Works (360)

2019 journal article

3-D-DATE: A Circuit-Level Three-Dimensional DRAM Area, Timing, and Energy Model

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 66(2), 756–768.

By: J. Park, W. Davis & P. Franzon

Sources: NC State University Libraries, ORCID
Added: February 18, 2019

2019 journal article

Appliance Identification Algorithm for a Non-Intrusive Home Energy Monitor Using Cogent Confabulation

IEEE Transactions on Smart Grid, 10(1), 714–721.

By: S. Park, L. Baker & P. Franzon

Sources: NC State University Libraries, ORCID
Added: January 28, 2019

2018 chapter

3D Design Styles

In P. Franzon, E. Martissen, & M. Bakir (Eds.), 3D Handbook Design and Test. Wiley.

By: P. Franzon

Ed(s): P. Franzon, E. Martissen & M. Bakir

Source: NC State University Libraries
Added: March 20, 2019

2018 chapter

3D Integration: Technology and Design

In K. Sakuma (Ed.), 3D Integration in VLSI Circuits.

By: P. Franzon

Ed(s): K. Sakuma

Source: NC State University Libraries
Added: March 9, 2019

2018 book

3DIC Handbook Design and Test

Wiley.

Ed(s): P. Franzon, E. Martissen & M. Bakir

Source: NC State University Libraries
Added: March 9, 2019

2018 chapter

Electronic Design Automaton for 3D

In P. Franzon, E. Martissen, & M. Bakir (Eds.), 3D Handbook Design and Test. Wiley.

By: P. Franzon

Ed(s): P. Franzon, E. Martissen & M. Bakir

Source: NC State University Libraries
Added: March 9, 2019

2018 journal article

Exploring the Tradeoffs of Application-Specific Processing

IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 8(3), 531–542.

By: J. Schabel & P. Franzon

Sources: NC State University Libraries, ORCID
Added: October 16, 2018

2018 journal article

On using the volatile mem-capacitive effect of TiO2 resistive random access memory to mimic the synaptic forgetting process

Journal of Electronic Materials, 47(2), 994–997.

By: B. Sarkar, S. Mills, B. Lee, W. Pitts, V. Misra & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2017 journal article

Corrections to “Crosstalk-Canceling Multimode Interconnect Using Transmitter Encoding”[ Aug 13 1562-1567]

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 25(5), 1792–1792.

By: H. Kim, C. Won & P. Franzon

Sources: Crossref, ORCID
Added: March 9, 2019

2016 journal article

A Generally Applicable Calibration Algorithm for Digitally Reconfigurable Self-Healing RFICs

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 24(3), 1151–1164.

By: E. Wyers, M. Morton, T. Sollner, C. Kelley & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

Design and ASIC acceleration of cortical algorithm for text recognition

In 2016 29th IEEE International System-on-Chip Conference (SOCC). IEEE.

By: S. Dey & P. Franzon

Event: 2016 29th IEEE International System-on-Chip Conference (SOCC)

Sources: Crossref, ORCID
Added: March 24, 2019

2016 conference paper

Design of a rectifier-free UHF Gen-2 compatible RFID Tag using RF-only logic

In 2016 IEEE International Conference on RFID (RFID). IEEE.

By: W. Zhao, K. Bhanushali & P. Franzon

Event: 2016 IEEE International Conference on RFID (RFID)

Sources: Crossref, ORCID
Added: March 24, 2019

2016 conference paper

Hardware implementation of Hierarchical Temporal Memory algorithm

In 2016 29th IEEE International System-on-Chip Conference (SOCC). IEEE.

By: W. Li & P. Franzon

Event: 2016 29th IEEE International System-on-Chip Conference (SOCC)

Sources: Crossref, ORCID
Added: March 24, 2019

2016 conference paper

Machine learning in physical design

In 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS). IEEE.

By: B. Li & P. Franzon

Event: 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2016 journal article

Multimode high-density link design methodology and implementation

IEEE Transactions on Components Packaging and Manufacturing Technology, 6(8), 1251–1260.

By: Z. Yan, K. Aygun, H. Braunisch & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

Novel packaging and thermal measurement for 3D heterogeneous stacks

In 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). IEEE.

By: T. Harris, W. Davis & P. Franzon

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

Sources: Crossref, ORCID
Added: March 24, 2019

2016 conference paper

Physical design of a 3D-stacked heterogeneous multi-core processor

In 2016 IEEE International 3D Systems Integration Conference (3DIC). IEEE.

By: R. Widialaksono, R. Basu Roy Chowdhury, Z. Zhang, J. Schabel, S. Lipa, E. Rotenberg, W. Rhett Davis, P. Franzon

Event: 2016 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2016 conference paper

Processor-in-memory support for artificial neural networks

In 2016 IEEE International Conference on Rebooting Computing (ICRC). IEEE.

By: J. Schabel, L. Baker, S. Dey, W. Li & P. Franzon

Event: 2016 IEEE International Conference on Rebooting Computing (ICRC)

Sources: Crossref, ORCID
Added: March 24, 2019

2016 conference paper

RDL and interposer design for DiRAM4 interfaces

In 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS). IEEE.

By: T. Nigussie & P. Franzon

Event: 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2015 journal article

A multitier study on various stacking topologies of TSV-based PDN systems using on-chip decoupling capacitor models

IEEE Transactions on Components Packaging and Manufacturing Technology, 5(4), 541–550.

By: G. Charles & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2015 conference paper

Characterization of the Mechanical Stress Impact on Device Electrical Performance in the CMOS and III-V HEMT/HBT Heterogeneous Integration Environment

In Proceedings Gomactech 2015.

By: E. Wyers, T. Harris, J. Massad & P. Franson

Source: NC State University Libraries
Added: April 11, 2019

2015 conference paper

Characterization of the mechanical stress impact on device electrical performance in the CMOS and III–V HEMT/HBT heterogeneous integration environment

In 2015 International 3D Systems Integration Conference (3DIC). IEEE.

By: E. Wyers, T. Harris, W. Pitts, J. Massad & P. Franzon

Event: 2015 International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2015 chapter

Chip Package Codesign

In L. Scheffer, L. Lavagno, & G. Martin (Eds.), The Handbook for EDA of Electronic Circuits (Second). CRC Press.

By: P. Franzon & M. Swaminathan

Ed(s): L. Scheffer, L. Lavagno & G. Martin

Source: NC State University Libraries
Added: March 9, 2019

2015 conference paper

Computing in 3D

In 2015 IEEE Custom Integrated Circuits Conference (CICC). IEEE.

By: P. Franzon, E. Rotenberg, J. Tuck, W. Davis, H. Zhou, J. Schabel, Z. Zhang, J. Dwiel ...

Event: 2015 IEEE Custom Integrated Circuits Conference - CICC 2015

Sources: Crossref, ORCID
Added: March 24, 2019

2015 conference paper

Computing in 3D

In 2015 International 3D Systems Integration Conference (3DIC). Singapore: IEEE.

By: P. Franzon, E. Rotenberg, W. Davis, J. Tuck, W. Davis, H. Zhou, J. Schabel, Z. Zhang ...

Event: 2015 International 3D Systems Integration Conference (3DIC) at Sendai, Japan on August 31 - September 2, 2015

Sources: Crossref, NC State University Libraries, ORCID
Added: March 24, 2019

2015 conference paper

Defense Applications of 3DIC

In Proceedings Gomactech 2015.

By: P. Franzon

Source: NC State University Libraries
Added: April 14, 2019

2015 chapter

Optimization for Self-Calibrating Circuits

In Semiconductor Devices in Harsh Conditions. CRC.

By: E. Wyers, T. Kelley & P. Franzon

Source: NC State University Libraries
Added: March 9, 2019

2015 conference paper

Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks

In 2015 International 3D Systems Integration Conference (3DIC). IEEE.

By: T. Harris, E. Wyers, L. Wang, S. Graham, G. Pavlidis, P. Franzon, W. Davis

Event: 2015 International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2014 conference paper

3D-enabled customizable embedded computer (3DECC)

In 2014 International 3D Systems Integration Conference (3DIC). IEEE.

By: P. Franzon, E. Rotenberg, J. Tuck, H. Zhou, W. Davis, H. Dai, J. Huh, S. Ku ...

Event: 2014 International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2014 conference paper

A 0.65 mW/Gbps 30 Gbps capacitive coupled 10 mm serial link in 2.5D silicon interposer

In 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems. IEEE.

By: M. Karim & P. Franzon

Event: 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2014 journal article

A Generic and Scalable Architecture for a Large Acoustic Model and Large Vocabulary Speech Recognition Accelerator Using Logic on Memory

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 22(12), 2701–2712.

By: O. Bapat, P. Franzon & R. Fastow

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2014 journal article

Adaptive and reliable clock distribution design for 3-D integrated circuits

IEEE Transactions on Components Packaging and Manufacturing Technology, 4(11), 1862–1870.

By: X. Chen, T. Zhu, W. Davis & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2014 conference paper

Advances in TSVs and 3D interconnects

In 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems. IEEE.

By: P. Franzon & S. Grivet-Talocia

Event: 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2014 journal article

Dual floating gate unified memory MOSFET with simultaneous dynamic and non-volatile operation

IEEE Electron Device Letters, 35(1), 48–50.

By: B. Sarkar, N. Ramanan, S. Jayanti, N. Spigna, B. Lee, P. Franzon, V. Misra

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2014 conference paper

Leveraging 3D-IC for on-chip timing uncertainty measurements

In 2014 International 3D Systems Integration Conference (3DIC). IEEE.

By: R. Widialaksono, W. Zhao, W. Davis & P. Franzon

Event: 2014 International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2014 journal article

Millimeter-scale true 3-D antenna-in-package structures for near-field power transfer

IEEE Transactions on Components Packaging and Manufacturing Technology, 4(10), 1574–1581.

By: P. Gadfort & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2014 conference paper

Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC

In 2014 IEEE International Conference on IC Design & Technology. IEEE.

By: S. Priyadarshi, W. Davis & P. Franzon

Event: 2014 IEEE International Conference on IC Design & Technology (ICICDT)

Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018

2014 chapter

Storage Class Memories

In A. Chen, J. Hutchby, V. Zhrinov, & G. Bourianoff (Eds.), Emerging Nanoelectronic Devices. Wiley.

By: G. Burr & P. Franzon

Ed(s): A. Chen, J. Hutchby, V. Zhrinov & G. Bourianoff

Source: NC State University Libraries
Added: March 9, 2019

2014 conference paper

Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits

In 2014 International 3D Systems Integration Conference (3DIC). IEEE.

By: T. Harris, P. Franzon, W. Davis & L. Wang

Event: 2014 International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2014 journal article

Thermal pathfinding for 3-D ICs

IEEE Transactions on Components Packaging and Manufacturing Technology, 4(7), 1159–1168.

By: S. Priyadarshi, W. Davis, M. Steer & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 journal article

A bounded and discretized Nelder-Mead algorithm suitable for RFIC calibration

IEEE Transactions on Circuits and Systems. I, Regular Papers, 60(7), 1787–1799.

By: E. Wyers, M. Steer, C. Kelley & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

A compact inductively coupled connector for mobile devices

In 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) (pp. 2385–2390).

By: W. Zhao, P. Gadfort, E. Erickson & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Applications and design styles for 3DIC

In 2013 IEEE International Electron Devices Meeting. IEEE.

By: P. Franzon, E. Rotenberg, J. Tuck, W. Davis, H. Zhou, J. Schabel, Z. Zhang, J. Park ...

