Works (393)
Updated: April 4th, 2024 10:02
2023 journal article
A Deep Transfer Learning Design Rule Checker With Synthetic Training
IEEE DESIGN & TEST, 40(1), 77–84.
author keywords: Layout; Design methodology; Convolutional neural networks; Transfer learning; Generators; Deep learning; Manuals; Training data; Design Rule Checking; Machine Learning; IC Verification; Physical Verification; Convolutional Neural Network; Deep Learning; Synthetic Data Training; Transfer Learning
Sources: ORCID, Web Of Science, NC State University Libraries
Added: January 24, 2023
2023 article
Chiplet Set For Artificial Intelligence
2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC.
author keywords: ASIP; chiplet; AI accelerator; AIB
TL;DR:
This paper presents a chipletized design used for Artificial Intelligence, which details a scalable AI chiplet set, along with Central Processing Units (CPUs), and focuses on phase one, which uses the United Semiconductor Japan Co. (USJC) 55 nm LP process to fabricate the design.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 14, 2023
2023 article
Generative Multi-Physics Models for System Power and Thermal Analysis Using Conditional Generative Adversarial Networks
2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPS.
author keywords: Power integrity; thermal analysis; digital twins; GAN; multi-physics; co-simulation
TL;DR:
A novel way of using a class of deep learning algorithms called conditional GANs (cGANs) to efficiently model the power/thermal co-simulation task using generative models that can predict unseen simulation conditions is described.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: January 2, 2024
2023 article
System Aware Floorplanning for Chip-Package Co-design
2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPS.
author keywords: Floorplanning; Chip-package co-design
TL;DR:
A new floorplanning solution based on a novel floorplan model that more closely depicts the design challenges imposed by modern SoC system constraints is presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
11. Sustainable Cities and Communities
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: January 2, 2024
2023 conference paper
Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package
2023 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2023 IEEE International 3D Systems Integration Conference (3DIC).
Event: 2023 IEEE International 3D Systems Integration Conference (3DIC)
author keywords: GaN power module; thermal reliability; mechanical stress; fatigue life prediction; finite element analysis
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries, Crossref
Added: July 3, 2023
2023 article
Thermal Estimation for 3D-ICs through Generative Networks
2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC.
author keywords: 3DIC; thermal; generative; GAN; hybrid-bonding
TL;DR:
This paper presents a generative approach for modeling the power to heat dissipation for a 3DIC and shows that, given the power map, the model can generate the resultant heat for the bulk, opening the door for thermally aware floorplanning.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 14, 2023
2022 journal article
Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 30(9), 1230–1243.
author keywords: Split-manufacturing; partitioning; design obfuscation; hybrid bonding; 3-D integrated circuit (3DIC)
TL;DR:
The results show that it should take more than 10 years to reconstruct the netlist using a brute-force attack if an adversary obtains either the fabricated wafers or their GDS.
(via Semantic Scholar)
Sources: ORCID, Web Of Science, NC State University Libraries
Added: August 15, 2022
2022 article
FAXID: FPGA-Accelerated XGBoost Inference for Data Centers using HLS
2022 IEEE 30TH INTERNATIONAL SYMPOSIUM ON FIELD-PROGRAMMABLE CUSTOM COMPUTING MACHINES (FCCM 2022), pp. 113–121.
TL;DR:
An FPGA-based XGBoost accelerator designed with High-Level Synthesis (HLS) tools and design flow accelerating binary classification inference is showcased, showing a latency speedup of the proposed design over state-of-art CPU and GPU implementations, including energy efficiency and cost-effectiveness.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
3. Good Health and Well-being
(Web of Science)
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries, ORCID
Added: October 11, 2022
2022 journal article
Hardware Implementation of Hierarchical Temporal Memory Algorithm
ACM JOURNAL ON EMERGING TECHNOLOGIES IN COMPUTING SYSTEMS, 18(1).
author keywords: Hierarchical temporal memory (HTM); ASIC design; distributed memory; KTH benchmark
TL;DR:
Hierarchical temporal memory is an un-supervised machine learning algorithm that can learn both spatial and temporal information of input that has been successfully applied to multiple areas.
(via Semantic Scholar)
dl.acm.org (publisher PDF)
UN Sustainable Development Goal Categories
11. Sustainable Cities and Communities
(Web of Science)
Source: Web Of Science
Added: January 23, 2023
2022 article
High Dimensional Optimization for Electronic Design
MLCAD '22: PROCEEDINGS OF THE 2022 ACM/IEEE 4TH WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD), pp. 153–157.
author keywords: Electronic Design Automation (EDA); High Dimensions; Bayesian Optimization; Random Embeddings; Local Inspection; Analog Circuits
TL;DR:
IC-REMBO improves the effectiveness and efficiency of the Random EMbedding Bayesian Optimization (REMBO) approach, which is a state-of-the-art high dimensional optimization method and is the first time applying REMBO or inspection method to electronic design.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: October 31, 2022
2022 article
Modeling of Adaptive Receiver Performance Using Generative Adversarial Networks
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), pp. 1958–1963.
author keywords: SerDes; receiver; behavior modeling; adaptive; generative; GAN; DFE; IBIS-AMI
TL;DR:
A data-driven approach to modeling a high-speed serializer/deserializer (SerDes) receiver through generative adversarial networks (GANs) through the use of a discriminator structure that improves the training to generate a contour plot that makes it difficult to distinguish the ground truth.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
3. Good Health and Well-being
(Web of Science)
10. Reduced Inequalities
(OpenAlex)
Sources: Web Of Science, NC State University Libraries, ORCID
Added: September 19, 2022
2022 article
RxGAN: Modeling High-Speed Receiver through Generative Adversarial Networks
MLCAD '22: PROCEEDINGS OF THE 2022 ACM/IEEE 4TH WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD), pp. 167–172.
Contributors: P. Kashyap n
author keywords: SerDes; receiver; behavior modeling; adaptive; generative; measurement; GAN; DFE; IBIS-AMI
TL;DR:
This work proposes a data-driven approach using generative adversarial training to model a real-world receiver with varying DFE and CTLE configurations while handling different channel conditions and bitstreams.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries, ORCID
Added: October 31, 2022
2021 journal article
2Deep: Enhancing Side-Channel Attacks on Lattice-Based Key-Exchange via 2-D Deep Learning
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 40(6), 1217–1229.
author keywords: Resistance; Performance evaluation; Deep learning; Protocols; Power measurement; Side-channel attacks; NIST; Cross-device; data-augmentation; deep learning (DL); lattice-based key-exchange protocols; power side channels
TL;DR:
2Deep—a deep-learning (DL)-based SCA—targeting parallelized implementations of PQKE protocols, namely, Frodo and NewHope with data augmentation techniques are proposed, exploring approaches that convert 1-D time-series power measurement data into 2-D images to formulate SCA an image recognition task.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries, ORCID
Added: June 10, 2021
2021 journal article
A 125 mu m x 245 mu m Mainly Digital UHF EPC Gen2 Compatible RFID Tag in 55 nm CMOS Process
IEEE JOURNAL OF RADIO FREQUENCY IDENTIFICATION, 5(3), 317–323.
author keywords: UHF Gen2 RFID; passive; chip asset tracking; obscuration; RF-only
TL;DR:
This paper presents a compact and largely digital UHF EPC Gen2-compatible RFID implemented using digital IP blocks that are easily portable and suitable for cost-sensitive applications, and as embedded RFIDs for tagging counterfeit Integrated Circuits.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(Web of Science; OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: September 13, 2021
2021 article
A Review of 3D-Dynamic Random-Access Memory based Near-Memory Computation
2021 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC).
author keywords: near-memory computation; hardware accelerators; neural network; processing-in-memory; survey; 3D-IC; memory accelerator; comparison; hybrid-memory-cube
TL;DR:
This paper analyzes a few critical NMC architecture implementations, specifically those with 3D-Stacked DRAM memory, and organized a literature review across structures, configuration, application, performance metrics, and present challenges and opportunities.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: May 2, 2022
2021 journal article
A Scalable Cluster-based Hierarchical Hardware Accelerator for a Cortically Inspired Algorithm
ACM JOURNAL ON EMERGING TECHNOLOGIES IN COMPUTING SYSTEMS, 17(4).
author keywords: Neuromorphic computing; accelerator; cortical processor; hierarchical temporal memory; sparse distributed memory
TL;DR:
A scalable, configurable and cluster-based hierarchical hardware accelerator through custom hardware architecture for Sparsey, a cortical learning algorithm inspired by the operation of the human cortex that uses a Sparse Distributed Representation to enable unsupervised learning and inference in the same algorithm.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: February 28, 2022
2021 article
Design Benefits of Hybrid Bonding for 3D Integration
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1876–1881.
author keywords: 3DIC; Hybrid bonding; DBI; Thermo-Compression Bonding; Partitioning; 3D design flow
TL;DR:
Electrical and thermal analyses of 3D digital designs using hybrid bonding, specifically using the design rules, and other properties, for the XPERI DBI® technology at a $\mathrm{1.6}\ \mu \ mathrm{m}$ pad pitch are presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: November 1, 2021
2021 article
Design for 3D Stacked Circuits
2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM).
TL;DR:
2.5D and 3D technologies can give rise to a node equivalent of scaling due to improved connectivity because of improved connectivity, but design issues that need to be addressed in pursuing such exploitations include thermal management, design for test and computer aided design.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: July 11, 2022
2021 article
Fast and Accurate PPA Modeling with Transfer Learning
2021 ACM/IEEE 3RD WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD).
author keywords: PPA; Machine Learning; Power; Performance; Area; Gradient Boost; Neural Network; Transfer Learning
TL;DR:
This work presents a machine learning approach using gradient boost models and neural networks to fast and accurately predict the power, performance, and area of a System-on-Chip (SoC) by reducing the number of samples used to create the models.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: November 15, 2021
2021 conference paper
Fast and Accurate PPA Modeling with Transfer Learning
2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD). Presented at the 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD), Munich, Germany.
Event: 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD) at Munich, Germany on November 1-4, 2021
author keywords: PPA; Machine Learning; Power; Performance; Area; Gradient Boost; Neural Network; Transfer Learning; Surrogate Modeling
TL;DR:
The approach reached the same PPA solution as human designers in the same or fewer runs for a CORTEX-M0 system design, showing potential for automating the recipe optimization without needing more runs than a human designer would need.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
3. Good Health and Well-being
(Web of Science)
9. Industry, Innovation and Infrastructure
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: February 21, 2022
2021 article
High Speed Receiver Modeling Using Generative Adversarial Networks
IEEE 30TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2021).
author keywords: eye diagram; IBIS-AMI; generative model; generative adversarial network; GAN; receiver
TL;DR:
The model is not built with domain knowledge but learned from a wide range of channel conditions and input bitstreams to generate an eye diagram, and a neural network model is developed to evaluate the generated eye diagram's relevant characteristics, such as eye height and width.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: March 21, 2022
2021 article
Multi-ANN embedded system based on a custom 3D-DRAM
2021 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC).
author keywords: machine learning; embedded system; Deep Neural Networks (DNNs); CNN; neural network; LSTM; MLP
TL;DR:
This work demon-strates how a customized 3D-DRAM with a very wide databus can be combined with application-specific layers to produce a system meeting the requirements of embedded systems employing multiple instances of disparate ANNs.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
3. Good Health and Well-being
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: May 2, 2022
2020 article
Application of Quantum Machine Learning to VLSI Placement
PROCEEDINGS OF THE 2020 ACM/IEEE 2ND WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD '20), pp. 61–66.
author keywords: Quantum Machine Learning; Balanced Min-Cut; Variational Quantum Eigensolver; Recursive Partitioning Placement
TL;DR:
The Variational Quantum Eigensolver (VQE) is used to formulate a recursive Balanced Min-Cut (BMC) algorithm, and it is suggested that quantum machine learning techniques can lower error rates and allow for faster convergence to an optimal solution.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 16, 2021
2020 journal article
Asymmetric Transformer Design With Multiband Frequency Response for Simultaneous Power and Data Transfer
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 10(4), 644–653.
author keywords: Frequency response; Passband; Bandwidth; Mathematical model; Connectors; Inductors; Data transfer; Asymmetric transformer design; communication on wireless power transfer (WPT) link; inductive power transfer; inductively coupled channel
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(Web of Science; OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: April 27, 2020
2020 article
CTLE Adaptation Using Deep Learning in High-speed SerDes Link
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), pp. 952–955.
author keywords: receiver; CTLE; adaptation; deep neural networks; high- correlation; fast
TL;DR:
This research focuses on building a model for high-speed SerDes receiver CTLE adaptation behavior, which has a fast simulation speed and high-precision prediction.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: March 8, 2021
2020 article
Design Rule Checking with a CNN Based Feature Extractor
PROCEEDINGS OF THE 2020 ACM/IEEE 2ND WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD '20), pp. 9–14.
author keywords: Design Rule Checking; Machine Learning; IC Verification; Design for Manufacturing; Convolutional Neural Network; Deep Learning
TL;DR:
The proof of feasibility for a fast interactive DRC engine that could be used during layout is established and the proposed model consists of a convolutional neural network trained to detect DRC violations.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 16, 2021
2020 article
Machine Learning and Hardware security: Challenges and Opportunities -Invited Talk
2020 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER AIDED-DESIGN (ICCAD).
author keywords: machine learning; hardware security
TL;DR:
Novel applications of machine learning for hardware security, such as evaluation of post quantum cryptography hardware and extraction of physically unclonable functions from neural networks and practical model extraction attack based on electromagnetic side-channel measurements are demonstrated.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 30, 2021
2020 journal article
Multi-Fidelity Surrogate-Based Optimization for Electromagnetic Simulation Acceleration
ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS, 25(5).
author keywords: Statistical machine learning; surrogate-based optimization; multi-fidelity; electromagnetic simulation
TL;DR:
In this article, MFSBO-CS has been applied to two design cases, and the result shows that the proposed methodology offers a cost-efficient solution for analog/RF design problems involving EM simulation.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: November 2, 2020
2020 journal article
Self-Evolution Cascade Deep Learning Model for High-Speed Receiver Adaptation
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 10(6), 1043–1053.
author keywords: Adaptation models; Integrated circuit modeling; Logic gates; Receivers; Deep learning; Data models; Training; Adaptation; behavior; cascade; deep learning; high correlation; IBIS algorithmic modeling interface (IBIS-AMI); modeling; receiver; self-evolution cascade deep learning (SCDL)
TL;DR:
The self-evolution cascade deep learning (SCDL) model is proposed to show a parallel approach to effectively modeling adaptive SerDes behavior and uses its own failure experiences to optimize its future solution search according to the prediction of the receiver equalization adaptation trend.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: July 6, 2020
2019 journal article
3-D-DATE: A Circuit-Level Three-Dimensional DRAM Area, Timing, and Energy Model
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 66(2), 756–768.
author keywords: Dynamic random access memory (DRAM); area and energy and timing model; circuit level model
TL;DR:
3-D-DATE is presented, a circuit-level dynamic random access memory (DRAM) area, timing, and energy model that models both the front and back end of 3-D integrated DRAM designs from 90–16 nm, across a broader range of emerging transistor devices and through-silicon vias.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: February 18, 2019
2019 journal article
Appliance Identification Algorithm for a Non-Intrusive Home Energy Monitor Using Cogent Confabulation
IEEE Transactions on Smart Grid, 10(1), 714–721.
author keywords: Appliance identification; cogent confabulation; monitoring; neural network applications; non-intrusive; energy monitor
TL;DR:
This paper presents an appliance identification algorithm for use with a non-intrusive home energy monitor based on a cogent confabulation neural network that showed better performance than the combinatorial optimization and artificial neural network approaches.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries, NC State University Libraries
Added: January 28, 2019
2019 book
Handbook of 3D Integration: Design, Test, and Thermal Management
Ed(s): n , E. Jan Marinissen & M. S. Bakir *
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: February 5, 2022
2018 chapter
3D Integration: Technology and Design
In K. Sakuma (Ed.), 3D Integration in VLSI Circuits.
