John M. Wilson

Karaguzel, B., Merritt, C. R., Kang, T., Wilson, J. M., Nagle, H. T., Grant, E., & Pourdeyhimi, B. (2009). Flexible, durable printed electrical circuits. JOURNAL OF THE TEXTILE INSTITUTE, 100(1), 1–9. https://doi.org/10.1080/00405000802390147

Chandrasekar, K., Wilson, J., Erickson, E., Feng, Z. P., Xu, J., Mick, S., & Franzon, P. (2008). Inductively coupled connectors and sockets for multi-Gb/s pulse signaling. IEEE Transactions on Advanced Packaging, 31(4), 749–758. https://doi.org/10.1109/tadvp.2008.2005465

Wylie, G., Zamora, F., Mulari, B. N., Reddy, B. R. E., L. S., W., J. D., W., … Culotta, A. M. (2008). Method and apparatus for a monodiameter wellbore, monodiameter casing, monobore, and/or monowell. Washington, DC: U.S. Patent and Trademark Office.

Karaguzel, B., Merritt, C. R., Kang, T., Wilson, J. M., Nagle, H. T., Grant, E., & Pourdeyhimi, B. (2008). Utility of nonwovens in the production of integrated electrical circuits via printing conductive inks. JOURNAL OF THE TEXTILE INSTITUTE, 99(1), 37–45. https://doi.org/10.1080/00405000701547748

Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007, May). Fully integrated AC coupled interconnect using buried bumps. IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 30, pp. 191–199. https://doi.org/10.1109/TADVP.2007.896920

Zhang, L., Wilson, J. M., Bashirullah, R., Luo, L., Xu, J., & Franzon, P. D. (2007). Voltage-mode driver preemphasis technique for on-chip global buses. IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 15(2), 231–236. https://doi.org/10.1109/TVLSI.2007.893588

Luo, L., Wilson, J. M., Mick, S. E., Xu, J., Zhang, L., & Franzon, P. D. (2006). 3 Gb/s AC Coupled Chip-to-Chip Communication Using a Low Swing Pulse Receiver. IEEE Journal of Solid-State Circuits, 41(1), 287–296. https://doi.org/10.1109/JSSC.2005.859881

Davis, W. R., Wilson, J., Mick, S., Xu, M., Hua, H., Mineo, C., … Franzon, P. D. (2005). Demystifying 3D ICs: The procs and cons of going vertical. IEEE DESIGN & TEST OF COMPUTERS, 22(6), 498–510. https://doi.org/10.1109/MDT.2005.136

Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October). AC coupled interconnect for dense 3-D ICs. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, Vol. 51, pp. 2156–2160. https://doi.org/10.1109/TNS.2004.834712

Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February). Buried bump and AC coupled interconnection technology. IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 121–125. https://doi.org/10.1109/TADVP.2004.825482

Franzon, P. D., Mick, S. E., & Wilson, J. M. Buried solder bumps for AC-coupled microelectronic interconnects. Washington, DC: U.S. Patent and Trademark Office.

Franzon, P. D., Mick, S. E., & Wilson, J. M. Inductively coupled electrical connectors. Washington, DC: U.S. Patent and Trademark Office.