Works (393)

Updated: February 1st, 2024 05:27

2023 journal article

A Deep Transfer Learning Design Rule Checker With Synthetic Training

IEEE DESIGN & TEST, 40(1), 77โ€“84.

By: L. Francisco n, W. Davis n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Layout; Design methodology; Convolutional neural networks; Transfer learning; Generators; Deep learning; Manuals; Training data; Design Rule Checking; Machine Learning; IC Verification; Physical Verification; Convolutional Neural Network; Deep Learning; Synthetic Data Training; Transfer Learning
Sources: ORCID, Web Of Science
Added: January 24, 2023

2023 article

Chiplet Set For Artificial Intelligence

2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC.

By: J. Stevens n, T. Pan n, P. Ravichandiran n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: ASIP; chiplet; AI accelerator; AIB
Sources: Web Of Science, ORCID
Added: August 14, 2023

2023 article

Generative Multi-Physics Models for System Power and Thermal Analysis Using Conditional Generative Adversarial Networks

2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPS.

By: P. Kashyap*, C. Cheng*, Y. Choi* & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Power integrity; thermal analysis; digital twins; GAN; multi-physics; co-simulation
Sources: Web Of Science, ORCID
Added: January 2, 2024

2023 article

System Aware Floorplanning for Chip-Package Co-design

2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPS.

By: T. Pan n, P. Franzon nโ€‰, V. Srinivas*, M. Nagarajanโ€‰* & D. Popovic*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Floorplanning; Chip-package co-design
Sources: Web Of Science, ORCID
Added: January 2, 2024

2023 conference paper

Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package

2023 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2023 IEEE International 3D Systems Integration Conference (3DIC).

By: P. Zaghari n, S. Sinha n, J. Ryu nโ€‰, P. Franzon nโ€‰ & D. Hopkins nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2023 IEEE International 3D Systems Integration Conference (3DIC)

author keywords: GaN power module; thermal reliability; mechanical stress; fatigue life prediction; finite element analysis
Sources: Web Of Science, ORCID, Crossref
Added: July 3, 2023

2023 article

Thermal Estimation for 3D-ICs through Generative Networks

2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC.

By: P. Kashyap nโ€‰, P. Ravichandiran n, L. Wang*, D. Baron nโ€‰, C. Wong nโ€‰, T. Wu nโ€‰, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: 3DIC; thermal; generative; GAN; hybrid-bonding
Sources: Web Of Science, ORCID
Added: August 14, 2023

2022 journal article

Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning

IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 30(9), 1230โ€“1243.

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Split-manufacturing; partitioning; design obfuscation; hybrid bonding; 3-D integrated circuit (3DIC)
Sources: ORCID, Web Of Science
Added: August 15, 2022

2022 article

FAXID: FPGA-Accelerated XGBoost Inference for Data Centers using HLS

2022 IEEE 30TH INTERNATIONAL SYMPOSIUM ON FIELD-PROGRAMMABLE CUSTOM COMPUTING MACHINES (FCCM 2022), pp. 113โ€“121.

By: A. Gajjar n, P. Kashyap nโ€‰, A. Aysu n, P. Franzon nโ€‰, S. Dey* & C. Cheng*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Web Of Science, ORCID
Added: October 11, 2022

2022 journal article

Hardware Implementation of Hierarchical Temporal Memory Algorithm

ACM JOURNAL ON EMERGING TECHNOLOGIES IN COMPUTING SYSTEMS, 18(1).

By: W. Li n, P. Franzon nโ€‰, S. Dey n & J. Schabel n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Hierarchical temporal memory (HTM); ASIC design; distributed memory; KTH benchmark
Source: Web Of Science
Added: January 23, 2023

2022 article

High Dimensional Optimization for Electronic Design

MLCAD '22: PROCEEDINGS OF THE 2022 ACM/IEEE 4TH WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD), pp. 153โ€“157.

By: Y. Wen n, J. Dean n, B. Floyd nโ€‰ & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Electronic Design Automation (EDA); High Dimensions; Bayesian Optimization; Random Embeddings; Local Inspection; Analog Circuits
Sources: Web Of Science, ORCID
Added: October 31, 2022

2022 article

Modeling of Adaptive Receiver Performance Using Generative Adversarial Networks

IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), pp. 1958โ€“1963.

By: P. Kashyap nโ€‰, Y. Choi*, S. Dey*, D. Baron nโ€‰, C. Wong nโ€‰, T. Wu nโ€‰, C. Cheng*, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: SerDes; receiver; behavior modeling; adaptive; generative; GAN; DFE; IBIS-AMI
Sources: Web Of Science, ORCID
Added: September 19, 2022

2022 article

RxGAN: Modeling High-Speed Receiver through Generative Adversarial Networks

MLCAD '22: PROCEEDINGS OF THE 2022 ACM/IEEE 4TH WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD), pp. 167โ€“172.

By: P. Kashyap nโ€‰, A. Gajjar n, Y. Choi*, C. Wong nโ€‰, D. Baron nโ€‰, T. Wu nโ€‰, C. Cheng*, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Contributors: P. Kashyap nโ€‰

author keywords: SerDes; receiver; behavior modeling; adaptive; generative; measurement; GAN; DFE; IBIS-AMI
Sources: Web Of Science, ORCID
Added: October 31, 2022

2021 journal article

2Deep: Enhancing Side-Channel Attacks on Lattice-Based Key-Exchange via 2-D Deep Learning

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 40(6), 1217โ€“1229.

By: P. Kashyap nโ€‰, F. Aydin n, S. Potluri n, P. Franzon nโ€‰ & A. Aysu n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Resistance; Performance evaluation; Deep learning; Protocols; Power measurement; Side-channel attacks; NIST; Cross-device; data-augmentation; deep learning (DL); lattice-based key-exchange protocols; power side channels
Sources: Web Of Science, ORCID
Added: June 10, 2021

2021 journal article

A 125 mu m x 245 mu m Mainly Digital UHF EPC Gen2 Compatible RFID Tag in 55 nm CMOS Process

IEEE JOURNAL OF RADIO FREQUENCY IDENTIFICATION, 5(3), 317โ€“323.

By: K. Bhanushali n, W. Zhao n, W. Pitts n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: UHF Gen2 RFID; passive; chip asset tracking; obscuration; RF-only
Sources: Web Of Science, ORCID
Added: September 13, 2021

2021 article

A Review of 3D-Dynamic Random-Access Memory based Near-Memory Computation

2021 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC).

By: P. Ravichandiran n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: near-memory computation; hardware accelerators; neural network; processing-in-memory; survey; 3D-IC; memory accelerator; comparison; hybrid-memory-cube
Sources: Web Of Science, ORCID
Added: May 2, 2022

2021 journal article

A Scalable Cluster-based Hierarchical Hardware Accelerator for a Cortically Inspired Algorithm

ACM JOURNAL ON EMERGING TECHNOLOGIES IN COMPUTING SYSTEMS, 17(4).

By: S. Dey n, L. Baker n, J. Schabelโ€‰ n, W. Li n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Neuromorphic computing; accelerator; cortical processor; hierarchical temporal memory; sparse distributed memory
Sources: Web Of Science, ORCID
Added: February 28, 2022

2021 article

Design Benefits of Hybrid Bonding for 3D Integration

IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1876โ€“1881.

By: T. Nigussie*, T. Pan n, S. Lipa n, W. Pitts n, J. DeLaCruz* & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: 3DIC; Hybrid bonding; DBI; Thermo-Compression Bonding; Partitioning; 3D design flow
Sources: Web Of Science, ORCID
Added: November 1, 2021

2021 article

Design for 3D Stacked Circuits

2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM).

By: P. Franzon nโ€‰, W. Davis n, E. Rotenberg n, J. Stevens n, S. Lipa n, T. Nigussie n, H. Panโ€‰ n, L. Baker n ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Web Of Science, ORCID
Added: July 11, 2022

2021 article

Fast and Accurate PPA Modeling with Transfer Learning

2021 ACM/IEEE 3RD WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD).

By: L. Francisco n, P. Franzon nโ€‰ & W. Davis n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: PPA; Machine Learning; Power; Performance; Area; Gradient Boost; Neural Network; Transfer Learning
Sources: Web Of Science, ORCID
Added: November 15, 2021

2021 conference paper

Fast and Accurate PPA Modeling with Transfer Learning

2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD). Presented at the 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD), Munich, Germany.

By: W. Davis nโ€‰, P. Franzon nโ€‰, L. Francisco n, B. Huggins n & R. Jain*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD) at Munich, Germany on November 1-4, 2021

author keywords: PPA; Machine Learning; Power; Performance; Area; Gradient Boost; Neural Network; Transfer Learning; Surrogate Modeling
Sources: Web Of Science, ORCID
Added: February 21, 2022

2021 article

High Speed Receiver Modeling Using Generative Adversarial Networks

IEEE 30TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2021).

By: P. Kashyap nโ€‰, W. Pitts n, D. Baron nโ€‰, C. Wong nโ€‰, T. Wu nโ€‰ & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: eye diagram; IBIS-AMI; generative model; generative adversarial network; GAN; receiver
Sources: Web Of Science, ORCID
Added: March 21, 2022

2021 article

Multi-ANN embedded system based on a custom 3D-DRAM

2021 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC).

By: L. Baker n, R. Patti & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: machine learning; embedded system; Deep Neural Networks (DNNs); CNN; neural network; LSTM; MLP
Sources: Web Of Science, ORCID
Added: May 2, 2022

2020 article

Application of Quantum Machine Learning to VLSI Placement

PROCEEDINGS OF THE 2020 ACM/IEEE 2ND WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD '20), pp. 61โ€“66.

By: I. Turtletaub n, G. Li n, M. Ibrahim n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Quantum Machine Learning; Balanced Min-Cut; Variational Quantum Eigensolver; Recursive Partitioning Placement
Sources: Web Of Science, ORCID
Added: August 16, 2021

2020 journal article

Asymmetric Transformer Design With Multiband Frequency Response for Simultaneous Power and Data Transfer

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 10(4), 644โ€“653.

By: N. Zannatโ€‰ n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Frequency response; Passband; Bandwidth; Mathematical model; Connectors; Inductors; Data transfer; Asymmetric transformer design; communication on wireless power transfer (WPT) link; inductive power transfer; inductively coupled channel
Sources: Web Of Science, ORCID
Added: April 27, 2020

2020 article

CTLE Adaptation Using Deep Learning in High-speed SerDes Link

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), pp. 952โ€“955.

By: B. Li n, B. Jiao*, C. Chou*, R. Mayder* & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: receiver; CTLE; adaptation; deep neural networks; high- correlation; fast
Sources: Web Of Science, ORCID
Added: March 8, 2021

2020 article

Design Rule Checking with a CNN Based Feature Extractor

PROCEEDINGS OF THE 2020 ACM/IEEE 2ND WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD '20), pp. 9โ€“14.

