Christopher Alexander Mineo

Mineo, C., & Davis, W. R. (2009). The Benefits of 3D networks-on-chip as shown with LDPC decoding. 2009 IEEE International Conference on 3d Systems Integration, 89–96. https://doi.org/10.1109/3dic.2009.5306585

Davis, W. R., Wilson, J., Mick, S., Xu, M., Hua, H., Mineo, C., … Franzon, P. D. (2005). Demystifying 3D ICs: The procs and cons of going vertical. IEEE DESIGN & TEST OF COMPUTERS, 22(6), 498–510. https://doi.org/10.1109/MDT.2005.136