Event: 2013 IEEE International Electron Devices Meeting (IEDM)

Sources: Crossref, ORCID
Added: March 24, 2019

2013 conference paper

Circuit/channel co-design methodology for multimode signaling

In 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) (pp. 1356–1361).

By: Z. Yan, P. Franzon, K. Aygun & H. Braunisch

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 journal article

Crosstalk-canceling multimode interconnect using transmitter encoding

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 21(8), 1562–1567.

By: H. Kim, C. Won & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Design and test of 2.5D and 3D stacked ICs

In 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems. IEEE.

By: P. Franzon

Event: 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2013 conference paper

Design of 60 GHz contact less probe system for RDL in passive silicon interposer

In 2013 ieee international 3d systems integration conference (3dic).

By: E. Suh & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Design of controller for L2 cache mapped in Tezzaron stacked DRAM

In 2013 ieee international 3d systems integration conference (3dic).

By: N. Tshibangu, P. Franzon, E. Rotenberg & W. Davis

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Exploring early design tradeoffs in 3DIC

In 2013 ieee international symposium on circuits and systems (iscas) (pp. 545–549).

By: P. Franzon, S. Priyadarshi, S. Lipa, W. Davis & T. Thorolfsson

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Face-to-face bus design with built-in self-test in 3D ICS

In 2013 ieee international 3d systems integration conference (3dic).

By: Z. Zhang, B. Noia, K. Chakrabarty & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Hetero(2) 3d integration: A scheme for optimizing efficiency/cost of chip multiprocessors

In Proceedings of the fourteenth international symposium on quality electronic design (ISQED 2013) (pp. 1–7).

By: S. Priyadarshi, N. Choudhary, B. Dwiel, A. Upreti, E. Rotenberg, R. Davis, P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Investigation of intermediate dielectric for dual floating gate MOSFET

In 2013 13th Non-Volatile Memory Technology Symposium (NVMTS).

By: B. Sarkar, S. Jayanti, N. Spigna, B. Lee, V. Misra & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

MOOCs, OOCs, flips and hybrids: The new world of higher education

In Proceedings ieee international conference on microelectronic systems (pp. 13–13).

By: P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Power comparison of 2D, 3D and 2.5D interconnect solutions and power optimization of interposer interconnects

In 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) (pp. 860–866).

By: M. Karim, P. Franzon & A. Kumar

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Rationale for a 3D heterogeneous multi-core processor

In 2013 IEEE 31st International Conference on Computer Design (ICCD). IEEE.

By: E. Rotenberg, B. Dwiel, E. Forbes, Z. Zhang, R. Widialaksono, R. Basu Roy Chowdhury, N. Tshibangu, S. Lipa ...

Event: 2013 IEEE 31st International Conference on Computer Design (ICCD)

Sources: Crossref, ORCID
Added: March 24, 2019

2013 conference paper

TSV-based, modular and collision detectable face-to-back shared bus design

In 2013 ieee international 3d systems integration conference (3dic).

By: Z. Zhang & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Thermal requirements in future 3D processors

In 2013 IEEE International 3D Systems Integration Conference (3DIC). IEEE.

By: P. Franzon & A. Bar-Cohen

Event: 2013 IEEE International 3D Systems Integration Conference (3DIC)

Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018

2013 conference paper

Variation-aware circuit macromodeling and design based on surrogate models

In Simulation and modeling methodologies, technologies and applications (Vol. 197, pp. 255–269).

By: T. Zhu, M. Yelten, M. Steer & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 conference paper

A 10.35 mW/GFlop Stacked SAR DSP unit using fine-grain partitioned 3D integration

In 2012 ieee custom integrated circuits conference (cicc).

By: T. Thorolfsson, S. Lipa & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits

IEEE Trans CPMT, P(99), 1.

By: T. Harris, S. Priyadarshi, S. Melamed, C. Ortega, R. Manohar, S. Dooley, N. Kriplani, W. Davis ...

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

A compact dielectric elastomer tubular actuator for refreshable Braille displays

Sensors and Actuators. A, Physical, 179, 151–157.

By: P. Chakraborti, H. Toprakci, P. Yang, N. Di Spigna, P. Franzon & T. Ghosh

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 conference paper

A novel double floating-gate unified memory device

In 2012 IEEE/IFIP 20th International Conference on VLSI and System-on-Chip (VLSI-SoC). IEEE.

By: N. Di Spigna, D. Schinke, S. Jayanti, V. Misra & P. Franzon

Event: 2012 IEEE/IFIP 20th International Conference on VLSI and System-on-Chip (VLSI-SoC)

Sources: Crossref, ORCID
Added: March 24, 2019

2012 conference paper

An analysis of subthreshold SRAM bitcells for operation in low power RF-only technologies

In 2012 IEEE subthreshold microelectronics conference (SUBVT).

By: J. Ledford, P. Gadfort & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Analog negative-bias-temperature-instability monitoring circuit

IEEE Transactions on Device and Materials Reliability, 12(1), 177–179.

By: M. Yelten, P. Franzon & M. Steer

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Comparing through-silicon-via (TSV) void/pinhole defect self-test methods

Journal of Electronic Testing : Theory and Applications, 28(1), 27–38.

By: Y. Lou, Z. Yan, F. Zhang & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 conference paper

Comparison of TSV-based PDN-design effects using various stacking topology methods

In Ieee conference on electrical performance of electronic packaging and (pp. 83–86).

By: G. Charles & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Comparison of modeling techniques in circuit variability analysis

International Journal of Numerical Modelling, 25(3), 288–302.

By: M. Yelten, P. Franzon & M. Steer

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 conference paper

Coordinating 3D designs: Interface IP, standards or free form?

In 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. IEEE.

By: P. Franzon, W. Davis, Z. Zhou, S. Priyadarshi, M. Hogan, T. Karnik, G. Srinavas

Event: 2011 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2012 journal article

Demystifying Surrogate Modeling for Circuits and Systems

IEEE Circuits and Systems Magazine, 12(1), 45–63.

By: M. Yelten, T. Zhu, S. Koziel, P. Franzon & M. Steer

Sources: Crossref, ORCID
Added: March 9, 2019

2012 conference paper

Design, modeling, and fabrication of mm(3) three-dimensional integrated antennas

In 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) (pp. 1794–1799).

By: P. Gadfort & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Dynamic Electrothermal Simulation of Three-Dimensional Circuits Using Standard Cell Macromodels

IET Circuits, Devices, and Systems, 6(1), 35–44.

By: S. Priyadarshi, T. Harris, S. Melamed, C. Otero, N. Kriplani, C. Christoffersen, R. Manohar, S. Dooley ...

Source: NC State University Libraries
Added: March 9, 2019

2012 journal article

Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 conference paper

Near threshold RF-only analog to digital converter

In 2012 IEEE subthreshold microelectronics conference (SUBVT).

By: P. Gadfort & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Parallel transient simulation of multiphysics circuits using delay-based partitioning

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(10), 1522–1535.

By: S. Priyadarshi, C. Saunders, N. Kriplani, H. Demircioglu, W. Davis, P. Franzon, M. Steer

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 conference paper

Pathfinder 3D: A flow for system-level design space exploration

In 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. IEEE.

By: S. Priyadarshi, J. Hu, W. Choi, S. Melamed, W. Davis & P. Franzon

Event: 2011 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2012 conference paper

Process mismatch analysis based on reduced-order models

In 2012 13th international symposium on quality electronic design (isqed) (pp. 648–655).

By: M. Yelten, P. Franzon & M. Steer

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 conference paper

S-parameter based multimode signaling

In Ieee conference on electrical performance of electronic packaging and (pp. 11–14).

By: Z. Yan, C. Won, P. Franzon, K. Aygun & H. Braunisch

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Surrogate Model-Based Self-Calibrated Design for Process and Temperature Compensation in Analog/RF Circuits

IEEE Design Test of Computers, 29(6), 74–83.

By: T. Zhu, M. Steer & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2011 conference paper

3D specific systems design and CAD

In 2011 International Conference on Embedded Computer Systems: Architectures, Modeling and Simulation. IEEE.

By: P. Franzon, W. Davis, T. Thorolfsson & S. Melamed

Event: 2011 International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XI)

Sources: Crossref, ORCID
Added: March 24, 2019

2011 conference paper

3D specific systems: Design and CAD

In 2011 20th asian test symposium (ats) (pp. 470–473).

By: P. Franzon, W. Davis, T. Thorolfsson & S. Melamed

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2011 journal article

Accurate and scalable IO buffer macromodel based on surrogate modeling

IEEE Transactions on Components Packaging and Manufacturing Technology, 1(8), 1240–1249.

By: T. Zhu, M. Steer & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2011 conference paper

Adaptive clock distribution for 3D integrated circuits

In Ieee conference on electrical performance of electronic packaging and (pp. 91–94).

By: X. Chen, W. Davis & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2011 conference paper

Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-droop and resonant noise in 3DIC

In Ieee conference on electrical performance of electronic packaging and (pp. 267–270).

By: G. Charles, P. Franzon, J. Kim & A. Levin

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2011 journal article

Computing with novel floating-gate devices

Computer, 44(2), 29–36.

By: D. Schinke, N. Spigna, M. Shiveshwarkar & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2011 conference paper

Design strategies for processor, chip/package co-design (M-VI)

In 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems. IEEE.

By: P. Franzon & E. Liu

Event: 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2011 journal article

Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor

IET Computers and Digital Techniques, 5(3), 198–204.

By: T. Thorolfsson, N. Moezzi-Madani & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2011 journal article

SPICE-compatible physical model of nanocrystal floating gate devices for circuit simulation

IET Circuits Devices & Systems, 5(6), 477–483.

By: D. Schinke, S. Priyadarshi, W. Pitts, N. Spigna & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2011 journal article

Surrogate Model-Based Analysis of Analog Circuits – Part I. Variability Analysis

IEEE Transactions on Device and Materials Reliability, PP(99).

By: M. Yelten, P. Franzon & M. Steer

Source: NC State University Libraries
Added: March 9, 2019

2010 conference paper

A zero power consumption Multi-Capacitor structure for voltage summing in high-speed FFE

In 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems. IEEE.

By: B. Su, W. Pitts, P. Franzon & J. Wilson

Event: 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Creating 3D specific systems: Architecture, design and CAD

In 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010). IEEE.

By: P. Franzon, W. Davis & T. Thorolffson

Event: 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Logic-on-logic 3D integration and placement

In 2010 IEEE International 3D Systems Integration Conference (3DIC). IEEE.

By: T. Thorolfsson, G. Luo, J. Cong & P. Franzon

Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Multimode transceiver for high-density interconnects: Measurement and validation

In 2010 proceedings 60th electronic components and technology conference (ectc) (pp. 1733–1738).

By: Y. Choi, H. Braunisch, K. Aygun & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2010 conference paper

The NCSU Tezzaron design kit

In 2010 IEEE International 3D Systems Integration Conference (3DIC) (pp. 1–15). IEEE.

By: S. Lipa, T. Thorolfsson & P. Franzon

Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: April 11, 2019

2010 conference paper

The integration of novel EAP-based Braille cells for use in a refreshable tactile display

In Electroactive polymer actuators and devices (eapad) 2010 (Vol. 7642).

By: N. Spigna, P. Chakraborti, D. Winick, P. Yang, T. Ghosh & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2010 conference paper

Thermal Investigatoin of Tier Swapping to Improve the Thermal Profile of Memory-on-Logic 3DICs

In IEEE THERMINIC (pp. 1–6).

By: S. Melamed, T. Thorolfsson, A. Srinivasan, E. Cheng, P. Franozn & W. Davis

Source: NC State University Libraries
Added: April 11, 2019

2010 conference paper

Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications

In 2010 IEEE International 3D Systems Integration Conference (3DIC). IEEE.