By: L. Francisco n, T. Lagare n, A. Jain n, S. Chaudhary n, M. Kulkarni n, D. Sardana n, W. Davis n, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Design Rule Checking; Machine Learning; IC Verification; Design for Manufacturing; Convolutional Neural Network; Deep Learning
Sources: Web Of Science, ORCID
Added: August 16, 2021

2020 article

Machine Learning and Hardware security: Challenges and Opportunities -Invited Talk

2020 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER AIDED-DESIGN (ICCAD).

co-author countries: Germany ๐Ÿ‡ฉ๐Ÿ‡ช France ๐Ÿ‡ซ๐Ÿ‡ท Ireland ๐Ÿ‡ฎ๐Ÿ‡ช Japan ๐Ÿ‡ฏ๐Ÿ‡ต Netherlands ๐Ÿ‡ณ๐Ÿ‡ฑ Singapore ๐Ÿ‡ธ๐Ÿ‡ฌ United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: machine learning; hardware security
Sources: Web Of Science, ORCID
Added: August 30, 2021

2020 journal article

Multi-Fidelity Surrogate-Based Optimization for Electromagnetic Simulation Acceleration

ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS, 25(5).

By: Y. Wang n, P. Franzon nโ€‰, D. Smart* & B. Swahn*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Statistical machine learning; surrogate-based optimization; multi-fidelity; electromagnetic simulation
Sources: Web Of Science, ORCID
Added: November 2, 2020

2020 journal article

Self-Evolution Cascade Deep Learning Model for High-Speed Receiver Adaptation

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 10(6), 1043โ€“1053.

By: B. Li n, B. Jiao*, C. Chou*, R. Mayder* & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Adaptation models; Integrated circuit modeling; Logic gates; Receivers; Deep learning; Data models; Training; Adaptation; behavior; cascade; deep learning; high correlation; IBIS algorithmic modeling interface (IBIS-AMI); modeling; receiver; self-evolution cascade deep learning (SCDL)
Sources: Web Of Science, ORCID
Added: July 6, 2020

2019 journal article

3-D-DATE: A Circuit-Level Three-Dimensional DRAM Area, Timing, and Energy Model

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 66(2), 756โ€“768.

By: J. Parkโ€‰ n, W. Davis nโ€‰ & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Dynamic random access memory (DRAM); area and energy and timing model; circuit level model
Sources: Web Of Science, ORCID
Added: February 18, 2019

2019 journal article

Appliance Identification Algorithm for a Non-Intrusive Home Energy Monitor Using Cogent Confabulation

IEEE Transactions on Smart Grid, 10(1), 714โ€“721.

By: S. Parkโ€‰*, L. Baker n & P. Franzon nโ€‰

co-author countries: Korea (Republic of) ๐Ÿ‡ฐ๐Ÿ‡ท United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Appliance identification; cogent confabulation; monitoring; neural network applications; non-intrusive; energy monitor
Sources: Web Of Science, ORCID, NC State University Libraries
Added: January 28, 2019

2019 book

Handbook of 3D Integration: Design, Test, and Thermal Management

Paul Franzon

Ed(s): P. Franzon nโ€‰, E. Jan Marinissen & M. S. Bakirโ€‰*

Sources: Crossref, ORCID
Added: February 5, 2022

2018 chapter

3D Design Styles

In P. Franzon, E. Martissen, & M. Bakir (Eds.), 3D Handbook Design and Test. Wiley.

By: P. Franzonโ€‰

Ed(s): P. Franzonโ€‰, E. Martissen & M. Bakir

Source: NC State University Libraries
Added: March 20, 2019

2018 chapter

3D Integration: Technology and Design

In K. Sakuma (Ed.), 3D Integration in VLSI Circuits.

By: P. Franzonโ€‰

Ed(s): K. Sakuma

Source: NC State University Libraries
Added: March 9, 2019

2018 book

3DIC Handbook Design and Test

Wiley.

Paul Franzon

Ed(s): P. Franzonโ€‰, E. Martissen & M. Bakir

Source: NC State University Libraries
Added: March 9, 2019

2018 chapter

Electronic Design Automaton for 3D

In P. Franzon, E. Martissen, & M. Bakir (Eds.), 3D Handbook Design and Test. Wiley.

By: P. Franzonโ€‰

Ed(s): P. Franzonโ€‰, E. Martissen & M. Bakir

Source: NC State University Libraries
Added: March 9, 2019

2018 journal article

Exploring the Tradeoffs of Application-Specific Processing

IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 8(3), 531โ€“542.

By: J. Schabelโ€‰ n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: ASIP; SIMD; CGRA; processing-in-memory; processing-near-memory; HTM; sparsey; artificial neural networks
Sources: Web Of Science, ORCID
Added: October 16, 2018

2018 journal article

On Using the Volatile Mem-Capacitive Effect of TiO2 Resistive Random Access Memory to Mimic the Synaptic Forgetting Process

JOURNAL OF ELECTRONIC MATERIALS, 47(2), 994โ€“997.

By: B. Sarkar n, S. Mills n, B. Lee n, W. Pitts n, V. Misra nโ€‰ & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: RRAM; TiO2; synapse; neuromorphic systems; volatile memory
Sources: Web Of Science, ORCID
Added: August 6, 2018

2017 journal article

Corrections to โ€œCrosstalk-Canceling Multimode Interconnect Using Transmitter Encodingโ€[ Aug 13 1562-1567]

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 25(5), 1792โ€“1792.

By: H. Kim n, C. Won n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Crossref, ORCID
Added: March 9, 2019

2017 conference paper

H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor

2017 IEEE International Conference on Computer Design (ICCD), 145โ€“152.

By: V. Srinivasan n, R. Chowdhury*, E. Forbes*, R. Widialaksono*, Z. Zhangโ€‰*, J. Schabelโ€‰ n, S. Ku*, S. Lipa n ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2017 IEEE International Conference on Computer Design (ICCD) at Boston, MA on November 5-8, 2017

Sources: Web Of Science, ORCID
Added: August 6, 2018

2016 journal article

A Generally Applicable Calibration Algorithm for Digitally Reconfigurable Self-Healing RFICs

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 24(3), 1151โ€“1164.

By: E. Wyers n, M. Morton*, T. Sollner*, C. Kelley nโ€‰ & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Calibration; digitally reconfigurable radio frequency integrated circuits (RFICs); Hooke-Jeeves algorithm; Nelder-Mead algorithm; self-healing
Sources: Web Of Science, ORCID, Crossref, NC State University Libraries
Added: August 6, 2018

2016 conference paper

Design and ASIC acceleration of cortical algorithm for text recognition

2016 29th IEEE International System-on-Chip Conference (SOCC). Presented at the 2016 29th IEEE International System-on-Chip Conference (SOCC).

By: S. Dey n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2016 29th IEEE International System-on-Chip Conference (SOCC)

Sources: Crossref, ORCID
Added: March 24, 2019

2016 conference paper

Design of a rectifier-free UHF Gen-2 compatible RFID Tag using RF-only logic

2016 IEEE International Conference on RFID (RFID). Presented at the 2016 IEEE International Conference on RFID (RFID).

By: W. Zhao n, K. Bhanushaliโ€‰ n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2016 IEEE International Conference on RFID (RFID)

Sources: Crossref, ORCID
Added: March 24, 2019

2016 conference paper

Hardware implementation of Hierarchical Temporal Memory algorithm

2016 29th IEEE International System-on-Chip Conference (SOCC). Presented at the 2016 29th IEEE International System-on-Chip Conference (SOCC).

By: W. Liโ€‰ n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2016 29th IEEE International System-on-Chip Conference (SOCC)

Sources: Crossref, ORCID
Added: March 24, 2019

2016 conference paper

Machine learning in physical design

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS). Presented at the 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

By: B. Liโ€‰ n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2016 journal article

Multimode High-Density Link Design Methodology and Implementation

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 6(8), 1251โ€“1260.

By: Z. Yanโ€‰*, K. Aygunโ€‰*, H. Braunisch* & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Codesign methodology; crosstalk mitigation; high-density links; modal signaling; multimode signaling; S-parameters
Sources: Web Of Science, ORCID
Added: August 6, 2018

2016 conference paper

Novel packaging and thermal measurement for 3D heterogeneous stacks

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), Raleigh, NC.

By: T. Harris*, W. Davis* & P. Franzon*โ€‰

co-author countries: China ๐Ÿ‡จ๐Ÿ‡ณ

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) at Raleigh, NC on June 13-15, 2016

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2016 conference paper

Physical design of a 3D-stacked heterogeneous multi-core processor

2016 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2016 IEEE International 3D Systems Integration Conference (3DIC), -San Francisco, CA.

By: R. Widialaksono n, R. Basu Roy Chowdhury n, Z. Zhangโ€‰ n, J. Schabelโ€‰ n, S. Lipa n, E. Rotenberg n, W. Rhett Davis, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2016 IEEE International 3D Systems Integration Conference (3DIC) at -San Francisco, CA on November 8-11, 2016

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2016 conference paper

Processor-in-memory support for artificial neural networks

2016 IEEE International Conference on Rebooting Computing (ICRC). Presented at the 2016 IEEE International Conference on Rebooting Computing (ICRC).

By: J. Schabelโ€‰ n, L. Baker n, S. Dey n, W. Liโ€‰ n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2016 IEEE International Conference on Rebooting Computing (ICRC)

Sources: Crossref, ORCID
Added: March 24, 2019

2016 conference paper

RDL and interposer design for DiRAM4 interfaces

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS). Presented at the 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

By: T. Nigussie n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2016 conference paper

Thermal raman and IR measurement of heterogeneous integration stacks

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1505โ€“1510.

By: T. Harris n, G. Pavlidisโ€‰*, E. Wyers*, D. Newberry n, S. Grahamโ€‰*, P. Franzon nโ€‰, W. Davis nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) at Las Vegas, NV on May 31 - June 3, 2016

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2015 journal article

A Multitier Study on Various Stacking Topologies of TSV-Based PDN Systems Using On-Chip Decoupling Capacitor Models

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 5(4), 541โ€“550.

By: G. Charles n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Back-to-back (B2B); face-to-back (F2B); face-to-face (F2F); on-chip decoupling capacitors; power distribution network (PDN); segmentation method; through silicon via (TSV)
Sources: Web Of Science, ORCID
Added: August 6, 2018

2015 conference paper

Characterization of the Mechanical Stress Impact on Device Electrical Performance in the CMOS and III-V HEMT/HBT Heterogeneous Integration Environment

Proceedings Gomactech 2015.

By: E. Wyers, T. Harris, J. Massad & P. Franson

Source: NC State University Libraries
Added: April 11, 2019

2015 conference paper

Characterization of the mechanical stress impact on device electrical performance in the CMOS and IIIโ€“V HEMT/HBT heterogeneous integration environment

2015 International 3D Systems Integration Conference (3DIC). Presented at the 2015 International 3D Systems Integration Conference (3DIC).

By: E. Wyers*, T. Harris n, W. Pitts n, J. Massadโ€‰* & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2015 International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2015 chapter

Chip Package Codesign

In L. Scheffer, L. Lavagno, & G. Martin (Eds.), The Handbook for EDA of Electronic Circuits (Second). CRC Press.

