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Paul Franzon

Electrical & Computer Engineering

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Paul Franzon

Works (119)

Schabel, J. C., & Franzon, P. D. (2018). Exploring the Tradeoffs of Application-Specific Processing. IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 8(3), 531–542. https://doi.org/10.1109/JETCAS.2018.2849939

Source: NCSU Libraries

Sarkar, B., Mills, S., Lee, B., Pitts, W. S., Misra, V., & Franzon, P. D. (2018). On using the volatile mem-capacitive effect of TiO2 resistive random access memory to mimic the synaptic forgetting process. Journal of Electronic Materials, 47(2), 994–997.

Source: NCSU Libraries

Zhao, W. X., Gadfort, P., Bhanushali, K., & Franzon, P. D. (2018). RF-only logic: An area efficient logic family for RF-power harvesting applications. IEEE Transactions on Circuits and Systems. I, Regular Papers, 65(1), 406–418.

Source: NCSU Libraries

Srinivasan, V., Chowdhury, R. B. R., Forbes, E., Widialaksono, R., Zhang, Z. Q., Schabel, J., … Franzon, P. D. (2017). H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor. In 2017 ieee 35th international conference on computer design (iccd) (pp. 145–152).

Source: NCSU Libraries

Wyers, E. J., Qi, W. Y., & Franzon, P. D. (2017). A Robust calibration and supervised machine learning reliability framework for digitally-assisted self-healing RFICS. In 2017 ieee 60th international midwest symposium on circuits and systems (mwscas) (pp. 1138–1141).

Source: NCSU Libraries

Dey, S., & Franzon, P. D. (2016). Design and ASIC acceleration of cortical algorithm for text recognition (pp. 114–119).

Source: NCSU Libraries
Dey, S., & Franzon, P. D. (2016). Design and ASIC acceleration of cortical algorithm for text recognition (pp. 114–119).
Source: NCSU Libraries

Li, W. F., & Franzon, P. (2016). Hardware implementation of hierarchical temporal memory algorithm (pp. 133–138).

Source: NCSU Libraries
Li, W. F., & Franzon, P. (2016). Hardware implementation of hierarchical temporal memory algorithm (pp. 133–138).
Source: NCSU Libraries

Li, B. W., & Franzon, P. D. (2016). Machine learning in physical design. In Ieee conference on electrical performance of electronic packaging and (pp. 147–149).

Source: NCSU Libraries

Yan, Z., Aygun, K., Braunisch, H., & Franzon, P. D. (2016). Multimode high-density link design methodology and implementation. IEEE Transactions on Components Packaging and Manufacturing Technology, 6(8), 1251–1260.

Source: NCSU Libraries

Schabel, J., Baker, L., Dey, S., Li, W. F., & Franzon, P. D. (2016). Processor-in-memory support for artificial neural networks.

Source: NCSU Libraries

Nigussie, T., & Franzon, P. D. (2016). RDL and interposer design for DiRAM4 interfaces. In Ieee conference on electrical performance of electronic packaging and (pp. 17–19).

Source: NCSU Libraries

Harris, T. R., Pavlidis, G., Wyers, E. J., Newberry, D. M., Graham, S., Franzon, P., & Davis, W. R. (2016). Thermal raman and IR measurement of heterogeneous integration stacks. In Intersociety conference on thermal and thermomechanical phenomena in (pp. 1505–1510).

Source: NCSU Libraries

Wyers, E. J., Morton, M. A., Sollner, T. C. L. G., Kelley, C. T., & Franzon, P. D. (2016). A generally applicable calibration algorithm for digitally reconfigurable self-healing RFICS. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 24(3), 1151–1164.

Source: NCSU Libraries

Burr, G. W., & Franzon, P. (2015). Storage class memory. Emerging Nanoelectronic Devices, 498–510.