By: P. Franzon, J. Wilson & M. Li

Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2009 journal article

A 32-Gb/s On-Chip Bus With Driver Pre-Emphasis Signaling

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(9), 1267–1274.

By: L. Zhang, J. Wilson, R. Bashirullah, L. Luo, J. Xu & P. Franzon

Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018

2009 conference paper

A low power 3D integrated FFT engine using hypercube memory division

In ISLPED 09 (pp. 231–236).

By: T. Thorolfsson, N. Moezzi-Madani & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 conference paper

An enhanced macromodeling approach for differential output drivers

In BMAS 2009: Proceedings of the 2009 IEEE International Behavioral Modeling and Simulation Workshop (pp. 54–59).

By: T. Zhu & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 journal article

Application exploration for 3-D integrated circuits: TCAM, FIFO, and FFT case studies

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(4), 496–506.

By: W. Davis, E. Oh, A. Sule & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 conference paper

Application of EAP materials toward a refreshable Braille display

In Y. Bar-Cohen & T. Wallmersperger (Eds.), Electroactive Polymer Actuators and Devices (EAPAD) 2009. SPIE.

By: N. Di Spigna, P. Chakraborti, P. Yang, T. Ghosh & P. Franzon

Ed(s): Y. Bar-Cohen & T. Wallmersperger

Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring

Sources: Crossref, ORCID
Added: March 24, 2019

2009 conference paper

Application of surrogate modeling to generate compact and PVT-sensitive IBIS models

In Electrical Performance of Electronic Packaging and Systems (pp. 77–80).

By: T. Zhu & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 conference paper

CAD and Design Application Exploration of 3DICs

In Proceedings 2008 Gomactech.

By: P. Franzon, W. Davis, M. Steer, T. Thorolfsson, L. McIlrath & K. Obermiller

Source: NC State University Libraries
Added: April 11, 2019

2009 journal article

Controllable molecular modulation of conductivity in silicon-based devices

Journal of the American Chemical Society, 131(29), 10023–10030.

By: T. He, D. Corley, M. Lu, N. Spigna, J. He, D. Nackashi, P. Franzon, J. Tour

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 conference paper

CryptoFSM – Securing chips against reverse engineering

In Proceedings 2008 Gomactech.

By: M. Hamlett, L. McIlrath, F. Kiamilev & V. Ozguz

Source: NC State University Libraries
Added: April 11, 2019

2009 conference paper

Design Automation of a 3DIC FFT Processor, for Synthetic Aperture Radar: A case study

In Proceedings ACM/IEEE DAC 2009 (pp. 51–56).

By: T. Thorolffson, K. Gonsalves & P. Franzon

Sources: NC State University Libraries, ORCID
Added: April 14, 2019

2009 conference paper

Low-power self-equalizing driver for silicon carrier interconnects with low bit error rate

In Electrical Performance of Electronic Packaging and Systems (pp. 37–40).

By: P. Gadfort & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 conference paper

Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors

In Electrical Performance of Electronic Packaging and Systems (pp. 121–124).

By: E. Erickson, J. Wilson, K. Chandrasekar & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 article

Overview of RFID technology and Its applications in the food industry

Journal of Food Science.

By: P. Kumar, H. Reinitz, J. Simunovic, K. Sandeep & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 chapter

Use of AC Coupled Interconnect in Contactless Packaging

In R. Ho (Ed.), Coupled Data Communications. Springer-Verlag.

By: P. Franzon

Ed(s): R. Ho

Source: NC State University Libraries
Added: March 9, 2019

2008 conference paper

AC coupled backplane communication using embedded capacitor

In 2008 IEEE-EPEP Electrical Performance of Electronic Packaging. IEEE.

By: B. Su, P. Patel, S. Hunter, M. Cases & P. Franzon

Event: 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP)

Sources: Crossref, ORCID
Added: March 24, 2019

2008 conference paper

An 8192-point fast fourier transform 3D-IC case study

In 2008 51st Midwest Symposium on Circuits and Systems. IEEE.

By: W. Davis, A. Sule & P. Franzon

Event: 2008 51st IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)

Sources: Crossref, ORCID
Added: March 24, 2019

2008 conference paper

Analysis of inter-bundle crosstalk in multimode signaling for high-density interconnects

In 2008 58th Electronic Components and Technology Conference. IEEE.

By: Y. Choi, H. Braunisch, K. Aygun & P. Franzon

Event: 2008 58th Electronic Components and Technology Conference (ECTC 2008)

Sources: Crossref, ORCID
Added: March 24, 2019

2008 conference paper

Application Specific Integrated Circuit Verification: An Illustration Based Approach

In IEEE MSE.

By: M. Yadav, R. Jenkal, P. Franzon, P. Lafucci, B. Potts & I. Burgess

Source: NC State University Libraries
Added: April 14, 2019

2008 conference paper

Application and Design Exploration for 3D Integrated Circuits

In VLSI Multi-level Interconnect Conference.

By: P. Franzon, W. Davis, M. Steer, H. Hao, S. Lipa, S. Luniya, C. Mineo, J. Oh, A. Sule, T. Thorolfsson

Source: NC State University Libraries
Added: April 11, 2019

2008 conference paper

Autonomous Vision Processing and 3D Scene Reconstruction

In GOMACTECH.

By: W. Pitts, M. Vaidya, M. Kadambi, S. Malkani & P. Franzon

Source: NC State University Libraries
Added: April 14, 2019

2008 conference paper

Computer-Aided Design and Application Exploration for 3D Integrated Circuits

In GOMACTECH.

By: P. Franzon

Source: NC State University Libraries
Added: April 15, 2019

2008 conference paper

Design and CAD for 3D integrated circuits

In Proceedings of the 45th annual conference on Design automation - DAC '08. ACM Press.

By: P. Franzon, S. Berkeley, B. Shani, K. Obermiller, W. Davis, M. Steer, S. Lipa, E. Oh ...

Event: the 45th annual conference

Sources: Crossref, ORCID
Added: March 24, 2019

2008 chapter

Design for 3-D Integration

In P. Garrou, P. Ramm, & C. Bower (Eds.), 3-D IC Integration: Technology and Applications. Wiley VCH.

By: P. Franzon

Ed(s): P. Garrou, P. Ramm & C. Bower

Source: NC State University Libraries
Added: March 9, 2019

2008 conference paper

Extreme Temperature Invariant Circuitry Through Adaptive Body Biasing

In GOMACTECH.

By: W. Pitts, V. Devasthali, J. Damiano & P. Franzon

Source: NC State University Libraries
Added: April 15, 2019

2008 journal article

Foreword special section on electrical performance analysis and simulation of interconnects, packages and devices composing electronic systems for high-performance applications

IEEE Transactions on Advanced Packaging, 31(4), 662–663.

By: F. Canavero & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2008 conference paper

Improving behavioral IO buffer modeling based on IBIS

In IEEE Transactions on Advanced Packaging (Vol. 31, pp. 711–721).

By: A. Varma, M. Steer & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2008 conference paper

Inductively coupled connectors and sockets for multi-Gb/s pulse signaling

In IEEE Transactions on Advanced Packaging (Vol. 31, pp. 749–758).

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2008 conference paper

Keeping hot chips cool

In Proceedings of the 45th annual conference on Design automation - DAC '08. ACM Press.

By: R. Puri, D. Varma, D. Edwards, A. Weger, P. Franzon, A. Yang, S. Kosonocky

Event: the 45th annual conference

Sources: Crossref, ORCID
Added: March 24, 2019

2008 conference paper

Memory rich applications for 3D integration

In S. F. Al-Sarawi, V. K. Varadan, N. Weste, & K. Kalantar-Zadeh (Eds.), Smart Structures, Devices, and Systems IV. SPIE.

By: P. Franzon, S. Lipa, J. Oh, T. Thorolfsson & R. Davis

Ed(s): S. Al-Sarawi, V. Varadan, N. Weste & K. Kalantar-Zadeh

Event: Smart Materials, Nano-and Micro-Smart Systems

Sources: Crossref, ORCID
Added: March 24, 2019

2008 conference paper

Multimode signaling on non-ideal channels

In 2008 IEEE-EPEP Electrical Performance of Electronic Packaging (pp. 51–54).

By: Y. Choi, C. Won, P. Franzon, H. Braunisch & K. Aygun

Sources: NC State University Libraries, ORCID
Added: April 15, 2019

2008 journal article

Reversible modulation of conductance in silicon devices via UV/visible-light irradiation

Advanced Materials, 20(23), 4541–4546.

By: T. He, M. Lu, J. Yao, J. He, B. Chen, N. Spigna, D. Nackashi, P. Franzon, J. Tour

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2008 journal article

Special issue on 3D integrated circuits and microarchitectures

ACM Journal on Emerging Technologies in Computing Systems, 4(4).

By: Y. Xie, J. Cong & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2007 conference paper

Application and Design Exploration for 3D Integrated Circuits

In VLSI Multi-level Interconnect Conference.

By: P. Franzon, W. Davis, M. Steer, H. Hao, S. Lipa, S. Luniya, C. Mineo, J. Oh, A. Sule, T. Thorolfsson

Source: NC State University Libraries
Added: April 14, 2019

2007 conference paper

Design Considerations and Benefits of Three-Dimensional Ternary Content Addressable Memory

In 2007 IEEE Custom Integrated Circuits Conference. IEEE.

By: E. Oh & P. Franzon

Event: 2007 IEEE 29th Custom Integrated Circuits Conference

Sources: Crossref, ORCID
Added: March 24, 2019

2007 conference paper

Design for 3D Integration and Applications

In 2007 International Symposium on Signals, Systems and Electronics. IEEE.

By: P. Franzon, W. Davis, M. Steer, H. Hao, S. Lipa, S. Luniya, C. Mineo, J. Oh ...

Event: 2007 International Symposium on Signals, Systems and Electronics

Sources: Crossref, ORCID
Added: March 24, 2019

2007 journal article

Electronic properties of molecular memory circuits on a nanoscale scaffold

IEEE Transactions on Nanobioscience, 6(4), 270–274.

By: A. Blum, C. Soto, C. Wilson, C. Amsinck, P. Franzon & B. Ratna

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2007 conference paper

Flexible Low Power Probability Density Estimation Unit For Speech Recognition

In 2007 IEEE International Symposium on Circuits and Systems. IEEE.

By: U. Pazhayaveetil, D. Chandra & P. Franzon

Event: 2007 IEEE International Symposium on Circuits and Systems

Sources: Crossref, ORCID
Added: March 24, 2019

2007 conference paper

FreePDK: An Open-Source Variation-Aware Design Kit

In 2007 IEEE International Conference on Microelectronic Systems Education (MSE'07). IEEE.

By: J. Stine, I. Castellanos, M. Wood, J. Henson, F. Love, W. Davis, P. Franzon, M. Bucher ...

Event: 2007 IEEE International Conference on Microelectronic Systems Education

Sources: Crossref, ORCID
Added: March 24, 2019

2007 journal article

Fully integrated AC coupled interconnect using buried bumps

IEEE Transactions on Advanced Packaging, 30(2), 191–199.

By: J. Wilson, S. Mick, J. Xu, L. Luo, S. Bonafede, A. Huffman, R. LaBennett, P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2007 conference paper

Hardware Architecture of a Parallel Pattern Matching Engine

In 2007 IEEE International Symposium on Circuits and Systems. IEEE.