By: P. Franzonโ€‰ & M. Swaminathan

Ed(s): L. Scheffer, L. Lavagno & G. Martin

Source: NC State University Libraries
Added: March 9, 2019

2015 conference paper

Computing in 3D

2015 IEEE Custom Integrated Circuits Conference (CICC). Presented at the 2015 IEEE Custom Integrated Circuits Conference - CICC 2015.

By: P. Franzon nโ€‰, E. Rotenberg n, J. Tuck n, W. Davis n, H. Zhouโ€‰ n, J. Schabelโ€‰ n, Z. Zhang n, J. Dwiel n ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2015 IEEE Custom Integrated Circuits Conference - CICC 2015

Sources: Crossref, ORCID
Added: March 24, 2019

2015 conference paper

Computing in 3D

2015 International 3D Systems Integration Conference (3DIC). Presented at the 2015 International 3D Systems Integration Conference (3DIC), Sendai, Japan.

By: P. Franzon nโ€‰, E. Rotenberg n, W. Davis n, J. Tuck n, W. Davis, H. Zhouโ€‰ n, J. Schabelโ€‰ n, Z. Zhang n ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2015 International 3D Systems Integration Conference (3DIC) at Sendai, Japan on August 31 - September 2, 2015

Sources: Crossref, NC State University Libraries, ORCID
Added: March 24, 2019

2015 conference paper

Defense Applications of 3DIC

Proceedings Gomactech 2015.

By: P. Franzonโ€‰

Source: NC State University Libraries
Added: April 14, 2019

2015 chapter

Optimization for Self-Calibrating Circuits

In Semiconductor Devices in Harsh Conditions. CRC.

By: E. Wyers, T. Kelley & P. Franzonโ€‰

Source: NC State University Libraries
Added: March 9, 2019

2015 conference paper

Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks

2015 International 3D Systems Integration Conference (3DIC), 1โ€“3.

By: T. Harris n, E. Wyers*, L. Wang*, S. Grahamโ€‰*, G. Pavlidisโ€‰*, P. Franzon nโ€‰, W. Davis n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2015 International 3D Systems Integration Conference (3DIC) at Sendai, Japan on August 31 - September 2, 2015

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2014 conference paper

3D-enabled customizable embedded computer (3DECC)

2014 International 3D Systems Integration Conference (3DIC). Presented at the 2014 International 3D Systems Integration Conference (3DIC).

By: P. Franzon nโ€‰, E. Rotenberg n, J. Tuck n, H. Zhouโ€‰ n, W. Davis n, H. Dai n, J. Huh n, S. Ku n ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2014 International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2014 conference paper

A 0.65 mW/Gbps 30 Gbps capacitive coupled 10 mm serial link in 2.5D silicon interposer

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems. Presented at the 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS).

By: M. Karim n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2014 journal article

A Generic and Scalable Architecture for a Large Acoustic Model and Large Vocabulary Speech Recognition Accelerator Using Logic on Memory

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 22(12), 2701โ€“2712.

By: O. Bapat n, P. Franzon nโ€‰ & R. Fastow

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Accelerator; beam search; embedded; hardware software co-design; logic on memory; multipass decoding; N-best; speech recognition; sphinx
Sources: Web Of Science, ORCID, NC State University Libraries
Added: August 6, 2018

2014 journal article

Adaptive and Reliable Clock Distribution Design for 3-D Integrated Circuits

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(11), 1862โ€“1870.

By: . Chenโ€‰ n, T. Zhu n, W. Davis nโ€‰ & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: 3-D integrated circuit (3-D IC); adaptive; clock distribution; deskew; optimization; process-voltage-temperature (PVT) variation; stacking; thermal profile; through-silicon-via (TSV); tunable-delay-buffer (TDB)
Sources: Web Of Science, ORCID
Added: August 6, 2018

2014 conference paper

Advances in TSVs and 3D interconnects

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems. Presented at the 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS).

By: P. Franzon nโ€‰ & S. Grivet-Talociaโ€‰*

co-author countries: Italy ๐Ÿ‡ฎ๐Ÿ‡น United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2014 journal article

Dual Floating Gate Unified Memory MOSFET With Simultaneous Dynamic and Non-Volatile Operation

IEEE ELECTRON DEVICE LETTERS, 35(1), 48โ€“50.

By: B. Sarkar n, N. Ramanan n, S. Jayanti n, N. Di Spigna n, B. Lee n, P. Franzon nโ€‰, V. Misra nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Flash memory; floating gate; dynamic memory; MOSFET; FN tunneling; direct tunneling
Sources: Web Of Science, ORCID
Added: August 6, 2018

2014 conference paper

Leveraging 3D-IC for on-chip timing uncertainty measurements

2014 International 3D Systems Integration Conference (3DIC). Presented at the 2014 International 3D Systems Integration Conference (3DIC).

By: R. Widialaksono n, W. Zhao n, W. Davis n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2014 International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2014 journal article

Millimeter-Scale True 3-D Antenna-in-Package Structures for Near-Field Power Transfer

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(10), 1574โ€“1581.

By: P. Gadfort n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Coils; electronics packaging; inductive power transmission; omnidirectional antennas; planar arrays; three-dimensional integrated packaging
Sources: Web Of Science, ORCID
Added: August 6, 2018

2014 conference paper

Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC

2014 IEEE International Conference on IC Design & Technology. Presented at the 2014 IEEE International Conference on IC Design & Technology (ICICDT).

By: S. Priyadarshi n, W. Davis n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2014 IEEE International Conference on IC Design & Technology (ICICDT)

Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018

2014 chapter

Storage Class Memories

In A. Chen, J. Hutchby, V. Zhrinov, & G. Bourianoff (Eds.), Emerging Nanoelectronic Devices. Wiley.

By: G. Burr & P. Franzonโ€‰

Ed(s): A. Chen, J. Hutchby, V. Zhrinov & G. Bourianoff

Source: NC State University Libraries
Added: March 9, 2019

2014 journal article

Thermal Pathfinding for 3-D ICs

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(7), 1159โ€“1168.

By: S. Priyadarshi n, W. Davis n, M. Steer n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: 3-D IC; electronic system-level (ESL); electrothermal simulation; pathfinding; through-silicon via (TSV); transaction-level simulation
Sources: Web Of Science, ORCID
Added: August 6, 2018

2014 conference paper

Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits

2014 International 3D Systems Integration Conference (3DIC). Presented at the 2014 International 3D Systems Integration Conference (3DIC).

By: T. Harris n, P. Franzon nโ€‰, W. Davis n & L. Wang*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2014 International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2013 journal article

A Bounded and Discretized Nelder-Mead Algorithm Suitable for RFIC Calibration

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 60(7), 1787โ€“1799.

By: E. Wyers n, M. Steer n, C. Kelley nโ€‰ & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Calibration; derivative-free optimization; Nelder-Mead direct search algorithm; PLL spurious tone reduction; radio frequency integrated circuit calibration
Sources: Web Of Science, ORCID
Added: August 6, 2018

2013 conference paper

A compact inductively coupled connector for mobile devices

2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), 2385โ€“2390.

By: W. Zhao n, P. Gadfort n, E. Erickson n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Applications and design styles for 3DIC

2013 IEEE International Electron Devices Meeting. Presented at the 2013 IEEE International Electron Devices Meeting (IEDM), Washington, DC.

By: P. Franzon nโ€‰, E. Rotenberg n, J. Tuck n, W. Davis nโ€‰, H. Zhouโ€‰ n, J. Schabelโ€‰ n, Z. Zhang n, J. Park n ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2013 IEEE International Electron Devices Meeting (IEDM) at Washington, DC on December 9-11, 2013

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2013 conference paper

Circuit/channel co-design methodology for multimode signaling

2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), 1356โ€“1361.

By: Z. Yan n, P. Franzon nโ€‰, K. Aygunโ€‰* & H. Braunisch*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 journal article

Crosstalk-Canceling Multimode Interconnect Using Transmitter Encoding

IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 21(8), 1562โ€“1567.

By: H. Kim n, C. Won n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Crosstalk cancellation; encoding; modal decomposition; multiconductor transmission; multimode interconnect
Sources: Web Of Science, ORCID
Added: August 6, 2018

2013 conference paper

Design and test of 2.5D and 3D stacked ICs

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems. Presented at the 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

By: P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2013 conference paper

Design of 60 GHz contact less probe system for RDL in passive silicon interposer

2013 ieee international 3d systems integration conference (3dic).

By: E. Suh n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Design of controller for L2 cache mapped in Tezzaron stacked DRAM

2013 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA.

By: N. Tshibangu n, P. Franzon nโ€‰, E. Rotenberg n & W. Davis nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2013 IEEE International 3D Systems Integration Conference (3DIC) at San Francisco, CA on October 2-4, 2013

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Exploring early design tradeoffs in 3DIC

2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545โ€“549.

By: P. Franzon nโ€‰, S. Priyadarshi n, S. Lipa n, W. Davis nโ€‰ & T. Thorolfsson*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2013 IEEE International Symposium on Circuits and Systems (ISCAS) at Beijing, China on May 19-23, 2013

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Face-to-face bus design with built-in self-test in 3D ICS

2013 ieee international 3d systems integration conference (3dic).

By: Z. Zhang n, B. Noia*, K. Chakrabartyโ€‰* & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Hetero(2) 3d integration: A scheme for optimizing efficiency/cost of chip multiprocessors

Proceedings of the fourteenth international symposium on quality electronic design (ISQED 2013), 1โ€“7.

By: S. Priyadarshi n, N. Choudhary n, B. Dwiel n, A. Upreti n, E. Rotenberg n, R. Davis n, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: International Symposium on Quality Electronic Design (ISQED) at Santa Clara, CA on March 4-6, 2013

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Investigation of intermediate dielectric for dual floating gate MOSFET

2013 13th Non-Volatile Memory Technology Symposium (NVMTS).

By: B. Sarkar n, S. Jayanti n, N. Spigna n, B. Lee n, V. Misra nโ€‰ & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

MOOCs, OOCs, flips and hybrids: The new world of higher education

Proceedings ieee international conference on microelectronic systems, 13โ€“13.

By: P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Power comparison of 2D, 3D and 2.5D interconnect solutions and power optimization of interposer interconnects

2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), 860โ€“866.

By: M. Karim n, P. Franzon nโ€‰ & A. Kumar

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Rationale for a 3D heterogeneous multi-core processor

2013 IEEE 31st International Conference on Computer Design (ICCD), 154โ€“168.

By: E. Rotenberg n, B. Dwiel n, E. Forbes n, Z. Zhangโ€‰ n, R. Widialaksono n, R. Chowdhury n, N. Tshibangu n, S. Lipa n ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2013 IEEE 31st International Conference on Computer Design (ICCD) at Asheville, NC on October 6-9, 2013

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2013 chapter

Simulation and Experimental Characterization of a Unified Memory Device with Two Floating-Gates

In VLSI-SoC: From Algorithms to Circuits and System-on-Chip Design (pp. 217โ€“233).