Source: NCSU Libraries

Charles, G., & Franzon, P. D. (2015). A multitier study on various stacking topologies of TSV-based PDN systems using on-chip decoupling capacitor models. IEEE Transactions on Components Packaging and Manufacturing Technology, 5(4), 541–550.

Source: NCSU Libraries

Chen, X., Zhu, T., Davis, W. R., & Franzon, P. D. (2014). Adaptive and reliable clock distribution design for 3-D integrated circuits. IEEE Transactions on Components Packaging and Manufacturing Technology, 4(11), 1862–1870.

Source: NCSU Libraries

Sarkar, B., Ramanan, N., Jayanti, S., Di Spigna, N., Lee, B., Franzon, P., & Misra, V. (2014). Dual floating gate unified memory MOSFET with simultaneous dynamic and non-volatile operation. IEEE Electron Device Letters, 35(1), 48–50.

Source: NCSU Libraries

Gadfort, P., & Franzon, P. D. (2014). Millimeter-scale true 3-D antenna-in-package structures for near-field power transfer. IEEE Transactions on Components Packaging and Manufacturing Technology, 4(10), 1574–1581.

Source: NCSU Libraries

Priyadarshi, S., Davis, W. R., & Franzon, P. D. (2014). Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC.

Source: NCSU Libraries

Priyadarshi, S., Davis, W. R., Steer, M. B., & Franzon, P. D. (2014). Thermal pathfinding for 3-D ICs. IEEE Transactions on Components Packaging and Manufacturing Technology, 4(7), 1159–1168.

Source: NCSU Libraries

Bapat, O. A., Franzon, P. D., & Fastow, R. M. (2014). A generic and scalable architecture for a large acoustic model and large vocabulary speech recognition accelerator using logic on memory. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 22(12), 2701–2712.

Source: NCSU Libraries

Yan, Z., Franzon, P. D., Aygun, K., & Braunisch, H. (2013). Circuit/channel co-design methodology for multimode signaling (pp. 1356–1361).

Source: NCSU Libraries

Kim, H., Won, C., & Franzon, P. D. (2013). Crosstalk-canceling multimode interconnect using transmitter encoding. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 21(8), 1562–1567.

Source: NCSU Libraries

Suh, E. J., & Franzon, P. D. (2013). Design of 60 GHz contact less probe system for RDL in passive silicon interposer. In 2013 ieee international 3d systems integration conference (3dic).

Source: NCSU Libraries

Tshibangu, N. M., Franzon, P. D., Rotenberg, E., & Davis, W. R. (2013). Design of controller for L2 cache mapped in Tezzaron stacked DRAM. In 2013 ieee international 3d systems integration conference (3dic).

Source: NCSU Libraries

Franzon, P. D., Priyadarshi, S., Lipa, S., Davis, W. R., & Thorolfsson, T. (2013). Exploring early design tradeoffs in 3DIC. In 2013 ieee international symposium on circuits and systems (iscas) (pp. 545–549).

Source: NCSU Libraries

Zhang, Z. Q., Noia, B., Chakrabarty, K., & Franzon, P. (2013). Face-to-face bus design with built-in self-test in 3D ICS. In 2013 ieee international 3d systems integration conference (3dic).

Source: NCSU Libraries

Priyadarshi, S., Choudhary, N., Dwiel, B., Upreti, A., Rotenberg, E., Davis, R., & Franzon, P. (2013). Hetero(2) 3d integration: A scheme for optimizing efficiency/cost of chip multiprocessors. In Proceedings of the fourteenth international symposium on quality electronic design (ISQED 2013) (pp. 1–7).

Source: NCSU Libraries

Sarkar, B., Jayanti, S., Di Spigna, N., Lee, B., Misra, V., & Franzon, P. (2013). Investigation of intermediate dielectric for dual floating gate MOSFET.

Source: NCSU Libraries

Franzon, P. D. (2013). MOOCs, OOCs, flips and hybrids: The new world of higher education. In Proceedings ieee international conference on microelectronic systems (pp. 13–13).