By: M. Yadav, A. Venkatachaliah & P. Franzon

Event: 2007 IEEE International Symposium on Circuits and Systems

Sources: Crossref, ORCID
Added: March 24, 2019

2007 conference paper

Molecular Electronics

In 2nd IEEE International Workshop on advances in sensors and interfaces.

By: P. Franzon, C. Amsinck, N. DiSPigna, D. Nackashi & S. Sonkusale

Source: NC State University Libraries
Added: April 14, 2019

2007 chapter

Molecular Electronics – Devices and Circuits Technology

In Vlsi-Soc: From Systems To Silicon. Springer Boston.

By: P. Franzon, D. Nackashi, C. Amsinck, N. DiSpigna & S. Sonkulale

Source: NC State University Libraries
Added: March 9, 2019

2007 journal article

SOI CMOS implementation of a multirate PSK demodulator for space communications

IEEE Transactions on Circuits and Systems. I, Regular Papers, 54(2), 420–431.

By: M. Yuce, W. Liu, J. Damiano, B. Bharath, P. Franzon & N. Dogan

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2007 conference paper

System Design for 3D Multi-FPGA Packaging

In 2007 IEEE Electrical Performance of Electronic Packaging. IEEE.

By: T. Thorolfsson & P. Franzon

Event: 2007 IEEE Electrical Performance of Electronic Packaging

Sources: Crossref, ORCID
Added: March 24, 2019

2007 conference paper

System level Validation of Improved IO Buffer Behavioral Modeling Methodology Based on IBIS

In 2007 IEEE Electrical Performance of Electronic Packaging. IEEE.

By: A. Varma, M. Steer & P. Franzon

Event: 2007 IEEE Electrical Performance of Electronic Packaging

Sources: Crossref, ORCID
Added: March 24, 2019

2007 journal article

Uniformity analysis of wafer scale sub-25 nm wide nanowire array nanoimprint mold fabricated by PEDAL process

Microelectronic Engineering, 84(5-8), 1523–1527.

By: S. Sonkusale, N. Spigna & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2007 journal article

Voltage-mode driver preemphasis technique for on-chip global buses

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 15(2), 231–236.

By: L. Zhang, J. Wilson, R. Bashirullah, L. Luo, J. Xu & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2006 journal article

3 Gb/s AC Coupled Chip-to-Chip Communication Using a Low Swing Pulse Receiver

IEEE Journal of Solid-State Circuits, 41(1), 287–296.

By: L. Luo, J. Wilson, S. Mick, J. Xu, L. Zhang & P. Franzon

Sources: Crossref, ORCID
Added: March 9, 2019

2006 conference paper

A 32Gb/s On-chip Bus with Driver Pre-emphasis Signaling

In IEEE Custom Integrated Circuits Conference 2006. IEEE.

By: L. Zhang, J. Wilson, R. Bashirullah, L. Luo, J. Xu & P. Franzon

Event: Proceedings of the IEEE 2006 Custom Integrated Circuits Conference

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

A 36Gb/s ACCI Multi-Channel Bus using a Fully Differential Pulse Receiver

In IEEE Custom Integrated Circuits Conference 2006. IEEE.

By: L. Luo, J. Wilson, S. Mick, J. Xu, L. Zhang, E. Erickson, P. Franzon

Event: IEEE Custom Integrated Circuits Conference 2006

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

AC Coupled Interconnect using Buried Bumps for Laminated Organic Packages

In Proceedings Electronic Components and Technology, ECTC.

By: J. Wilson, L. Luo, S. Mick, B. Chan, H. Lin & P. Franzon

Source: NC State University Libraries
Added: April 15, 2019

2006 conference paper

Architecture for Low Power Large Vocabulary Speech Recognition

In 2006 IEEE International SOC Conference. IEEE.

By: D. Chandra, U. Pazhayaveetil & P. Franzon

Event: 2006 IEEE International SOC Conference

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

Considerations for Transmission Line Design on MCMs using AC Coupled Interconnect with Buried Solder Bumps

In 2006 IEEE Workship on Signal Propagation on Interconnects. IEEE.

By: J. Wilson, S. Mick, J. Xu, L. Luo, E. Erickson & P. Franzon

Event: 2006 IEEE Workshop on Signal Propagation on Interconnects

Sources: Crossref, ORCID
Added: March 24, 2019

2006 journal article

Controlled modulation of conductance in silicon devices by molecular monolayers

Journal of the American Chemical Society, 128(45), 14537–14541.

By: T. He, J. He, M. Lu, B. Chen, H. Pang, W. Reus, W. Nolte, D. Nackashi ...

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2006 conference paper

Controlled nanowire fabrication by PEDAL process

In 2006 1st International Conference on Nano-Networks and Workshops. IEEE.

By: S. Sonkusale & P. Franzon

Event: 2006 1st International Conference on Nano-Networks and Workshops

Sources: Crossref, ORCID
Added: March 24, 2019

2006 journal article

Deterministic nanowire fanout and interconnect without any critical translational alignment

IEEE Transactions on Nanotechnology, 5(4), 356–361.

By: N. Spigna, D. Nackashi, C. Amsinck, S. Sonkusale & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2006 conference paper

Developing Improved IO Buffer Behavioral Modeling Methodology Based on IBIS

In 2006 IEEE Electrical Performane of Electronic Packaging. IEEE.

By: A. Varma, M. Steer & P. Franzon

Event: 2006 IEEE Electrical Performane of Electronic Packaging

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

Differential current-mode signaling for robust and power efficient on-chip global interconnects

In IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. IEEE.

By: L. Zhang, J. Wilson, R. Bashirullah & P. Franzon

Event: IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

Fine Pitch Inductively Coupled Connectors for Multi-Gbps Pulse Signaling

In 2006 IEEE Electrical Performane of Electronic Packaging. IEEE.

By: K. Chandrasekar, J. Wilson, E. Erickson, Z. Feng, J. Xu, S. Mick, P. Franzon

Event: 2006 IEEE Electrical Performane of Electronic Packaging

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

High-Frequency Characterization of Printed CPW Lines on Textiles using a Custom Test Fixture

In 2006 IEEE Workship on Signal Propagation on Interconnects. IEEE.

By: J. Wilson, C. Merritt, B. Karaguzel, T. Kang, H. Nagle, E. Grant, B. Pourdeyhemi, P. Franzon

Event: 2006 IEEE Workship on Signal Propagation on Interconnects

Sources: Crossref, ORCID
Added: March 24, 2019

2006 journal article

Physically based molecular device model in a transient circuit simulator

Chemical Physics, 326(1), 188–196.

By: N. Kriplani, D. Nackashi, C. Amsinck, N. Spigna, M. Steer, P. Franzon, R. Rick, G. Solomon, J. Reimers

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2006 conference paper

Pulse Signaling in Inductively Coupled Sockets and Connectors

In SRC Student Symposium.

By: J. Xu, J. Wilson, E. Erickson & P. Franzon

Source: NC State University Libraries
Added: April 14, 2019

2006 conference paper

Sensors on textile substrates for home-based healthcare monitoring

In Proceedings of the 1st Conference on Distributed Diagnosis and Home Healthcare (pp. 5–7). Arlington, VA, USA.

By: T. Kang, C. Merritt, B. Karaguzel, J. Wilson, P. Franzon, B. Pourdeyhimi, E. Grant, T. Nagle

Event: 1st Transdisciplinary Conference on Distributed Diagnosis and Home Healthcare at Arlington, VA, USA on April 2-4, 2006

Sources: NC State University Libraries, ORCID
Added: June 8, 2019

2006 conference paper

Signal integrity and robustness of ACCI packaged systems

In IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. IEEE.

By: L. Luo, J. Wilson, J. Xu, S. Mick & P. Franzon

Event: IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

Sources: Crossref, ORCID
Added: March 24, 2019

2006 conference paper

TCAM core design in 3D IC for low matchline capacitance and low power

In S. F. Al-Sarawi (Ed.), Smart Structures, Devices, and Systems III. SPIE.

By: E. Oh & P. Franzon

Ed(s): S. Al-Sarawi

Event: Smart Materials, Nano- and Micro-Smart Systems

Sources: Crossref, ORCID
Added: March 24, 2019

2005 conference paper

2.8 Gb/s Inductively Coupled Interconnect for 3-D ICs

In Japan VLSI Symposium.

By: J. Xu, J. Wilson, S. Mick, L. Luo & P. Franzon

Source: NC State University Libraries
Added: April 17, 2019

2005 conference paper

2.8 Gbps inductively coupled interconnect for 3D ICs

In Proceedings of the 2005 symposium on VLSI circuits (pp. 352–355).

By: J. Xu, J. Wilson, S. Mick & L. Luo

Source: NC State University Libraries
Added: June 9, 2019

2005 conference paper

3Gb/s AC-coupled chip-to-chip communication using a low-swing pulse receiver

In Proceedings of the 2005 International Solid State Circuits Conference. San Francisco, CA, USA.

By: L. Luo, J. Wilson, S. Mick, J. Xu, L. Zhang & P. Franzon

Event: 2005 International Solid State Circuits Conference at San Francisco, CA, USA on February 10, 2005

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

2005 conference paper

A tunable combline bandpass filter using thin film barium strontium titanate interdigital varactors on an alumina substrate

In Proceedings of the IEEE MTT-S International Microwave Symposium, June 12-17, 2005, Long Beach, CA (pp. 595–598). Piscataway, NJ: IEEE.

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2005 journal article

An electronically tunable microstrip bandpass filter using thin-film barium-strontium-titanate (BST) varactors

IEEE Transactions on Microwave Theory and Techniques, 53(9), 2707–2712.

By: J. Nath, D. Ghosh, J. Maria, A. Kingon, W. Fathelbab, P. Franzon, M. Steer

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2005 journal article

An Engineered Virus as a Scaffold for Three-Dimensional Self-Assembly on the Nanoscale

Small, 1(7), 702–706.

By: A. Blum, C. Soto, C. Wilson, T. Brower, S. Pollack, T. Schull, A. Chatterji, T. Lin ...

Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018

2005 conference paper

An integrated self-masking technique for providing low-loss metallized RF MEMS devices in a polysilicon only MEMS process

In Proceedings of the SPIE Micro Europe. Sevilla, Spain.

By: J. Wilson, R. Bashirullah, D. Nackashi, D. Winick & P. Franzon

Event: SPIE Micro Europe at Sevilla, Spain

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

2005 journal article

CAD Flows for Chip-Package CoVerification

IEEE Transactions on Advanced Packaging, 28(1), 194–202.

By: A. Varma, A. Glaser & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2005 chapter

Chip-Package Codesign

In L. Scheffer, L. Lavagno, & G. Martin (Eds.), The Handbook for EDA of Electronic Circuits. CRC Press.

By: P. Franzon

Ed(s): L. Scheffer, L. Lavagno & G. Martin

Source: NC State University Libraries
Added: March 9, 2019

2005 journal article

Configurable String Matching Hardware for Speeding Up Intrusion Detection

SIGARCH Comput. Archit. News, 33(1), 99–107.

By: M. Aldwairi, T. Conte & P. Franzon

Sources: ORCID, NC State University Libraries
Added: March 9, 2019

2005 journal article

Demystifying 3D ICs: The procs and cons of going vertical

IEEE Design & Test of Computers, 22(6), 498–510.

By: W. Davis, J. Wilson, S. Mick, M. Xu, H. Hua, C. Mineo, A. Sule, M. Steer, P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2005 conference paper

Drive circuit for a mode conversion rotary ultrasonic motor

In 31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005. IEEE.

By: J. Xu, E. Grant, A. Kingon, J. Wilson & P. Franzon

Event: 31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005.

