Works (4)

Updated: July 5th, 2023 15:37

2021 journal article

3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules


By: H. Ke n, U. Mehrotra n & D. Hopkins n

author keywords: Inductance; Multichip modules; Wires; Electronic packaging thermal management; Three-dimensional displays; Switches; Silicon carbide; Electronic packaging thermal management; finite element analysis; half bridge; inductance; multichip modules; multi sided cooling; power semiconductor devices; power electronics packaging; semiconductor device packaging; power module; phase-leg power module packaged; press fitting; 3-D prismatic power packaging; 3-D interconnection
Sources: Web Of Science, ORCID
Added: August 16, 2021

2017 journal article

Primary cilia are sensors of electrical field stimulation to induce osteogenesis of human adipose-derived stem cells

FASEB JOURNAL, 31(1), 346–355.

By: S. Cai n, J. Bodle n, P. Mathieu n, A. Amos n, M. Hamouda n, S. Bernacki n, G. McCarty n, E. Loboa n

author keywords: polycystin-1; intraflagellar protein-88; siRNA knockdown; signal transduction; calcium oscillations
MeSH headings : Adipose Tissue / cytology; Biomarkers; Calcium / metabolism; Cell Survival; Cells, Cultured; Cilia / physiology; Electric Stimulation; Gene Expression Regulation / physiology; Humans; Osteogenesis / physiology; RNA Interference; RNA, Small Interfering; Stem Cells / physiology
Source: Web Of Science
Added: August 6, 2018

2016 conference paper

Design, package, and hardware verification of a high voltage current switch

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, 2016-May, 295–302.

Contributors: A. De n, A. Morgan n, V. Iyer n, H. Ke n, X. Zhao n, K. Vechalapu n, S. Bhattacharya n, D. Hopkins n

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2015 conference paper

The first demonstration of symmetric blocking SiC gate turn-off (GTO) thyristor

2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD), 257–260.

By: W. Sung n, A. Huang n, B. Baliga n, I. Ji n, H. Ke n & D. Hopkins n

Event: 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD)

Sources: NC State University Libraries, ORCID, Crossref
Added: August 6, 2018

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