2015 journal article
A multitier study on various stacking topologies of TSV-based PDN systems using on-chip decoupling capacitor models
IEEE Transactions on Components Packaging and Manufacturing Technology, 5(4), 541–550.
2011 conference paper
Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-droop and resonant noise in 3DIC
Ieee conference on electrical performance of electronic packaging and, 267–270.