Sources: Crossref, ORCID
Added: March 24, 2019

2005 conference paper

Driver pre-emphasis techniques for on-chip global buses

In Proceedings of the 2005 international symposium on Low power electronics and design - ISLPED '05. ACM Press.

By: L. Zhang, J. Wilson, R. Bashirullah, L. Luo, J. Xu & P. Franzon

Event: the 2005 international symposium

Sources: Crossref, ORCID
Added: March 24, 2019

2005 journal article

Fabrication of wafer scale, aligned sub-25 nm nanowire and nanowire templates using planar edge defined alternate layer process

Physica. E, Low-Dimensional Systems & Nanostructures, 28(2), 107–114.

By: S. Sonkusale, C. Amsinck, D. Nackashi, N. Spigna, D. Barlage, M. Johnson, P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2005 conference paper

Fabrication of wafer-scale, aligned Sub-25 nm nanowires and templates using Planar Edge Defined Alternate Layer (PEDAL) Process

In Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show. Anaheim, CA.

By: S. Sonkusale, C. Amsinck, D. Nackashi, N. Di Spigna, D. Barlage, M. Johnson, P. Franzon

Event: 2005 NSTI Nanotechnology Conference and Trade Show at Anaheim, CA

Source: NC State University Libraries
Added: June 9, 2019

2005 conference paper

Impact of SOI research Project on microelectronics education: a case study

In Proceedings of the IEEE International Conference on Microelectronics systems education (pp. 33–34). Anaheim, CA, USA: IEEE.

By: N. Dogan, P. Franzon & W. Liu

Event: 2005 IEEE International Conference on Microelectronic Systems Education (MSE'05) at Anaheim, CA, USA on June 12-13, 2005

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

2005 conference paper

Inductively Coupled Board-to-Board Connectors

In Proceedings Electronic Components and Technology, 2005. ECTC '05. (pp. 1109–1113). Lake Buena Vista, FL, USA: IEEE.

By: K. Chandrasekar, Z. Feng, J. Wilson, S. Mick & P. Franzon

Event: 2005 55th Electronic Components and Technology Conference at Lake Buena Vista, FL, USA on May 31 - June 3, 2005

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2005 conference paper

Integrated dynamic body contact for H-gate PD-SOI MOSFETs for high performance/low power

In 2004 IEEE International SOI Conference (IEEE Cat. No.04CH37573). IEEE.

By: J. Damiano & P. Franzon

Event: 2004 IEEE International SOI Conference

Sources: Crossref, ORCID
Added: March 24, 2019

2005 conference paper

Molecular electronic latches and memories

In IEEE Nano (pp. 819–822).

By: D. Nackashi, C. Amsinck, N. DiSPigna & P. Franzon

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

2005 conference paper

Molecular electronics – devices and circuits technology

In Proceedings IFIP VLSI-SoC 2005 (pp. 57–63).

By: P. Franzon, D. Nackashi, N. DiSpigna & S. Sonkusale

Source: NC State University Libraries
Added: April 21, 2019

2005 journal article

Optimal chip-package codesign for high-performance DSP

IEEE Transactions on Advanced Packaging, 28(2), 288–297.

By: P. Mehrotra, V. Rao, T. Conte & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2005 journal article

Scaling constraints in nanoelectronic random-access memories

Nanotechnology, 16(10), 2251–2260.

By: C. Amsinck, N. Spigna, D. Nackashi & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2004 journal article

A defect level versus cost system tradeoff for electronics manufacturing

IEEE Transactions on Electronics Packaging Manufacturing, 27(1), 67–76.

By: M. Scheffler, P. Franzon & G. Troster

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2004 conference paper

A configurable classification engine for polymorphous chip architecture

In Proceedings of the ACM BEACON Workshop. Boston, MA.

By: M. Yadav, P. Hamilton, R. Sears, Y. Viniotis, T. Conte & P. Franzon

Event: ACM BEACON Workshop at Boston, MA

Source: NC State University Libraries
Added: June 9, 2019

2004 journal article

AC coupled interconnect for dense 3-D ICs

IEEE Transactions on Nuclear Science, 51(5), 2156–2160.

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2004 journal article

Buried bump and AC coupled interconnection technology

IEEE Transactions on Advanced Packaging, 27(1), 121–125.

By: S. Mick, L. Luo, J. Wilson & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2004 journal article

Causal reduced-order modeling of distributed structures in a transient circuit simulator

IEEE Transactions on Microwave Theory and Techniques, 52(9), 2207–2214.

By: R. Mohan, M. Choi, S. Mick, F. Hart, K. Chandrasekar, A. Cangellaris, P. Franzon, M. Steer

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2004 journal article

Chip-package co-implementation of a triple DES processor

IEEE Transactions on Advanced Packaging, 27(1), 194–202.

By: T. Schaffer, A. Glaser & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2004 journal article

Clustering effects on discontinuous gold film NanoCells

Journal of Nanoscience and Nanotechnology, 4(7), 907–917.

By: J. Seminario, Y. Ma, L. Agapito, L. Yan, R. Araujo, S. Bingi, N. Vadlamani, K. Chagarlamudi ...

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2004 conference paper

Configureable String matching hardware for speeding up intrusion detection

In ACM Workshop on secure networking. Boston.

By: M. Aldwairi, T. Conte & P. Franzon

Event: at Boston

Source: NC State University Libraries
Added: April 17, 2019

2004 conference paper

Integration for Molecular Electronics

In Proceedings of the Conference on Foundations of NanoScience. Snowbird, UT.

By: P. Franzon, C. Amsinck, N. Di Spigna, S. Sonkusale & D. Nackashi

Event: at Snowbird, UT

Source: NC State University Libraries
Added: April 21, 2019

2004 conference paper

SSN issues with IBIS models

In Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging (pp. 87–90). Portland, OR, USA: IEEE.

By: A. Varma, M. Steer & P. Franzon

Event: IEEE Electrical Performance of Electronic Packaging at Portland, OR, USA on October 25-27, 2004

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

2004 conference paper

Simplified delay design guidelines for on-chip global interconnects

(pp. 29–32). Presented at the The ACM Great Lakes Symposium on VLSI.

By: L. Zhang, W. Liu, R. Bashirullah, J. Wilson & P. Franzon

Event: The ACM Great Lakes Symposium on VLSI

Source: NC State University Libraries
Added: April 17, 2019

2004 conference paper

Simultaneous switching noise in IBIS models

In Proceedings of the 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) (Vol. 3, pp. 1000–1004). Silicon Valley, CA, USA: IEEE.

By: A. Varma, S. Lipa, A. Glaser, M. Steer & P. Franzon

Event: 2004 International Symposium on Electromagnetic Compatibility at Silicon Valley, CA, USA on August 9-13, 2004

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

2004 journal article

The design and characterization of a novel piezoelectric transducer-based linear motor

IEEE/ASME Transactions on Mechatronics, 9(2), 392–398.

By: J. Palmer, B. Dessent, J. Mulling, T. Usher, E. Grant, J. Eischen, A. Kingon, P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2004 conference paper

The Design, Fabrication and Characterization of Millimeter Scale Motors for Miniature Direct Drive Robots

In Proceedings of the IEEE International Conference on Robotics and Automation ’04 (pp. 4668–4673). New Orleans, LA, USA: IEEE.

By: J. Palmer, J. Mulling, B. Dessent, E. Grant, J. Eischen, A. Gruverman, A. Kingon, P. Franzon

Event: IEEE International Conference on Robotics and Automation at New Orleans, LA, USA on April 26 - May 1, 2004

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

2004 conference paper

The performance and experimental results of a multiple bit rate symbol timing recovery circuit for PSK receivers

In Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571) (pp. 591–594). Orlando, FL, USA: IEEE.

By: M. Yuce, W. Liu, B. Bharat, J. Damaino & P. Franzon

Event: IEEE 2004 Custom Integrated Circuits Conference at Orlando, FL, USA on October 3-6, 2004

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

2003 conference paper

A low power PSK receiver for space applications in 0.35 µm CMOS

In Proceedings of the IEEE Custom Integrated Circuits Conference (pp. 155–158). San Jose, CA, USA: IEEE.

By: M. Yuce, W. Liu, J. Damiano, B. Bharat, P. Franzon & N. Nugan

Event: IEEE 2003 Custom Integrated Circuits Conference at San Jose, CA, USA on September 24, 2003

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

2003 conference paper

AC Coupled Interconnect for Dense 3-D Systems

In Proceedings of the IEEE Conference on Nuclear Science and Imaging. Seattle, Washington: IEEE.

By: J. Xu, S. Mick, J. Wilson, L. Luo, K. Chandrasakhar & P. Franzon

Event: 2003 IEEE Nuclear Science Symposium Conference at Portland, OR, USA on October 19-25, 2003

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

2003 conference paper

AC Coupled Interconnect for High-Density High-Bandwidth Packaging

In Extended Abstracts of the 2003 International Conference on Solid State Devices and Materials (pp. 67–69). Perth, Australia: The Japan Society of Applied Physics.

By: P. Franzon, S. Mick, J. Wilson, L. Luo & K. Chandrasakhar

Event: 2003 International Conference on Solid State Devices and Materials at Perth, Australia

Sources: Crossref, NC State University Libraries, ORCID
Added: March 24, 2019

2003 conference paper

CAD flows for chip-package codesign

In Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging (pp. 11–14). Princeton, NJ, USA: IEEE.

By: A. Varma, A. Glaser & P. Franzon

Event: Electrical Performance of Electrical Packaging at Princeton, NJ, USA on October 27-29, 2003

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

2003 conference paper

High Frequency, High Density Interconnect Using AC Coupling

In Fall MRS Conference. Boston, MA.

By: P. Franzon, A. Kingon, S. Mick, J. Wilson, L. Luo, K. Chandrasakhar, J. Xu, S. Bonafede ...

Event: at Boston, MA

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

2003 journal article

Molecular electronics: From devices and interconnect to circuits and architecture

Proceedings of the IEEE, 91(11), 1940–1957.

By: M. Stan, P. Franzon, S. Goldstein, J. Lach & M. Ziegler

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2003 journal article

NanoCell electronic memories

Journal of the American Chemical Society, 125(43), 13279–13283.

By: J. Tour, L. Cheng, D. Nackashi, Y. Yao, A. Flatt, S. Angelo, T. Mallouk, P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2003 conference paper

The development of a macro-modeling tool to develop IBIS models

In Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging (pp. 177–280). Princeton, NJ, USA: IEEE.

By: A. Varma, A. Glaser, S. Lipa, M. Steer & P. Franzon

Event: IEEE Conference on Electrical Performance of Electrical Packaging at Princeton, NJ, USA on October 27-29, 2003

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

2002 conference paper

4 Gbps AC Coupled Interconnection

In Proceedings of the IEEE Custom Integrated Circuits Conference (pp. 133–140). Orlando, FL, USA: IEEE.

By: S. Mick, J. Wilson & P. Franzon

Event: IEEE 2002 Custom Integrated Circuits Conference at Orlando, FL, USA on May 12-16, 2002

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

2002 conference paper

Binary Search Schemes for Fast IP Lookups

In Proceedings of the IEEE Globecom (pp. 2005–2009). Taipei, Taiwan: IEEE.

By: P. Mehortra & P. Franzon

Event: Global Telecommunications Conference, 2002 at Taipei, Taiwan on November 17-21, 2002

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

2002 conference paper

Buried solder bump connections for high- density capacitive coupling

In Proceedings of the IEEE Electrical Performance of Electronic Packaging (pp. 205–208). Monterey, CA, USA: IEEE.

