@inproceedings{chandrasekar_wilson_erickson_feng_xu_mick_franzon_2008, title={Inductively coupled connectors and sockets for multi-Gb/s pulse signaling}, volume={31}, DOI={10.1109/tadvp.2008.2005465}, abstractNote={Multi-Gb/s pulse signaling is demonstrated with inductively coupled interconnects across packaging interfaces. This has application in realizing submillimeter pitch, true zero insertion force (ZIF) surface mount connectors, and sockets. The signaling data rate achieved in this system is from 1 to 8.5 Gbps, which depends on the 3-dB coupling frequency of the composite channel consisting of the inductive interconnections and the transmission lines. This paper presents the results of a set of experiments demonstrating this capability and describes the principles behind the design of inductively coupled sockets and connectors.}, number={4}, booktitle={IEEE Transactions on Advanced Packaging}, author={Chandrasekar, K. and Wilson, J. and Erickson, E. and Feng, Z. P. and Xu, J. and Mick, S. and Franzon, Paul}, year={2008}, pages={749–758} }
 @article{xu_mick_wilson_luo_chandrasekar_erickson_franzon_2004, title={AC coupled interconnect for dense 3-D ICs}, volume={51}, ISSN={["1558-1578"]}, DOI={10.1109/TNS.2004.834712}, abstractNote={This paper presents the potential application of AC coupled interconnect (ACCI) for dense three-dimensional (3-D) integrated circuits (ICs). The concept of inductive ACCI for 3-D ICs has been proposed. Combined with the "through vias" technology, inductive ACCI can provide small pitch vertical interconnects, as well as an excellent thermal solution for dense 3-D ICs. Transformer modeling and transceiver circuit design have also been investigated. Simulations predict that, for 20 /spl mu/m thinned die stacks coupled by a 100 /spl mu/m diameter transformer, the transceiver circuit fed with a 5 Gbps data stream consumes 14.5 mW power.}, number={5}, journal={IEEE TRANSACTIONS ON NUCLEAR SCIENCE}, author={Xu, J and Mick, S and Wilson, J and Luo, L and Chandrasekar, K and Erickson, E and Franzon, PD}, year={2004}, month={Oct}, pages={2156–2160} }
 @article{mohan_choi_mick_hart_chandrasekar_cangellaris_franzon_steer_2004, title={Causal reduced-order modeling of distributed structures in a transient circuit simulator}, volume={52}, ISSN={["1557-9670"]}, DOI={10.1109/TMTT.2004.834588}, abstractNote={Fosters' canonical representation of the transfer characteristic of a linear system is the key to causal fully convergent incorporation of distributed structures in transient circuit simulators. The implementation of the Foster's model in the fREEDA circuit simulator is reported and the modeling of a two-port coupled inductor is presented as an example.}, number={9}, journal={IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES}, author={Mohan, R and Choi, MJ and Mick, SE and Hart, FP and Chandrasekar, K and Cangellaris, AC and Franzon, PD and Steer, MB}, year={2004}, month={Sep}, pages={2207–2214} }