By: N. Di Spigna n, D. Schinke n, S. Jayanti n, V. Misra nโ€‰ & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Crossref, ORCID
Added: September 6, 2020

2013 conference paper

TSV-based, modular and collision detectable face-to-back shared bus design

2013 ieee international 3d systems integration conference (3dic).

By: Z. Zhang n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Thermal requirements in future 3D processors

2013 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2013 IEEE International 3D Systems Integration Conference (3DIC).

By: P. Franzon nโ€‰ & A. Bar-Cohen*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2013 IEEE International 3D Systems Integration Conference (3DIC)

Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018

2013 article

Variation-Aware Circuit Macromodeling and Design Based on Surrogate Models

SIMULATION AND MODELING METHODOLOGIES, TECHNOLOGIES AND APPLICATIONS, Vol. 197, pp. 255โ€“269.

By: T. Zhu n, M. Yelten n, M. Steer n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Surrogate Modeling; Macromodel; Variation-Aware; Circuit; Device Model; Design Exploration; IO Buffer
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 conference paper

A 10.35 mW/GFlop Stacked SAR DSP unit using fine-grain partitioned 3D integration

2012 ieee custom integrated circuits conference (cicc).

By: T. Thorolfsson n, S. Lipa n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits

IEEE Trans CPMT, P(99), 1.

By: T. Harris n, S. Priyadarshi n, S. Melamed n, C. Ortega*, R. Manoharโ€‰*, S. Dooley*, N. Kriplani n, W. Davis nโ€‰ ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: 3DIC; electrothermal effects; thermal management; transient analysis
Sources: Web Of Science, ORCID, NC State University Libraries
Added: August 6, 2018

2012 journal article

A compact dielectric elastomer tubular actuator for refreshable Braille displays

SENSORS AND ACTUATORS A-PHYSICAL, 179, 151โ€“157.

By: P. Chakrabortiโ€‰ n, H. Toprakciโ€‰ n, P. Yang n, N. Di Spigna n, P. Franzon nโ€‰ & T. Ghosh nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Electroactive polymers; Dielectric elastomer actuator; Braille display actuators; Refreshable Braille display
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 conference paper

A novel double floating-gate unified memory device

2012 IEEE/IFIP 20th International Conference on VLSI and System-on-Chip (VLSI-SoC). Presented at the 2012 IEEE/IFIP 20th International Conference on VLSI and System-on-Chip (VLSI-SoC).

By: N. Di Spigna n, D. Schinke n, S. Jayanti n, V. Misraโ€‰ n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2012 IEEE/IFIP 20th International Conference on VLSI and System-on-Chip (VLSI-SoC)

Sources: Crossref, ORCID
Added: March 24, 2019

2012 conference paper

An analysis of subthreshold SRAM bitcells for operation in low power RF-only technologies

2012 IEEE subthreshold microelectronics conference (SUBVT).

By: J. Ledford n, P. Gadfort n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Analog Negative-Bias-Temperature-Instability Monitoring Circuit

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 12(1), 177โ€“179.

By: M. Yelten n, P. Franzon nโ€‰ & M. Steer n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Amplifier; analog circuits; negative-bias temperature instability (NBTI); reliability; sensor
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 journal article

Comparing Through-Silicon-Via (TSV) Void/Pinhole Defect Self-Test Methods

JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 28(1), 27โ€“38.

By: Y. Lou n, Z. Yanโ€‰ n, F. Zhang n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: TSV; 3D stacking yield; On-chip capacitor bridge; Test-before-stacking
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 conference paper

Comparison of TSV-based PDN-design effects using various stacking topology methods

Ieee conference on electrical performance of electronic packaging and, 83โ€“86.

By: G. Charles n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Comparison of modeling techniques in circuit variability analysis

INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS, 25(3), 288โ€“302.

By: M. Yelten n, P. Franzon nโ€‰ & M. Steer n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: artificial neural network; digital circuit; drain current; Kriging; least-squares support vector machine; surrogate modeling; variability Analysis; XOR
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 conference paper

Coordinating 3D designs: Interface IP, standards or free form?

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. Presented at the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan.

By: P. Franzon nโ€‰, W. Davis nโ€‰, Z. Zhouโ€‰ n, S. Priyadarshi n, M. Hogan*, T. Karnikโ€‰*, G. Srinavas*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2011 IEEE International 3D Systems Integration Conference (3DIC) at Osaka, Japan on January 31 - February 2, 2011

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2012 journal article

Demystifying Surrogate Modeling for Circuits and Systems

IEEE Circuits and Systems Magazine, 12(1), 45โ€“63.

By: M. Yeltenโ€‰ n, T. Zhuโ€‰ n, S. Kozielโ€‰*, P. Franzon nโ€‰ & M. Steer n

co-author countries: Iceland ๐Ÿ‡ฎ๐Ÿ‡ธ United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Crossref, ORCID
Added: March 9, 2019

2012 conference paper

Design, modeling, and fabrication of mm(3) three-dimensional integrated antennas

2012 IEEE 62nd Electronic Components and Technology Conference (ECTC), 1794โ€“1799.

By: P. Gadfort n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels

IET Circuits, Devices & Systems, 6(1), 35.

By: S. Priyadarshi n, T. Harris n, S. Melamedโ€‰ n, C. Otero*, N. Kriplani n, C. Christoffersen*, R. Manoharโ€‰*, S. Dooley* ...

co-author countries: Canada ๐Ÿ‡จ๐Ÿ‡ฆ United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Crossref, ORCID, NC State University Libraries
Added: March 9, 2019

2012 journal article

Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676โ€“689.

By: S. Melamed*, T. Thorolfsson*, T. Harris*, S. Priyadarshi n, P. Franzon nโ€‰, M. Steer n, W. Davis nโ€‰

co-author countries: Japan ๐Ÿ‡ฏ๐Ÿ‡ต United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 conference paper

Near threshold RF-only analog to digital converter

2012 IEEE subthreshold microelectronics conference (SUBVT).

By: P. Gadfort n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 31(10), 1522โ€“1535.

By: S. Priyadarshi n, C. Saundersโ€‰*, N. Kriplani n, H. Demircioglu n, W. Davis n, P. Franzon nโ€‰, M. Steer n

co-author countries: Sweden ๐Ÿ‡ธ๐Ÿ‡ช United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Delay element; electrothermal simulation; multicore; multiphysics; parallel simulation; parallelization; transient simulation
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 conference paper

Pathfinder 3D: A flow for system-level design space exploration

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. Presented at the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan.

By: S. Priyadarshi n, J. Hu n, W. Choi n, S. Melamedโ€‰ n, X. Chenโ€‰ n, W. Davis nโ€‰, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2011 IEEE International 3D Systems Integration Conference (3DIC) at Osaka, Japan on January 31 - February 2, 2011

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2012 conference paper

Process mismatch analysis based on reduced-order models

2012 13th international symposium on quality electronic design (isqed), 648โ€“655.

By: M. Yelten n, P. Franzon nโ€‰ & M. Steer n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 conference paper

S-parameter based multimode signaling

Ieee conference on electrical performance of electronic packaging and, 11โ€“14.

By: Z. Yan n, C. Won n, P. Franzon nโ€‰, K. Aygunโ€‰* & H. Braunisch*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Surrogate Model-Based Self-Calibrated Design for Process and Temperature Compensation in Analog/RF Circuits

IEEE Design Test of Computers, 29(6), 74โ€“83.

By: T. Zhu n, M. Steer n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Web Of Science, ORCID
Added: August 6, 2018

2011 conference paper

3D specific systems design and CAD

2011 International Conference on Embedded Computer Systems: Architectures, Modeling and Simulation. Presented at the 2011 International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XI).

By: P. Franzon nโ€‰, W. Davis n, T. Thorolfsson n & S. Melamedโ€‰ n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2011 International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XI)

Sources: Crossref, ORCID
Added: March 24, 2019

2011 conference paper

3D specific systems: Design and CAD

2011 Asian Test Symposium, 470โ€“473.

By: P. Franzon nโ€‰, W. Davis nโ€‰, T. Thorolfsson n & S. Melamedโ€‰ n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2011 Asian Test Symposium at New Delhi, India on November 20-23, 2011

author keywords: 3DIC; 3D IC; three dimensional IC; TSV; stacked memory; memory on logic; FFT
Sources: Web Of Science, ORCID
Added: August 6, 2018

2011 journal article

Accurate and Scalable IO Buffer Macromodel Based on Surrogate Modeling

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 1(8), 1240โ€“1249.

By: T. Zhu n, M. Steer n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: IBIS; input/output buffer modeling; macromodel; process-voltage-temperature variations; surrogate modeling
Sources: Web Of Science, ORCID
Added: August 6, 2018

2011 conference paper

Adaptive clock distribution for 3D integrated circuits

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, 91โ€“94.

By: X. Chen n, W. Davis nโ€‰ & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems at San Jose, CA on October 23-26, 2011

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2011 conference paper

Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-droop and resonant noise in 3DIC

Ieee conference on electrical performance of electronic packaging and, 267โ€“270.

By: G. Charles n, P. Franzon nโ€‰, J. Kimโ€‰* & A. Levin*

co-author countries: Belgium ๐Ÿ‡ง๐Ÿ‡ช United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2011 journal article

Computing with Novel Floating-Gate Devices

COMPUTER, 44(2), 29โ€“36.

By: D. Schinke n, N. Di Spigna n, M. Shiveshwarkar n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Web Of Science, ORCID
Added: August 6, 2018

2011 conference paper

Design strategies for processor, chip/package co-design (M-VI)

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems. Presented at the 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

By: P. Franzon nโ€‰ & E. Liuโ€‰*

co-author countries: Singapore ๐Ÿ‡ธ๐Ÿ‡ฌ United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2011 journal article

Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor

IET COMPUTERS AND DIGITAL TECHNIQUES, 5(3), 198โ€“204.

By: T. Thorolfsson n, N. Moezzi-Madani n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Web Of Science, ORCID
Added: August 6, 2018

2011 journal article

SPICE-compatible physical model of nanocrystal floating gate devices for circuit simulation

IET CIRCUITS DEVICES & SYSTEMS, 5(6), 477โ€“483.

By: D. Schinke n, S. Priyadarshi n, W. Pitts n, N. Di Spigna n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Web Of Science, ORCID
Added: August 6, 2018

2011 journal article

Surrogate Model-Based Analysis of Analog Circuits โ€“ Part I. Variability Analysis

IEEE Transactions on Device and Materials Reliability, PP(99).

By: M. Yelten, P. Franzonโ€‰ & M. Steer

Source: NC State University Libraries
Added: March 9, 2019

2010 conference paper

A zero power consumption Multi-Capacitor structure for voltage summing in high-speed FFE

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems. Presented at the 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

By: B. Su n, W. Pitts n, P. Franzon nโ€‰ & J. Wilsonโ€‰ n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Creating 3D specific systems: Architecture, design and CAD

2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010), 1684โ€“1688.

By: P. Franzon nโ€‰, W. Davis n & T. Thorolffson n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) at Dresden, Germany on March 8-12, 2010

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2010 conference paper

Logic-on-logic 3D integration and placement

2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).