By: S. Mick, L. Luo, J. Wilson & P. Franzon

Event: 2002 IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging at Monterey, CA, USA on October 21-23, 2002

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

2002 conference paper

Hierarchical simulation of high speed digital interconnects using a packaging simulator

In 1994 Proceedings. 44th Electronic Components and Technology Conference. IEEE.

By: M. Basel, M. Steer & P. Franzon

Event: 1994 Proceedings. 44th Electronic Components and Technology Conference

Sources: Crossref, ORCID
Added: March 24, 2019

2002 conference paper

Low power logical element for FPGA fabric

In Proceedings of the IEEE International Conference on Microelectronics (pp. 55–57). Beirut, Lebanon: IEEE.

By: M. Nakkar & P. Franzon

Event: The 14th International Conference on Microelectronics at Beirut, Lebanon on December 13, 2002

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

2002 journal article

Nanocell logic gates for molecular computing

IEEE Transactions on Nanotechnology, 1(2), 100–109.

By: J. Tour, W. Zandt, C. Husband, S. Husband, L. Wilson, P. Franzon, D. Nackashi

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2002 conference paper

Network Processor Design for Optical Burst Switched Networks

In Proceedings of the 14th Annual IEEE International ASIC/SOC Conference (pp. 296–300). Arlington, VA, USA: IEEE.

By: P. Mehrotra, I. Baldine, D. Stevenson & P. Franzon

Event: 14th Annual IEEE International ASIC/SOC Conference at Arlington, VA, USA on September 12-15, 2001

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

2002 conference paper

Novel Hardware Implementation for Fast Address Lookups

In Proceedings of 2002 Workshop on High Performance Switching and Routing. Kobe, Japan: IEEE.

By: P. Mehortra & P. Franzon

Event: 2002 Workshop on High Performance Switching and Routing at Kobe, Japan on May 26-29, 2002

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

2002 journal article

Novel hardware architecture for fast address lookups

IEEE Communications Magazine, 40(11), 66–71.

By: P. Mehrotra & P. Franzon

Sources: Crossref, ORCID
Added: March 9, 2019

2002 conference paper

Packaging Technology for AC Coupled Interconnection

In IMAPS Flip-Chip Conference.

By: S. Mick, P. Franzon & A. Huffman

Source: NC State University Libraries
Added: April 17, 2019

2002 conference paper

Scalable Molecular Circuit Architectures

In 2002 Engineering Foundation Conference on Molecular Computing. Key West.

By: P. Franzon, C. Amsinck, D. Nackashi & N. DeSpagna

Event: at Key West

Source: NC State University Libraries
Added: April 17, 2019

2002 journal article

Single force measurements on 3D collagen matrix

Biophysical Journal, 82(1).

By: A. Meshel, D. Nackashi, P. Franzon & M. Sheetz

Source: NC State University Libraries
Added: March 9, 2019

2001 conference paper

Design of rotating MEMS tunable capacitors for use at RF and Microwave frequencies

In Proceedings of the SPIE International Symposium on Microelectronics and MEMS. Adelaide, Australia.

By: J. Wilson, R. Bashirullah, D. Nackashi, D. Winick, B. Duewer & P. Franzon

Event: at Adelaide, Australia

Source: NC State University Libraries
Added: April 17, 2019

2001 conference paper

Improving Interconnect Characteristics of Thin Film MEMS Processes

In Proceedings of the SPIE International Symposium on Microelectronics and MEMS. Adelaide, Australia.

By: B. Duewer, D. Winick, A. Oberhofer, J. Muth & P. Franzon

Event: at Adelaide, Australia

Source: NC State University Libraries
Added: April 17, 2019

2001 journal article

Load characterization of high displacement piezoelectric actuators with various end conditions

Sensors and Actuators. A, Physical, 94(1-2), 19–24.

By: J. Mulling, T. Usher, B. Dessent, J. Palmer, P. Franzon, E. Grant, A. Kingon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2001 conference paper

Multi-gigahertz low-power low-skew rotary clock scheme

In Proceedings International Conference On Solid State Circuits (pp. 400–401, 470).

By: J. Wood, S. Lipa, P. Franzon & M. Steer

Source: NC State University Libraries
Added: April 17, 2019

2001 conference paper

Smart sensors to monitor warp tension and breaks on a loom

By: S. Gahide, G. Hodge, A. Seyam, W. Oxenham & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2001 conference paper

The Future of Molecular Electronics

In Proceedings of the International Conference on Computer Aided Design of Integrated Circuits. Panel Session.

By: P. Franzon

Source: NC State University Libraries
Added: June 9, 2019

2000 conference paper

Application of micromachines to textiles: Using smart sensors to monitor warp tension and breaks during formation of woven fabrics

In Proceedings of the International Mechanical Engineering Congress & Exposition, ASME, Orlando (FL), November 2000. New York: ASME.

By: S. Gahide, A. Seyam, G. Hodge, W. Oxenham & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2000 conference paper

High displacement piezoelectric actuators: characterization at high load with controlled end conditions

In Proceedings of the 12th IEEE International Symposium on Applications of Ferroelectrics (pp. 745–748). Honolulu, HI, USA: IEEE.

By: J. Mulling, T. Usher, B. Desent, J. Palmer, P. Franzon, E. Grant, A. Kingon

Event: 12th IEEE International Symposium on Applications of Ferroelectrics at Honolulu, HI, USA on July 21 - August 2, 2000

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

2000 conference paper

Leveraging high density packaging for high performance DSP systems

In Proceedings of the IEEE Electrical Performance on Electronic Packaging (pp. 25–28). Scottsdale, AZ, USA: IEEE.

By: P. Mehrotra, V. Rao, T. Conte & P. Franzon

Event: at Scottsdale, AZ, USA on October 23-25, 2002

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

2000 conference paper

Micromachines and textiles: Matching two industries

In Manchester 2000 CD-ROM: Papers from the 2000 Annual (80th) World Conference of The Textile Institute. April 16-19, 2000.

By: S. Gahide, G. Hodge, W. Oxenham, A. Seyam & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2000 journal article

Micromachines and textiles: Matching two industries

Textile Asia, 31, 58–66.

By: S. Gahide, A. Seyam, G. Hodge, W. Oxenham & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2000 conference paper

Moletronics: A circuit design perspective

In Proceedings of the SPIE 4236, Smart Electronics and MEMS II (Vol. 4236, pp. 80–88). Melbourne, Australia.

By: D. Nackashi & P. Franzon

Event: at Melbourne, Australia

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1999 conference paper

Accuracy Issues in Full-Chip Extraction

In DAC 1999.

By: P. Franzon

Source: NC State University Libraries
Added: April 17, 2019

1999 conference paper

Design Automation and Design Challenges for Package/Systems

In Proceedings of the IEEE Asia Design Automation Conference (p. 372). Hong Kong.

By: P. Franzon

Event: at Hong Kong

Source: NC State University Libraries
Added: April 21, 2019

1999 conference paper

Dynamically Programmable Cache, Evaluation and Virtualization

In Proceedings ACM/SIGDA FPGA 99 (p. 246). New York, NY, USA: ACM.

By: M. Nakkar, P. Franzon, J. Harding & D. Schwartz

Event: at Monterey, CA on February 21-23, 1999

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1999 journal article

High frequency loss and electromagnetic field distribution for striplines and microstrips

IEEE Transactions on Advanced Packaging, 22(1), 16–25.

By: H. Lo, J. Kauffman & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

1999 journal article

Improved delay prediction for on-chip buses

Proceedings of the 1999 Design Automation Conference, 497–501.

By: R. Pomerleau, G. Bilbro & P. Franzon

Event: at New Orleans, LA, USA on June 21-25, 1999

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1999 conference paper

Infrastructure and course progression for complex IC design education

In Proceedings of the 1999 IEEE International Conference on Microelectronic Systems Education (MSE'99) `Systems Education in the 21st Century' (Cat.No.99-63794) (pp. 88–89). Los Alamitos, CA, USA: IEEE Computer Society.

By: P. Franzon, W. Lui, C. Gloster, T. Schaffer, A. Glaser & A. Stanaski

Event: 1999 IEEE International Conference on Microelectronic Systems Education (MSE'99) `Systems Education in the 21st Century' (Cat.No.99-63794) at Arlington, VA, USA on July 19-21, 1999

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

1999 conference paper

MEMS-based switches for Digital and RF Switching

In Proceedings Advanced Research in VLSI (pp. 369–377). Atlanta, GA.

By: B. Duewer, J. Wilson, D. Winick & P. Franzon

Event: at Atlanta, GA

Source: NC State University Libraries
Added: April 21, 2019

1999 conference paper

Methodology for Design of Electrostatic MEMS Devices Using the SUMMiT Process

In Proceedings of the 45th International Instrumentation Symposium (pp. 511–520). Albequerue, NM.

By: B. Duewer, D. Winick, J. Wilson, J. Palmer & P. Franzon

Event: at Albequerue, NM

Source: NC State University Libraries
Added: April 21, 2019

1999 conference paper

Programmable MEMS Capacitor Arrays

In Proceedings SPIE International Symposium on Microelectronics and Micromechanical Systems.

By: P. Franzon, B. Duewer, J. Wilson & D. Winick

Source: NC State University Libraries
Added: April 17, 2019

1999 conference paper

Three Dimensional MCM Package Assembly and Analysis

In Proceedings of the IEEE/IMAPS Conference on High Density Packaging and MCMS (pp. 188–192). Denver, CO.

By: M. Nakkar, A. Glaser, P. Franzon, K. Williams, M. Roberson & G. Rinne

Event: IEEE/IMAPS Conference on High Density Packaging and MCMS at Denver, CO

Source: NC State University Libraries
Added: June 9, 2019

1998 journal article

A review of 3-D packaging technology

IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, 21(1), 2–14.

By: S. Al-Sarawi, D. Abbott & P. Franzon

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

1998 conference paper

Accurate Lumped-Parameter modeling for dynamic simulation of electrostatic MEMS Actuators

In Proceedings International Workshop on Modeling of MEMS Systems.

By: S. Chaudhury & P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1998 conference paper

Dynamically Programmable Cache

In Proceedings of the SPIE Conference on Reconfigurable Computing (pp. 218–226). Boston, MA.

By: M. Nakkar, D. Bentlage, J. Harding, D. Schwartz, P. Franzon & T. Conte

Event: at Boston, MA

Source: NC State University Libraries
Added: April 17, 2019

1998 conference paper

Flip-chip Power Distribution

In Proceedings of the IEEE 7th Topical Meeting on the Electrical Performance of Electronic Packaging (pp. 39–41). West Point, NY, USA: IEEE.

By: S. Lipa, A. Glaser & P. Franzon

Event: IEEE 7th Topical Meeting at West Point, NY, USA on October 26-28, 1998

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1998 conference paper

Issues in Chip-Package Codesign with MCM-D/Flip-Chip Technology

In Proceedings of the IEEE International Symposium on Chip-Package Codesign (pp. 88–92). Santa Cruz, CA, USA: IEEE.

By: J. Schaffer, S. Lipa, A. Glaser & P. Franzon

Event: at Santa Cruz, CA, USA on February 2-3, 1998

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1998 conference paper

MEMS-based diffractive optical beam steering system

In Proceedings SPIE 3276, Miniaturized Systems with Micro-Optics and Micromechanics III (Vol. 3276, pp. 81–87). San Jose, CA, United States: SPIE.

