Works (2)
Updated: July 5th, 2023 15:56
2009 article
The benefits of 3D networks-on-chip as shown with LDPC decoding
Mineo, C., & Davis, W. R. (2009, September 1). 2009 IEEE International Conference on 3d Systems Integration, pp. 89–96.
topics (OpenAlex): Interconnection Networks and Systems; Error Correcting Code Techniques; Advanced Memory and Neural Computing
TL;DR:
The core is a fast, high level transaction-based NoC simulator, which accesses carefully compiled power, timing, and area models for basic NoC componets built from detailed circuit simulation.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2005 article
Demystifying 3D ICs: The Pros and Cons of Going Vertical
Davis, W. R., Wilson, J., Mick, S., Xu, J., Hua, H., Mineo, C., … Franzon, P. D. (2005, June 1). IEEE Design & Test of Computers, Vol. 22, pp. 498–510.
topics (OpenAlex): 3D IC and TSV technologies; VLSI and FPGA Design Techniques; Semiconductor materials and devices
TL;DR:
A practical introduction to the design trade-offs of the currently available 3D IC technology options is provided, with an analysis relating the number of transistors on a chip to the vertical interconnect density using estimates based on Rent's rule.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018