Ed(s): K. Sakuma
Source: NC State University Libraries
Added: March 9, 2019
2018 journal article
Exploring the Tradeoffs of Application-Specific Processing
IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 8(3), 531–542.
author keywords: ASIP; SIMD; CGRA; processing-in-memory; processing-near-memory; HTM; sparsey; artificial neural networks
TL;DR:
This work proposes an architecture that combines existing processing schemes utilizing CGRAs for dynamic data path configuration as a means to add flexibility and reusability to data-centric acceleration and presents a CGRA architecture for mapping functional accelerators operating at 500 MHz in 32 nm.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: October 16, 2018
2018 journal article
On Using the Volatile Mem-Capacitive Effect of TiO2 Resistive Random Access Memory to Mimic the Synaptic Forgetting Process
JOURNAL OF ELECTRONIC MATERIALS, 47(2), 994–997.
author keywords: RRAM; TiO2; synapse; neuromorphic systems; volatile memory
UN Sustainable Development Goal Categories
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2017 journal article
Corrections to “Crosstalk-Canceling Multimode Interconnect Using Transmitter Encoding”[ Aug 13 1562-1567]
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 25(5), 1792–1792.
TL;DR:
It is difficult to find correct references in the currently published paper due to the reference discords.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 9, 2019
2017 conference paper
H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor
2017 IEEE International Conference on Computer Design (ICCD), 145–152.
Event: 2017 IEEE International Conference on Computer Design (ICCD) at Boston, MA on November 5-8, 2017
TL;DR:
The H3 chip is presented, that uses 3D die stacking and novel microarchitecture to implement a heterogeneous multi-core processor (HMP) with low-latency fast thread migration capabilities and can reduce power consumption of benchmarks by up to 26%.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2016 journal article
A Generally Applicable Calibration Algorithm for Digitally Reconfigurable Self-Healing RFICs
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 24(3), 1151–1164.
author keywords: Calibration; digitally reconfigurable radio frequency integrated circuits (RFICs); Hooke-Jeeves algorithm; Nelder-Mead algorithm; self-healing
TL;DR:
It is shown that the proposed hybrid Nelder-Mead and Hooke-Jeeves calibration algorithm is capable of reducing the gain error and phase error of the phase rotator output to less than a maximum of 0.5 dB and 2° relative to the chosen gain and phase targets.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries, Crossref, NC State University Libraries
Added: August 6, 2018
2016 conference paper
Design and ASIC acceleration of cortical algorithm for text recognition
2016 29th IEEE International System-on-Chip Conference (SOCC). Presented at the 2016 29th IEEE International System-on-Chip Conference (SOCC).
Event: 2016 29th IEEE International System-on-Chip Conference (SOCC)
TL;DR:
The aim of the work reported in this paper was to design and implement an application specific integrated circuit (ASIC) having a massive speedup of a cortical algorithm, as compared with a CPU baseline.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2016 conference paper
Design of a rectifier-free UHF Gen-2 compatible RFID Tag using RF-only logic
2016 IEEE International Conference on RFID (RFID). Presented at the 2016 IEEE International Conference on RFID (RFID).
Event: 2016 IEEE International Conference on RFID (RFID)
TL;DR:
This work shows that AC-DC rectifier and storage capacitors take up 25% or more of chip area for cost-sensitive passive RFID tags and can be eliminated by utilizing a RF-only circuit structure, which would be smaller and cheaper.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2016 conference paper
Hardware implementation of Hierarchical Temporal Memory algorithm
2016 29th IEEE International System-on-Chip Conference (SOCC). Presented at the 2016 29th IEEE International System-on-Chip Conference (SOCC).
Event: 2016 29th IEEE International System-on-Chip Conference (SOCC)
TL;DR:
A hardware ASIC implementation of the Numenta Hierarchical Temporal Memory (HTM) algorithm is presented, and compared to the performance of a software implementation on the 4 threads CPU, the ASIC version provides a 329.6× speedup in learning mode.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2016 conference paper
Machine learning in physical design
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS). Presented at the 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Event: 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
TL;DR:
Surrogate Modeling is implemented to predict results after GR in Physical Design and machine learning models for predicting Detailed Route (DR) results using Global Route (GR) results are discussed.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2016 journal article
Multimode High-Density Link Design Methodology and Implementation
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 6(8), 1251–1260.
author keywords: Codesign methodology; crosstalk mitigation; high-density links; modal signaling; multimode signaling; S-parameters
TL;DR:
This paper presents a design methodology for designing practical nonuniform high density links using multimode signaling and significantly improves the ability to design high-density low-crosstalk interconnect subsystems in practical scenarios.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2016 conference paper
Novel packaging and thermal measurement for 3D heterogeneous stacks
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), Raleigh, NC.
Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) at Raleigh, NC on June 13-15, 2016
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 24, 2019
2016 conference paper
Physical design of a 3D-stacked heterogeneous multi-core processor
2016 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2016 IEEE International 3D Systems Integration Conference (3DIC), -San Francisco, CA.
Event: 2016 IEEE International 3D Systems Integration Conference (3DIC) at -San Francisco, CA on November 8-11, 2016
TL;DR:
This paper presents a 3D-SIC physical design methodology for a multi-core processor using commercial off-the-shelf tools and indicates an order of magnitude decrease in wirelengths for critical inter-core components in the 3D implementation compared to 2D implementations.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 24, 2019
2016 conference paper
Processor-in-memory support for artificial neural networks
2016 IEEE International Conference on Rebooting Computing (ICRC). Presented at the 2016 IEEE International Conference on Rebooting Computing (ICRC).
Event: 2016 IEEE International Conference on Rebooting Computing (ICRC)
TL;DR:
This work presents a custom processor solution to accelerate two hetero-associative memories capable of unsupervised and one-hot learning and results in up to a 20× speedup and a 2000× reduction in energy per frame compared to a software implementation operating on a dataset for recognition of human actions.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2016 conference paper
RDL and interposer design for DiRAM4 interfaces
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS). Presented at the 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Event: 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2016 conference paper
Thermal raman and IR measurement of heterogeneous integration stacks
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1505–1510.
Event: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) at Las Vegas, NV on May 31 - June 3, 2016
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2015 journal article
A Multitier Study on Various Stacking Topologies of TSV-Based PDN Systems Using On-Chip Decoupling Capacitor Models
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 5(4), 541–550.
author keywords: Back-to-back (B2B); face-to-back (F2B); face-to-face (F2F); on-chip decoupling capacitors; power distribution network (PDN); segmentation method; through silicon via (TSV)
TL;DR:
The PDN impedance noise of F2F chip stacking is found to be relatively lower than F2B and B2B chip stacking topologies, and a metal-insulator-metal capacitor model written as a complex impedance equation is presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2015 conference paper
Characterization of the Mechanical Stress Impact on Device Electrical Performance in the CMOS and III-V HEMT/HBT Heterogeneous Integration Environment
Proceedings Gomactech 2015.
Source: NC State University Libraries
Added: April 11, 2019
2015 conference paper
Characterization of the mechanical stress impact on device electrical performance in the CMOS and III–V HEMT/HBT heterogeneous integration environment
2015 International 3D Systems Integration Conference (3DIC). Presented at the 2015 International 3D Systems Integration Conference (3DIC).
Event: 2015 International 3D Systems Integration Conference (3DIC)
TL;DR:
Measurements from a partial heterogeneous integration fabrication run will be presented to provide insight into how the backside source vias, alternatively referred to as through-silicon-carbide vias (TSCVs), used within the heterogeneous Integration environment impacts GaN HEMT device-level DC performance.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2015 chapter
Chip Package Codesign
In L. Scheffer, L. Lavagno, & G. Martin (Eds.), The Handbook for EDA of Electronic Circuits (Second). CRC Press.
Ed(s): L. Scheffer, L. Lavagno & G. Martin
Source: NC State University Libraries
Added: March 9, 2019
2015 conference paper
Computing in 3D
2015 IEEE Custom Integrated Circuits Conference (CICC). Presented at the 2015 IEEE Custom Integrated Circuits Conference - CICC 2015.
Event: 2015 IEEE Custom Integrated Circuits Conference - CICC 2015
TL;DR:
3D technologies offer significant potential to improve total performance and performance per unit of power, and the next frontier is to create sophisticated logic on logic solutions that promise further increases in performance/power beyond those attributable to memory interfaces alone.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2015 conference paper
Computing in 3D
2015 International 3D Systems Integration Conference (3DIC). Presented at the 2015 International 3D Systems Integration Conference (3DIC), Sendai, Japan.
Event: 2015 International 3D Systems Integration Conference (3DIC) at Sendai, Japan on August 31 - September 2, 2015
TL;DR:
The concept of Fast Thread Migration using 3DIC technologies is introduced and the design of a power optimized SIMD unit in which over half of the power is employed in the FP units is presented.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 24, 2019
2015 conference paper
Defense Applications of 3DIC
Proceedings Gomactech 2015.
Source: NC State University Libraries
Added: April 14, 2019
2015 chapter
Optimization for Self-Calibrating Circuits
In Semiconductor Devices in Harsh Conditions. CRC.
Source: NC State University Libraries
Added: March 9, 2019
2015 conference paper
Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks
2015 International 3D Systems Integration Conference (3DIC), 1–3.
Event: 2015 International 3D Systems Integration Conference (3DIC) at Sendai, Japan on August 31 - September 2, 2015
TL;DR:
Preliminary results are presented which examine the thermal performance of the integration of materials such as GaN, InP, SiGe, and Si and two methods for building up the model of a test chip are compared.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 24, 2019
2014 conference paper
3D-enabled customizable embedded computer (3DECC)
2014 International 3D Systems Integration Conference (3DIC). Presented at the 2014 International 3D Systems Integration Conference (3DIC).
Event: 2014 International 3D Systems Integration Conference (3DIC)
TL;DR:
This paper describes a 3D computer architecture designed to achieve the lowest possible power consumption for “embedded applications” like radar and signal processing and introduces several unique concepts including a low-power SIMD tile, low- power 3D memories, and 3D and 2.5D interconnect that can be tuned at run-time for a specific application.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2014 conference paper
A 0.65 mW/Gbps 30 Gbps capacitive coupled 10 mm serial link in 2.5D silicon interposer
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems. Presented at the 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS).
Event: 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2014 journal article
A Generic and Scalable Architecture for a Large Acoustic Model and Large Vocabulary Speech Recognition Accelerator Using Logic on Memory
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 22(12), 2701–2712.
author keywords: Accelerator; beam search; embedded; hardware software co-design; logic on memory; multipass decoding; N-best; speech recognition; sphinx
TL;DR:
A scalable hardware accelerator for speech recognition, which uses a two pass decoding algorithm with word dependent N-best Viterbi Beam Search, which achieves an overall speed up of 4.3X over a 2.4-GHz Intel Core 2 Duo processor running the CMU Sphinx speech recognition software.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
4. Quality Education
(OpenAlex)
Sources: Web Of Science, NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2014 journal article
Adaptive and Reliable Clock Distribution Design for 3-D Integrated Circuits
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(11), 1862–1870.
author keywords: 3-D integrated circuit (3-D IC); adaptive; clock distribution; deskew; optimization; process-voltage-temperature (PVT) variation; stacking; thermal profile; through-silicon-via (TSV); tunable-delay-buffer (TDB)
TL;DR:
A novel active deskew technique to adaptively mitigate the cross-tier variations and the 3-D wiring asymmetry is proposed and a thermal profile-based optimization flow is developed to further improve the power efficiency and reduce design overhead.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2014 conference paper
Advances in TSVs and 3D interconnects
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems. Presented at the 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS).
Event: 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2014 journal article
Dual Floating Gate Unified Memory MOSFET With Simultaneous Dynamic and Non-Volatile Operation
IEEE ELECTRON DEVICE LETTERS, 35(1), 48–50.
author keywords: Flash memory; floating gate; dynamic memory; MOSFET; FN tunneling; direct tunneling
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2014 conference paper
Leveraging 3D-IC for on-chip timing uncertainty measurements
2014 International 3D Systems Integration Conference (3DIC). Presented at the 2014 International 3D Systems Integration Conference (3DIC).
Event: 2014 International 3D Systems Integration Conference (3DIC)
TL;DR:
This paper presents a circuit implementation and design flow which realizes high volume on-chip timing measurements for a 2D product die using three-dimensional integration (3D-IC) and focuses on achieving observability at clock sinks which are critical for understanding on- chip timing uncertainty.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2014 journal article
Millimeter-Scale True 3-D Antenna-in-Package Structures for Near-Field Power Transfer
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(10), 1574–1581.
author keywords: Coils; electronics packaging; inductive power transmission; omnidirectional antennas; planar arrays; three-dimensional integrated packaging
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2014 conference paper
Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC
2014 IEEE International Conference on IC Design & Technology. Presented at the 2014 IEEE International Conference on IC Design & Technology (ICICDT).
Event: 2014 IEEE International Conference on IC Design & Technology (ICICDT)
TL;DR:
A CAD flow and associated framework called Pathfinder3D is presented, which facilitates physically-aware system-level thermal simulation of 3DICs and facilitates early thermal evaluation of possible 3D design choices and thermal management techniques.
(via Semantic Scholar)
Sources: NC State University Libraries, Crossref, NC State University Libraries
Added: August 6, 2018
2014 chapter
Storage Class Memories
In A. Chen, J. Hutchby, V. Zhrinov, & G. Bourianoff (Eds.), Emerging Nanoelectronic Devices. Wiley.
Ed(s): A. Chen, J. Hutchby, V. Zhrinov & G. Bourianoff
Source: NC State University Libraries
Added: March 9, 2019
2014 journal article
Thermal Pathfinding for 3-D ICs
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(7), 1159–1168.
author keywords: 3-D IC; electronic system-level (ESL); electrothermal simulation; pathfinding; through-silicon via (TSV); transaction-level simulation
TL;DR:
A pathfinding flow that integrates SystemC transaction-level electrical and dynamic thermal simulations to pass complex physical constraints to system architects in a convenient form is presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2014 conference paper
Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits
2014 International 3D Systems Integration Conference (3DIC). Presented at the 2014 International 3D Systems Integration Conference (3DIC).
Event: 2014 International 3D Systems Integration Conference (3DIC)
TL;DR:
Preliminary results are presented which examine the thermal performance of the DAPRA Diverse Accessible Heterogeneous Integration technology and two methods for building up the model of a test chip are compared.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2013 journal article
A Bounded and Discretized Nelder-Mead Algorithm Suitable for RFIC Calibration
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 60(7), 1787–1799.
author keywords: Calibration; derivative-free optimization; Nelder-Mead direct search algorithm; PLL spurious tone reduction; radio frequency integrated circuit calibration
TL;DR:
It is shown that a gradient descent-based algorithm has difficulty in reducing the VCO control line ripple, while the proposed algorithm reduces the relative power of the first harmonic reference spurs by at least 10 dBc and effectively enables design complexity reduction in the supporting analog calibration circuitry.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries, ORCID
Added: August 6, 2018
2013 conference paper
A compact inductively coupled connector for mobile devices
2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), 2385–2390.
TL;DR:
A nested inductive connector, consisting of a single power channel and one or more data channels, is proposed as replacement for legacy conductive connectors in mobile devices, with advantages include minimized space in the mobile device, waterproofing, orientation independence, and resistance to stress through a breakaway mechanism.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Applications and design styles for 3DIC
2013 IEEE International Electron Devices Meeting. Presented at the 2013 IEEE International Electron Devices Meeting (IEDM), Washington, DC.
Event: 2013 IEEE International Electron Devices Meeting (IEDM) at Washington, DC on December 9-11, 2013
TL;DR:
3D technologies offer significant potential to improve raw performance and performance per unit power and the next frontier is to create more sophisticated solutions that promise further increases in power/performance beyond those attributable to memory interfaces alone.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 24, 2019
2013 conference paper
Circuit/channel co-design methodology for multimode signaling
2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), 1356–1361.
TL;DR:
A new circuit/channel co-design methodology for high density links with multimode signaling with over 60% root mean square (RMS) jitter reduction compared with single-ended signaling is presented.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 journal article
Crosstalk-Canceling Multimode Interconnect Using Transmitter Encoding
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 21(8), 1562–1567.
author keywords: Crosstalk cancellation; encoding; modal decomposition; multiconductor transmission; multimode interconnect
TL;DR:
A new implementation approach to cancel crosstalk using modal decomposition on a multiconductor transmission bundle is presented, which gives potential for more flexibility, lower power, better scaling, and ease of implementation.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Design and test of 2.5D and 3D stacked ICs
2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems. Presented at the 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Event: 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
TL;DR:
This tutorial will discuss the significant opportunities presented by 3DIC in the context of the opportunities and challenges that face the designer.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2013 conference paper
Design of 60 GHz contact less probe system for RDL in passive silicon interposer
2013 ieee international 3d systems integration conference (3dic).