By: T. Thorolfsson n, G. Luoโ€‰*, J. Congโ€‰* & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 article

Multimode Transceiver for High-Density Interconnects: Measurement and Validation

2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), pp. 1733โ€“1738.

By: Y. Choi n, H. Braunisch*, K. Ayguen & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Web Of Science, ORCID
Added: August 6, 2018

2010 conference paper

The NCSU Tezzaron design kit

2010 IEEE International 3D Systems Integration Conference (3DIC), 1โ€“15.

By: S. Lipa, T. Thorolfsson & P. Franzon*โ€‰

Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: April 11, 2019

2010 article

The integration of novel EAP-based Braille cells for use in a refreshable tactile display

ELECTROACTIVE POLYMER ACTUATORS AND DEVICES (EAPAD) 2010, Vol. 7642.

By: N. Di Spigna n, P. Chakrabortiโ€‰ n, D. Winick n, P. Yang n, T. Ghoshโ€‰ n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Braille; blind; PVDF; electroactive polymers; dielectric elastomer; visual impairments; bimorph
Sources: Web Of Science, ORCID
Added: August 6, 2018

2010 conference paper

Thermal Investigatoin of Tier Swapping to Improve the Thermal Profile of Memory-on-Logic 3DICs

IEEE THERMINIC, 1โ€“6.

By: S. Melamed, T. Thorolfsson, A. Srinivasan, E. Cheng, P. Franozn & W. Davis

Source: NC State University Libraries
Added: April 11, 2019

2010 conference paper

Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications

2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).

By: P. Franzon*โ€‰, J. Wilsonโ€‰* & M. Liโ€‰*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2009 journal article

A 32-Gb/s On-Chip Bus With Driver Pre-Emphasis Signaling

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(9), 1267โ€“1274.

By: L. Zhang n, J. Wilsonโ€‰ n, R. Bashirullah*, L. Luo n, J. Xu n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Interconnects; low power; on-chip; pre-emphasis
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018

2009 conference paper

A low power 3D integrated FFT engine using hypercube memory division

ISLPED 09, 231โ€“236.

By: T. Thorolfsson n, N. Moezzi-Madani n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 conference paper

An enhanced macromodeling approach for differential output drivers

BMAS 2009: Proceedings of the 2009 IEEE International Behavioral Modeling and Simulation Workshop, 54โ€“59.

By: T. Zhu n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 journal article

Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies

IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 17(4), 496โ€“506.

By: W. Davis n, E. Oh n, A. Sule n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Fast Fourier transform (FFT); first-in first-out (FIFO); ternary content-addressable memory (TCAM); 3-D integrated circuit (IC)
Sources: Web Of Science, ORCID
Added: August 6, 2018

2009 conference paper

Application of EAP materials toward a refreshable Braille display

In Y. Bar-Cohen & T. Wallmersperger (Eds.), Electroactive Polymer Actuators and Devices (EAPAD) 2009.

By: N. Di Spigna n, P. Chakrabortiโ€‰ n, P. Yang n, T. Ghoshโ€‰ n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Ed(s): Y. Bar-Cohen & T. Wallmersperger

Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring

Sources: Crossref, ORCID
Added: March 24, 2019

2009 conference paper

Application of surrogate modeling to generate compact and PVT-sensitive IBIS models

Electrical Performance of Electronic Packaging and Systems, 77โ€“80.

By: T. Zhu n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 conference paper

CAD and Design Application Exploration of 3DICs

Proceedings 2008 Gomactech.

By: P. Franzonโ€‰, W. Davis, M. Steer, T. Thorolfsson, L. McIlrath & K. Obermiller

Source: NC State University Libraries
Added: April 11, 2019

2009 journal article

Controllable Molecular Modulation of Conductivity in Silicon-Based Devices

JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 131(29), 10023โ€“10030.

By: T. Heโ€‰ n, D. Corley n, M. Luโ€‰ n, N. Di Spigna n, J. He n, D. Nackashi n, P. Franzon nโ€‰, J. Tourโ€‰ n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
MeSH headings : Electric Conductivity; Membranes, Artificial; Semiconductors; Silicon / chemistry
Sources: Web Of Science, ORCID
Added: August 6, 2018

2009 conference paper

CryptoFSM โ€“ Securing chips against reverse engineering

Proceedings 2008 Gomactech.

By: M. Hamlett, L. McIlrath, F. Kiamilev & V. Ozguz

Source: NC State University Libraries
Added: April 11, 2019

2009 conference paper

Design Automation of a 3DIC FFT Processor, for Synthetic Aperture Radar: A case study

Proceedings ACM/IEEE DAC 2009, 51โ€“56.

By: T. Thorolffson, K. Gonsalves n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: April 14, 2019

2009 conference paper

Junction-level thermal extraction and simulation of 3DICs

2009 IEEE International Conference on 3d Systems Integration, 395โ€“401.

By: S. Melamedโ€‰ n, T. Thorolfsson n, A. Srinivasan*, E. Cheng*, P. Franzon nโ€‰ & R. Davis n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2009 IEEE International Conference on 3D System Integration at San Francisco, CA on September 28-30, 2009

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 conference paper

Low-power self-equalizing driver for silicon carrier interconnects with low bit error rate

Electrical Performance of Electronic Packaging and Systems, 37โ€“40.

By: P. Gadfortโ€‰ n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 conference paper

Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors

Electrical Performance of Electronic Packaging and Systems, 121โ€“124.

By: E. Erickson n, J. Wilsonโ€‰*, K. Chandrasekar* & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 review

Overview of RFID Technology and Its Applications in the Food Industry

[Review of ]. JOURNAL OF FOOD SCIENCE, 74(8), R101โ€“R106.

By: P. Kumarโ€‰ n, H. Reinitz n, J. Simunovic nโ€‰, K. Sandeep nโ€‰ & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: applications in food industry; RFID; working principle
MeSH headings : Food Industry / instrumentation; Food Industry / methods; Food Industry / standards; Radio Frequency Identification Device / economics; Radio Frequency Identification Device / methods
Sources: Web Of Science, ORCID
Added: August 6, 2018

2009 chapter

Use of AC Coupled Interconnect in Contactless Packaging

In R. Ho (Ed.), Coupled Data Communications. Springer-Verlag.

By: P. Franzonโ€‰

Ed(s): R. Ho

Source: NC State University Libraries
Added: March 9, 2019

2008 conference paper

AC coupled backplane communication using embedded capacitor

2008 IEEE-EPEP Electrical Performance of Electronic Packaging. Presented at the 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP).

By: B. Su n, P. Patel, S. Hunter, M. Cases* & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP)

Sources: Crossref, ORCID
Added: March 24, 2019

2008 conference paper

An 8192-point fast fourier transform 3D-IC case study

2008 51st Midwest Symposium on Circuits and Systems, 438โ€“441.

By: W. Davis n, A. Sule* & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2008 51st IEEE International Midwest Symposium on Circuits and Systems (MWSCAS) at Knoxville, TN on August 10-13, 2008

Sources: Crossref, ORCID, Web Of Science
Added: March 24, 2019

2008 conference paper

Analysis of inter-bundle crosstalk in multimode signaling for high-density interconnects

2008 58th Electronic Components and Technology Conference. Presented at the 2008 58th Electronic Components and Technology Conference (ECTC 2008).

By: Y. Choi n, H. Braunisch*, K. Aygunโ€‰* & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2008 58th Electronic Components and Technology Conference (ECTC 2008)

Sources: Crossref, ORCID
Added: March 24, 2019

2008 conference paper

Application Specific Integrated Circuit Verification: An Illustration Based Approach

IEEE MSE.

By: M. Yadav, R. Jenkal, P. Franzonโ€‰, P. Lafucci, B. Potts & I. Burgess

Source: NC State University Libraries
Added: April 14, 2019

2008 conference paper

Application and Design Exploration for 3D Integrated Circuits

VLSI Multi-level Interconnect Conference.

By: P. Franzonโ€‰, W. Davis, M. Steer, H. Hao, S. Lipa, S. Luniya, C. Mineo, J. Oh, A. Sule, T. Thorolfsson

Source: NC State University Libraries
Added: April 11, 2019

2008 conference paper

Autonomous Vision Processing and 3D Scene Reconstruction

GOMACTECH.

By: W. Pitts, M. Vaidya, M. Kadambi, S. Malkani & P. Franzonโ€‰

Source: NC State University Libraries
Added: April 14, 2019

2008 conference paper

Computer-Aided Design and Application Exploration for 3D Integrated Circuits

GOMACTECH.

By: P. Franzonโ€‰

Source: NC State University Libraries
Added: April 15, 2019

2008 conference paper

Design and CAD for 3D integrated circuits

Proceedings of the 45th annual conference on Design automation - DAC '08, 668โ€“673.

By: P. Franzon nโ€‰, S. Berkeley*, B. Shani*, K. Obermiller*, W. Davis n, M. Steer n, S. Lipa n, E. Oh n ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: the 45th annual conference

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2008 chapter

Design for 3-D Integration

In P. Garrou, P. Ramm, & C. Bower (Eds.), 3-D IC Integration: Technology and Applications. Wiley VCH.

By: P. Franzonโ€‰

Ed(s): P. Garrou, P. Ramm & C. Bower

Source: NC State University Libraries
Added: March 9, 2019

2008 conference paper

Extreme Temperature Invariant Circuitry Through Adaptive Body Biasing

GOMACTECH.

By: W. Pitts, V. Devasthali, J. Damiano & P. Franzonโ€‰

Source: NC State University Libraries
Added: April 15, 2019

2008 article

Foreword Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance Applications

Canavero, F., & Franzon, P. D. (2008, November). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 31, pp. 662โ€“663.

By: F. Canaveroโ€‰* & P. Franzon nโ€‰

co-author countries: Italy ๐Ÿ‡ฎ๐Ÿ‡น United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Web Of Science, ORCID
Added: August 6, 2018

2008 article

Improving Behavioral IO Buffer Modeling Based on IBIS

Varma, A. K., Steer, M., & Franzon, P. D. (2008, November). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 31, pp. 711โ€“721.

By: A. Varma*, M. Steer n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Behavioral modeling; gate modulation effect; input output buffer information specification (IBIS); input/output (IO) buffer modeling; simultaneous switching noise (SSN)
Sources: Web Of Science, ORCID
Added: August 6, 2018

2008 conference paper

Inductively coupled connectors and sockets for multi-Gb/s pulse signaling

IEEE Transactions on Advanced Packaging, 31(4), 749โ€“758.

By: K. Chandrasekar n, J. Wilson n, E. Erickson n, Z. Feng n, J. Xu n, S. Mick n, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2008 conference paper

Keeping hot chips cool

Proceedings of the 45th annual conference on Design automation - DAC '08. Presented at the the 45th annual conference.

By: R. Puri*, D. Varma, D. Edwards*, A. Weger*, P. Franzon nโ€‰, A. Yang, S. Kosonockyโ€‰*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: the 45th annual conference

Sources: Crossref, ORCID
Added: March 24, 2019

2008 conference paper

Memory rich applications for 3D integration

In S. F. Al-Sarawi, V. K. Varadan, N. Weste, & K. Kalantar-Zadeh (Eds.), Smart Structures, Devices, and Systems IV.