Source: NCSU Libraries

Karim, M. A., Franzon, P. D., & Kumar, A. (2013). Power comparison of 2D, 3D and 2.5D interconnect solutions and power optimization of interposer interconnects (pp. 860–866).

Source: NCSU Libraries

Zhang, Z. Q., & Franzon, P. (2013). TSV-based, modular and collision detectable face-to-back shared bus design. In 2013 ieee international 3d systems integration conference (3dic).

Source: NCSU Libraries

Franzon, P., & Bar-Cohen, A. (2013). Thermal requirements in future 3d processors. In 2013 ieee international 3d systems integration conference (3dic).

Source: NCSU Libraries

Zhu, T., Yelten, M. B., Steer, M. B., & Franzon, P. D. (2013). Variation-aware circuit macromodeling and design based on surrogate models. In Simulation and modeling methodologies, technologies and applications (Vol. 197, pp. 255–269).

Source: NCSU Libraries

Wyers, E. J., Steer, M. B., Kelley, C. T., & Franzon, P. D. (2013). A bounded and discretized Nelder-Mead algorithm suitable for RFIC calibration. IEEE Transactions on Circuits and Systems. I, Regular Papers, 60(7), 1787–1799.

Source: NCSU Libraries

Zhao, W. X., Gadfort, P., Erickson, E., & Franzon, P. D. (2013). A compact inductively coupled connector for mobile devices (pp. 2385–2390).

Source: NCSU Libraries

Yelten, M. B., Franzon, P. D., & Steer, M. B. (2012). Analog negative-bias-temperature-instability monitoring circuit. IEEE Transactions on Device and Materials Reliability, 12(1), 177–179.

Source: NCSU Libraries

Lou, Y., Yan, Z., Zhang, F., & Franzon, P. D. (2012). Comparing through-silicon-via (TSV) void/pinhole defect self-test methods. Journal of Electronic Testing : Theory and Applications, 28(1), 27–38.

Source: NCSU Libraries

Charles, G., & Franzon, P. D. (2012). Comparison of TSV-based PDN-design effects using various stacking topology methods. In Ieee conference on electrical performance of electronic packaging and (pp. 83–86).

Source: NCSU Libraries

Yelten, M. B., Franzon, P. D., & Steer, M. B. (2012). Comparison of modeling techniques in circuit variability analysis. International Journal of Numerical Modelling, 25(3), 288–302.

Source: NCSU Libraries

Gadfort, P., & Franzon, P. D. (2012). Design, modeling, and fabrication of mm(3) three-dimensional integrated antennas (pp. 1794–1799).

Source: NCSU Libraries

Melamed, S., Thorolfsson, T., Harris, T. R., Priyadarshi, S., Franzon, P., Steer, M. B., & Davis, W. R. (2012). Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.

Source: NCSU Libraries

Gadfort, P., & Franzon, P. D. (2012). Near threshold RF-only analog to digital converter.

Source: NCSU Libraries

Priyadarshi, S., Saunders, C. S., Kriplani, N. M., Demircioglu, H., Davis, W. R., Franzon, P. D., & Steer, M. B. (2012). Parallel transient simulation of multiphysics circuits using delay-based partitioning. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(10), 1522–1535.

Source: NCSU Libraries

Yelten, M. B., Franzon, P. D., & Steer, M. B. (2012). Process mismatch analysis based on reduced-order models. In 2012 13th international symposium on quality electronic design (isqed) (pp. 648–655).

Source: NCSU Libraries

Yan, Z., Won, C. Y., Franzon, P. D., Aygun, K., & Braunisch, H. (2012). S-parameter based multimode signaling. In Ieee conference on electrical performance of electronic packaging and (pp. 11–14).

Source: NCSU Libraries

Zhu, T., Steer, M. B., & Franzon, P. D. (2012). Surrogate model-based self-calibrated design for process and temperature compensation in analog/RF circuits. IEEE Design & Test of Computers, 29(6), 74–83.