TL;DR:
A probe design for detecting discontinuities of a redistribution layer (RDL) on TSV silicon interposer using the capacitive coupling effects between two signal traces using a 60 GHz contactless system based on a quarter-wavelength directional coupler.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Design of controller for L2 cache mapped in Tezzaron stacked DRAM
2013 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA.
Event: 2013 IEEE International 3D Systems Integration Conference (3DIC) at San Francisco, CA on October 2-4, 2013
TL;DR:
This paper investigates the implementation of such a cache controller using 3-layer 256 MB Tezzaron Octopus stacked DRAM, which provides a fast data access through burst-4 and burst-8 mode and has a low hit latency.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Exploring early design tradeoffs in 3DIC
2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549.
Event: 2013 IEEE International Symposium on Circuits and Systems (ISCAS) at Beijing, China on May 19-23, 2013
TL;DR:
This paper explores some of the approaches to creating 3D specific designs and the CAD tools that can help in that exploration, together with early results from a thermal pathfinding tool.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Face-to-face bus design with built-in self-test in 3D ICS
2013 ieee international 3d systems integration conference (3dic).
TL;DR:
A new teleport-register-file structure and corresponding clock gating and switching techniques to synchronize data across multiple clock domains are proposed and Simultaneous bi-directional transfer is supported and 50% reduction of flip-flops compared with conventional synchronizer design.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Hetero(2) 3d integration: A scheme for optimizing efficiency/cost of chip multiprocessors
Proceedings of the fourteenth international symposium on quality electronic design (ISQED 2013), 1–7.
Event: International Symposium on Quality Electronic Design (ISQED) at Santa Clara, CA on March 4-6, 2013
TL;DR:
This work proposes exploiting two complementary forms of heterogeneity to profitably exploit an immature technology for Chip Multiprocessors (CMP): 3D integration facilitates a technology alloy and application and microarchitectural heterogeneity is exploited to compensate for lower efficiency of old-technology cores.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Investigation of intermediate dielectric for dual floating gate MOSFET
2013 13th Non-Volatile Memory Technology Symposium (NVMTS).
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
MOOCs, OOCs, flips and hybrids: The new world of higher education
Proceedings ieee international conference on microelectronic systems, 13–13.
TL;DR:
A combination of new teaching methods, tools, and cloud services together with cloud services promises to deliver greater efficiency to higher education with improved teaching outcomes.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Power comparison of 2D, 3D and 2.5D interconnect solutions and power optimization of interposer interconnects
2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), 860–866.
TL;DR:
It was found that power efficiency decreases linearly with the increase of pitch and length of the interposer traces both in one stack and 4 stack die of Wide IO, and optimization of a Back End of the Line (BEOL) 65 nm interposers interface is presented to find maximize power efficiency.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Rationale for a 3D heterogeneous multi-core processor
2013 IEEE 31st International Conference on Computer Design (ICCD), 154–168.
Event: 2013 IEEE 31st International Conference on Computer Design (ICCD) at Asheville, NC on October 6-9, 2013
TL;DR:
Single-ISA heterogeneous multi-core processors are comprised of multiple core types that are functionally equivalent but microarchitecturally diverse.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 24, 2019
2013 chapter
Simulation and Experimental Characterization of a Unified Memory Device with Two Floating-Gates
In VLSI-SoC: From Algorithms to Circuits and System-on-Chip Design (pp. 217–233).
TL;DR:
The operation of a novel unified memory device using two floating-gates using dynamic, nonvolatile, and concurrent modes is described through experimental characterization of a fabricated proof-of-concept device and confirmed through simulation.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: September 6, 2020
2013 conference paper
TSV-based, modular and collision detectable face-to-back shared bus design
2013 ieee international 3d systems integration conference (3dic).
TL;DR:
A shared backbone bus solution specially tuned for modular 3DIC post-silicon-stacking that allows multiple parallel TSV-based channels to be placed and shared among various stacked components, which is uniquely supported by the dense connection pitch of the Face-to-back TSV bonding technology.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Thermal requirements in future 3D processors
2013 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2013 IEEE International 3D Systems Integration Conference (3DIC).
Event: 2013 IEEE International 3D Systems Integration Conference (3DIC)
TL;DR:
This paper reports on a study in which the projected thermal load of future 3D optimized embedded computers was explored, and the performance, power consumption and area of a reasonably power-efficient 7 nm, 6672 core baseline conventionally packaged design, and 3D alternatives to this design.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, Crossref, NC State University Libraries
Added: August 6, 2018
2013 article
Variation-Aware Circuit Macromodeling and Design Based on Surrogate Models
SIMULATION AND MODELING METHODOLOGIES, TECHNOLOGIES AND APPLICATIONS, Vol. 197, pp. 255–269.
author keywords: Surrogate Modeling; Macromodel; Variation-Aware; Circuit; Device Model; Design Exploration; IO Buffer
TL;DR:
A new variation-aware IO buffer macromodel is developed by integrating surrogate modeling and a physically-based model structure that provides both good accuracy and scalability for signal integrity analysis.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2012 conference paper
A 10.35 mW/GFlop Stacked SAR DSP unit using fine-grain partitioned 3D integration
2012 ieee custom integrated circuits conference (cicc).
TL;DR:
This paper shows how this technique was used to build the first fine-grain partitioned 3D integrated system to be demonstrated with silicon measurements in the literature, which is an ultra efficient floating-point synthetic aperture radar (SAR) DSP processing unit.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2012 journal article
A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits
IEEE Trans CPMT, P(99), 1.
author keywords: 3DIC; electrothermal effects; thermal management; transient analysis
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2012 journal article
A compact dielectric elastomer tubular actuator for refreshable Braille displays
SENSORS AND ACTUATORS A-PHYSICAL, 179, 151–157.
author keywords: Electroactive polymers; Dielectric elastomer actuator; Braille display actuators; Refreshable Braille display
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2012 conference paper
A novel double floating-gate unified memory device
2012 IEEE/IFIP 20th International Conference on VLSI and System-on-Chip (VLSI-SoC). Presented at the 2012 IEEE/IFIP 20th International Conference on VLSI and System-on-Chip (VLSI-SoC).
Event: 2012 IEEE/IFIP 20th International Conference on VLSI and System-on-Chip (VLSI-SoC)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2012 conference paper
An analysis of subthreshold SRAM bitcells for operation in low power RF-only technologies
2012 IEEE subthreshold microelectronics conference (SUBVT).
TL;DR:
An in-depth study and comparison of subthreshold SRAM bitcells has been conducted to analyze how such memories will function in a subth threshold RF-only regime without the need for RF-DC conversion.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2012 journal article
Analog Negative-Bias-Temperature-Instability Monitoring Circuit
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 12(1), 177–179.
author keywords: Amplifier; analog circuits; negative-bias temperature instability (NBTI); reliability; sensor
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2012 journal article
Comparing Through-Silicon-Via (TSV) Void/Pinhole Defect Self-Test Methods
JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 28(1), 27–38.
author keywords: TSV; 3D stacking yield; On-chip capacitor bridge; Test-before-stacking
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2012 conference paper
Comparison of TSV-based PDN-design effects using various stacking topology methods
Ieee conference on electrical performance of electronic packaging and, 83–86.
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2012 journal article
Comparison of modeling techniques in circuit variability analysis
INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS, 25(3), 288–302.
author keywords: artificial neural network; digital circuit; drain current; Kriging; least-squares support vector machine; surrogate modeling; variability Analysis; XOR
UN Sustainable Development Goal Categories
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2012 conference paper
Coordinating 3D designs: Interface IP, standards or free form?
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. Presented at the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan.
Event: 2011 IEEE International 3D Systems Integration Conference (3DIC) at Osaka, Japan on January 31 - February 2, 2011
TL;DR:
This paper proposes that 3D chip stack management should be managed through an Interface IP approach Design blocks with associated properties that not only supports signaling and power delivery but also constraints that must be managed between chips both during design but also in-situ and as part of physical verification.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 24, 2019
2012 journal article
Demystifying Surrogate Modeling for Circuits and Systems
IEEE Circuits and Systems Magazine, 12(1), 45–63.
TL;DR:
The important point is that surrogate modeling has a solid mathematical basis leading to what has become a dramatic increase in the ability to develop engineering models and to engineer systems.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 9, 2019
2012 conference paper
Design, modeling, and fabrication of mm(3) three-dimensional integrated antennas
2012 IEEE 62nd Electronic Components and Technology Conference (ECTC), 1794–1799.
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2012 journal article
Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels
IET Circuits, Devices & Systems, 6(1), 35.
TL;DR:
The macromodel-based methodology enables robust and significantly faster dynamic electrothermal simulation over the long times required for thermal transients to subside and results in significant speed-up over transistor-level simulation for large-scale circuits.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 9, 2019
2012 journal article
Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.
TL;DR:
This paper presents a resistive mesh-based approach that improves on the fidelity of prior approaches by constructing a thermal model of the full structure of 3DICs, including the interconnect, and introduces a method for dividing the thermal response caused by a heat load into a high fidelity “near response” and a lower fidelity” in order to implement Power Blurring high definition (HD).
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2012 conference paper
Near threshold RF-only analog to digital converter
2012 IEEE subthreshold microelectronics conference (SUBVT).
TL;DR:
This paper describes an analog-to-digital converter capable of operating in a RF-only circuit topology, comprised of a cross-coupled pair of inverters, which act as the comparator for the ADC.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2012 journal article
Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 31(10), 1522–1535.
author keywords: Delay element; electrothermal simulation; multicore; multiphysics; parallel simulation; parallelization; transient simulation
TL;DR:
A parallel delay-based iterative approach for interfacing delay-partitioned subcircuits is applied, which achieves the reasonable accuracy of nonparallel circuit simulation if both incorporate the same interblock delay.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2012 conference paper
Pathfinder 3D: A flow for system-level design space exploration
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. Presented at the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan.
Event: 2011 IEEE International 3D Systems Integration Conference (3DIC) at Osaka, Japan on January 31 - February 2, 2011
TL;DR:
A flow for fast system-level exploration useful for path finding studies and a free open source design kit compiler, FreePDK3D45, and a tool for fast floorplan evaluation of TSV-based digital architectures, Pathfinder3D.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 24, 2019
2012 conference paper
Process mismatch analysis based on reduced-order models
2012 13th international symposium on quality electronic design (isqed), 648–655.
TL;DR:
It is shown that in a cascode current mirror the variability of the reference current can be reduced by ensuring that the same rail transistors experience similar variations, as well as the variations of the effective channel length and intrinsic threshold voltage.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2012 conference paper
S-parameter based multimode signaling
Ieee conference on electrical performance of electronic packaging and, 11–14.
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2012 journal article
Surrogate Model-Based Self-Calibrated Design for Process and Temperature Compensation in Analog/RF Circuits
IEEE Design Test of Computers, 29(6), 74–83.
TL;DR:
This article presents a design flow to find appropriate tuning knob settings to compensate for different process variation scenarios in analog circuits designed in submicrometer nodes.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2011 conference paper
3D specific systems design and CAD
2011 International Conference on Embedded Computer Systems: Architectures, Modeling and Simulation. Presented at the 2011 International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XI).
Event: 2011 International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XI)
TL;DR:
This abstract explores application drivers, design and CAD for 3D ICs, including logic on memory, in a specific DSP example, showing a 25% power advantage when implemented in 3D compared with 2D.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2011 conference paper
3D specific systems: Design and CAD
2011 Asian Test Symposium, 470–473.
Event: 2011 Asian Test Symposium at New Delhi, India on November 20-23, 2011
author keywords: 3DIC; 3D IC; three dimensional IC; TSV; stacked memory; memory on logic; FFT
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2011 journal article
Accurate and Scalable IO Buffer Macromodel Based on Surrogate Modeling
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 1(8), 1240–1249.
author keywords: IBIS; input/output buffer modeling; macromodel; process-voltage-temperature variations; surrogate modeling
TL;DR:
Both single-ended and differential output buffer circuit examples demonstrate that the proposed modeling method offers good accuracy and flexible scalability to facilitate signal integrity analysis.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2011 conference paper
Adaptive clock distribution for 3D integrated circuits
2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, 91–94.
Event: 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems at San Jose, CA on October 23-26, 2011
TL;DR:
A robust tunable-delay-buffer circuit and a novel active de-skew method are developed in order to handle the cross-die variations, thermal gradients, and wiring asymmetry in 3D ICs.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2011 conference paper
Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-droop and resonant noise in 3DIC
Ieee conference on electrical performance of electronic packaging and, 267–270.
TL;DR:
To better understand how to reduce noise, particularly simultaneous switching noise (SSN) and determine voltage drop impact on power delivery networks for 3DICs, an analytical model is enhanced and applied to estimate the different noise levels of hierarchical TSV-based PDN structures.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2011 journal article
Computing with Novel Floating-Gate Devices
COMPUTER, 44(2), 29–36.
TL;DR:
The authors report on the design, operation, and architectural implications of single and double floating-gate devices for nontraditional applications enabling low-power FPGAs and analog-to-digital converters, and propose a unified nonvolatile/volatile memory device.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2011 conference paper
Design strategies for processor, chip/package co-design (M-VI)
2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems. Presented at the 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Event: 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2011 journal article
Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor
IET COMPUTERS AND DIGITAL TECHNIQUES, 5(3), 198–204.
TL;DR:
A floating-point synthetic aperture radar processor that achieves a power efficiency of 18.0 mW/GFlop in simulation through the use of three-dimensional (3D) integration and reconfiguration of the data path is presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2011 journal article
SPICE-compatible physical model of nanocrystal floating gate devices for circuit simulation
IET CIRCUITS DEVICES & SYSTEMS, 5(6), 477–483.
TL;DR:
A comprehensive and accurate SPICE-compatible physical equation-based model of nanocrystal floating gate devices is developed based on uniform direct Tunnelling and Fowler-Nordheim tunnelling based on a Verilog-A module that captures the physical behaviours of programming and erasing the device.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2011 journal article
Surrogate Model-Based Analysis of Analog Circuits – Part I. Variability Analysis
IEEE Transactions on Device and Materials Reliability, PP(99).
Source: NC State University Libraries
Added: March 9, 2019
2010 conference paper
A zero power consumption Multi-Capacitor structure for voltage summing in high-speed FFE
19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems. Presented at the 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Event: 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2010 conference paper
Creating 3D specific systems: Architecture, design and CAD
2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010), 1684–1688.
Event: 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) at Dresden, Germany on March 8-12, 2010
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 24, 2019
2010 conference paper
Logic-on-logic 3D integration and placement
2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).
Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)
TL;DR:
This methodology shows that using 3D face-to-face integration with microbumps in conjunction with the three placement algorithms can improve the maximum clock speed of AES module by 15.3% and the PE by 22.6%, while reducing the power of the AES module and thePE by 2.6%.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2010 article
Multimode Transceiver for High-Density Interconnects: Measurement and Validation
2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), pp. 1733–1738.
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2010 conference paper
The NCSU Tezzaron design kit
2010 IEEE International 3D Systems Integration Conference (3DIC), 1–15.
Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)
Sources: Crossref, NC State University Libraries
Added: April 11, 2019
2010 article
The integration of novel EAP-based Braille cells for use in a refreshable tactile display
ELECTROACTIVE POLYMER ACTUATORS AND DEVICES (EAPAD) 2010, Vol. 7642.
author keywords: Braille; blind; PVDF; electroactive polymers; dielectric elastomer; visual impairments; bimorph
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2010 conference paper
Thermal Investigatoin of Tier Swapping to Improve the Thermal Profile of Memory-on-Logic 3DICs
IEEE THERMINIC, 1–6.
Source: NC State University Libraries
Added: April 11, 2019
2010 conference paper
Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications
2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).
Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)
TL;DR:
Simulation shows that the DRAM can operate at a temperature 47°C cooler than the CPU, and the combination of a vacuum gap, formed using standard semiconductor processing, together with capacitive or inductive signaling across the gap.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2009 journal article
A 32-Gb/s On-Chip Bus With Driver Pre-Emphasis Signaling
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(9), 1267–1274.
author keywords: Interconnects; low power; on-chip; pre-emphasis
TL;DR:
A differential current-mode bus architecture based on driver pre-emphasis for on-chip global interconnects that achieves high-data rates while reducing bus power dissipation and improving signal delay latency is described.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, Crossref, NC State University Libraries
Added: August 6, 2018
2009 conference paper
A low power 3D integrated FFT engine using hypercube memory division
ISLPED 09, 231–236.
