Works (3)
Updated: July 5th, 2023 15:40
2015 journal article
A Multitier Study on Various Stacking Topologies of TSV-Based PDN Systems Using On-Chip Decoupling Capacitor Models
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 5(4), 541–550.
author keywords: Back-to-back (B2B); face-to-back (F2B); face-to-face (F2F); on-chip decoupling capacitors; power distribution network (PDN); segmentation method; through silicon via (TSV)
TL;DR:
The PDN impedance noise of F2F chip stacking is found to be relatively lower than F2B and B2B chip stacking topologies, and a metal-insulator-metal capacitor model written as a complex impedance equation is presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2012 conference paper
Comparison of TSV-based PDN-design effects using various stacking topology methods
Ieee conference on electrical performance of electronic packaging and, 83–86.
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2011 conference paper
Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-droop and resonant noise in 3DIC
Ieee conference on electrical performance of electronic packaging and, 267–270.
TL;DR:
To better understand how to reduce noise, particularly simultaneous switching noise (SSN) and determine voltage drop impact on power delivery networks for 3DICs, an analytical model is enhanced and applied to estimate the different noise levels of hierarchical TSV-based PDN structures.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
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