Ming-Hung Tsai

Works (6)

Updated: November 7th, 2023 15:01

2013 journal article

Dislocations with edge components in nanocrystalline bcc Mo

Journal of Materials Research, 28(13), 1820–1826.

By: G. Cheng n, W. Xu n, W. Jian n, H. Yuan n, M. Tsai n, Y. Zhu n , Y. Zhang *, P. Millett *

Contributors: G. Cheng n, W. Xu n, W. Jian n, H. Yuan n, M. Tsai n, Y. Zhu n , Y. Zhang *, P. Millett *

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 journal article

Morphology, structure and composition of precipitates in Al0.3CoCrCu0.5FeNi high-entropy alloy

INTERMETALLICS, 32, 329–336.

By: M. Tsai n, H. Yuan  n, G. Cheng n, W. Xu n, K. Tsai*, C. Tsai *, W. Jian n, C. Juan* ...

Contributors: M. Tsai n, H. Yuan  n, G. Cheng n, W. Xu n, K. Tsai*, C. Tsai *, W. Jian n, C. Juan* ...

author keywords: Precipitates; Microstructure; Widmanstatten morphology; Electron microscopy; transmission
Sources: Web Of Science, ORCID
Added: August 6, 2018

2013 journal article

Significant hardening due to the formation of a sigma phase matrix in a high entropy alloy

INTERMETALLICS, 33, 81–86.

By: M. Tsai n, H. Yuan n, G. Cheng n, W. Xu n, W. Jian n, M. Chuang*, C. Juan*, A. Yeh * ...

Contributors: M. Tsai n, H. Yuan n, G. Cheng n, W. Xu n, W. Jian n, M. Chuang*, C. Juan*, A. Yeh *, S. Lin *, Y. Zhu n 

author keywords: Age-hardening; Precipitates; Electron microscopy, transmission
Sources: Web Of Science, ORCID
Added: August 6, 2018

2013 journal article

Structure and properties of two Al-Cr-Nb-Si-Ti high-entropy nitride coatings

Surface & Coatings Technology, 221, 118–123.

By: M. Hsieh, M. Tsai, W. Shen & J. Yeh

Source: NC State University Libraries
Added: August 6, 2018

2011 journal article

Microstructure and wear behavior of Al(x)Co(1.5)CrFeNi(1.5)Ti(y) high-entropy alloys

Acta Materialia, 59(16), 6308–6317.

By: M. Chuang, M. Tsai, W. Wang, S. Lin & J. Yeh

Source: NC State University Libraries
Added: August 6, 2018

2011 journal article

Thermal stability and performance of NbSiTaTiZr high-entropy alloy barrier for copper metallization

Journal of the Electrochemical Society, 158(11), H1161–1165.

By: M. Tsai, C. Wang, C. Tsai, W. Shen, J. Yeh, J. Gan, W. Wu

Source: NC State University Libraries
Added: August 6, 2018

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