TL;DR:
A floating point FFT processor that leverages both 3D integration and a hypercube memory division scheme to reduce the power consumption of a 1024 point F FT down to 4.227 μJ is demonstrated.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2009 conference paper
An enhanced macromodeling approach for differential output drivers
BMAS 2009: Proceedings of the 2009 IEEE International Behavioral Modeling and Simulation Workshop, 54–59.
TL;DR:
The approach is demonstrated with two typical digital drivers, low-voltage differential signaling (LVDS) driver and pre-emphasis driver, which achieve excellent accuracy in capturing behaviors at various input patterns, loading conditions and supply voltages.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2009 journal article
Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 17(4), 496–506.
author keywords: Fast Fourier transform (FFT); first-in first-out (FIFO); ternary content-addressable memory (TCAM); 3-D integrated circuit (IC)
TL;DR:
This paper presents physical-design case studies of ternary content-addressable memories, first-in first-out (FIFO) memories, and a 8192-point fast Fourier transform (FFT) processor in order to quantify the benefit of the through-silicon vias in an available 180-nm 3-D process.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2009 conference paper
Application of EAP materials toward a refreshable Braille display
In Y. Bar-Cohen & T. Wallmersperger (Eds.), Electroactive Polymer Actuators and Devices (EAPAD) 2009.
Ed(s): Y. Bar-Cohen & T. Wallmersperger
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring
UN Sustainable Development Goal Categories
10. Reduced Inequalities
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2009 conference paper
Application of surrogate modeling to generate compact and PVT-sensitive IBIS models
Electrical Performance of Electronic Packaging and Systems, 77–80.
TL;DR:
A new proposal of applying surrogate-modeling in Input-output Buffer Information Specification (IBIS) saves the IBIS data storage resource, extends the model utility to various process-voltage-temperature (PVT) simulations and eliminates the data interpolation deviations.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2009 conference paper
CAD and Design Application Exploration of 3DICs
Proceedings 2008 Gomactech.
Source: NC State University Libraries
Added: April 11, 2019
2009 journal article
Controllable Molecular Modulation of Conductivity in Silicon-Based Devices
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 131(29), 10023–10030.
MeSH headings : Electric Conductivity; Membranes, Artificial; Semiconductors; Silicon / chemistry
TL;DR:
It is reported that a molecular monolayer, covalently grafted atop a silicon channel, can play a role similar to gating and impurity doping, which leads to the observed controllable modulation of conductivity in pseudometal-oxide-semiconductor field-effect transistors (pseudo-MOSFETs).
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2009 conference paper
CryptoFSM – Securing chips against reverse engineering
Proceedings 2008 Gomactech.
Source: NC State University Libraries
Added: April 11, 2019
2009 conference paper
Design Automation of a 3DIC FFT Processor, for Synthetic Aperture Radar: A case study
Proceedings ACM/IEEE DAC 2009, 51–56.
TL;DR:
The work shows how the vertical dimension can be exploited for novel memory architecture tradeoffs that are not feasible in 2D, reducing the energy consumed per memory operation in the FFT by 60.3%.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: April 14, 2019
2009 conference paper
Junction-level thermal extraction and simulation of 3DICs
2009 IEEE International Conference on 3d Systems Integration, 395–401.
Event: 2009 IEEE International Conference on 3D System Integration at San Francisco, CA on September 28-30, 2009
TL;DR:
It was found that lowering the simulation resolution and using composite thermal conductivities failed to accurately predict the location of these tentpoles, so large isolated temperature spikes were found near groups of clock buffers at the edge of the SRAMs on the middle tier.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2009 conference paper
Low-power self-equalizing driver for silicon carrier interconnects with low bit error rate
Electrical Performance of Electronic Packaging and Systems, 37–40.
TL;DR:
This paper demonstrates and compares the power efficiency of a standard differential current mode driver operating over an FR-4 channel with an improved driver with pre-emphasis operating over a silicon carrier channel.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2009 conference paper
Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors
Electrical Performance of Electronic Packaging and Systems, 121–124.
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2009 review
Overview of RFID Technology and Its Applications in the Food Industry
[Review of ]. JOURNAL OF FOOD SCIENCE, 74(8), R101–R106.
author keywords: applications in food industry; RFID; working principle
MeSH headings : Food Industry / instrumentation; Food Industry / methods; Food Industry / standards; Radio Frequency Identification Device / economics; Radio Frequency Identification Device / methods
TL;DR:
Key concepts and terminology related to RFID technology and its applications in the food industry (supply chain management, temperature monitoring of foods, and ensuring food safety) are presented.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2009 chapter
Use of AC Coupled Interconnect in Contactless Packaging
In R. Ho (Ed.), Coupled Data Communications. Springer-Verlag.
Ed(s): R. Ho
Source: NC State University Libraries
Added: March 9, 2019
2008 conference paper
AC coupled backplane communication using embedded capacitor
2008 IEEE-EPEP Electrical Performance of Electronic Packaging. Presented at the 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP).
Event: 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2008 conference paper
An 8192-point fast fourier transform 3D-IC case study
2008 51st Midwest Symposium on Circuits and Systems, 438–441.
Event: 2008 51st IEEE International Midwest Symposium on Circuits and Systems (MWSCAS) at Knoxville, TN on August 10-13, 2008
TL;DR:
This paper presents a case studies of an 8192-point fast Fourier transform (FFT) processor in order to quantify the benefit of the through-silicon vias in an available 180 nm 3D process.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Crossref, NC State University Libraries, Web Of Science
Added: March 24, 2019
2008 conference paper
Analysis of inter-bundle crosstalk in multimode signaling for high-density interconnects
2008 58th Electronic Components and Technology Conference. Presented at the 2008 58th Electronic Components and Technology Conference (ECTC 2008).
Event: 2008 58th Electronic Components and Technology Conference (ECTC 2008)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2008 conference paper
Application Specific Integrated Circuit Verification: An Illustration Based Approach
IEEE MSE.
Source: NC State University Libraries
Added: April 14, 2019
2008 conference paper
Application and Design Exploration for 3D Integrated Circuits
VLSI Multi-level Interconnect Conference.
Source: NC State University Libraries
Added: April 11, 2019
2008 conference paper
Autonomous Vision Processing and 3D Scene Reconstruction
GOMACTECH.
Source: NC State University Libraries
Added: April 14, 2019
2008 conference paper
Computer-Aided Design and Application Exploration for 3D Integrated Circuits
GOMACTECH.
Source: NC State University Libraries
Added: April 15, 2019
2008 conference paper
Design and CAD for 3D integrated circuits
Proceedings of the 45th annual conference on Design automation - DAC '08, 668–673.
Event: the 45th annual conference
TL;DR:
This paper presents several case studies that are uniquely enhanced through 3D implementation, including a 3D CAM, an FFT processor, and a SAR processor, which requires higher fidelity thermal modeling than 2DIC design.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 24, 2019
2008 chapter
Design for 3-D Integration
In P. Garrou, P. Ramm, & C. Bower (Eds.), 3-D IC Integration: Technology and Applications. Wiley VCH.
Ed(s): P. Garrou, P. Ramm & C. Bower
Source: NC State University Libraries
Added: March 9, 2019
2008 conference paper
Extreme Temperature Invariant Circuitry Through Adaptive Body Biasing
GOMACTECH.
Source: NC State University Libraries
Added: April 15, 2019
2008 article
Foreword Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance Applications
Canavero, F., & Franzon, P. D. (2008, November). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 31, pp. 662–663.
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2008 article
Improving Behavioral IO Buffer Modeling Based on IBIS
Varma, A. K., Steer, M., & Franzon, P. D. (2008, November). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 31, pp. 711–721.
author keywords: Behavioral modeling; gate modulation effect; input output buffer information specification (IBIS); input/output (IO) buffer modeling; simultaneous switching noise (SSN)
TL;DR:
A method is presented for compensating for the missing information in IBIS by complimenting the IBIS model with a black box that is simulator independent, without compromising with the speed that IBIS enjoys over the transistor models.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2008 conference paper
Inductively coupled connectors and sockets for multi-Gb/s pulse signaling
IEEE Transactions on Advanced Packaging, 31(4), 749–758.
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2008 conference paper
Keeping hot chips cool
Proceedings of the 45th annual conference on Design automation - DAC '08. Presented at the the 45th annual conference.
Event: the 45th annual conference
TL;DR:
This is an educational panel with a little bit of controversy that will address the thermal issue in IC design and the severity of power issues coupled with packaging complexity translate into a thermal crisis in future.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2008 conference paper
Memory rich applications for 3D integration
In S. F. Al-Sarawi, V. K. Varadan, N. Weste, & K. Kalantar-Zadeh (Eds.), Smart Structures, Devices, and Systems IV.
Ed(s): S. Al-Sarawi, V. Varadan, N. Weste & K. Kalantar-Zadeh
Event: Smart Materials, Nano-and Micro-Smart Systems
TL;DR:
This paper shows how memory power and memory bandwidth can both be improved by an order of magnitude through 3D integration, and specifically explores a DSP application.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2008 conference paper
Multimode signaling on non-ideal channels
2008 IEEE-EPEP Electrical Performance of Electronic Packaging, 51–54.
Sources: NC State University Libraries, NC State University Libraries
Added: April 15, 2019
2008 journal article
Reversible Modulation of Conductance in Silicon Devices via UV/Visible-Light Irradiation
ADVANCED MATERIALS, 20(23), 4541–4546.
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2008 journal article
Special issue on 3D integrated circuits and microarchitectures
ACM Journal on Emerging Technologies in Computing Systems, 4(4).
TL;DR:
This special issue of the ACM Journal of Emerging Technologies in Computing Systems is dedicated to three-dimensional integrated circuits and microarchitectures and five papers on diverse topics related to 3D integration were accepted for the special issue.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2007 conference paper
Application and Design Exploration for 3D Integrated Circuits
VLSI Multi-level Interconnect Conference.
Source: NC State University Libraries
Added: April 14, 2019
2007 conference paper
Design Considerations and Benefits of Three-Dimensional Ternary Content Addressable Memory
2007 IEEE Custom Integrated Circuits Conference. Presented at the 2007 IEEE 29th Custom Integrated Circuits Conference.
Event: 2007 IEEE 29th Custom Integrated Circuits Conference
TL;DR:
It is demonstrated that a 3D TCAM with three tiers can achieve 40% matchline capacitance reduction and 21% power reduction compared to a TCAM in a conventional single-tier process.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2007 conference paper
Design for 3D Integration and Applications
2007 International Symposium on Signals, Systems and Electronics, 263–266,
Event: 2007 International Symposium on Signals, Systems and Electronics at Montreal, Quebec, Canada on July 30 - August 2, 2007
TL;DR:
This paper explores application drivers and computer aided design (CAD) for 3D ICs in order to provide system advantages equivalent to up to two technology nodes of scaling.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 24, 2019
2007 journal article
Electronic properties of molecular memory circuits on a nanoscale scaffold
IEEE TRANSACTIONS ON NANOBIOSCIENCE, 6(4), 270–274.
author keywords: biomaterials; molecular electronics; nanotechnology
MeSH headings : Binding Sites; Biocompatible Materials / chemistry; Bionics / methods; Comovirus / chemistry; Crystallization; Electric Conductivity; Gold; Ion Exchange; Macromolecular Substances / chemistry; Materials Testing; Metal Nanoparticles / chemistry; Metal Nanoparticles / virology; Microscopy, Scanning Tunneling; Molecular Conformation; Nanotechnology / methods; Organisms, Genetically Modified; Protein Engineering
TL;DR:
Here, genetically engineered cowpea mosaic virus was modified to express cysteine residues on the capsid exterior, gold nanoparticles were attached to the viral scaffold in a specific predetermined pattern to produce specific interparticle distances, resulting in three-dimensional network.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2007 conference paper
Flexible Low Power Probability Density Estimation Unit For Speech Recognition
2007 IEEE International Symposium on Circuits and Systems. Presented at the 2007 IEEE International Symposium on Circuits and Systems.
Event: 2007 IEEE International Symposium on Circuits and Systems
TL;DR:
A flexible probability density estimation unit that is both power efficient and meets real time requirements while being flexible enough to handle emerging speech recognition techniques is designed.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2007 conference paper
FreePDK: An Open-Source Variation-Aware Design Kit
2007 IEEE International Conference on Microelectronic Systems Education (MSE'07). Presented at the 2007 IEEE International Conference on Microelectronic Systems Education, San Diego, CA.
Event: 2007 IEEE International Conference on Microelectronic Systems Education at San Diego, CA on June 3-4, 2007
TL;DR:
An open source, variation aware Process Design Kit (PDK), based on Scalable CMOS design rules, down to 45 nm, for use in VLSI research, education and small businesses is discussed.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(OpenAlex)
11. Sustainable Cities and Communities
(Web of Science)
Sources: Crossref, NC State University Libraries, Web Of Science
Added: March 24, 2019
2007 article
Fully integrated AC coupled interconnect using buried bumps
Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007, May). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 30, pp. 191–199.
author keywords: AC coupled interconnect (ACCI); buried bumps; capacitive coupling; MCM; pulse signaling; noncontacting I/O; chip and package co-design
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2007 conference paper
Hardware Architecture of a Parallel Pattern Matching Engine
2007 IEEE International Symposium on Circuits and Systems. Presented at the 2007 IEEE International Symposium on Circuits and Systems.
Event: 2007 IEEE International Symposium on Circuits and Systems
TL;DR:
The hardware architecture of a parallel, pipelined pattern matching engine that uses trie based pattern matching algorithmic approach is described that outperforms most current implementations in terms of speed and memory requirement and outperforms TCAM based solutions interms of power consumption, area, and cost while remaining competitive in Terms of throughput and update times.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2007 conference paper
Molecular Electronics
2nd IEEE International Workshop on advances in sensors and interfaces.
Source: NC State University Libraries
Added: April 14, 2019
2007 chapter
Molecular Electronics – Devices and Circuits Technology
In Vlsi-Soc: From Systems To Silicon. Springer Boston.
Source: NC State University Libraries
Added: March 9, 2019
2007 journal article
SOI CMOS implementation of a multirate PSK demodulator for space communications
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 54(2), 420–431.
author keywords: differential detection; multirate; phase-shift keying (PSK); sampling; space communications; symbol timing circuit
TL;DR:
A low-power phase-shift keying demodulator integrated circuit (IC) has been implemented using silicon-on-insulator CMOS technology for deep space and satellite applications and digital decimation is used after sampling to achieve a low power implementation of multirate transmission.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2007 conference paper
System Design for 3D Multi-FPGA Packaging
2007 IEEE Electrical Performance of Electronic Packaging. Presented at the 2007 IEEE Electrical Performance of Electronic Packaging.
Event: 2007 IEEE Electrical Performance of Electronic Packaging
TL;DR:
This paper explores the system-level considerations such as layout, routing and IO in the design of 3D multi-FPGA packaging, along with their architectural implications.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2007 conference paper
System level Validation of Improved IO Buffer Behavioral Modeling Methodology Based on IBIS
2007 IEEE Electrical Performance of Electronic Packaging. Presented at the 2007 IEEE Electrical Performance of Electronic Packaging.
Event: 2007 IEEE Electrical Performance of Electronic Packaging
TL;DR:
System level simulation and validation of a new macromodeling methodology based on IBIS (Input/Output Buffer Information Specification) models is presented and enhancements of the black-box techniques discussed in [1] are discussed.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2007 article
Uniformity analysis of wafer scale sub-25 nm wide nanowire array nanoimprint mold fabricated by PEDAL process
MICROELECTRONIC ENGINEERING, Vol. 84, pp. 1523–1527.
author keywords: PEDAL; nanoimprint; mold; nanowires
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2007 journal article
Voltage-mode driver preemphasis technique for on-chip global buses
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 15(2), 231–236.
author keywords: global buses; low-power; on-chip; preemphasis; repeater insertion
TL;DR:
This paper demonstrates that driver preemphasis technique can be used for on-chip global buses to increase signal channel bandwidth and reduces power consumption by 12%-39% for data activity factors above 0.1.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2006 journal article
3 Gb/s AC Coupled Chip-to-Chip Communication Using a Low Swing Pulse Receiver
IEEE Journal of Solid-State Circuits, 41(1), 287–296.
author keywords: AC coupled interconnect; bandlimited communications; buried bump technology; capacitive coupling; multichip modules; pulse receiver; pulse signaling
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Crossref, NC State University Libraries, Web Of Science
Added: August 6, 2018
2006 conference paper
A 32Gb/s On-chip Bus with Driver Pre-emphasis Signaling
IEEE Custom Integrated Circuits Conference 2006. Presented at the Proceedings of the IEEE 2006 Custom Integrated Circuits Conference.
