2015 journal article
A Multitier Study on Various Stacking Topologies of TSV-Based PDN Systems Using On-Chip Decoupling Capacitor Models
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 5(4), 541–550.
2012 conference paper
Comparison of TSV-based PDN-design effects using various stacking topology methods
Ieee conference on electrical performance of electronic packaging and, 83–86.
2011 conference paper
Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-droop and resonant noise in 3DIC
Ieee conference on electrical performance of electronic packaging and, 267–270.