By: P. Franzon nโ€‰, S. Lipa n, J. Oh n, T. Thorolfsson n & R. Davis n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Ed(s): S. Al-Sarawi, V. Varadan, N. Weste & K. Kalantar-Zadeh

Event: Smart Materials, Nano-and Micro-Smart Systems

Sources: Crossref, ORCID
Added: March 24, 2019

2008 conference paper

Multimode signaling on non-ideal channels

2008 IEEE-EPEP Electrical Performance of Electronic Packaging, 51โ€“54.

By: Y. Choi n, C. Won n, P. Franzon nโ€‰, H. Braunisch* & K. Aygunโ€‰*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: April 15, 2019

2008 journal article

Reversible Modulation of Conductance in Silicon Devices via UV/Visible-Light Irradiation

ADVANCED MATERIALS, 20(23), 4541โ€“4546.

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Web Of Science, ORCID
Added: August 6, 2018

2008 journal article

Special issue on 3D integrated circuits and microarchitectures

ACM Journal on Emerging Technologies in Computing Systems, 4(4).

By: Y. Xieโ€‰*, J. Cong & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2007 conference paper

Application and Design Exploration for 3D Integrated Circuits

VLSI Multi-level Interconnect Conference.

By: P. Franzonโ€‰, W. Davis, M. Steer, H. Hao, S. Lipa, S. Luniya, C. Mineo, J. Oh, A. Sule, T. Thorolfsson

Source: NC State University Libraries
Added: April 14, 2019

2007 conference paper

Design Considerations and Benefits of Three-Dimensional Ternary Content Addressable Memory

2007 IEEE Custom Integrated Circuits Conference. Presented at the 2007 IEEE 29th Custom Integrated Circuits Conference.

By: E. Oh n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2007 IEEE 29th Custom Integrated Circuits Conference

Sources: Crossref, ORCID
Added: March 24, 2019

2007 conference paper

Design for 3D Integration and Applications

2007 International Symposium on Signals, Systems and Electronics, 263โ€“266,

By: P. Franzon nโ€‰, W. Davis nโ€‰, M. Steer n, H. Haoโ€‰ n, S. Lipa n, S. Luniya n, C. Mineo n, J. Oh n ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2007 International Symposium on Signals, Systems and Electronics at Montreal, Quebec, Canada on July 30 - August 2, 2007

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2007 journal article

Electronic properties of molecular memory circuits on a nanoscale scaffold

IEEE TRANSACTIONS ON NANOBIOSCIENCE, 6(4), 270โ€“274.

By: A. Blumโ€‰*, C. Soto*, C. Wilson, C. Amsinck n, P. Franzon nโ€‰ & B. Ratna*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: biomaterials; molecular electronics; nanotechnology
MeSH headings : Binding Sites; Biocompatible Materials / chemistry; Bionics / methods; Comovirus / chemistry; Crystallization; Electric Conductivity; Gold; Ion Exchange; Macromolecular Substances / chemistry; Materials Testing; Metal Nanoparticles / chemistry; Metal Nanoparticles / virology; Microscopy, Scanning Tunneling; Molecular Conformation; Nanotechnology / methods; Organisms, Genetically Modified; Protein Engineering
Sources: Web Of Science, ORCID
Added: August 6, 2018

2007 conference paper

Flexible Low Power Probability Density Estimation Unit For Speech Recognition

2007 IEEE International Symposium on Circuits and Systems. Presented at the 2007 IEEE International Symposium on Circuits and Systems.

By: U. Pazhayaveetil n, D. Chandra n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2007 IEEE International Symposium on Circuits and Systems

Sources: Crossref, ORCID
Added: March 24, 2019

2007 conference paper

FreePDK: An Open-Source Variation-Aware Design Kit

2007 IEEE International Conference on Microelectronic Systems Education (MSE'07). Presented at the 2007 IEEE International Conference on Microelectronic Systems Education, San Diego, CA.

By: J. Stineโ€‰*, I. Castellanos*, M. Wood*, J. Henson*, F. Love*, W. Davis n, P. Franzon nโ€‰, M. Bucher n ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2007 IEEE International Conference on Microelectronic Systems Education at San Diego, CA on June 3-4, 2007

Sources: Crossref, ORCID, Web Of Science
Added: March 24, 2019

2007 article

Fully integrated AC coupled interconnect using buried bumps

Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., โ€ฆ Franzon, P. D. (2007, May). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 30, pp. 191โ€“199.

By: J. Wilson n, S. Mick n, J. Xu n, L. Luo n, S. Bonafede*, A. Huffman*, R. LaBennett*, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: AC coupled interconnect (ACCI); buried bumps; capacitive coupling; MCM; pulse signaling; noncontacting I/O; chip and package co-design
Sources: Web Of Science, ORCID
Added: August 6, 2018

2007 conference paper

Hardware Architecture of a Parallel Pattern Matching Engine

2007 IEEE International Symposium on Circuits and Systems. Presented at the 2007 IEEE International Symposium on Circuits and Systems.

By: M. Yadav n, A. Venkatachaliah n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2007 IEEE International Symposium on Circuits and Systems

Sources: Crossref, ORCID
Added: March 24, 2019

2007 conference paper

Molecular Electronics

2nd IEEE International Workshop on advances in sensors and interfaces.

By: P. Franzonโ€‰, C. Amsinck, N. DiSPigna, D. Nackashi & S. Sonkusale

Source: NC State University Libraries
Added: April 14, 2019

2007 chapter

Molecular Electronics โ€“ Devices and Circuits Technology

In Vlsi-Soc: From Systems To Silicon. Springer Boston.

By: P. Franzonโ€‰, D. Nackashi, C. Amsinck, N. DiSpigna & S. Sonkulale

Source: NC State University Libraries
Added: March 9, 2019

2007 journal article

SOI CMOS implementation of a multirate PSK demodulator for space communications

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 54(2), 420โ€“431.

By: M. Yuceโ€‰*, W. Liuโ€‰*, J. Damiano n, B. Bharath n, P. Franzon nโ€‰ & N. Dogan*

co-author countries: Australia ๐Ÿ‡ฆ๐Ÿ‡บ United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: differential detection; multirate; phase-shift keying (PSK); sampling; space communications; symbol timing circuit
Sources: Web Of Science, ORCID
Added: August 6, 2018

2007 conference paper

System Design for 3D Multi-FPGA Packaging

2007 IEEE Electrical Performance of Electronic Packaging. Presented at the 2007 IEEE Electrical Performance of Electronic Packaging.

By: T. Thorolfsson n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2007 IEEE Electrical Performance of Electronic Packaging

Sources: Crossref, ORCID
Added: March 24, 2019

2007 conference paper

System level Validation of Improved IO Buffer Behavioral Modeling Methodology Based on IBIS

2007 IEEE Electrical Performance of Electronic Packaging. Presented at the 2007 IEEE Electrical Performance of Electronic Packaging.

By: A. Varma n, M. Steer n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2007 IEEE Electrical Performance of Electronic Packaging

Sources: Crossref, ORCID
Added: March 24, 2019

2007 article

Uniformity analysis of wafer scale sub-25 nm wide nanowire array nanoimprint mold fabricated by PEDAL process

MICROELECTRONIC ENGINEERING, Vol. 84, pp. 1523โ€“1527.

By: S. Sonkusale n, N. Di Spigna n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: PEDAL; nanoimprint; mold; nanowires
Sources: Web Of Science, ORCID
Added: August 6, 2018

2007 journal article

Voltage-mode driver preemphasis technique for on-chip global buses

IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 15(2), 231โ€“236.

By: L. Zhangโ€‰ n, J. Wilson n, R. Bashirullah*, L. Luo n, J. Xu n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: global buses; low-power; on-chip; preemphasis; repeater insertion
Sources: Web Of Science, ORCID
Added: August 6, 2018

2006 journal article

3 Gb/s AC Coupled Chip-to-Chip Communication Using a Low Swing Pulse Receiver

IEEE Journal of Solid-State Circuits, 41(1), 287โ€“296.

By: L. Luo n, J. Wilson n, S. Mick n, J. Xuโ€‰ n, L. Zhangโ€‰ n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: AC coupled interconnect; bandlimited communications; buried bump technology; capacitive coupling; multichip modules; pulse receiver; pulse signaling
Sources: Crossref, ORCID, Web Of Science
Added: August 6, 2018

2006 conference paper

A 32Gb/s On-chip Bus with Driver Pre-emphasis Signaling

IEEE Custom Integrated Circuits Conference 2006. Presented at the Proceedings of the IEEE 2006 Custom Integrated Circuits Conference.

By: L. Zhangโ€‰ n, J. Wilsonโ€‰ n, R. Bashirullah n, L. Luo n, J. Xuโ€‰ n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: Proceedings of the IEEE 2006 Custom Integrated Circuits Conference

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

A 36Gb/s ACCI Multi-Channel Bus using a Fully Differential Pulse Receiver

IEEE Custom Integrated Circuits Conference 2006. Presented at the IEEE Custom Integrated Circuits Conference 2006.

By: L. Luo n, J. Wilsonโ€‰ n, S. Mick n, J. Xuโ€‰ n, L. Zhangโ€‰ n, E. Erickson, P. Franzonโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: IEEE Custom Integrated Circuits Conference 2006

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

AC Coupled Interconnect using Buried Bumps for Laminated Organic Packages

Proceedings Electronic Components and Technology, ECTC.

By: J. Wilson, L. Luo, S. Mick, B. Chan, H. Lin & P. Franzonโ€‰

Source: NC State University Libraries
Added: April 15, 2019

2006 conference paper

Architecture for Low Power Large Vocabulary Speech Recognition

2006 IEEE International SOC Conference. Presented at the 2006 IEEE International SOC Conference.

By: D. Chandra n, U. Pazhayaveetil n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2006 IEEE International SOC Conference

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

Considerations for Transmission Line Design on MCMs using AC Coupled Interconnect with Buried Solder Bumps

2006 IEEE Workship on Signal Propagation on Interconnects. Presented at the 2006 IEEE Workshop on Signal Propagation on Interconnects.

By: J. Wilsonโ€‰ n, S. Mick n, J. Xuโ€‰ n, L. Luo n, E. Erickson n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2006 IEEE Workshop on Signal Propagation on Interconnects

author keywords: AC Coupled Interconnect; ACCI; buried solder bumps; transmission lines; routing; MCM; stripline
Sources: Crossref, ORCID
Added: March 24, 2019

2006 journal article

Controlled modulation of conductance in silicon devices by molecular monolayers

JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 128(45), 14537โ€“14541.

By: T. Heโ€‰ n, J. He n, M. Luโ€‰ n, B. Chenโ€‰ n, H. Pang n, W. Reus n, W. Nolteโ€‰ n, D. Nackashi n ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Web Of Science, ORCID
Added: August 6, 2018

2006 conference paper

Controlled nanowire fabrication by PEDAL process

2006 1st International Conference on Nano-Networks and Workshops. Presented at the 2006 1st International Conference on Nano-Networks and Workshops.