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Thorolfsson, T., Lipa, S., & Franzon, P. D. (2012). A 10.35 mW/GFlop Stacked SAR DSP unit using fine-grain partitioned 3D integration. In 2012 ieee custom integrated circuits conference (cicc).

Source: NCSU Libraries

Chakraborti, P., Toprakci, H. A. K., Yang, P., Di Spigna, N., Franzon, P., & Ghosh, T. (2012). A compact dielectric elastomer tubular actuator for refreshable Braille displays. Sensors and Actuators. A, Physical, 179, 151–157. https://doi.org/10.1016/j.sna.2012.02.004

Source: NCSU Libraries

Harris, T. R., Priyadarshi, S., Melamed, S., Ortega, C., Manohar, R., Dooley, S. R., … Steer, M. B. (2012). A transient electrothermal analysis of three-dimensional integrated circuits. IEEE Transactions on Components Packaging and Manufacturing Technology, 2(4), 660–667.

Source: NCSU Libraries

Ledford, J., Gadfort, P., & Franzon, P. D. (2012). An analysis of subthreshold SRAM bitcells for operation in low power RF-only technologies.

Source: NCSU Libraries

Franzon, P. D., Davis, W. R., Thorolfsson, T., & Melamed, S. (2011). 3D specific systems: Design and CAD. In 2011 20th asian test symposium (ats) (pp. 470–473).

Source: NCSU Libraries

Zhu, T., Steer, M. B., & Franzon, P. D. (2011). Accurate and scalable IO buffer macromodel based on surrogate modeling. IEEE Transactions on Components Packaging and Manufacturing Technology, 1(8), 1240–1249.

Source: NCSU Libraries

Chen, X., Davis, W. R., & Franzon, P. D. (2011). Adaptive clock distribution for 3D integrated circuits. In Ieee conference on electrical performance of electronic packaging and (pp. 91–94).

Source: NCSU Libraries

Charles, G., Franzon, P. D., Kim, J., & Levin, A. (2011). Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-droop and resonant noise in 3DIC. In Ieee conference on electrical performance of electronic packaging and (pp. 267–270).

Source: NCSU Libraries

Schinke, D., Di Spigna, N., Shiveshwarkar, M., & Franzon, P. (2011). Computing with novel floating-gate devices. Computer, 44(2), 29–36.

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Thorolfsson, T., Moezzi-Madani, N., & Franzon, P. D. (2011). Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor. IET Computers and Digital Techniques, 5(3), 198–204.

Source: NCSU Libraries

Schinke, D., Priyadarshi, S., Pitts, W. S., Di Spigna, N., & Franzon, P. (2011). SPICE-compatible physical model of nanocrystal floating gate devices for circuit simulation. IET Circuits Devices & Systems, 5(6), 477–483.

Source: NCSU Libraries

Yelten, M. B., Franzon, P. D., & Steer, M. B. (2011). Surrogate-model-based analysis of analog circuits-part I: Variability analysis. IEEE Transactions on Device and Materials Reliability, 11(3), 466–473.

Source: NCSU Libraries

Yelten, M. B., Franzon, P. D., & Steer, M. B. (2011). Surrogate-model-based analysis of analog circuits-part II: Reliability analysis. IEEE Transactions on Device and Materials Reliability, 11(3), 458–465.

Source: NCSU Libraries

Choi, Y. J., Braunisch, H., Aygun, K., & Franzon, P. D. (2010). Multimode transceiver for high-density interconnects: Measurement and validation. In 2010 proceedings 60th electronic components and technology conference (ectc) (pp. 1733–1738).

Source: NCSU Libraries

Di Spigna, N., Chakraborti, P., Winick, D., Yang, P., Ghosh, T., & Franzon, P. (2010). The integration of novel EAP-based Braille cells for use in a refreshable tactile display. In Electroactive polymer actuators and devices (eapad) 2010 (Vol. 7642).

