2009 conference paper

The Benefits of 3D networks-on-chip as shown with LDPC decoding

2009 IEEE International Conference on 3d Systems Integration, 89–96.

By: C. Mineo & W. Davis

Source: NC State University Libraries
Added: August 6, 2018

2005 journal article

Demystifying 3D ICs: The procs and cons of going vertical

IEEE Design & Test of Computers, 22(6), 498–510.

By: W. Davis, J. Wilson, S. Mick, M. Xu, H. Hua, C. Mineo, A. Sule, M. Steer, P. Franzon

Source: NC State University Libraries
Added: August 6, 2018