By: S. Sonkusale n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2006 1st International Conference on Nano-Networks and Workshops

Sources: Crossref, ORCID
Added: March 24, 2019

2006 journal article

Deterministic nanowire fanout and interconnect without any critical translational alignment

IEEE TRANSACTIONS ON NANOTECHNOLOGY, 5(4), 356โ€“361.

By: N. Di Spigna n, D. Nackashi n, C. Amsinck n, S. Sonkusale n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: alignment; crossbar architectures; fanout; interconnect; nanoscale interfacing; nanotechnology
Sources: Web Of Science, ORCID
Added: August 6, 2018

2006 conference paper

Developing Improved IO Buffer Behavioral Modeling Methodology Based on IBIS

2006 IEEE Electrical Performane of Electronic Packaging. Presented at the 2006 IEEE Electrical Performane of Electronic Packaging.

By: A. Varma n, M. Steer n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2006 IEEE Electrical Performane of Electronic Packaging

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

Differential current-mode signaling for robust and power efficient on-chip global interconnects

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. Presented at the IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

By: L. Zhangโ€‰ n, J. Wilsonโ€‰ n, R. Bashirullah n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

Fine Pitch Inductively Coupled Connectors for Multi-Gbps Pulse Signaling

2006 IEEE Electrical Performane of Electronic Packaging. Presented at the 2006 IEEE Electrical Performane of Electronic Packaging.

By: K. Chandrasekar n, J. Wilsonโ€‰ n, E. Erickson n, Z. Fengโ€‰ n, J. Xuโ€‰ n, S. Mick n, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2006 IEEE Electrical Performane of Electronic Packaging

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

High-Frequency Characterization of Printed CPW Lines on Textiles using a Custom Test Fixture

2006 IEEE Workship on Signal Propagation on Interconnects. Presented at the 2006 IEEE Workship on Signal Propagation on Interconnects.

By: J. Wilsonโ€‰ n, C. Merritt n, B. Karaguzel n, T. Kangโ€‰ n, H. Nagleโ€‰ n, E. Grantโ€‰ n, B. Pourdeyhemi n, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2006 IEEE Workship on Signal Propagation on Interconnects

author keywords: wearable electronics; electronic textiles; RF and microwave testing; printed electronics; polymer thick film
Sources: Crossref, ORCID
Added: March 24, 2019

2006 journal article

Physically based molecular device model in a transient circuit simulator

CHEMICAL PHYSICS, 326(1), 188โ€“196.

By: N. Kriplani*, D. Nackashi*, C. Amsinck*, N. Di Spigna*, M. Steer*, P. Franzon*โ€‰, R. Rick, G. Solomon, J. Reimers

author keywords: molecular electronics; circuit simulator; density-functional theory; 1,4-benzenedithiol; single-molecule conductivity
Sources: Web Of Science, ORCID
Added: August 6, 2018

2006 conference paper

Pulse Signaling in Inductively Coupled Sockets and Connectors

SRC Student Symposium.

By: J. Xu, J. Wilson, E. Erickson & P. Franzonโ€‰

Source: NC State University Libraries
Added: April 14, 2019

2006 conference paper

Sensors on textile substrates for home-based healthcare monitoring

Proceedings of the 1st Conference on Distributed Diagnosis and Home Healthcare, 5โ€“7.

By: T. Kangโ€‰ n, C. Merritt n, B. Karaguzel n, J. Wilsonโ€‰ n, P. Franzon nโ€‰, B. Pourdeyhimi nโ€‰, E. Grantโ€‰ n, T. Nagleโ€‰ n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 1st Transdisciplinary Conference on Distributed Diagnosis and Home Healthcare at Arlington, VA, USA on April 2-4, 2006

Sources: NC State University Libraries, ORCID, Crossref
Added: March 24, 2019

2006 conference paper

Signal integrity and robustness of ACCI packaged systems

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. Presented at the IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

By: L. Luo n, J. Wilsonโ€‰ n, J. Xuโ€‰ n, S. Mick n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

TCAM core design in 3D IC for low matchline capacitance and low power

In S. F. Al-Sarawi (Ed.), Smart Structures, Devices, and Systems III.

By: E. Oh n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Ed(s): S. Al-Sarawi

Event: Smart Materials, Nano- and Micro-Smart Systems

author keywords: TCAM (ternary content addressable memory); 3D1C (3-dimentional integrated circuits); integrated circuit interconnect; vertical interconnect; inter-tier via; 3D via; inatchline capacitance; interconnect capacitance; low power TCAM; CAM
Sources: Crossref, ORCID
Added: March 24, 2019

2005 conference paper

2.8 Gb/s Inductively Coupled Interconnect for 3-D ICs

Japan VLSI Symposium.

By: J. Xu, J. Wilson, S. Mick, L. Luo & P. Franzonโ€‰

Source: NC State University Libraries
Added: April 17, 2019

2005 conference paper

2.8 Gbps inductively coupled interconnect for 3D ICs

Proceedings of the 2005 symposium on VLSI circuits, 352โ€“355.

By: J. Xu, J. Wilson, S. Mick & L. Luo

Source: NC State University Libraries
Added: June 9, 2019

2005 conference paper

3Gb/s AC-coupled chip-to-chip communication using a low-swing pulse receiver

Proceedings of the 2005 International Solid State Circuits Conference. Presented at the 2005 International Solid State Circuits Conference, San Francisco, CA, USA.

By: L. Luoโ€‰ n, J. Wilson n, S. Mick n, J. Xuโ€‰ n, L. Zhangโ€‰ n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2005 International Solid State Circuits Conference at San Francisco, CA, USA on February 10, 2005

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

2005 article

A tunable combline bandpass filter using Barium Strontium Titanate interdigital varactors on an alumina substrate

2005 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, VOLS 1-4, pp. 595โ€“598.

By: J. Nath n, D. Ghosh n, W. Fathelbab n, J. Maria n, A. Kingon n, P. Franzon nโ€‰, M. Steer n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Barium Strontium Titanate (BST); ferroelectric; microstrip filters; resonators; thin film devices; tunable filters; varactor
Sources: Web Of Science, ORCID
Added: August 6, 2018

2005 journal article

An Engineered Virus as a Scaffold for Three-Dimensional Self-Assembly on the Nanoscale

Small, 1(7), 702โ€“706.

By: A. Blumโ€‰*, C. Soto*, C. Wilson, T. Brower*, S. Pollack*, T. Schull*, A. Chatterji*, T. Lin* ...

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: molecular electronics; nanotechnology; protein engineering; self-assembly; viruses
MeSH headings : Biomedical Engineering / methods; Capsid / chemistry; Electronics; Microscopy, Scanning Tunneling; Models, Chemical; Models, Molecular; Mutation; Nanocomposites / chemistry; Nanostructures; Nanotechnology / methods; Protein Engineering / methods; Viruses / chemistry; Viruses / genetics
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018

2005 article

An electronically tunable microstrip bandpass filter using thin-film barium-strontium-titanate (BST) varactors

Nath, J., Ghosh, D., Maria, J. P., Kingon, A. I., Fathelbab, W., Franzon, P. D., & Steer, M. B. (2005, September). IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, Vol. 53, pp. 2707โ€“2712.

By: J. Nath n, D. Ghosh n, J. Maria n, A. Kingon n, W. Fathelbab n, P. Franzon nโ€‰, M. Steer n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: barium strontium titanate (BST); combline filter; ferroelectric films; intermodulation distortion; microstrip filters; resonators; thin-film devices; tunable filters; varactor
Sources: Web Of Science, ORCID
Added: August 6, 2018

2005 conference paper

An integrated self-masking technique for providing low-loss metallized RF MEMS devices in a polysilicon only MEMS process

Proceedings of the SPIE Micro Europe. Presented at the SPIE Micro Europe, Sevilla, Spain.

By: J. Wilsonโ€‰ n, R. Bashirullah*, D. Nackashi n, D. Winick n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: SPIE Micro Europe at Sevilla, Spain

author keywords: RF MEMS; post process; metallization; tunable capacitor; removable mask; SUMMiT
Sources: Web Of Science, ORCID
Added: June 9, 2019

2005 journal article

CAD Flows for Chip-Package CoVerification

IEEE Transactions on Advanced Packaging, 28(1), 194โ€“202.

By: A. Varma n, A. Glaser* & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2005 chapter

Chip-Package Codesign

In L. Scheffer, L. Lavagno, & G. Martin (Eds.), The Handbook for EDA of Electronic Circuits. CRC Press.

By: P. Franzonโ€‰

Ed(s): L. Scheffer, L. Lavagno & G. Martin

Source: NC State University Libraries
Added: March 9, 2019

2005 journal article

Configurable String Matching Hardware for Speeding Up Intrusion Detection

SIGARCH Comput. Archit. News, 33(1), 99โ€“107.

By: M. Aldwairiโ€‰ n, T. Conte n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: ORCID, NC State University Libraries
Added: March 9, 2019

2005 journal article

Cover Picture: An Engineered Virus as a Scaffold for Three-Dimensional Self-Assembly on the Nanoscale (Small 7/2005)

Small, 1(7), 669โ€“669.

By: A. Blum, C. Soto, C. Wilson, T. Brower, S. Pollack, T. Schull, A. Chatterji, T. Lin ...

Sources: Crossref, ORCID
Added: September 6, 2020

2005 journal article

Cover Picture: An Engineered Virus as a Scaffold for Three-Dimensional Self-Assembly on the Nanoscale (Small 7/2005)

Small, 1(7), 669โ€“669.

By: A. Blum, C. Soto, C. Wilson, T. Brower, S. Pollack, T. Schull, A. Chatterji, T. Lin ...

Sources: Crossref, ORCID
Added: September 6, 2020

2005 journal article

Demystifying 3D ICs: The procs and cons of going vertical

IEEE DESIGN & TEST OF COMPUTERS, 22(6), 498โ€“510.

By: W. Davis nโ€‰, J. Wilson n, S. Mick n, M. Xu*, H. Hua*, C. Mineo n, A. Sule n, M. Steer n, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Web Of Science, ORCID
Added: August 6, 2018

2005 conference paper

Drive circuit for a mode conversion rotary ultrasonic motor

31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005. Presented at the 31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005.

By: J. Xu n, E. Grant n, A. Kingonโ€‰ n, J. Wilson n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005.

Sources: Crossref, ORCID
Added: March 24, 2019

2005 conference paper

Driver pre-emphasis techniques for on-chip global buses

Proceedings of the 2005 international symposium on Low power electronics and design - ISLPED '05. Presented at the the 2005 international symposium.

By: L. Zhangโ€‰ n, J. Wilsonโ€‰ n, R. Bashirullah*, L. Luo n, J. Xuโ€‰ n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: the 2005 international symposium

Sources: Crossref, ORCID
Added: March 24, 2019

2005 journal article

Fabrication of wafer scale, aligned sub-25 nm nanowire and nanowire templates using planar edge defined alternate layer process

PHYSICA E-LOW-DIMENSIONAL SYSTEMS & NANOSTRUCTURES, 28(2), 107โ€“114.