Event: Proceedings of the IEEE 2006 Custom Integrated Circuits Conference
TL;DR:
A 16-bit on-chip bus with driver pre-emphasis fabricated in 0.25mum CMOS technology attains an aggregate signaling data rate of 32Gb/s over 5-10mm long lossy interconnects while reducing delay latency, power, and peak current over a conventional single-ended voltage-mode static bus.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2006 conference paper
A 36Gb/s ACCI Multi-Channel Bus using a Fully Differential Pulse Receiver
IEEE Custom Integrated Circuits Conference 2006. Presented at the IEEE Custom Integrated Circuits Conference 2006.
Event: IEEE Custom Integrated Circuits Conference 2006
TL;DR:
A new differential pulse receiver is demonstrated for AC coupled interconnect (ACCI), which enables the highest data rate, at 6Gb/s/channel (36Gb/S aggregate), for capacitively coupled systems using pulse signaling.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2006 conference paper
AC Coupled Interconnect using Buried Bumps for Laminated Organic Packages
Proceedings Electronic Components and Technology, ECTC.
Source: NC State University Libraries
Added: April 15, 2019
2006 conference paper
Architecture for Low Power Large Vocabulary Speech Recognition
2006 IEEE International SOC Conference. Presented at the 2006 IEEE International SOC Conference.
Event: 2006 IEEE International SOC Conference
TL;DR:
This paper proposes an architecture for real-time large vocabulary speech recognition on a mobile embedded device that has a low power embedded processor and dedicated ASIC units for complex computations.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2006 conference paper
Considerations for Transmission Line Design on MCMs using AC Coupled Interconnect with Buried Solder Bumps
2006 IEEE Workship on Signal Propagation on Interconnects. Presented at the 2006 IEEE Workshop on Signal Propagation on Interconnects.
Event: 2006 IEEE Workshop on Signal Propagation on Interconnects
author keywords: AC Coupled Interconnect; ACCI; buried solder bumps; transmission lines; routing; MCM; stripline
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2006 journal article
Controlled modulation of conductance in silicon devices by molecular monolayers
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 128(45), 14537–14541.
TL;DR:
Controlling the drain current and threshold voltage in pseudo metal-oxide-semiconductor field-effect transistors by grafting a monolayer of molecules atop oxide-free H-passivated silicon surfaces might serve as a useful method for controlling electronic characteristics in small silicon devices at future technology nodes.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2006 conference paper
Controlled nanowire fabrication by PEDAL process
2006 1st International Conference on Nano-Networks and Workshops. Presented at the 2006 1st International Conference on Nano-Networks and Workshops.
Event: 2006 1st International Conference on Nano-Networks and Workshops
TL;DR:
The experimental results presented in this paper prove the efficacy of PEDAL process in making nanowire template of sub-25 nm wide lines with good routing capability.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2006 journal article
Deterministic nanowire fanout and interconnect without any critical translational alignment
IEEE TRANSACTIONS ON NANOTECHNOLOGY, 5(4), 356–361.
author keywords: alignment; crossbar architectures; fanout; interconnect; nanoscale interfacing; nanotechnology
TL;DR:
A design is presented that allows complete and deterministic fanout of regular arrays of wires from the nano- to the microworld without the need for any critical translational alignment steps.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
3. Good Health and Well-being
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2006 conference paper
Developing Improved IO Buffer Behavioral Modeling Methodology Based on IBIS
2006 IEEE Electrical Performane of Electronic Packaging. Presented at the 2006 IEEE Electrical Performane of Electronic Packaging.
Event: 2006 IEEE Electrical Performane of Electronic Packaging
TL;DR:
A new macromodeling methodology based on IBIS (input/output buffer information specification) models is proposed and produces models that can be simulated accurately for simultaneous switching noise (SSN).
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2006 conference paper
Differential current-mode signaling for robust and power efficient on-chip global interconnects
IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. Presented at the IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.
Event: IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2006 conference paper
Fine Pitch Inductively Coupled Connectors for Multi-Gbps Pulse Signaling
2006 IEEE Electrical Performane of Electronic Packaging. Presented at the 2006 IEEE Electrical Performane of Electronic Packaging.
Event: 2006 IEEE Electrical Performane of Electronic Packaging
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2006 conference paper
High-Frequency Characterization of Printed CPW Lines on Textiles using a Custom Test Fixture
2006 IEEE Workship on Signal Propagation on Interconnects. Presented at the 2006 IEEE Workship on Signal Propagation on Interconnects.
Event: 2006 IEEE Workship on Signal Propagation on Interconnects
author keywords: wearable electronics; electronic textiles; RF and microwave testing; printed electronics; polymer thick film
UN Sustainable Development Goal Categories
3. Good Health and Well-being
(Web of Science)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2006 journal article
Physically based molecular device model in a transient circuit simulator
CHEMICAL PHYSICS, 326(1), 188–196.
author keywords: molecular electronics; circuit simulator; density-functional theory; 1,4-benzenedithiol; single-molecule conductivity
UN Sustainable Development Goal Categories
16. Peace, Justice and Strong Institutions
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2006 conference paper
Pulse Signaling in Inductively Coupled Sockets and Connectors
SRC Student Symposium.
Source: NC State University Libraries
Added: April 14, 2019
2006 conference paper
Sensors on textile substrates for home-based healthcare monitoring
Proceedings of the 1st Conference on Distributed Diagnosis and Home Healthcare, 5–7.
Event: 1st Transdisciplinary Conference on Distributed Diagnosis and Home Healthcare at Arlington, VA, USA on April 2-4, 2006
TL;DR:
Progress in developing textile-based sensors for wearable physiological monitoring systems for ECG and EOG data is described and a capacitive sensor for monitoring breathing is presented.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries, Crossref
Added: March 24, 2019
2006 conference paper
Signal integrity and robustness of ACCI packaged systems
IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. Presented at the IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.
Event: IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.
TL;DR:
The potential for switching noise, crosstalk and ISI control in ACCI system is discussed, which could help improve multi-Giga-b/s/channel communication.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2006 conference paper
TCAM core design in 3D IC for low matchline capacitance and low power
In S. F. Al-Sarawi (Ed.), Smart Structures, Devices, and Systems III.
Ed(s): S. Al-Sarawi
Event: Smart Materials, Nano- and Micro-Smart Systems
author keywords: TCAM (ternary content addressable memory); 3D1C (3-dimentional integrated circuits); integrated circuit interconnect; vertical interconnect; inter-tier via; 3D via; inatchline capacitance; interconnect capacitance; low power TCAM; CAM
TL;DR:
3D vias are used to replace matchlines, whose transition during parallel search operations is a major source of high power consumption in TCAM and field analysis and spice simulation results show that a 40% matchline capacitance reduction and a 23% power reduction can be achieved by using a 3-tier 3D IC structure instead of the conventional 2D approach.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2005 conference paper
2.8 Gb/s Inductively Coupled Interconnect for 3-D ICs
Japan VLSI Symposium.
Source: NC State University Libraries
Added: April 17, 2019
2005 conference paper
2.8 Gbps inductively coupled interconnect for 3D ICs
Proceedings of the 2005 symposium on VLSI circuits, 352–355.
Source: NC State University Libraries
Added: June 9, 2019
2005 conference paper
3Gb/s AC-coupled chip-to-chip communication using a low-swing pulse receiver
Proceedings of the 2005 International Solid State Circuits Conference. Presented at the 2005 International Solid State Circuits Conference, San Francisco, CA, USA.
Event: 2005 International Solid State Circuits Conference at San Francisco, CA, USA on February 10, 2005
TL;DR:
A 120-mV/sub ppd/ low swing pulse receiver is presented for AC coupled interconnect (ACCI) and first-time demonstration of a flip-chip ACCI is presented, with both the AC and DC connections successfully integrated between the flipped chip and the multichip module (MCM) substrate by using the buried bump technology.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: June 9, 2019
2005 article
A tunable combline bandpass filter using Barium Strontium Titanate interdigital varactors on an alumina substrate
2005 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, VOLS 1-4, pp. 595–598.
author keywords: Barium Strontium Titanate (BST); ferroelectric; microstrip filters; resonators; thin film devices; tunable filters; varactor
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2005 journal article
An Engineered Virus as a Scaffold for Three-Dimensional Self-Assembly on the Nanoscale
Small, 1(7), 702–706.
author keywords: molecular electronics; nanotechnology; protein engineering; self-assembly; viruses
MeSH headings : Biomedical Engineering / methods; Capsid / chemistry; Electronics; Microscopy, Scanning Tunneling; Models, Chemical; Models, Molecular; Mutation; Nanocomposites / chemistry; Nanostructures; Nanotechnology / methods; Protein Engineering / methods; Viruses / chemistry; Viruses / genetics
TL;DR:
Using cowpea mosaic virus, modified to express cysteine residues on the capsid exterior, gold nanoparticles were attached to the viral scaffold to produce specific interparticle distances, resulting in a 3D spherical conductive network.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
3. Good Health and Well-being
(Web of Science)
Sources: Web Of Science, Crossref, NC State University Libraries
Added: August 6, 2018
2005 article
An electronically tunable microstrip bandpass filter using thin-film barium-strontium-titanate (BST) varactors
Nath, J., Ghosh, D., Maria, J. P., Kingon, A. I., Fathelbab, W., Franzon, P. D., & Steer, M. B. (2005, September). IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, Vol. 53, pp. 2707–2712.
author keywords: barium strontium titanate (BST); combline filter; ferroelectric films; intermodulation distortion; microstrip filters; resonators; thin-film devices; tunable filters; varactor
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2005 conference paper
An integrated self-masking technique for providing low-loss metallized RF MEMS devices in a polysilicon only MEMS process
Proceedings of the SPIE Micro Europe. Presented at the SPIE Micro Europe, Sevilla, Spain.
Event: SPIE Micro Europe at Sevilla, Spain
author keywords: RF MEMS; post process; metallization; tunable capacitor; removable mask; SUMMiT
Sources: Web Of Science, NC State University Libraries
Added: June 9, 2019
2005 journal article
CAD Flows for Chip-Package CoVerification
IEEE Transactions on Advanced Packaging, 28(1), 194–202.
TL;DR:
A unified method is presented for layout and package design implemented within a commercial design environment that will reduce design time and enable chip-package coverification.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2005 chapter
Chip-Package Codesign
In L. Scheffer, L. Lavagno, & G. Martin (Eds.), The Handbook for EDA of Electronic Circuits. CRC Press.
Ed(s): L. Scheffer, L. Lavagno & G. Martin
Source: NC State University Libraries
Added: March 9, 2019
2005 journal article
Configurable String Matching Hardware for Speeding Up Intrusion Detection
SIGARCH Comput. Archit. News, 33(1), 99–107.
TL;DR:
A configurable string matching accelerator is developed with the focus on increasing throughput while maintaining the configurability provided by the software IDSs.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: March 9, 2019
2005 journal article
Cover Picture: An Engineered Virus as a Scaffold for Three-Dimensional Self-Assembly on the Nanoscale (Small 7/2005)
Small, 1(7), 669–669.
Sources: Crossref, NC State University Libraries
Added: September 6, 2020
2005 journal article
Cover Picture: An Engineered Virus as a Scaffold for Three-Dimensional Self-Assembly on the Nanoscale (Small 7/2005)
Small, 1(7), 669–669.
Sources: Crossref, NC State University Libraries
Added: September 6, 2020
2005 journal article
Demystifying 3D ICs: The procs and cons of going vertical
IEEE DESIGN & TEST OF COMPUTERS, 22(6), 498–510.
TL;DR:
A practical introduction to the design trade-offs of the currently available 3D IC technology options is provided, with an analysis relating the number of transistors on a chip to the vertical interconnect density using estimates based on Rent's rule.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2005 conference paper
Drive circuit for a mode conversion rotary ultrasonic motor
31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005. Presented at the 31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005.
Event: 31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005.
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2005 conference paper
Driver pre-emphasis techniques for on-chip global buses
Proceedings of the 2005 international symposium on Low power electronics and design - ISLPED '05. Presented at the the 2005 international symposium.
Event: the 2005 international symposium
TL;DR:
This proposed architecture lowers the worst coupling capacitance to total capacitance ratio to 14.4%.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2005 journal article
Fabrication of wafer scale, aligned sub-25 nm nanowire and nanowire templates using planar edge defined alternate layer process
PHYSICA E-LOW-DIMENSIONAL SYSTEMS & NANOSTRUCTURES, 28(2), 107–114.
author keywords: nanowire; nanoimprinting; mold; template; interconnects; nanotechnology
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2005 conference paper
Fabrication of wafer-scale, aligned Sub-25 nm nanowires and templates using Planar Edge Defined Alternate Layer (PEDAL) Process
Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show. Presented at the 2005 NSTI Nanotechnology Conference and Trade Show, Anaheim, CA.
Event: 2005 NSTI Nanotechnology Conference and Trade Show at Anaheim, CA
Source: NC State University Libraries
Added: June 9, 2019
2005 conference paper
Impact of SOI research Project on microelectronics education: a case study
Proceedings of the IEEE International Conference on Microelectronics systems education, 33–34.
Event: 2005 IEEE International Conference on Microelectronic Systems Education (MSE'05) at Anaheim, CA, USA on June 12-13, 2005
TL;DR:
The impact of an RF-SoC research project on the career choices of students involved and its broader impact on the microelectronics education in the participating universities are presented.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: June 9, 2019
2005 conference paper
Inductively Coupled Board-to-Board Connectors
Proceedings Electronic Components and Technology, 2005. ECTC '05., 1109–1113.
Event: 2005 55th Electronic Components and Technology Conference at Lake Buena Vista, FL, USA on May 31 - June 3, 2005
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 24, 2019
2005 conference paper
Integrated dynamic body contact for H-gate PD-SOI MOSFETs for high performance/low power
2004 IEEE International SOI Conference (IEEE Cat. No.04CH37573). Presented at the 2004 IEEE International SOI Conference.
Event: 2004 IEEE International SOI Conference
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2005 conference paper
Molecular electronic latches and memories
IEEE Nano, 819–822.
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
2005 conference paper
Molecular electronics – devices and circuits technology
Proceedings IFIP VLSI-SoC 2005, 57–63.
Source: NC State University Libraries
Added: April 21, 2019
2005 journal article
Optimal chip-package codesign for high-performance DSP
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 28(2), 288–297.
author keywords: chip-package codesign; fast Fourier transform (FFT); seamless high off-chip connectivity (SHOCC)
TL;DR:
This paper presents the design of a fast Fourier transform (FFT) engine that gives SRAM-like performance in a DRAM-based system and uses almost 100% of the available burst-mode memory bandwidth.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2005 journal article
Scaling constraints in nanoelectronic random-access memories
NANOTECHNOLOGY, 16(10), 2251–2260.
TL;DR:
Using a combined circuit theoretical modelling and simulation approach, the impact of both the device and interconnect architecture on the scalability of a conductivity-state memory system is quantified.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2004 journal article
A "Defect level versus cost" system tradeoff for electronics manufacturing
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 27(1), 67–76.
author keywords: cost quality tradeoff; genetic algorithm; high-density packaging (HDP); Pareto chart
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2004 conference paper
A configurable classification engine for polymorphous chip architecture
Proceedings of the ACM BEACON Workshop. Presented at the ACM BEACON Workshop, Boston, MA.
