@article{qin_dong_lee_2017, title={AC-pulse modulated electrohydrodynamic jet printing and electroless copper deposition for conductive microscale patterning on flexible insulating substrates}, volume={43}, url={http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000385603000021&KeyUID=WOS:000385603000021}, DOI={10.1016/j.rcim.2015.09.010}, journal={Robotics and Computer-Integrated Manufacturing}, author={Qin, H. T. and Dong, Jingyan and Lee, Yuan-Shin}, year={2017}, pages={179–187} }
 @article{qin_wei_dong_lee_2017, title={Direct printing and electrical characterization of conductive micro-silver tracks by alternating current-pulse modulated electrohydrodynamic jet printing}, volume={139}, url={http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000393881400008&KeyUID=WOS:000393881400008}, DOI={10.1115/1.4033903}, number={2}, journal={Journal of Manufacturing Science and Engineering}, author={Qin, H. T. and Wei, C. and Dong, Jingyan and Lee, Yuan-Shin}, year={2017} }
 @inproceedings{qin_cai_dong_lee_2016, title={Direct printing of capacitive touch sensors on flexible substrates by additive e-jet printing with silver nanoinks}, volume={139}, DOI={10.1115/msec2016-8740}, number={3}, booktitle={Proceedings of the ASME 11th International Manufacturing Science and Engineering Conference, 2016, vol 1}, author={Qin, H. T. and Cai, Y. and Dong, Jingyan and Lee, Yuan-Shin}, year={2016} }
 @article{wei_qin_chiu_lee_dong_2015, title={Drop-on-demand E-jet printing of continuous interconnects with AC-pulse modulation on highly insulating substrates}, volume={37}, url={http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000367698200008&KeyUID=WOS:000367698200008}, DOI={10.1016/j.jmsy.2014.07.005}, journal={Journal of Manufacturing Systems}, author={Wei, C. and Qin, H. T. and Chiu, C. P. and Lee, Yuan-Shin and Dong, Jingyan}, year={2015}, pages={505–510} }
 @inproceedings{qin_dong_lee_2015, title={Electrohydrodynamic jet printing of silver seeds: Micro scale patterning by electroless copper deposition}, DOI={10.1115/msec2015-9487}, booktitle={Proceedings of the ASME 10th International Manufacturing Science and Engineering Conference, 2015, vol 1}, author={Qin, H. T. and Dong, Jingyan and Lee, Yuan-Shin}, year={2015} }
 @inproceedings{qin_wei_dong_lee_2014, title={Direct fabrication of highly conductive micro silver tracks using electrohydrodynamic jet printing for sub-20 mu m micro-manufacturing}, volume={2}, url={http://www.scopus.com/inward/record.url?eid=2-s2.0-84908429027&partnerID=MN8TOARS}, DOI={10.1115/msec2014-4163}, booktitle={Proceedings of the ASME 9th International Manufacturing Science and Engineering Conference, 2014, vol 2}, author={Qin, H. T. and Wei, C. and Dong, Jingyan and Lee, Yuan-Shin}, year={2014} }
 @article{wei_qin_ramirez-iglesias_chiu_lee_dong_2014, title={High-resolution AC-pulse modulated electrohydrodynamic jet printing on highly insulating substrates}, volume={24}, url={http://www.scopus.com/inward/record.url?eid=2-s2.0-84897548526&partnerID=MN8TOARS}, DOI={10.1088/0960-1317/24/4/045010}, number={4}, journal={Journal of Micromechanics and Microengineering}, author={Wei, C. and Qin, H. T. and Ramirez-Iglesias, N. A. and Chiu, C. P. and Lee, Yuan-Shin and Dong, Jingyan}, year={2014} }