agarwal, A. K. (2022). SPICE Modeling and Circuit Demonstration of a SiC Power IC Technology. IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 10, 129–138. https://doi.org/10.1109/JEDS.2022.3150364

Mehrotra, U., Morgan, A. J., & Hopkins, D. C. (2021). Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices. 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2351–2356. https://doi.org/10.1109/APEC42165.2021.9487311

Gao, B., Morgan, A. J., Xu, Y., Zhao, X., & Hopkins, D. C. (2018). 6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications. Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1288–1293. https://doi.org/10.1109/apec.2018.8341182

De, A., Morgan, A. J., Iyer, V. M., Ke, H., Zhao, X., Vechalapu, K., … Hopkins, D. C. (2018). Design, Package, and Hardware Verification of a High-Voltage Current Switch. IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441–450. https://doi.org/10.1109/jestpe.2017.2727051

Morgan, A., Choobineh, L., Fresne, D., & Hopkins, D. C. (2017). Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices. ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Presented at the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. https://doi.org/10.1115/ipack2017-74222

Morgan, A. J., Xu, Y., Hopkins, D. C., Husain, I., & Yu, W. S. (2016). Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module. Apec 2016 31st annual ieee applied power electronics conference and exposition, 2141–2146. https://doi.org/10.1109/apec.2016.7468163

De, A., Morgan, A., Iyer, V. M., Ke, H., Zhao, X., Vechalapu, K., … Hopkins, D. C. (2016). Design, package, and hardware verification of a high voltage current switch. Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, 2016-May, 295–302. https://doi.org/10.1109/apec.2016.7467887

De, A., Morgan, A., Bhattacharya, S., & Hopkins, D. C. (2015). Design considerations of packaging a high voltage current switch. International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, vol 3.