Event: ACM BEACON Workshop at Boston, MA
Source: NC State University Libraries
Added: June 9, 2019
2004 article
AC coupled interconnect for dense 3-D ICs
Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October). IEEE TRANSACTIONS ON NUCLEAR SCIENCE, Vol. 51, pp. 2156–2160.
author keywords: AC coupled; inductive coupling; spiral inductor; three-dimensional integrated circuits (3-D ICs); through vias; vertical interconnect
TL;DR:
This paper presents the potential application of AC coupled interconnect (ACCI) for dense three-dimensional (3-D) integrated circuits (ICs) and concludes that inductive ACCI can provide small pitch vertical interconnects, as well as an excellent thermal solution for dense 3-D ICs.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2004 article
Buried bump and AC coupled interconnection technology
Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 121–125.
author keywords: capacity-coupled circuits; coupled interconnections; integrated circuits; I/O; solder bumps
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2004 journal article
Causal reduced-order modeling of distributed structures in a transient circuit simulator
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 52(9), 2207–2214.
author keywords: Foster's canonical model; transient circuit simulation
TL;DR:
The implementation of the Foster's model in the fREEDA circuit simulator is reported and the modeling of a two-port coupled inductor is presented as an example.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2004 article
Chip-package co-implementation of a triple DES processor
Schaffer, T., Glaser, A., & Franzon, P. D. (2004, February). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 194–202.
author keywords: CMOS; DES processor; IC; I/O; MCM package
TL;DR:
Measurements show 3DES operation at 110 MHz, which translates to a throughput of over 7 Gb/s, the highest reported 3DES throughput to date.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2004 journal article
Clustering effects on discontinuous gold film NanoCells
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 4(7), 907–917.
author keywords: negative differential resistance; NanoCell; clustering; filamentary formation; discontinuous gold film; interlinking molecule; self-assembling; ab initio; molecular dynamics; density functional theory; nanotechnology; molecular electronics; nanoelectronics
MeSH headings : Electric Impedance; Electronics; Electrons; Gold / chemistry; Materials Testing; Models, Molecular; Nanostructures / chemistry; Nanotechnology / methods
TL;DR:
The domain of molecular electronics based in organic molecules to include nanosized clusters as active units is extended and facilitates a scenario where synthetically accessible organic molecules can be adjusted by metallic nanoclusters as an in situ fine-tuning element, able to compensate for the lack of addressing in the nanosize regime.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
14. Life Below Water
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2004 conference paper
Configureable String matching hardware for speeding up intrusion detection
ACM Workshop on secure networking. Presented at the Boston.
Event: at Boston
Source: NC State University Libraries
Added: April 17, 2019
2004 conference paper
Integration for Molecular Electronics
Proceedings of the Conference on Foundations of NanoScience. Presented at the Snowbird, UT.
Event: at Snowbird, UT
Source: NC State University Libraries
Added: April 21, 2019
2004 conference paper
SSN issues with IBIS models
Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging, 87–90.
Event: IEEE Electrical Performance of Electronic Packaging at Portland, OR, USA on October 25-27, 2004
TL;DR:
A CMOS driver circuit is simulated in HSPICE and compared with an equivalent circuit created with IBIS (input/output buffer information specification) models of the same drivers to analyze for accuracy in modeling simultaneous switching noise in drivers.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: April 21, 2019
2004 conference paper
Simplified delay design guidelines for on-chip global interconnects
Zhang, L., Liu, W., Bashirullah, R., Wilson, J., & Franzon, P. (2004, April). 29–32.
Event: The ACM Great Lakes Symposium on VLSI
Source: NC State University Libraries
Added: April 17, 2019
2004 conference paper
Simultaneous switching noise in IBIS models
Proceedings of the 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559), 3, 1000–1004.
Event: 2004 International Symposium on Electromagnetic Compatibility at Silicon Valley, CA, USA on August 9-13, 2004
TL;DR:
A tool to convert SPICE netlists to IBIS (Input/Output Buffer Information Specification) models is presented and these models are compared against macro-models of nonlinear digital drivers using spline functions with finite time difference approximation modeling techniques.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: June 9, 2019
2004 conference paper
The Design, Fabrication and Characterization of Millimeter Scale Motors for Miniature Direct Drive Robots
Proceedings of the IEEE International Conference on Robotics and Automation ’04, 4668–4673.
Event: IEEE International Conference on Robotics and Automation at New Orleans, LA, USA on April 26 - May 1, 2004
author keywords: piezoelectric; scale; ultrasonic motor
TL;DR:
Research into miniature, direct drive, high force/torque motors to support insect-sized mobile robotic platforms and results suggest that smaller versions of the rotary ultrasonic motor would possess a static torque density seven times that of a commercial 3-mm electromagnetic system.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries, Crossref
Added: April 21, 2019
2004 journal article
The design and characterization of a novel piezoelectric transducer-based linear motor
IEEE-ASME TRANSACTIONS ON MECHATRONICS, 9(2), 392–398.
author keywords: direct drive motors; linear piezomotor; passive latches; piezoelectric transducers
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2004 conference paper
The performance and experimental results of a multiple bit rate symbol timing recovery circuit for PSK receivers
Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571), 591–594.
Event: IEEE 2004 Custom Integrated Circuits Conference at Orlando, FL, USA on October 3-6, 2004
TL;DR:
A low-power all-digital symbol timing recovery circuit for digital PSK transmission systems is implemented in a 0.35-pm Silicon Qn Insulator (SOI) technology and robust against fast and large Doppler shift or frequency error on the input signal.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: June 9, 2019
2003 conference paper
A low power PSK receiver for space applications in 0.35 µm CMOS
Proceedings of the IEEE Custom Integrated Circuits Conference, 155–158.
Event: IEEE 2003 Custom Integrated Circuits Conference at San Jose, CA, USA on September 24, 2003
TL;DR:
An all-digital and low power PSK baseband receiver circuit using silicon on insulator technology (SOI) is designed for space applications and employs double differential detection to improve the receiver's robustness to Doppler effect as well as a 1 bit A/D at the front to reduce complexity and power.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: April 21, 2019
2003 conference paper
AC Coupled Interconnect for Dense 3-D Systems
Proceedings of the IEEE Conference on Nuclear Science and Imaging. Presented at the 2003 IEEE Nuclear Science Symposium Conference, Portland, OR, USA.
Event: 2003 IEEE Nuclear Science Symposium Conference at Portland, OR, USA on October 19-25, 2003
TL;DR:
This paper presents the potential application of AC Coupled Interconnect (ACCI) for dense three-dimensional (3-D) ICs and suggests that it can provide small pitch vertical interconnects, as well as an excellent thermal solution for dense 3-D ICs.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: April 21, 2019
2003 conference paper
AC Coupled Interconnect for High-Density High-Bandwidth Packaging
Extended Abstracts of the 2003 International Conference on Solid State Devices and Materials, 67–69.
Event: 2003 International Conference on Solid State Devices and Materials at Perth, Australia
Sources: Crossref, NC State University Libraries, NC State University Libraries
Added: March 24, 2019
2003 conference paper
CAD flows for chip-package codesign
Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging, 11–14.
Event: Electrical Performance of Electrical Packaging at Princeton, NJ, USA on October 27-29, 2003
TL;DR:
A unified method is presented for layout and package design implemented within a commercial design environment that will reduce design time and enable chip-package codesign.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: April 21, 2019
2003 conference paper
High Frequency, High Density Interconnect Using AC Coupling
Fall MRS Conference. Presented at the Boston, MA.
Event: at Boston, MA
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
2003 journal article
Molecular electronics: From devices and interconnect to circuits and architecture
PROCEEDINGS OF THE IEEE, 91(11), 1940–1957.
author keywords: crossbar architectures; defect tolerance; molecular electronics; nanocircuits; nanodevices; nanoscience; nanotechnology; nanotubes
TL;DR:
This work explores the design space available to the nanoelectronic circuit designer and system architect based on proposed nanoscale interconnect and device structures and presents issues related to circuits and architecture.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2003 journal article
NanoCell electronic memories
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 125(43), 13279–13283.
TL;DR:
The first assembly of a NanoCell with disordered arrays of molecules and Au islands is reported, demonstrating the efficacy of a disordered nanoscale array for high-yielding switching and memory while mitigating the arduous task of nanoscaling.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
14. Life Below Water
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2003 conference paper
The development of a macro-modeling tool to develop IBIS models
Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging, 177–280.
Event: IEEE Conference on Electrical Performance of Electrical Packaging at Princeton, NJ, USA on October 27-29, 2003
TL;DR:
A tool to convert SPICE netlists to IBIS (Input/Output Buffer Information Specification) models is presented and produces both static and dynamic characteristics of the IBIS model.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: April 21, 2019
2002 conference paper
4 Gbps AC Coupled Interconnection
Proceedings of the IEEE Custom Integrated Circuits Conference, 133–140.
Event: IEEE 2002 Custom Integrated Circuits Conference at Orlando, FL, USA on May 12-16, 2002
TL;DR:
A novel physical structure, buried solder bumps, are used as a solution for providing DC power and ground connections across the same surface as the AC connections to enable multi-gigabit-persecond communication data rates between integrated circuits with very high pin counts and low power consumption.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: June 9, 2019
2002 conference paper
Binary Search Schemes for Fast IP Lookups
Proceedings of the IEEE Globecom, 2005–2009.
Event: Global Telecommunications Conference, 2002 at Taipei, Taiwan on November 17-21, 2002
TL;DR:
Binary search schemes that allow fast address lookups that scale very well with both large databases and for longer addresses (as in IPv6) are described.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
2002 conference paper
Buried solder bump connections for high- density capacitive coupling
Proceedings of the IEEE Electrical Performance of Electronic Packaging, 205–208.
Event: 2002 IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging at Monterey, CA, USA on October 21-23, 2002
TL;DR:
AC coupled interconnects enable reliable, multi-gigabit-per-second communication data rates between integrated circuits with very high pin counts and low power consumption.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: April 21, 2019
2002 conference paper
Hierarchical simulation of high speed digital interconnects using a packaging simulator
1994 Proceedings. 44th Electronic Components and Technology Conference. Presented at the 1994 Proceedings. 44th Electronic Components and Technology Conference.
Event: 1994 Proceedings. 44th Electronic Components and Technology Conference
TL;DR:
A hierarchical strategy is presented which permits the tradeoff of modeling and simulation accuracy with simulation speed in the simulation of high speed signals on interconnects in multichip modules and printed circuit boards.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
2002 conference paper
Low power logical element for FPGA fabric
Proceedings of the IEEE International Conference on Microelectronics, 55–57.
Event: The 14th International Conference on Microelectronics at Beirut, Lebanon on December 13, 2002
TL;DR:
A low power LE is shown by taking advantage of the commutative property of operations to allow the data to be reorganized such that there will be separate paths for logic state 0 and logic state 1.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
2002 journal article
Nanocell logic gates for molecular computing
IEEE TRANSACTIONS ON NANOTECHNOLOGY, 1(2), 100–109.
author keywords: circuit simulation; genetic algorithms; logic circuit fault tolerance; logic devices; molecular electronics
TL;DR:
Genetic algorithm-based simulations of molecular device structures in a nanocell where placement and connectivity of the internal molecular switches are not specifically directed and the internal topology is generally disordered show that it is possible to use easily fabricated nanocells as logic devices by setting theinternal molecular switch states after the topological molecular assembly is complete.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2002 conference paper
Network Processor Design for Optical Burst Switched Networks
Proceedings of the 14th Annual IEEE International ASIC/SOC Conference, 296–300.
Event: 14th Annual IEEE International ASIC/SOC Conference at Arlington, VA, USA on September 12-15, 2001
TL;DR:
Scalable hardware, architectures are required for optical burst switched networks where future fibers may be handling 4Tbps or more and issues investigated include centralized vs. distributed architectures, sealing issues related to performance, and the hardware impact of just-in- time (JIT) vs. just-enough-time (JET) signaling.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: June 9, 2019
2002 conference paper
Novel Hardware Implementation for Fast Address Lookups
Proceedings of 2002 Workshop on High Performance Switching and Routing. Presented at the 2002 Workshop on High Performance Switching and Routing, Kobe, Japan.
Event: 2002 Workshop on High Performance Switching and Routing at Kobe, Japan on May 26-29, 2002
TL;DR:
The work presented describes a new fast and efficient algorithm for searching a large database where only a single off-chip DRAM access is required to determine the next hop address.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: June 9, 2019
2002 journal article
Novel hardware architecture for fast address lookups
IEEE Communications Magazine, 40(11), 66–71.
Sources: Crossref, NC State University Libraries
Added: March 9, 2019
2002 conference paper
Packaging Technology for AC Coupled Interconnection
IMAPS Flip-Chip Conference.
Source: NC State University Libraries
Added: April 17, 2019
2002 conference paper
Scalable Molecular Circuit Architectures
2002 Engineering Foundation Conference on Molecular Computing. Presented at the Key West.
Event: at Key West
Source: NC State University Libraries
Added: April 17, 2019
2002 journal article
Single force measurements on 3D collagen matrix
Biophysical Journal, 82(1).
Source: NC State University Libraries
Added: March 9, 2019
2001 conference paper
Design of rotating MEMS tunable capacitors for use at RF and Microwave frequencies
Proceedings of the SPIE International Symposium on Microelectronics and MEMS. Presented at the Adelaide, Australia.
Event: at Adelaide, Australia
Source: NC State University Libraries
Added: April 17, 2019
2001 conference paper
Improving Interconnect Characteristics of Thin Film MEMS Processes
Proceedings of the SPIE International Symposium on Microelectronics and MEMS. Presented at the Adelaide, Australia.
Event: at Adelaide, Australia
Source: NC State University Libraries
Added: April 17, 2019
2001 journal article
Load characterization of high displacement piezoelectric actuators with various end conditions
SENSORS AND ACTUATORS A-PHYSICAL, 94(1-2), 19–24.
author keywords: THUNDER transducers; piezoelectric; actuator; ferroelectric; PZT; unimorph
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2001 conference paper
Multi-gigahertz low-power low-skew rotary clock scheme
Proceedings International Conference On Solid State Circuits, 400–401, 470.
Source: NC State University Libraries
Added: April 17, 2019
2001 conference paper
Smart sensors to monitor warp tension and breaks on a loom
Source: NC State University Libraries
Added: August 6, 2018
2001 conference paper
The Future of Molecular Electronics
Proceedings of the International Conference on Computer Aided Design of Integrated Circuits. Panel Session.
Source: NC State University Libraries
Added: June 9, 2019
2000 conference paper
Application of micromachines to textiles: Using smart sensors to monitor warp tension and breaks during formation of woven fabrics
Proceedings of the International Mechanical Engineering Congress & Exposition, ASME, Orlando (FL), November 2000. New York: ASME.
Source: NC State University Libraries
Added: August 6, 2018
2000 conference paper
High displacement piezoelectric actuators: characterization at high load with controlled end conditions
Proceedings of the 12th IEEE International Symposium on Applications of Ferroelectrics, 745–748.
Event: 12th IEEE International Symposium on Applications of Ferroelectrics at Honolulu, HI, USA on July 21 - August 2, 2000
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: June 9, 2019
2000 conference paper
Leveraging high density packaging for high performance DSP systems
Proceedings of the IEEE Electrical Performance on Electronic Packaging, 25–28.
Event: at Scottsdale, AZ, USA on October 23-25, 2002
TL;DR:
The physical and logical architecture of a high performance FFT system enabled by a combination of high density packaging and good memory management schemes, with an emphasis on signal integrity issues is described.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: June 9, 2019
2000 conference paper
Micromachines and textiles: Matching two industries
Source: NC State University Libraries
Added: August 6, 2018
2000 journal article
Micromachines and textiles: Matching two industries
Textile Asia, 31, 58–66.
Source: NC State University Libraries
Added: August 6, 2018
2000 conference paper
Moletronics: A circuit design perspective
Proceedings of the SPIE 4236, Smart Electronics and MEMS II, 4236, 80–88.
Event: at Melbourne, Australia
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1999 conference paper
Accuracy Issues in Full-Chip Extraction
DAC 1999.
Source: NC State University Libraries
Added: April 17, 2019
1999 conference paper
Design Automation and Design Challenges for Package/Systems
Proceedings of the IEEE Asia Design Automation Conference, 372.
Event: at Hong Kong
Source: NC State University Libraries
Added: April 21, 2019
1999 conference paper
Dynamically Programmable Cache, Evaluation and Virtualization
Proceedings ACM/SIGDA FPGA 99, 246.
