Gary Charles

Charles, G., & Franzon, P. D. (2015). A Multitier Study on Various Stacking Topologies of TSV-Based PDN Systems Using On-Chip Decoupling Capacitor Models. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 5(4), 541–550. https://doi.org/10.1109/tcpmt.2015.2416196

Charles, G., & Franzon, P. (2012). Comparison of TSV-based PDN-design effects using various stacking topology methods. Ieee conference on electrical performance of electronic packaging and, 83–86. https://doi.org/10.1109/epeps.2012.6457848

Charles, G., Franzon, P., Kim, J., & Levin, A. (2011). Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-droop and resonant noise in 3DIC. Ieee conference on electrical performance of electronic packaging and, 267–270. https://doi.org/10.1109/epeps.2011.6100243