Source: NCSU Libraries

Davis, W. R., Oh, E. C., Sule, A. M., & Franzon, P. D. (2009). Application exploration for 3-D integrated circuits: TCAM, FIFO, and FFT case studies. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(4), 496–506. https://doi.org/10.1109/TVLSI.2008.2009352

Source: NCSU Libraries

Zhu, T., & Franzon, P. D. (2009). Application of surrogate modeling to generate compact and PVT-sensitive IBIS models (pp. 77–80).

Source: NCSU Libraries

Thorolfsson, T., Melamed, S., Charles, G., & Franzon, P. D. (2009). Comparative analysis of two 3D integration implementations of a SAR processor (pp. 25–28).

Source: NCSU Libraries

He, T., Corley, D. A., Lu, M., Di Spigna, N. H., He, J. L., Nackashi, D. P., … Tour, J. M. (2009). Controllable molecular modulation of conductivity in silicon-based devices. Journal of the American Chemical Society, 131(29), 10023–10030. https://doi.org/10.1021/ja9002537

Source: NCSU Libraries

Melamed, S., Thorolfsson, T., Srinivasan, A., Cheng, E., Franzon, P., & Davis, R. (2009). Junction-level thermal extraction and simulation of 3DICs (pp. 395–401).

Source: NCSU Libraries

Gadfort, P., & Franzon, P. D. (2009). Low-power self-equalizing driver for silicon carrier interconnects with low bit error rate (pp. 37–40).

Source: NCSU Libraries

Erickson, E., Wilson, J., Chandrasekar, K., & Franzon, P. D. (2009). Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors (pp. 121–124).

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Kumar, P., Reinitz, H. W., Simunovic, J., Sandeep, K. P., & Franzon, P. D. (2009). Overview of RFID technology and Its applications in the food industry. Journal of Food Science, 74(8), R101–106.

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Oh, E. C., & Franzon, P. D. (2009). Technology impact analysis for 3D TCAM (pp. 206–210).

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Tsai, M. L., Klooz, A., Leonard, A., Appel, J., & Franzon, P. (2009). Through silicon Via(TSV) defect/pinhole self test circuit for 3D-IC (pp. 170–177).

Source: NCSU Libraries

Zhang, L., Wilson, J. M., Bashirullah, R., Luo, L., Xu, J., & Franzon, P. D. (2009). A 32-Gb/s on-chip bus with driver pre-emphasis signaling. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(9), 1267–1274. https://doi.org/10.1109/TVLSI.2008.2002682

Source: NCSU Libraries

Thorolfsson, T., Moezzi-Madani, N., & Franzon, P. D. (2009). A low power 3D integrated FFT engine using hypercube memory division (pp. 231–236).

Source: NCSU Libraries

Zhu, T., & Franzon, P. D. (2009). An enhanced macromodeling approach for differential output drivers (pp. 54–59).

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Canavero, F., & Franzon, P. D. (2008). Foreword special section on electrical performance analysis and simulation of interconnects, packages and devices composing electronic systems for high-performance applications. IEEE Transactions on Advanced Packaging, 31(4), 662–663.

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Varma, A. K., Steer, M., & Franzon, P. D. (2008). Improving behavioral IO buffer modeling based on IBIS (Vol. 31, pp. 711–721).

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Chandrasekar, K., Wilson, J., Erickson, E., Feng, Z. P., Xu, J., Mick, S., & Franzon, P. (2008). Inductively coupled connectors and sockets for multi-Gb/s pulse signaling (Vol. 31, pp. 749–758).

