2015 journal article

A Multitier Study on Various Stacking Topologies of TSV-Based PDN Systems Using On-Chip Decoupling Capacitor Models

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 5(4), 541–550.

By: G. Charles & P. Franzon

author keywords: Back-to-back (B2B); face-to-back (F2B); face-to-face (F2F); on-chip decoupling capacitors; power distribution network (PDN); segmentation method; through silicon via (TSV)
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 conference paper

Comparison of TSV-based PDN-design effects using various stacking topology methods

Ieee conference on electrical performance of electronic packaging and, 83–86.

By: G. Charles & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2011 conference paper

Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-droop and resonant noise in 3DIC

Ieee conference on electrical performance of electronic packaging and, 267–270.

By: G. Charles, P. Franzon, J. Kim* & A. Levin*

Sources: NC State University Libraries, ORCID
Added: August 6, 2018