By: D. Winick, B. Duewer, S. Chaudry, J. Wilson, J. Ticker, U. Eksi, P. Franzon

Event: Optoelectronics and High-Power Lasers and Applications at San Jose, CA, United States

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

1998 conference paper

Power Reduction by low activity datapath design and SRAM energy models

In Proceedings Workshop on Low Power Techniques, ISCA98.

By: M. Azam, R. Evans & P. Franzon

Source: NC State University Libraries
Added: April 17, 2019

1998 conference paper

The NCSU Design Kit for IC Fabrication Through MOSIS

In Proceedings 1998 International Cadence User Group Conference (pp. 71–80).

By: T. Schaffer, A. Stanaski, A. Glaser & P. Franzon

Event: on September 13-17, 1998

Source: NC State University Libraries
Added: April 21, 2019

1997 conference paper

A Low-cost, High Performance Three-Dimensional Memory Module

In Proceedings of the IEEE Memory Technology, Design and Testing Workshop (pp. 2–7). San Jose, CA, USA: IEEE.

By: A. Glaser, M. Nakkar, P. Franzon, T. Conte, G. Rinne, M. Roberson, V. Rogers, C. Williams

Event: at San Jose, CA, USA on August 11-12, 1997

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1997 conference paper

An accurate, computationally efficient crosstalk model for routing high-speed MCMs

In Proceedings ASIC Conference and Exhibit (pp. 110–114).

By: K. McClellan, T. Wailes & P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1997 journal article

Clocking Optimization and Distribution of Digital Systems with Scheduled Skews

International Journal of VLSI Signal Processing, 16, 19–36.

By: H. Hseih, W. Liu, P. Franzon & R. Cavin

Source: NC State University Libraries
Added: March 20, 2019

1997 journal article

Clocking optimization and distribution in digital systems with scheduled skews

Journal of VLSI Signal Processing Systems for Signal Image and Video Technology, 16(2-3), 131–147.

By: H. Hsieh, W. Liu, P. Franzon & R. Cavin

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

1997 conference paper

Experimental Electrical Characterization of On-Chip Interconnects

In Proceedings of the IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 57–59). Austin, TX, USA: IEEE.

By: B. Biswas, A. Glasser, S. Lipa, M. Steer, P. Franzon, D. Griffis, P. Russell

Event: at Austin, TX, USA on October 27-29, 1997

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1997 conference paper

Low Power Data Processing by Elimination of Redundant Computations

In Proceedings 1997 International Symposium on Low Power Electronics and Design (pp. 259–264). Monterey, California.

By: M. Azam, P. Franzon & T. Conte

Event: 1997 International Symposium on Low Power Electronics and Design at Monterey, California on August 18-20, 1997

Source: NC State University Libraries
Added: June 9, 2019

1997 conference paper

MCM Implementation of a Data Encryption Standard (DES) Processor

In Proceedings of the 1997 IEEE MCM Conference (pp. 13–17).

By: T. Schaeffer, A. Glaser, S. Lipa & P. Franzon

Event: 1997 IEEE MCM Conference

Source: NC State University Libraries
Added: June 9, 2019

1997 conference paper

MIDAS Flip-Chip Service

In Proceedings of the 1997 IEEE MCM Conference (pp. 133–135).

By: W. Hansford, J. Peltier, P. Franzon, S. Lipa & J. Schaeffer

Event: 1997 IEEE MCM Conference

Source: NC State University Libraries
Added: June 9, 2019

1997 conference paper

Performance Evaluation of Micromechanical Binary Phase-Only Holographic Optical Elements

In Proceedings of the IEEE Electronic Technology and Components Conference (pp. 419–424). San Jose, CA, USA: IEEE.

By: D. Winick, B. Duewer, S. Palchaudhury & P. Franzon

Event: at San Jose, CA, USA on May 18-21, 1997

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1997 conference paper

Simulation vs. Calculation of Crosstalk

In Proceedings of the IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 131–134). Austin, TX, USA.

By: K. McClellan, T. Wailes & P. Franzon

Event: at Austin, TX, USA on October 27-29, 1997

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1997 conference paper

Thermal/mechanical analysis and design of three dimensional high density MCM package

In Proceedings of the Next Generation Package Design Workshop.

By: M. Nakkar, P. Franzon, A. Glaser, V. Rogers, K. Willimas & G. Rinne

Source: NC State University Libraries
Added: April 21, 2019

1996 conference paper

Computer Design Strategy for MCM-D/Flip-Chip Technology

In Proceedings of the 1996 Topical Meeting on Electrical Performance of Electronic Packaging (pp. 6–8).

By: P. Franzon, T. Conte, S. Banerjia, A. Glaser, S. Lipa, T. Schaffer, A. Stanaski, Y. Tekmen

Source: NC State University Libraries
Added: April 21, 2019

1996 conference paper

Computer Design Strategy for MCM-D/Flip-Chip Technology

In Proceedings of the 1996 ASIC Conference (pp. 35–39).

By: P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1996 journal article

Experimental Characterization of Transmission Lines in Thin-Film Multichip Modules

IEEE Trans. on Components Hybrids and Manufacturing Technology Part A, 19(1), 74–82.

By: S. Lipa, M. Steer, A. Cangellaris & P. Franzon

Source: NC State University Libraries
Added: March 20, 2019

1996 book

High Performance Design Automation for Multi-Chip Modules and Packages

World Scientific.

By: J. Cho & P. Franzon

Source: NC State University Libraries
Added: March 9, 2019

1996 conference paper

High Speed Bus Design Using HSPICE Optimization Techniques Based on Worst Case Design Approach

In Proceedings of the 1996 Topical Meeting on Electrical Performance of Electronic Packaging (pp. 93–96).

By: R. Lakhani, C. Deutschle & P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1996 conference paper

Issues in Partitioning Integrated Circuits for MCM-D/Flip-Chip Technology

In Proceedings of the 1996 IEEE MultiChip Module Conference. Santa Cruz, CA, USA: IEEE.

By: S. Banerjia, A. Glaser, C. Harvatis, S. Lipa, R. Pomerleau, T. Schaffer, A. Stanaski, Y. Tekmen ...

Event: at Santa Cruz, CA, USA on February 6-7, 1996

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1996 chapter

Multichip Module Technology

In J. Whitaker (Ed.), The Electronic Handbook. CRC Press.

By: P. Franzon

Ed(s): J. Whitaker

Source: NC State University Libraries
Added: March 9, 2019

1996 conference paper

Pin Assignment for High-Performance MCM Systems

In Proceedings of the 1996 IEEE ISCAS Conference (pp. 771–774). Atlanta, GA, USA: IEEE.

By: C. Harvatis, Y. Tekmen, G. Bilbro & P. Franzon

Event: at Atlanta, GA, USA on May 15, 1996

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1996 conference paper

System Design Optimization With Multichip Module Technology

In Proceedings 1996 Conference of the Brazilian Microelectronics Society.

By: P. Franzon

Event: 1996 Conference of the Brazilian Microelectronics Society

Source: NC State University Libraries
Added: June 9, 2019

1995 conference paper

A Micro-machined Approach to Optical Interconnect

In Proceedings 1995 Electronic Components and Technology Conference (pp. 620–627).

By: M. Teague & P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1995 journal article

Energy consumption modeling and optimization for SRAM's

IEEE Journal of Solid-State Circuits, 30(5), 571–579.

By: R. Evans & P. Franzon

Sources: Crossref, ORCID
Added: March 9, 2019

1995 conference paper

Measurement of on-IC Capacitance Structures

In Proceedings of the 1995 IEEE Topical Meeting on Electrical Performance of Electronic Packaging.

By: A. Glaser, M. Steer & P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1995 conference paper

Optimal System Design with MultiChip Module Technology

In Proceedings of Microeletronics'95.

By: P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1995 conference paper

Performance Driven Global Routing and Wiring Rule Generation for High Speed PCBs and MCMs

In Proceedings 1995 Design Automation Conference (pp. 36–40).

By: S. Mehrotra, P. Franzon & M. Steer

Source: NC State University Libraries
Added: April 21, 2019

1995 chapter

Performance Driven Global Routing and Wiring Rule Generation for High Speed PCBs and MCMs

In M. Pecht (Ed.), Advanced Routing of Electronic Modules. Kluwer.

By: S. Mehrotra & P. Franzon

Ed(s): M. Pecht

Source: NC State University Libraries
Added: March 9, 2019

1995 journal article

Simulation of high speed interconnects using a convolution-based hierarchical packaging simulator

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 18(1), 74–82.

By: M. Basel, M. Steer & P. Franzon

Sources: NC State University Libraries, ORCID
Added: March 20, 2019

1995 conference paper

System Design Optimization for MCM

In Proceedings of the 1995 IEEE MultiChip Module Conference. Santa Cruz, CA, USA: IEEE.

By: P. Franzon, A. Stanaski, Y. Tekmen & S. Banerjia

Event: at Santa Cruz, CA, USA on January 31 - February 2, 1995

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1995 journal article

System design optimization for MCM-D/flip-chip

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 18(4), 620–627.

By: P. Franzon, A. Stanaski, Y. Tekmen & S. Banerjia

Sources: Crossref, ORCID
Added: March 9, 2019

1994 conference paper

Applications of MEMS to Reconfigurable Free Space Optical Interconnect

In Proceedings NSF Optical Packaging Workshop. Breckenridge, CO.

By: D. Winick, M. Teague & P. Franzon

Event: NSF Optical Packaging Workshop at Breckenridge, CO on August 15-17, 1994

Source: NC State University Libraries
Added: June 9, 2019

1994 conference paper

Control of Crosstalk Noise

In Proceedings of the 1994 ECTC Conference.

By: M. Sengupta, S. Lipa, P. Franzon & M. Steer

Source: NC State University Libraries
Added: April 21, 2019

1994 journal article

Delay and reflection noise macromodeling for signal integrity management of PCBs and MCMs

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 17(1), 15–21.

By: S. Simovich, S. Mehrotra, P. Franzon & M. Steer

Sources: Crossref, ORCID
Added: March 9, 2019

1994 journal article

Energy control and accurate delay estimation in the design of CMOS buffers

IEEE Journal of Solid-State Circuits, 29(9), 1150–1153.

By: S. Ma & P. Franzon

Sources: Crossref, ORCID
Added: March 9, 2019

1994 journal article

SABSA: Switching-Activity Based State Assignment

International Journal of High Speed Electronics and Systems, 5(2), 203–212.

By: S. Washabaugh, P. Franzon & H. Nagle

Source: NC State University Libraries
Added: March 20, 2019

1994 conference paper

Skew and Delay Minimization of High Speed CMOS Circuits using Stochastic Optimization

In Proceedings of the 1994 Custom Integrated Circuits Conference (pp. 45–48).

By: S. Mehrotra, P. Franzon & W. Liu

Source: NC State University Libraries
Added: June 9, 2019

1994 conference paper

Stochastic OptimizationApproach to Transistor Sizing for CMOS Circuits

In Proceedings of the 1994 IEEE Design Automation Conference (pp. 36–40). New York, NY, USA: ACM.

By: S. Mehrotra, P. Franzon & W. Liu

Event: at San Diego, California, USA on June 6-10, 1994

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1994 journal article

The Case for MCMs

Semiconductor International, 85–86.

By: D. Doane & P. Franzon

Source: NC State University Libraries
Added: March 9, 2019

1993 conference paper

A Signal Integrity Advisor for Automated Packaging Design

In Proceedings of the 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging. Monterey, CA, USA: IEEE.

By: S. Simovich, S. Mehrotra, P. Franzon, M. Steer, Z. Rakib & G. Simpson

Event: at Monterey, CA, USA on October 20-22, 1993

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1993 journal article

A layout-driven yield predictor and fault generator for VLSI

IEEE Transactions on Semiconductor Manufacturing, 6(1), 77–82.