Event: at Monterey, CA on February 21-23, 1999
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1999 journal article
High frequency loss and electromagnetic field distribution for striplines and microstrips
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 22(1), 16–25.
author keywords: finite element method; measured equation of invariance; microstrip; multichip module; package design; propagation mode; triplate strip
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
1999 journal article
Improved delay prediction for on-chip buses
Proceedings of the 1999 Design Automation Conference, 497–501.
Event: at New Orleans, LA, USA on June 21-25, 1999
TL;DR:
A simple procedure to predict wiring delay in bi-directional buses and a way of properly sizing the driver for each of its ports and a simple calibration procedure to improve its delay prediction over the Elmore delay of the RC tree are introduced.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1999 conference paper
Infrastructure and course progression for complex IC design education
Proceedings of the 1999 IEEE International Conference on Microelectronic Systems Education (MSE'99) `Systems Education in the 21st Century' (Cat.No.99-63794), 88–89.
Event: 1999 IEEE International Conference on Microelectronic Systems Education (MSE'99) `Systems Education in the 21st Century' (Cat.No.99-63794) at Arlington, VA, USA on July 19-21, 1999
TL;DR:
The ability to cope with design complexity is an important skill for computer engineers, especially potential system on a chip design engineers, and teaching complexity requires considerable investment in tool flows, design examples and tutorials.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: June 9, 2019
1999 conference paper
MEMS-based switches for Digital and RF Switching
Proceedings Advanced Research in VLSI, 369–377.
Event: at Atlanta, GA
Source: NC State University Libraries
Added: April 21, 2019
1999 conference paper
Methodology for Design of Electrostatic MEMS Devices Using the SUMMiT Process
Proceedings of the 45th International Instrumentation Symposium, 511–520.
Event: at Albequerue, NM
Source: NC State University Libraries
Added: April 21, 2019
1999 conference paper
Programmable MEMS Capacitor Arrays
Proceedings SPIE International Symposium on Microelectronics and Micromechanical Systems.
Source: NC State University Libraries
Added: April 17, 2019
1999 conference paper
Three Dimensional MCM Package Assembly and Analysis
Proceedings of the IEEE/IMAPS Conference on High Density Packaging and MCMS, 188–192.
Event: IEEE/IMAPS Conference on High Density Packaging and MCMS at Denver, CO
Source: NC State University Libraries
Added: June 9, 2019
1998 review
A review of 3-D packaging technology
[Review of ]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 21(1), 2–14.
author keywords: bare dice stacking; MCM stacking; 3-D MCM technology; 3-D packaging; vertical interconnection
TL;DR:
This paper reviews the state-of-the-art in three-dimensional (3-D) packaging technology for very large scale integration (VLSI) and investigates vertical interconnect techniques.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
1998 conference paper
Accurate Lumped-Parameter modeling for dynamic simulation of electrostatic MEMS Actuators
Proceedings International Workshop on Modeling of MEMS Systems.
Source: NC State University Libraries
Added: April 21, 2019
1998 conference paper
Dynamically Programmable Cache
Proceedings of the SPIE Conference on Reconfigurable Computing, 218–226.
Event: at Boston, MA
Source: NC State University Libraries
Added: April 17, 2019
1998 conference paper
Flip-chip Power Distribution
Proceedings of the IEEE 7th Topical Meeting on the Electrical Performance of Electronic Packaging, 39–41.
Event: IEEE 7th Topical Meeting at West Point, NY, USA on October 26-28, 1998
Sources: Web Of Science, NC State University Libraries
Added: April 21, 2019
1998 conference paper
Issues in Chip-Package Codesign with MCM-D/Flip-Chip Technology
Proceedings of the IEEE International Symposium on Chip-Package Codesign, 88–92.
Event: at Santa Cruz, CA, USA on February 2-3, 1998
TL;DR:
By distributing on-chip global power, ground, and clock planes on a thin film MCM, the IC can be made smaller, faster, and less noisy while consuming less power.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: April 21, 2019
1998 conference paper
MEMS-based diffractive optical beam steering system
Proceedings SPIE 3276, Miniaturized Systems with Micro-Optics and Micromechanics III, 3276, 81–87.
Event: Optoelectronics and High-Power Lasers and Applications at San Jose, CA, United States
author keywords: optical beam steering; programmable diffractive optics; MEMS; micro-mirrors; phase modulators
TL;DR:
This paper presents some results from phase-1 research into developing a beam steerer based on micro-mechanical diffractive elements that are electrostatically controlled to allow dynamic programming of a 2D phase function.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: June 9, 2019
1998 conference paper
Power Reduction by low activity datapath design and SRAM energy models
Proceedings Workshop on Low Power Techniques, ISCA98.
Source: NC State University Libraries
Added: April 17, 2019
1998 conference paper
The NCSU Design Kit for IC Fabrication Through MOSIS
Proceedings 1998 International Cadence User Group Conference, 71–80.
Event: on September 13-17, 1998
Source: NC State University Libraries
Added: April 21, 2019
1997 conference paper
A Low-cost, High Performance Three-Dimensional Memory Module
Proceedings of the IEEE Memory Technology, Design and Testing Workshop, 2–7.
Event: at San Jose, CA, USA on August 11-12, 1997
TL;DR:
This attach technology, perpendicular chip attach, is well-suited for applications such as memory modules, mixed-signal systems integration, and high-density microelectromechanical systems (MEMS).
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1997 conference paper
An accurate, computationally efficient crosstalk model for routing high-speed MCMs
Proceedings ASIC Conference and Exhibit, 110–114.
Source: NC State University Libraries
Added: April 21, 2019
1997 journal article
Clocking Optimization and Distribution of Digital Systems with Scheduled Skews
International Journal of VLSI Signal Processing, 16, 19–36.
Source: NC State University Libraries
Added: March 20, 2019
1997 journal article
Clocking optimization and distribution in digital systems with scheduled skews
JOURNAL OF VLSI SIGNAL PROCESSING SYSTEMS FOR SIGNAL IMAGE AND VIDEO TECHNOLOGY, 16(2-3), 131–147.
TL;DR:
A theoretical framework is first presented for solving the problem of optimally scheduling skews and a novel self-calibrating clock distribution scheme is then developed which can automatically track variations and minimize unintentional skews.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
1997 conference paper
Experimental Electrical Characterization of On-Chip Interconnects
Proceedings of the IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 57–59.
Event: at Austin, TX, USA on October 27-29, 1997
Sources: Web Of Science, NC State University Libraries
Added: April 21, 2019
1997 conference paper
Low Power Data Processing by Elimination of Redundant Computations
Proceedings 1997 International Symposium on Low Power Electronics and Design, 259–264.
Event: 1997 International Symposium on Low Power Electronics and Design at Monterey, California on August 18-20, 1997
Source: NC State University Libraries
Added: June 9, 2019
1997 conference paper
MCM Implementation of a Data Encryption Standard (DES) Processor
Proceedings of the 1997 IEEE MCM Conference, 13–17.
Event: 1997 IEEE MCM Conference
Source: NC State University Libraries
Added: June 9, 2019
1997 conference paper
MIDAS Flip-Chip Service
Proceedings of the 1997 IEEE MCM Conference, 133–135.
Event: 1997 IEEE MCM Conference
Source: NC State University Libraries
Added: June 9, 2019
1997 conference paper
Performance Evaluation of Micromechanical Binary Phase-Only Holographic Optical Elements
Proceedings of the IEEE Electronic Technology and Components Conference, 419–424.
Event: at San Jose, CA, USA on May 18-21, 1997
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1997 conference paper
Simulation vs. Calculation of Crosstalk
Proceedings of the IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 131–134.
Event: at Austin, TX, USA on October 27-29, 1997
Sources: Web Of Science, NC State University Libraries
Added: April 21, 2019
1997 conference paper
Thermal/mechanical analysis and design of three dimensional high density MCM package
Proceedings of the Next Generation Package Design Workshop.
Source: NC State University Libraries
Added: April 21, 2019
1996 conference paper
Computer Design Strategy for MCM-D/Flip-Chip Technology
Proceedings of the 1996 Topical Meeting on Electrical Performance of Electronic Packaging, 6–8.
Source: NC State University Libraries
Added: April 21, 2019
1996 conference paper
Computer Design Strategy for MCM-D/Flip-Chip Technology
Proceedings of the 1996 ASIC Conference, 35–39.
Source: NC State University Libraries
Added: April 21, 2019
1996 journal article
Experimental Characterization of Transmission Lines in Thin-Film Multichip Modules
IEEE Trans. on Components Hybrids and Manufacturing Technology Part A, 19(1), 74–82.
Source: NC State University Libraries
Added: March 20, 2019
1996 book
High Performance Design Automation for Multi-Chip Modules and Packages
World Scientific.
Source: NC State University Libraries
Added: March 9, 2019
1996 conference paper
High Speed Bus Design Using HSPICE Optimization Techniques Based on Worst Case Design Approach
Proceedings of the 1996 Topical Meeting on Electrical Performance of Electronic Packaging, 93–96.
Source: NC State University Libraries
Added: April 21, 2019
1996 conference paper
Issues in Partitioning Integrated Circuits for MCM-D/Flip-Chip Technology
Proceedings of the 1996 IEEE MultiChip Module Conference. Presented at the Santa Cruz, CA, USA.
Event: at Santa Cruz, CA, USA on February 6-7, 1996
TL;DR:
A discussion on issues of partitioning a high performance large monolithic chip onto MCM-D/flip-chip-solder-bump technology, using a CPU as an example, and speculates on some interesting possibilities arising from partitioning.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: April 21, 2019
1996 chapter
Multichip Module Technology
In J. Whitaker (Ed.), The Electronic Handbook. CRC Press.
Ed(s): J. Whitaker
Source: NC State University Libraries
Added: March 9, 2019
1996 conference paper
Pin Assignment for High-Performance MCM Systems
Proceedings of the 1996 IEEE ISCAS Conference, 771–774.
Event: at Atlanta, GA, USA on May 15, 1996
TL;DR:
A very fast and efficient pin assignment strategy and algorithm for the early design phase of high-performance Multi-Chip-Modules (MCM) is proposed, which minimizes total wire length, white satisfying the timing constraints.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1996 conference paper
System Design Optimization With Multichip Module Technology
Proceedings 1996 Conference of the Brazilian Microelectronics Society. Presented at the 1996 Conference of the Brazilian Microelectronics Society.
Event: 1996 Conference of the Brazilian Microelectronics Society
Source: NC State University Libraries
Added: June 9, 2019
1995 conference paper
A Micro-machined Approach to Optical Interconnect
Proceedings 1995 Electronic Components and Technology Conference, 620–627.
Source: NC State University Libraries
Added: April 21, 2019
1995 journal article
Energy consumption modeling and optimization for SRAM's
IEEE Journal of Solid-State Circuits, 30(5), 571–579.
TL;DR:
This paper presents and compares five approaches for modeling the energy consumption of CMOS circuits and shows that global, rather than local improvements, produce the largest energy savings.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 9, 2019
1995 conference paper
Measurement of on-IC Capacitance Structures
Proceedings of the 1995 IEEE Topical Meeting on Electrical Performance of Electronic Packaging.
Source: NC State University Libraries
Added: April 21, 2019
1995 conference paper
Optimal System Design with MultiChip Module Technology
Proceedings of Microeletronics'95.
Source: NC State University Libraries
Added: April 21, 2019
1995 conference paper
Performance Driven Global Routing and Wiring Rule Generation for High Speed PCBs and MCMs
Proceedings 1995 Design Automation Conference, 36–40.
Source: NC State University Libraries
Added: April 21, 2019
1995 chapter
Performance Driven Global Routing and Wiring Rule Generation for High Speed PCBs and MCMs
In M. Pecht (Ed.), Advanced Routing of Electronic Modules. Kluwer.
Ed(s): M. Pecht
Source: NC State University Libraries
Added: March 9, 2019
1995 journal article
Simulation of high speed interconnects using a convolution-based hierarchical packaging simulator
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 18(1), 74–82.
TL;DR:
A new impulse response/convolution technique is developed to efficiently handle large distributed interconnect networks and provides a smooth transition from delay modeling of interconnects to full distributed circuit simulation.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: March 20, 2019
1995 conference paper
System Design Optimization for MCM
Proceedings of the 1995 IEEE MultiChip Module Conference. Presented at the Santa Cruz, CA, USA.
Event: at Santa Cruz, CA, USA on January 31 - February 2, 1995
TL;DR:
Examples are given showing for what conditions the cost of the system can be reduced through chip partitioning and how the performance/cost of a computer core can be increased by 81%.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1995 journal article
System design optimization for MCM-D/flip-chip
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 18(4), 620–627.
author keywords: MULTICHIP MODULE; DESIGN OPTIMIZATION; PACKAGE DESIGN; IC DESIGN; IC YIELD; COST; MICROPROCESSOR; MCM-D; FLIP-CHIP
TL;DR:
Examples are given showing for what conditions the cost of the system can be reduced through chip partitioning and how the performance/cost of a computer core can be increased.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 9, 2019
1994 conference paper
Applications of MEMS to Reconfigurable Free Space Optical Interconnect
Proceedings NSF Optical Packaging Workshop. Presented at the NSF Optical Packaging Workshop, Breckenridge, CO.
Event: NSF Optical Packaging Workshop at Breckenridge, CO on August 15-17, 1994
Source: NC State University Libraries
Added: June 9, 2019
1994 conference paper
Control of Crosstalk Noise
Proceedings of the 1994 ECTC Conference.
Source: NC State University Libraries
Added: April 21, 2019
1994 journal article
Delay and reflection noise macromodeling for signal integrity management of PCBs and MCMs
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 17(1), 15–21.
TL;DR:
An automated approach based on a-priori simulation-based characterization of the interconnect circuit configurations is presented and the improved flexibility and accuracy provided, when compared with traditional approaches, are demonstrated via an MCM interconnect example.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 9, 2019
1994 journal article
Energy control and accurate delay estimation in the design of CMOS buffers
IEEE Journal of Solid-State Circuits, 29(9), 1150–1153.
TL;DR:
A computer aided method is presented to design CMOS multistage variable-taper buffers with optimum energy efficiencies while satisfying speed requirements, and a technique for obtaining accurate empirical delay equations for buffers is presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Crossref, NC State University Libraries
Added: March 9, 2019
1994 journal article
SABSA: Switching-Activity Based State Assignment
International Journal of High Speed Electronics and Systems, 5(2), 203–212.
Source: NC State University Libraries
Added: March 20, 2019
1994 conference paper
Skew and Delay Minimization of High Speed CMOS Circuits using Stochastic Optimization
Proceedings of the 1994 Custom Integrated Circuits Conference, 45–48.
Source: NC State University Libraries
Added: June 9, 2019
1994 conference paper
Stochastic OptimizationApproach to Transistor Sizing for CMOS Circuits
Proceedings of the 1994 IEEE Design Automation Conference, 36–40.
Event: at San Diego, California, USA on June 6-10, 1994
TL;DR:
A stochastic global optimization approach is presented for transistor sizing in CMOS VLSI circuits, which is a direct search strategy for the best design among feasible ones, with the designer determining when the search is stopped.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1994 journal article
The Case for MCMs
Semiconductor International, 85–86.
Source: NC State University Libraries
Added: March 9, 2019
1993 conference paper
A Signal Integrity Advisor for Automated Packaging Design
Proceedings of the 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging. Presented at the Monterey, CA, USA.
Event: at Monterey, CA, USA on October 20-22, 1993
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1993 journal article
A layout-driven yield predictor and fault generator for VLSI
IEEE Transactions on Semiconductor Manufacturing, 6(1), 77–82.
TL;DR:
The authors present an efficient approach to probability-graded fault list generation, and critical area calculation for IC yield production, which is built on top of existing design rule checking routines.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 9, 2019
1993 conference paper
A simple method for noise tolerance characterization of digital circuits
Proceedings 1993 Great Lakes VLSI Conference.
Source: NC State University Libraries
Added: April 21, 2019
1993 journal article
An MCM Design Process with Application to a Laptop Computer Design
IEEE Computer Magazine, 26(4), 41–49.
Source: NC State University Libraries
Added: March 9, 2019
1993 conference paper
Automatic A-Priori Generation of Delay and Noise Macromodels and Wiring Rules for MCMs
Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93. Presented at the Santa Cruz, CA, USA.
