Works (4)

2021 journal article

3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules


By: H. Ke, U. Mehrotra & D. Hopkins

author keywords: Inductance; Multichip modules; Wires; Electronic packaging thermal management; Three-dimensional displays; Switches; Silicon carbide; Electronic packaging thermal management; finite element analysis; half bridge; inductance; multichip modules; multi sided cooling; power semiconductor devices; power electronics packaging; semiconductor device packaging; power module; phase-leg power module packaged; press fitting; 3-D prismatic power packaging; 3-D interconnection
Sources: Web Of Science, ORCID
Added: August 16, 2021

2017 journal article

Primary cilia are sensors of electrical field stimulation to induce osteogenesis of human adipose-derived stem cells

FASEB JOURNAL, 31(1), 346–355.

By: S. Cai n, J. Bodle*, P. Mathieu*, A. Amos*, M. Hamouda*, S. Bernacki*, G. McCarty*, E. Loboa n

author keywords: polycystin-1; intraflagellar protein-88; siRNA knockdown; signal transduction; calcium oscillations
Source: Web Of Science
Added: August 6, 2018

2016 conference paper

Design, package, and hardware verification of a high voltage current switch

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, 2016-May, 295–302.

By: A. De, A. Morgan, V. Iyer n, H. Ke, X. Zhao, K. Vechalapu, S. Bhattacharya, D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2015 conference paper

The first demonstration of symmetric blocking SiC gate turn-off (GTO) thyristor

2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD), 257–260.

Event: 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD)

Sources: NC State University Libraries, ORCID, Crossref
Added: August 6, 2018