2015 journal article

A multitier study on various stacking topologies of TSV-based PDN systems using on-chip decoupling capacitor models

IEEE Transactions on Components Packaging and Manufacturing Technology, 5(4), 541–550.

By: G. Charles & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2012 conference paper

Comparison of TSV-based PDN-design effects using various stacking topology methods

Ieee conference on electrical performance of electronic packaging and, 83–86.

By: G. Charles & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2011 conference paper

Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-droop and resonant noise in 3DIC

Ieee conference on electrical performance of electronic packaging and, 267–270.

By: G. Charles, P. Franzon, J. Kim & A. Levin

Source: NC State University Libraries
Added: August 6, 2018