@article{liu_islam_ku_boyd_zhong_urbas_smith_derov_nguyen_kim_et al._2021, title={Novel computational design of high refractive index nanocomposites and effective refractive index tuning based on nanoparticle morphology effect}, volume={223}, ISSN={["1879-1069"]}, url={https://doi.org/10.1016/j.compositesb.2021.109128}, DOI={10.1016/j.compositesb.2021.109128}, abstractNote={This study introduces a method to predict the refractive index (RI) of nanocomposites with the Finite Elements Analysis (FEA) based on the Fabry-Pérot interference. The efficacy was verified by comparing the estimated composites’ RI with the available data in the literature. In the experimental verification, the FEA-based prediction showed closer results with the measurement as compared to the effective medium approximation (EMA) approaches, which are prevalently used to predict the physical properties of nanocomposites. Due to the modeling capability, the FEA-method could investigate the effect of the nanoparticle morphology (particle size, shape, and orientation) and distribution. Large particle size, particle agglomeration in high electric-field amplitude region, and particle elongation along the light oscillating direction are found to be the major factors to enhance the RI of composites. The underlying mechanism of RI changing is attributed to the light scattering by embedded nanoparticles, which provides one potential real-time RI tuning schematic.}, journal={COMPOSITES PART B-ENGINEERING}, publisher={Elsevier BV}, author={Liu, Sipan and Islam, Md Didarul and Ku, Zahyun and Boyd, Darryl A. and Zhong, Yaxu and Urbas, Augustine M. and Smith, Evan and Derov, John and Nguyen, Vinh Q. and Kim, Woohong and et al.}, year={2021}, month={Oct} }
 @article{seo_ryu_2020, title={Influence of Reflow Profile on Thermal Fatigue Behaviors of Solder Ball Joints}, volume={29}, ISSN={["1544-1024"]}, url={https://doi.org/10.1007/s11665-020-04899-3}, DOI={10.1007/s11665-020-04899-3}, abstractNote={In electronic package design, solder joints are critical in providing electrical connections and mechanical support. The mechanical reliability of interconnection is dependent on the microstructure evolution that occurs within the solder due to the temperature changes primarily from transportation, storage, and device usage. In this study, two solder alloys, eutectic 63Sn37Pb and lead-free 95.5Sn4.0Ag0.5Cu, were tested for their thermal fatigue reliability and were observed for changes in microstructure. The different microstructures of each sample were created by controlling the cooling rate, fast or slow, during reflow. To characterize reliability, the samples endured thermal cycling − 40-125 °C until electrical failure. Finite element analysis was used to predict the primary deformation mechanism. The microstructure was inspected by cross-sectioning the solder samples using scanning electron microscopy with energy-dispersive x-ray spectroscopy. It was found that by controlling the microstructure development through the reflow rate, the solder joint’s thermal fatigue life can be extended, and concurrently, the reliability of the electronic package can be enhanced.}, number={6}, journal={JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE}, publisher={Springer Science and Business Media LLC}, author={Seo, Eunice Y. and Ryu, Jong E.}, year={2020}, month={Jun}, pages={4095–4104} }