By: . Sonkusale n, C. Amsinck n, D. Nackashi n, N. Di Spigna n, D. Barlage n, M. Johnson n, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: nanowire; nanoimprinting; mold; template; interconnects; nanotechnology
Sources: Web Of Science, ORCID
Added: August 6, 2018

2005 conference paper

Fabrication of wafer-scale, aligned Sub-25 nm nanowires and templates using Planar Edge Defined Alternate Layer (PEDAL) Process

Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show. Presented at the 2005 NSTI Nanotechnology Conference and Trade Show, Anaheim, CA.

By: S. Sonkusale, C. Amsinck, D. Nackashi, N. Di Spigna, D. Barlage, M. Johnson, P. Franzonโ€‰

Event: 2005 NSTI Nanotechnology Conference and Trade Show at Anaheim, CA

Source: NC State University Libraries
Added: June 9, 2019

2005 conference paper

Impact of SOI research Project on microelectronics education: a case study

Proceedings of the IEEE International Conference on Microelectronics systems education, 33โ€“34.

By: N. Dogan*, P. Franzon nโ€‰ & W. Liu*

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2005 IEEE International Conference on Microelectronic Systems Education (MSE'05) at Anaheim, CA, USA on June 12-13, 2005

Sources: Web Of Science, ORCID
Added: June 9, 2019

2005 conference paper

Inductively Coupled Board-to-Board Connectors

Proceedings Electronic Components and Technology, 2005. ECTC '05., 1109โ€“1113.

By: K. Chandrasekar n, Z. Fengโ€‰ n, J. Wilsonโ€‰ n, S. Mick n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2005 55th Electronic Components and Technology Conference at Lake Buena Vista, FL, USA on May 31 - June 3, 2005

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2005 conference paper

Integrated dynamic body contact for H-gate PD-SOI MOSFETs for high performance/low power

2004 IEEE International SOI Conference (IEEE Cat. No.04CH37573). Presented at the 2004 IEEE International SOI Conference.

By: J. Damiano n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2004 IEEE International SOI Conference

Sources: Crossref, ORCID
Added: March 24, 2019

2005 conference paper

Molecular electronic latches and memories

IEEE Nano, 819โ€“822.

By: D. Nackashi n, C. Amsinck n, N. DiSPigna n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: April 21, 2019

2005 conference paper

Molecular electronics โ€“ devices and circuits technology

Proceedings IFIP VLSI-SoC 2005, 57โ€“63.

By: P. Franzonโ€‰, D. Nackashi, N. DiSpigna & S. Sonkusale

Source: NC State University Libraries
Added: April 21, 2019

2005 journal article

Optimal chip-package codesign for high-performance DSP

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 28(2), 288โ€“297.

By: P. Mehrotra n, V. Rao n, T. Conte n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: chip-package codesign; fast Fourier transform (FFT); seamless high off-chip connectivity (SHOCC)
Sources: Web Of Science, ORCID
Added: August 6, 2018

2005 journal article

Scaling constraints in nanoelectronic random-access memories

NANOTECHNOLOGY, 16(10), 2251โ€“2260.

By: C. Amsinck n, N. Di Spigna n, D. Nackashi n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: Web Of Science, ORCID
Added: August 6, 2018

2004 journal article

A "Defect level versus cost" system tradeoff for electronics manufacturing

IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 27(1), 67โ€“76.

By: M. Schefflerโ€‰*, P. Franzon nโ€‰ & G. Troster*

co-author countries: Switzerland ๐Ÿ‡จ๐Ÿ‡ญ United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: cost quality tradeoff; genetic algorithm; high-density packaging (HDP); Pareto chart
Sources: Web Of Science, ORCID
Added: August 6, 2018

2004 conference paper

A configurable classification engine for polymorphous chip architecture

Proceedings of the ACM BEACON Workshop. Presented at the ACM BEACON Workshop, Boston, MA.

By: M. Yadav, P. Hamilton, R. Sears, Y. Viniotis, T. Conte & P. Franzonโ€‰

Event: ACM BEACON Workshop at Boston, MA

Source: NC State University Libraries
Added: June 9, 2019

2004 article

AC coupled interconnect for dense 3-D ICs

Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October). IEEE TRANSACTIONS ON NUCLEAR SCIENCE, Vol. 51, pp. 2156โ€“2160.

By: J. Xu n, S. Mick n, J. Wilson n, L. Luo n, K. Chandrasekar n, E. Erickson n, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: AC coupled; inductive coupling; spiral inductor; three-dimensional integrated circuits (3-D ICs); through vias; vertical interconnect
Sources: Web Of Science, ORCID
Added: August 6, 2018

2004 article

Buried bump and AC coupled interconnection technology

Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 121โ€“125.

By: S. Mick n, L. Luo n, J. Wilson n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: capacity-coupled circuits; coupled interconnections; integrated circuits; I/O; solder bumps
Sources: Web Of Science, ORCID
Added: August 6, 2018

2004 journal article

Causal reduced-order modeling of distributed structures in a transient circuit simulator

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 52(9), 2207โ€“2214.

By: R. Mohan n, M. Choi*, S. Mick n, F. Hart n, K. Chandrasekar n, A. Cangellaris*, P. Franzon nโ€‰, M. Steer n

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Foster's canonical model; transient circuit simulation
Sources: Web Of Science, ORCID
Added: August 6, 2018

2004 article

Chip-package co-implementation of a triple DES processor

Schaffer, T., Glaser, A., & Franzon, P. D. (2004, February). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 194โ€“202.

By: T. Schaffer n, A. Glaser n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: CMOS; DES processor; IC; I/O; MCM package
Sources: Web Of Science, ORCID
Added: August 6, 2018

2004 journal article

Clustering effects on discontinuous gold film NanoCells

JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 4(7), 907โ€“917.

By: J. Seminario, Y. Ma, L. Agapito, L. Yan, R. Araujo, S. Bingi, N. Vadlamani, K. Chagarlamudi ...

author keywords: negative differential resistance; NanoCell; clustering; filamentary formation; discontinuous gold film; interlinking molecule; self-assembling; ab initio; molecular dynamics; density functional theory; nanotechnology; molecular electronics; nanoelectronics
MeSH headings : Electric Impedance; Electronics; Electrons; Gold / chemistry; Materials Testing; Models, Molecular; Nanostructures / chemistry; Nanotechnology / methods
Sources: Web Of Science, ORCID
Added: August 6, 2018

2004 conference paper

Configureable String matching hardware for speeding up intrusion detection

ACM Workshop on secure networking. Presented at the Boston.

By: M. Aldwairi, T. Conte & P. Franzonโ€‰

Event: at Boston

Source: NC State University Libraries
Added: April 17, 2019

2004 conference paper

Integration for Molecular Electronics

Proceedings of the Conference on Foundations of NanoScience. Presented at the Snowbird, UT.

By: P. Franzonโ€‰, C. Amsinck, N. Di Spigna, S. Sonkusale & D. Nackashi

Event: at Snowbird, UT

Source: NC State University Libraries
Added: April 21, 2019

2004 conference paper

SSN issues with IBIS models

Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging, 87โ€“90.

By: A. Varma n, M. Steer n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: IEEE Electrical Performance of Electronic Packaging at Portland, OR, USA on October 25-27, 2004

Sources: Web Of Science, ORCID
Added: April 21, 2019

2004 conference paper

Simplified delay design guidelines for on-chip global interconnects

Zhang, L., Liu, W., Bashirullah, R., Wilson, J., & Franzon, P. (2004, April). 29โ€“32.

By: L. Zhang, W. Liu, R. Bashirullah, J. Wilson & P. Franzonโ€‰

Event: The ACM Great Lakes Symposium on VLSI

Source: NC State University Libraries
Added: April 17, 2019

2004 conference paper

Simultaneous switching noise in IBIS models

Proceedings of the 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559), 3, 1000โ€“1004.

By: A. Varma, S. Lipa, A. Glaser, M. Steer & P. Franzon*โ€‰

Event: 2004 International Symposium on Electromagnetic Compatibility at Silicon Valley, CA, USA on August 9-13, 2004

Sources: Web Of Science, ORCID
Added: June 9, 2019

2004 conference paper

The Design, Fabrication and Characterization of Millimeter Scale Motors for Miniature Direct Drive Robots

Proceedings of the IEEE International Conference on Robotics and Automation โ€™04, 4668โ€“4673.

By: J. Palmerโ€‰ n, J. Mulling n, B. Dessent n, E. Grant n, J. Eischen nโ€‰, A. Gruvermanโ€‰ n, A. Kingonโ€‰ n, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: IEEE International Conference on Robotics and Automation at New Orleans, LA, USA on April 26 - May 1, 2004

author keywords: piezoelectric; scale; ultrasonic motor
Sources: Web Of Science, ORCID, Crossref
Added: April 21, 2019

2004 journal article

The design and characterization of a novel piezoelectric transducer-based linear motor

IEEE-ASME TRANSACTIONS ON MECHATRONICS, 9(2), 392โ€“398.

By: J. Palmerโ€‰ n, B. Dessent n, J. Mulling n, T. Usher*, E. Grant n, J. Eischen nโ€‰, A. Kingon n, P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: direct drive motors; linear piezomotor; passive latches; piezoelectric transducers
Sources: Web Of Science, ORCID
Added: August 6, 2018

2004 conference paper

The performance and experimental results of a multiple bit rate symbol timing recovery circuit for PSK receivers

Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571), 591โ€“594.

By: M. Yuceโ€‰ n, W. Liuโ€‰ n, B. Bharat n, J. Damaino & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: IEEE 2004 Custom Integrated Circuits Conference at Orlando, FL, USA on October 3-6, 2004

Sources: Web Of Science, ORCID
Added: June 9, 2019

2003 conference paper

A low power PSK receiver for space applications in 0.35 ยตm CMOS

Proceedings of the IEEE Custom Integrated Circuits Conference, 155โ€“158.

By: M. Yuceโ€‰ n, W. Liu n, J. Damiano n, B. Bharat n, P. Franzon nโ€‰ & N. Nugan

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: IEEE 2003 Custom Integrated Circuits Conference at San Jose, CA, USA on September 24, 2003

Sources: Web Of Science, ORCID
Added: April 21, 2019

2003 conference paper

AC Coupled Interconnect for Dense 3-D Systems

Proceedings of the IEEE Conference on Nuclear Science and Imaging. Presented at the 2003 IEEE Nuclear Science Symposium Conference, Portland, OR, USA.

By: J. Xuโ€‰ n, S. Mick n, J. Wilson n, L. Luoโ€‰ n, K. Chandrasakhar & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Event: 2003 IEEE Nuclear Science Symposium Conference at Portland, OR, USA on October 19-25, 2003

Sources: Web Of Science, ORCID
Added: April 21, 2019

2003 conference paper

AC Coupled Interconnect for High-Density High-Bandwidth Packaging

Extended Abstracts of the 2003 International Conference on Solid State Devices and Materials, 67โ€“69.

By: P. Franzon*โ€‰