Source: NCSU Libraries

He, T., Lu, M., Yao, J., He, J. L., Chen, B., Di Spigna, N. H., … Tour, J. M. (2008). Reversible modulation of conductance in silicon devices via UV/visible-light irradiation. Advanced Materials, 20(23), 4541–4546. https://doi.org/10.1002/adma.200703084

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Xie, Y., Cong, J., & Franzon, P. (2008). Special issue on 3D integrated circuits and microarchitectures. ACM Journal on Emerging Technologies in Computing Systems, 4(4).

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Blum, A. S., Soto, C. M., Wilson, C. D., Amsinck, C., Franzon, P., & Ratna, B. R. (2007). Electronic properties of molecular memory circuits on a nanoscale scaffold. IEEE Transactions on Nanobioscience, 6(4), 270–274. https://doi.org/10.1109/TNB.2007.908978

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Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007). Fully integrated AC coupled interconnect using buried bumps. IEEE Transactions on Advanced Packaging, 30(2), 191–199. https://doi.org/10.1109/TADVP.2007.896920

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Yuce, M. R., Liu, W. T., Damiano, J., Bharath, B., Franzon, P. D., & Dogan, N. S. (2007). SOI CMOS implementation of a multirate PSK demodulator for space communications. IEEE Transactions on Circuits and Systems. I, Regular Papers, 54(2), 420–431. https://doi.org/10.1109/TCSI.2006.885988

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Sonkusale, S. R., Di Spigna, N. H., & Franzon, P. D. (2007). Uniformity analysis of wafer scale sub-25 nm wide nanowire array nanoimprint mold fabricated by PEDAL process. Microelectronic Engineering, 84(5-8), 1523–1527. https://doi.org/10.1016/j.mee.2007.01.210

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Zhang, L., Wilson, J. M., Bashirullah, R., Luo, L., Xu, J., & Franzon, P. D. (2007). Voltage-mode driver preemphasis technique for on-chip global buses. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 15(2), 231–236. https://doi.org/10.1109/TVLSI.2007.893588

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He, T., He, J. L., Lu, M., Chen, B., Pang, H., Reus, W. F., … Tour, J. M. (2006). Controlled modulation of conductance in silicon devices by molecular monolayers. Journal of the American Chemical Society, 128(45), 14537–14541. https://doi.org/10.1021/ja063571l

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Di Spigna, N. H., Nackashi, D. P., Amsinck, C. J., Sonkusale, S. R., & Franzon, P. D. (2006). Deterministic nanowire fanout and interconnect without any critical translational alignment. IEEE Transactions on Nanotechnology, 5(4), 356–361. https://doi.org/10.1109/TNANO.2006.876926

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Mehrotra, P., & Franzon, P. D. (2006). Methods and systems for fast packet forwarding.

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Kriplani, N. M., Nackashi, D. P., Amsinck, C. J., Di Spigna, N. H., Steer, M. B., Franzon, P. D., … Reimers, J. R. (2006). Physically based molecular device model in a transient circuit simulator. Chemical Physics, 326(1), 188–196. https://doi.org/10.1016/j.chemphys.2006.03.003

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Franzon, P. D., Mick, S. E., & Wilson, J. M. (2005). Buried solder bumps for AC-coupled microelectronic interconnects.

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Varma, A. K., Glaser, A., & Franzon, P. D. (2005). CAD flows for chip-package coverification. IEEE Transactions on Advanced Packaging, 28(1), 96–101. https://doi.org/10.1109/TADVP.2004.841475

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Davis, W. R., Wilson, J., Mick, S., Xu, M., Hua, H., Mineo, C., … Franzon, P. D. (2005). Demystifying 3D ICs: The procs and cons of going vertical. IEEE Design & Test of Computers, 22(6), 498–510. https://doi.org/10.1109/MDT.2005.136

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Sonkusale, S. R., Amsinck, C. J., Nackashi, D. P., Di Spigna, N. H., Barlage, D., Johnson, M., & Franzon, P. D. (2005). Fabrication of wafer scale, aligned sub-25 nm nanowire and nanowire templates using planar edge defined alternate layer process. Physica. E, Low-Dimensional Systems & Nanostructures, 28(2), 107–114. https://doi.org/10.1016/j.physe.2005.01.010

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Franzon, P. D., Mick, S. E., & Wilson, J. M. (2005). Inductively coupled electrical connectors.

