Haotao Ke
Works (4)
2021 journal article
3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules
IEEE TRANSACTIONS ON POWER ELECTRONICS, 36(11), 13057–13066.
author keywords: Inductance; Multichip modules; Wires; Electronic packaging thermal management; Three-dimensional displays; Switches; Silicon carbide; Electronic packaging thermal management; finite element analysis; half bridge; inductance; multichip modules; multi sided cooling; power semiconductor devices; power electronics packaging; semiconductor device packaging; power module; phase-leg power module packaged; press fitting; 3-D prismatic power packaging; 3-D interconnection
www.lib.ncsu.edu (repository)
Sources: Web Of Science, ORCID
Added: August 16, 2021
2017 journal article
Primary cilia are sensors of electrical field stimulation to induce osteogenesis of human adipose-derived stem cells
FASEB JOURNAL, 31(1), 346–355.
author keywords: polycystin-1; intraflagellar protein-88; siRNA knockdown; signal transduction; calcium oscillations
Source: Web Of Science
Added: August 6, 2018
2016 conference paper
Design, package, and hardware verification of a high voltage current switch
Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, 2016-May, 295–302.
Sources: NC State University Libraries, ORCID
Added: August 6, 2018
2015 conference paper
The first demonstration of symmetric blocking SiC gate turn-off (GTO) thyristor
2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD), 257–260.
Event: 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD)
Sources: NC State University Libraries, ORCID, Crossref
Added: August 6, 2018
