2009 conference paper
The Benefits of 3D networks-on-chip as shown with LDPC decoding
2009 IEEE International Conference on 3d Systems Integration, 89–96.
By: C. Mineo & W. Davis
2005 journal article
Demystifying 3D ICs: The procs and cons of going vertical
IEEE Design & Test of Computers, 22(6), 498–510.
By: W. Davis, J. Wilson, S. Mick, M. Xu, H. Hua, C. Mineo, A. Sule, M. Steer, P. Franzon