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Mehrotra, P., & Franzon, P. D. (2005). Methods and systems for fast binary network address lookups using parent node information stored in routing table entries.

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Mehrotra, P., Rao, V., Conte, T. M., & Franzon, P. D. (2005). Optimal chip-package codesign for high-performance DSP. IEEE Transactions on Advanced Packaging, 28(2), 288–297. https://doi.org/10.1109/TADVP.2005.846937

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Amsinck, C. J., Di Spigna, N. H., Nackashi, D. P., & Franzon, P. D. (2005). Scaling constraints in nanoelectronic random-access memories. Nanotechnology, 16(10), 2251–2260. https://doi.org/10.1088/0957-4484/16/10/047

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Nath, J., Ghosh, D., Fathelbab, W., Maria, J.-P., Kingon, A. I., Franzon, P. D., & Steer, M. B. (2005). A tunable combline bandpass filter using thin film barium strontium titanate interdigital varactors on an alumina substrate. In Proceedings of the IEEE MTT-S International Microwave Symposium, June 12-17, 2005, Long Beach, CA (pp. 595–598).

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Nath, J., Ghosh, D., Maria, J. P., Kingon, A. I., Fathelbab, W., Franzon, P. D., & Steer, M. B. (2005). An electronically tunable microstrip bandpass filter using thin-film barium-strontium-titanate (BST) varactors. IEEE Transactions on Microwave Theory and Techniques, 53(9), 2707–2712. https://doi.org/10.1109/TMTT.2005.854196

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Blum, A. S., Soto, C. M., Wilson, C. D., Brower, T. L., Pollack, S. K., Schull, T. L., … Ratna, B. R. (2005). An engineered virus as a scaffold for three-dimensional self-assembly on the nanoscale. Small (Weinheim An Der Bergstrasse, Germany), 1(7), 702–706. https://doi.org/10.1002/smll.200500021

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Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004). AC coupled interconnect for dense 3-D ICs. IEEE Transactions on Nuclear Science, 51(5), 2156–2160. https://doi.org/10.1109/TNS.2004.834712

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Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004). Buried bump and AC coupled interconnection technology. IEEE Transactions on Advanced Packaging, 27(1), 121–125. https://doi.org/10.1109/TADVP.2004.825482

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Mohan, R., Choi, M. J., Mick, S. E., Hart, F. P., Chandrasekar, K., Cangellaris, A. C., … Steer, M. B. (2004). Causal reduced-order modeling of distributed structures in a transient circuit simulator. IEEE Transactions on Microwave Theory and Techniques, 52(9), 2207–2214. https://doi.org/10.1109/TMTT.2004.834588

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Schaffer, T., Glaser, A., & Franzon, P. D. (2004). Chip-package co-implementation of a triple DES processor. IEEE Transactions on Advanced Packaging, 27(1), 194–202. https://doi.org/10.1109/TADVP.2004.824944

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Seminario, J. M., Ma, Y. F., Agapito, L. A., Yan, L. M., Araujo, R. A., Bingi, S., … Tour, J. M. (2004). Clustering effects on discontinuous gold film NanoCells. Journal of Nanoscience and Nanotechnology, 4(7), 907–917. https://doi.org/10.1166/jnn.2004.104

Source: NCSU Libraries

Scheffler, M., Franzon, P. D., & Troster, G. (2004). A defect level versus cost system tradeoff for electronics manufacturing. IEEE Transactions on Electronics Packaging Manufacturing, 27(1), 67–76. https://doi.org/10.1109/TEPM.2004.830513

Source: NCSU Libraries

Nath, J., Ghosh, D., Fathelbab, W., Maria, J.-P., Kingon, A. I., Franzon, P. D., & Steer, M. B. (2004). A tunable combline bandpass filter using thin film barium strontium titanate (BST). In Proceedings of the 2004 Asia Pacific Microwave Conference, New Delhi (pp. 939–940).