Event: at Santa Cruz, CA, USA on May 15-18, 1993
TL;DR:
An automated approach based on a-priori simulation-based characterization of the interconnect circuit configurations is presented and the improved flexibility and accuracy provided, when compared with the rule of thumb approach, are demonstrated.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1993 journal article
Comparison of methods for determining the capacitance of planar transmission lines with application to multichip module characterization
IEEE Trans. on Components Hybrids and Manufacturing Technology/Advanced Packaging.
Source: NC State University Libraries
Added: March 20, 2019
1993 conference paper
Design advice systems for concurrent engineering: A constraint-based approach
Bowen, J., Bahler, D., & Franzon, P. (1993, January). Presented at the NSF Grantees Conference, Charlotte, NC.
Event: NSF Grantees Conference at Charlotte, NC
Source: NC State University Libraries
Added: April 21, 2019
1993 conference paper
Experimental characterization of interconnects and discontinuities in thin-film multichip module substrates
Proceedings of the 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging. Presented at the 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, USA.
Event: 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging at Monterey, CA, USA on October 20-22, 1993
Sources: NC State University Libraries, NC State University Libraries
Added: June 9, 2019
1993 conference paper
LISAS: A Language for Instruction Set Architecture Specification
Proceedings 1993 ICCD Conference, 552–557.
Source: NC State University Libraries
Added: June 9, 2019
1993 conference paper
Macromodels for Generating Signal Integrity and Timing Management Advice for Package Design
Proceedings of the IEEE 1993 ECTC Conference, 523–529.
Event: at Orlando, FL, USA on June 1-4, 1993
TL;DR:
The most important aspect of this solution, the internal 'macromodels' that accurately capture the relationships between electrical/timing design and the package physical design (or layout), are described.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: April 21, 2019
1993 journal article
Method for automated waveform analysis of transient in digital circuits
Electronics Letters, 29(8), 681–693.
Source: NC State University Libraries
Added: March 9, 2019
1993 book
Multichip Modules: Basics and Alternatives
Van Nostrand Rheinhold.
Source: NC State University Libraries
Added: March 9, 2019
1993 chapter
Tools and Techniques for the Design of High Speed Multichip Modules, Chapter 7
In J. Morris (Ed.), Electronics Packaging Forum (Vol. 3). IEEE Press.
Ed(s): J. Morris
Source: NC State University Libraries
Added: March 9, 2019
1992 conference paper
An efficient table-driven decoder for one-half rate convolutional codes
ACM-SE 30 Proceedings of the 30th annual Southeast regional conference, 116–123.
Event: at Raleigh, North Carolina on April 8-10, 1992
TL;DR:
This paper describes an efficient table-driven decoder for 1/2-rate nonsystematic convolutional codes and discusses various decoder implementation and performance issues.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: June 9, 2019
1992 conference paper
Automating Design for Signal Integrity
Proceedings 1992 IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 10–13.
Event: at Tucson, AZ, USA on April 22-24, 1992
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1992 journal article
Comment on an accurate measurement technique for line properties, junction effects and dielectric and magnetic parameters
IEEE Transactions on Microwave Theory Tech.
Source: NC State University Libraries
Added: March 9, 2019
1992 conference paper
Cost/performance issues in multichip module packaging
Proceedings of the Japan International Conference on Microelectronics.
Source: NC State University Libraries
Added: April 21, 2019
1992 conference paper
Introducing the through-line deembedding procedure
1992 IEEE MTT-S International Microwave Symposium Digest. Presented at the Albuquerque, NM, USA.
Event: at Albuquerque, NM, USA on June 1-5, 1992
TL;DR:
The through-line (TL) method is introduced to replace the through-reflect- line (TRL) deembedding procedure and accounts for the frequency-dependent characteristic impedance of the line and avoids the periodic glitches inherent in the TRL procedure.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1992 conference paper
Microwave characterization of thin-film multi-chip module substrates and printed wiring boards accounting for frequency-dependent characteristic impedance
Proceedings of the IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 125–127.
Event: at Tucson, AZ, USA on April 22-24, 1992
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1992 conference paper
Tools to aid in Wiring Rule Generation for High Speed Interconnects
Proceedings 1992 Design Automation Conference, 466–471.
Source: NC State University Libraries
Added: April 21, 2019
1991 conference paper
Accurate experimental characterization of three-ports
Proceedings of the 1991 IEEE MTT-S International Microwave Symposium Digest. Presented at the Boston, MA, USA.
Event: at Boston, MA, USA on July 10-14, 1991
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1991 conference paper
Automating Design for Signal Integrity
Topical Meeting on Electrical Performance of Electronic Packaging. Tucson, Arizona.
Source: NC State University Libraries
Added: April 21, 2019
1991 conference paper
Experimental electrical characterization of high speed interconnects
Proceedings of the 41st Electronic Components and Technology Conference.
Source: NC State University Libraries
Added: April 21, 2019
1991 journal article
Experimental electrical characterization of interconnects and discontinuities in high-speed digital systems
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 14(4), 761–765.
Sources: Crossref, NC State University Libraries
Added: March 9, 2019
1991 conference paper
High Speed Digital System Simulation using Frequency Dependent Transmission Line Network Modeling
Proceedings of the 1991 IEEE MTT-S International Microwave Symposium Digest. Presented at the Boston, MA, USA.
Event: at Boston, MA, USA on July 10-14, 1991
TL;DR:
A robust and accurate method for the analysis of high-speed digital circuits with a lossy, frequency-dependent transmission line network with convolution and time-domain scattering parameters is presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: April 21, 2019
1991 conference paper
Interconnect Modeling and Simulation for High Speed MCM
Proceedings Multichip Module Workshop, 122–129.
Source: NC State University Libraries
Added: April 21, 2019
1991 conference paper
Microwave characterization of thin-film multi-chip module substrates and printed wiring boards accounting for frequency-dependent characteristic impedance
Topical Meeting on Electrical Performance of Electronic Packaging. Tucson, Arizona.
Source: NC State University Libraries
Added: April 21, 2019
1991 conference paper
The NCSU Design Center
Proceedings of the 1991 Microsystems Educators Conference. Presented at the San Jose, CA.
Event: at San Jose, CA
Source: NC State University Libraries
Added: April 21, 2019
1991 conference paper
Tools and Techniques for the Design of High Speed Multichip Modules
Proceedings of the Third Annual Electronics Packaging Symposium. Presented at the Third Annual Electronics Packaging Symposium, Binghamton, NY.
Event: Third Annual Electronics Packaging Symposium at Binghamton, NY on May 13-14, 1991
Source: NC State University Libraries
Added: June 9, 2019
1991 conference paper
Tools and techniques for the Design of High Speed Multichip Modules
Proceedings Japan IEMT.
Source: NC State University Libraries
Added: April 21, 2019
1990 conference paper
Circuit Simulation with Distributed Elements
Proceedings of the Workshop on Circuit and Process Simulation. Presented at the Workshop on Circuit and Process Simulation, Microelectronics Center of North Carolina, Research Triangle Park.
Event: Workshop on Circuit and Process Simulation at Microelectronics Center of North Carolina, Research Triangle Park on November 6, 1990
Source: NC State University Libraries
Added: June 9, 2019
1990 conference paper
Defect tolerant implementations for feed-forward and recurrent neural networks
Proceedings of 1990 International Conference on Wafer-Scale Integration, 160–166.
Source: NC State University Libraries
Added: April 21, 2019
1990 conference paper
McYield: A CAD Tool for Functional Yield Projections for VLSI
1990 International Workshop on Defect and Fault Tolerance in VLSI Systems.
Source: NC State University Libraries
Added: April 21, 2019
1990 journal article
Scalable VLSI implementations for neural networks
Journal of VLSI Signal Processing Systems for Signal, Image and Video Technology, 1(4), 367–385.
TL;DR:
It is found that analog computation with digitally programmable weights works best for feed-forward networks, while stochastic processing takes advantage of the integrative nature of recurrent networks.
(via Semantic Scholar)
Sources: Crossref, NC State University Libraries
Added: March 24, 2019
1989 journal article
Achieving ULSI through defect tolerance
International Journal of Computer Aided VLSI Design, 1(1), 73–90.
Source: NC State University Libraries
Added: March 9, 2019
1989 conference paper
Comparison of Reconfiguration Schemes for Defect Tolerant Mesh Arrays
Proceedings of the 1989 Workshop on Defect Tolerance. Presented at the Tampa, Florida.
Event: at Tampa, Florida
Source: NC State University Libraries
Added: April 21, 2019
1989 chapter
Comparison of Reconfiguration Schemes for Defect Tolerant Mesh Arrays
In V. K. Jain (Ed.), Defect and Fault Tolerance in VLSI Systems (Vol. 2). Plenum.
Ed(s): V. Jain
Source: NC State University Libraries
Added: March 9, 2019
1989 chapter
Fundamental interconnection issues
In Electronic Materials Handbook: Vol. 1: Packaging (pp. 1–11). ASM International.
Source: NC State University Libraries
Added: March 20, 2019
1989 journal article
Modeling interconnect yield in reconfigurable circuits
Electronics Letters, 25(18), 1225–1226.
Source: NC State University Libraries
Added: April 21, 2019
1988 chapter
'Chip Frame’ scheme for reconfigurable mesh-connected arrays
In R. M. Lea (Ed.), Water Scale Integration II. North Holland.
Ed(s): R. Lea
Source: NC State University Libraries
Added: April 11, 2019
1987 journal article
FIR digital filters for high sample rate applications
IEEE Communications Magazine, 25(7), 62–72.
Sources: Crossref, NC State University Libraries
Added: March 9, 2019
1987 chapter
Franzon: Yield Modeling for Fault Tolerant VLSI
In W. Moore, A. McCabe, & R. Urquhart (Eds.), Systolic Arrays. Adam Hilger.
Ed(s): W. Moore, A. McCabe & R. Urquhart
Source: NC State University Libraries
Added: March 9, 2019
1987 journal article
Fundamental Interconnection Issues
AT&T Technical Journal, 66(4), 13–30.
Sources: Crossref, NC State University Libraries
Added: March 9, 2019
1987 conference paper
`Chip Frame' scheme for reconfigurable mesh-connected arrays
Proceedings of the 1987 International workshop on Wafer Scale Integration. Uxbridge, England.
Source: NC State University Libraries
Added: April 21, 2019
1986 conference paper
Interconnect Strategies for Fault Tolerant 2D VLSI Arrays
Proceedings of the International Conference on Computer Design, 230–234.
Event: at Rye Town, NY
Source: NC State University Libraries
Added: April 21, 2019
1986 conference paper
Through-Wafer Optical Interconnects for Multi-Wafer Wafer-Scale Integrated architectures
Proceedings of SPIE 86. Presented at the SPIE 86, San Diego, California.
Event: SPIE 86 at San Diego, California
Source: NC State University Libraries
Added: June 9, 2019
1986 conference paper
Yield Modeling for Fault Tolerant VLSI
Proceedings of the International Workshop on Systolic Arrays. England: University of Oxford.
Source: NC State University Libraries
Added: April 21, 2019
1985 conference paper
The Transform and Filter Brick: A new architecture for signal processing
Proceedings of the VLSI 85. Presented at the VLSI 85, Tokyo, Japan.
Event: VLSI 85 at Tokyo, Japan on August 25-28, 1985
Source: NC State University Libraries
Added: June 9, 2019
conference paper
A Robust calibration and supervised machine learning reliability framework for digitally-assisted self-healing RFICS
Wyers, E. J., Qi, W. Y., & Franzon, P. D. 2017 ieee 60th international midwest symposium on circuits and systems (mwscas), 1138–1141.
Source: NC State University Libraries
Added: August 6, 2018
patent
Buried solder bumps for AC-coupled microelectronic interconnects
Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
conference paper
CAD Tools for the Automated Design of High Speed Multichip Modules
Franzon, P. Proceedings of the 1990 International Packaging Symposium.
Source: NC State University Libraries
Added: April 21, 2019
conference paper
CAD tools for Managing Signal Integrity and Congestion Simultaneously
Mehrotra, S., Franzon, P., Bilbro, G., & Steer, M. Proceedings of the 1994 Topical Meeting on Electrical Performance of Electrical Packaging, 30–32.
Source: NC State University Libraries
Added: April 21, 2019
conference paper
Comparative analysis of two 3D integration implementations of a SAR processor
Thorolfsson, T., Melamed, S., Charles, G., & Franzon, P. D. 2009 IEEE International Conference on 3d Systems Integration, 25–28.
Source: NC State University Libraries
Added: August 6, 2018
conference paper
Design and ASIC acceleration of cortical algorithm for text recognition
Dey, S., & Franzon, P. D. 2016 29th IEEE International System-on-Chip Conference (SOCC), 114–119.
Source: NC State University Libraries
Added: August 6, 2018
conference paper
Design and ASIC acceleration of cortical algorithm for text recognition
Dey, S., & Franzon, P. D. 2016 29th IEEE International System-on-Chip Conference (SOCC), 114–119.
Source: NC State University Libraries
Added: August 6, 2018
conference paper
Hardware implementation of hierarchical temporal memory algorithm
Li, W. F., & Franzon, P. 2016 29th IEEE International System-on-Chip Conference (SOCC), 133–138.
Source: NC State University Libraries
Added: August 6, 2018
conference paper
Hardware implementation of hierarchical temporal memory algorithm
Li, W. F., & Franzon, P. 2016 29th IEEE International System-on-Chip Conference (SOCC), 133–138.
Source: NC State University Libraries
Added: August 6, 2018
patent
Inductively coupled electrical connectors
Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
conference paper
Machine learning in physical design
Li, B. W., & Franzon, P. D. Ieee conference on electrical performance of electronic packaging and, 147–149.
Source: NC State University Libraries
Added: August 6, 2018
patent
Methods and systems for fast binary network address lookups using parent node information stored in routing table entries
Mehrotra, P., & Franzon, P. D. Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
patent
Methods and systems for fast packet forwarding
Mehrotra, P., & Franzon, P. D. Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
conference paper
Processor-in-memory support for artificial neural networks
Schabel, J., Baker, L., Dey, S., Li, W. F., & Franzon, P. D. 2016 IEEE International Conference on Rebooting Computing (icrc).
Source: NC State University Libraries
Added: August 6, 2018
conference paper
RDL and interposer design for DiRAM4 interfaces
Nigussie, T., & Franzon, P. D. Ieee conference on electrical performance of electronic packaging and, 17–19.
Source: NC State University Libraries
Added: August 6, 2018
journal article
RF-only logic: An area efficient logic family for RF-power harvesting applications
Zhao, W. X., Gadfort, P., Bhanushali, K., & Franzon, P. D. IEEE Transactions on Circuits and Systems. I, Regular Papers, 65(1), 406–418.
Source: NC State University Libraries
Added: August 6, 2018
conference paper
Self-calibrating clock distribution with scheduled skews
Hsieh, H.-Y., Lui, W., Clements, M., & Franzon, P. Proceedings of ISCAS'98, 2 , 470–473.
Source: NC State University Libraries
Added: April 18, 2019
journal article
Storage class memory
Burr, G. W., & Franzon, P. Emerging Nanoelectronic Devices, 498–510.
Source: NC State University Libraries
Added: August 6, 2018
journal article
Surrogate-model-based analysis of analog circuits-part I: Variability analysis
Yelten, M. B., Franzon, P. D., & Steer, M. B. IEEE Transactions on Device and Materials Reliability, 11(3), 466–473.
Source: NC State University Libraries
Added: August 6, 2018
journal article
Surrogate-model-based analysis of analog circuits-part II: Reliability analysis
Yelten, M. B., Franzon, P. D., & Steer, M. B. IEEE Transactions on Device and Materials Reliability, 11(3), 458–465.
Source: NC State University Libraries
Added: August 6, 2018
conference paper
Technology impact analysis for 3D TCAM
Oh, E. C., & Franzon, P. D. 2009 IEEE International Conference on 3d Systems Integration, 206–210.
Source: NC State University Libraries
Added: August 6, 2018
conference paper
Through silicon Via(TSV) defect/pinhole self test circuit for 3D-IC
Tsai, M. L., Klooz, A., Leonard, A., Appel, J., & Franzon, P. 2009 IEEE International Conference on 3d Systems Integration, 170–177.
Source: NC State University Libraries
Added: August 6, 2018
book
Verilog styles for synthesis of digital systems
Smith, D. R., & Franzon, P. D. Upper Saddle River, NJ: Prentice Hall.
Source: NC State University Libraries
Added: August 6, 2018
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