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Palmer, J. A., Dessent, B., Mulling, J. F., Usher, T., Grant, E., Eischen, J. W., … Franzon, P. D. (2004). The design and characterization of a novel piezoelectric transducer-based linear motor. IEEE/ASME Transactions on Mechatronics, 9(2), 392–398. https://doi.org/10.1109/TMECH.2004.828647

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Stan, M. R., Franzon, P. D., Goldstein, S. C., Lach, J. C., & Ziegler, M. M. (2003). Molecular electronics: From devices and interconnect to circuits and architecture. Proceedings of the IEEE, 91(11), 1940–1957. https://doi.org/10.1109/JPROC.2003.818327

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Tour, J. M., Cheng, L., Nackashi, D. P., Yao, Y. X., Flatt, A. K., St Angelo, S. K., … Franzon, P. D. (2003). NanoCell electronic memories. Journal of the American Chemical Society, 125(43), 13279–13283. https://doi.org/10.1021/ja036369g

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Tour, J. M., Van Zandt, W. L., Husband, C. P., Husband, S. M., Wilson, L. S., Franzon, P. D., & Nackashi, D. P. (2002). Nanocell logic gates for molecular computing. IEEE Transactions on Nanotechnology, 1(2), 100–109. https://doi.org/10.1109/TNANO.2002.804744

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Mulling, J., Usher, T., Dessent, B., Palmer, J., Franzon, P., Grant, E., & Kingon, A. (2001). Load characterization of high displacement piezoelectric actuators with various end conditions. Sensors and Actuators. A, Physical, 94(1-2), 19–24. https://doi.org/10.1016/S0924-4247(01)00688-4

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Gahide, S., Hodge, G., Seyam, A., Oxenham, W., & Franzon, P. (2001). Smart sensors to monitor warp tension and breaks on a loom.

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Gahide, S., Seyam, A., Hodge, G., Oxenham, W., & Franzon, P. (2000). Application of micromachines to textiles: Using smart sensors to monitor warp tension and breaks during formation of woven fabrics. In Proceedings of the International Mechanical Engineering Congress & Exposition, ASME, Orlando (FL), November 2000.

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Gahide, S., Seyam, A., Hodge, G., Oxenham, W., & Franzon, P. (2000). Micromachines and textiles: Matching two industries. Textile Asia, 31, 58–66.

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Gahide, S., Hodge, G., Oxenham, W., Seyam, A. M., & Franzon, P. D. (2000). Micromachines and textiles: Matching two industries. In Manchester 2000 CD-ROM: Papers from the 2000 Annual (80th) World Conference of The Textile Institute. April 16-19, 2000.
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Smith, D. R., & Franzon, P. D. (2000). Verilog styles for synthesis of digital systems. Upper Saddle River, NJ: Prentice Hall.

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Lo, H. L., Kauffman, J. F., & Franzon, P. D. (1999). High frequency loss and electromagnetic field distribution for striplines and microstrips. IEEE Transactions on Advanced Packaging, 22(1), 16–25. https://doi.org/10.1109/6040.746538

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Al-Sarawi, S. F., Abbott, D., & Franzon, P. D. (1998). A review of 3-D packaging technology. IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, 21(1), 2–14. https://doi.org/10.1109/96.659500

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Hsieh, H. Y., Liu, W. T., Franzon, P. D., & Cavin, R. (1997). Clocking optimization and distribution in digital systems with scheduled skews. Journal of VLSI Signal Processing Systems for Signal Image and Video Technology, 16(2-3), 131–147. https://doi.org/10.1023/A:1007934922990

Source: NCSU Libraries