By: A. Dalal, P. Franzon & M. Lorenzetti

Sources: Crossref, ORCID
Added: March 9, 2019

1993 conference paper

A simple method for noise tolerance characterization of digital circuits

In Proceedings 1993 Great Lakes VLSI Conference.

By: S. Simovich & P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1993 journal article

An MCM Design Process with Application to a Laptop Computer Design

IEEE Computer Magazine, 26(4), 41–49.

By: P. Franzon & R. Evans

Source: NC State University Libraries
Added: March 9, 2019

1993 conference paper

Automatic A-Priori Generation of Delay and Noise Macromodels and Wiring Rules for MCMs

In Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93. Santa Cruz, CA, USA: IEEE.

By: P. Franzon, S. Simovich, S. Mehrotra & M. Steer

Event: at Santa Cruz, CA, USA on May 15-18, 1993

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1993 conference paper

Behavioral modeling of processors from instruction set specifications

In Open Verilog International 1993 Conference.

Ed(s): T. Cook, E. Harcourt, T. Miller & P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1993 journal article

Comparison of methods for determining the capacitance of planar transmission lines with application to multichip module characterization

IEEE Trans. on Components Hybrids and Manufacturing Technology/Advanced Packaging.

By: S. Lipa, M. Steer, A. Morris & P. Franzon

Source: NC State University Libraries
Added: March 20, 2019

1993 conference paper

Design advice systems for concurrent engineering: A constraint-based approach

Presented at the NSF Grantees Conference, Charlotte, NC.

By: J. Bowen, D. Bahler & P. Franzon

Event: NSF Grantees Conference at Charlotte, NC

Source: NC State University Libraries
Added: April 21, 2019

1993 conference paper

Experimental characterization of interconnects and discontinuities in thin-film multichip module substrates

In Proceedings of the 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging. Monterey, CA, USA: IEEE.

By: M. Steer, S. Lipa & P. Franzon

Event: 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging at Monterey, CA, USA on October 20-22, 1993

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

1993 conference paper

LISAS: A Language for Instruction Set Architecture Specification

In Proceedings 1993 ICCD Conference (pp. 552–557).

By: T. Cook, P. Franzon & T. Miller

Source: NC State University Libraries
Added: June 9, 2019

1993 conference paper

Macromodels for Generating Signal Integrity and Timing Management Advice for Package Design

In Proceedings of the IEEE 1993 ECTC Conference (pp. 523–529). Orlando, FL, USA: IEEE.

By: P. Franzon, S. Simovich, S. Mehrotra & M. Steer

Event: at Orlando, FL, USA on June 1-4, 1993

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1993 journal article

Method for automated waveform analysis of transient in digital circuits

Electronics Letters, 29(8), 681–693.

By: S. Simovich, P. Franzon & M. Steer

Source: NC State University Libraries
Added: March 9, 2019

1993 book

Multichip Modules: Basics and Alternatives

Van Nostrand Rheinhold.

By: D. Doane & P. Franzon

Source: NC State University Libraries
Added: March 9, 2019

1993 chapter

Tools and Techniques for the Design of High Speed Multichip Modules, Chapter 7

In J. Morris (Ed.), Electronics Packaging Forum (Vol. 3). IEEE Press.

By: P. Franzon & M. Steer

Ed(s): J. Morris

Source: NC State University Libraries
Added: March 9, 2019

1992 conference paper

An efficient table-driven decoder for one-half rate convolutional codes

In ACM-SE 30 Proceedings of the 30th annual Southeast regional conference (pp. 116–123). New York, NY, USA: ACM.

By: A. Dholakia, T. Lee, D. Bitzer, M. Vouk, L. Wang & P. Franzon

Event: at Raleigh, North Carolina on April 8-10, 1992

Sources: NC State University Libraries, ORCID
Added: June 9, 2019

1992 conference paper

Automating Design for Signal Integrity

In Proceedings 1992 IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 10–13). Tucson, AZ, USA: IEEE.

By: P. Franzon, M. Mehrotra, S. Simovich & M. Steer

Event: at Tucson, AZ, USA on April 22-24, 1992

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1992 journal article

Comment on an accurate measurement technique for line properties, junction effects and dielectric and magnetic parameters

IEEE Transactions on Microwave Theory Tech.

By: M. Steer, S. Goldberg & P. Franzon

Source: NC State University Libraries
Added: March 9, 2019

1992 conference paper

Cost/performance issues in multichip module packaging

In Proceedings of the Japan International Conference on Microelectronics.

By: E. Vardaman, M. Hartnett, L. Ng & P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1992 conference paper

Introducing the through-line deembedding procedure

In 1992 IEEE MTT-S International Microwave Symposium Digest. Albuquerque, NM, USA: IEEE.

By: M. Steer, S. Goldberg, G. Rinne, P. Franzon, I. Turlik & J. Kasten

Event: at Albuquerque, NM, USA on June 1-5, 1992

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1992 conference paper

Microwave characterization of thin-film multi-chip module substrates and printed wiring boards accounting for frequency-dependent characteristic impedance

In Proceedings of the IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 125–127). Tucson, AZ, USA: IEEE.

By: M. Steer & P. Franzon

Event: at Tucson, AZ, USA on April 22-24, 1992

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1992 conference paper

Tools to aid in Wiring Rule Generation for High Speed Interconnects

In Proceedings 1992 Design Automation Conference (pp. 466–471).

By: P. Franzon, S. Simovich, M. Steer, M. Basel, S. Mehrotra & T. Mills

Source: NC State University Libraries
Added: April 21, 2019

1991 conference paper

Accurate experimental characterization of three-ports

In Proceedings of the 1991 IEEE MTT-S International Microwave Symposium Digest. Boston, MA, USA: IEEE.

By: S. Goldberg, M. Steer & P. Franzon

Event: at Boston, MA, USA on July 10-14, 1991

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1991 conference paper

Automating Design for Signal Integrity

In Topical Meeting on Electrical Performance of Electronic Packaging. Tucson, Arizona.

By: P. Franzon, S. Mehrotra, S. Simovich & M. Steer

Source: NC State University Libraries
Added: April 21, 2019

1991 conference paper

Experimental electrical characterization of high speed interconnects

In Proceedings of the 41st Electronic Components and Technology Conference.

By: S. Goldberg, M. Steer & P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1991 journal article

Experimental electrical characterization of interconnects and discontinuities in high-speed digital systems

IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 14(4), 761–765.

By: S. Goldberg, M. Steer, P. Franzon & J. Kasten

Sources: Crossref, ORCID
Added: March 9, 2019

1991 conference paper

High Speed Digital System Simulation using Frequency Dependent Transmission Line Network Modeling

In Proceedings of the 1991 IEEE MTT-S International Microwave Symposium Digest. Boston, MA, USA: IEEE.

By: M. Basel, M. Steer, P. Franzon & D. Winkelstein

Event: at Boston, MA, USA on July 10-14, 1991

Sources: NC State University Libraries, ORCID
Added: April 21, 2019

1991 conference paper

Interconnect Modeling and Simulation for High Speed MCM

In Proceedings Multichip Module Workshop (pp. 122–129).

By: P. Franzon & M. Steer

Source: NC State University Libraries
Added: April 21, 2019

1991 conference paper

Microwave characterization of thin-film multi-chip module substrates and printed wiring boards accounting for frequency-dependent characteristic impedance

In Topical Meeting on Electrical Performance of Electronic Packaging. Tucson, Arizona.

By: M. Steer & P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1991 conference paper

The NCSU Design Center

In Proceedings of the 1991 Microsystems Educators Conference. San Jose, CA.

By: D. Van den Bout, T. Nagle, T. Miller & P. Franzon

Event: at San Jose, CA

Source: NC State University Libraries
Added: April 21, 2019

1991 conference paper

Tools and Techniques for the Design of High Speed Multichip Modules

In Proceedings of the Third Annual Electronics Packaging Symposium. Binghamton, NY.

By: P. Franzon & M. Steer

Event: Third Annual Electronics Packaging Symposium at Binghamton, NY on May 13-14, 1991

Source: NC State University Libraries
Added: June 9, 2019

1991 conference paper

Tools and techniques for the Design of High Speed Multichip Modules

In Proceedings Japan IEMT.

By: P. Franzon, M. Steer & R. Gyurcsik

Source: NC State University Libraries
Added: April 21, 2019

1990 conference paper

Circuit Simulation with Distributed Elements

In Proceedings of the Workshop on Circuit and Process Simulation. Microelectronics Center of North Carolina, Research Triangle Park.

By: M. Steer & P. Franzon

Event: Workshop on Circuit and Process Simulation at Microelectronics Center of North Carolina, Research Triangle Park on November 6, 1990

Source: NC State University Libraries
Added: June 9, 2019

1990 conference paper

Defect tolerant implementations for feed-forward and recurrent neural networks

In Proceedings of 1990 International Conference on Wafer-Scale Integration (pp. 160–166).

By: P. Franzon, D. Van den Bout, J. Paulos, T. Miller, W. Snyder, T. Nagle, W. Liu

Source: NC State University Libraries
Added: April 21, 2019

1990 conference paper

McYield: A CAD Tool for Functional Yield Projections for VLSI

In 1990 International Workshop on Defect and Fault Tolerance in VLSI Systems.

By: M. Lorenzetti, A. Dalal & P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1990 journal article

Scalable VLSI implementations for neural networks

Journal of VLSI Signal Processing Systems for Signal, Image and Video Technology, 1(4), 367–385.

By: D. van den Bout, P. Franzon, J. Paulos, T. Miller, W. Snyder, T. Nagle, W. Liu

Sources: Crossref, ORCID
Added: March 24, 2019

1989 journal article

Achieving ULSI through defect tolerance

International Journal of Computer Aided VLSI Design, 1(1), 73–90.

By: P. Franzon & K. Eshraghian

Source: NC State University Libraries
Added: March 9, 2019

1989 conference paper

Comparison of Reconfiguration Schemes for Defect Tolerant Mesh Arrays

In Proceedings of the 1989 Workshop on Defect Tolerance. Tampa, Florida.

By: P. Franzon

Event: at Tampa, Florida

Source: NC State University Libraries
Added: April 21, 2019

1989 chapter

Comparison of Reconfiguration Schemes for Defect Tolerant Mesh Arrays

In V. K. Jain (Ed.), Defect and Fault Tolerance in VLSI Systems (Vol. 2). Plenum.

By: P. Franzon

Ed(s): V. Jain

Source: NC State University Libraries
Added: March 9, 2019

1989 chapter

Fundamental interconnection issues

In Electronic Materials Handbook (Vol. 1: Packaging, pp. 1–11). ASM International.

By: M. Hatamian, L. Hornak, T. Little, S. Tewksbury & P. Franzon

Source: NC State University Libraries
Added: March 20, 2019

1989 journal article

Modeling interconnect yield in reconfigurable circuits

Electronics Letters, 25(18), 1225–1226.

By: P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1988 chapter

'Chip Frame’ scheme for reconfigurable mesh-connected arrays

In R. M. Lea (Ed.), Water Scale Integration II. North Holland.

By: P. Franzon & S. Tewksbury

Ed(s): R. Lea

Source: NC State University Libraries
Added: April 11, 2019

1987 journal article

FIR digital filters for high sample rate applications

IEEE Communications Magazine, 25(7), 62–72.

By: S. Tewksbury, M. Hatamian, P. Franzon, L. Hornak, C. Siller & V. Lawrence

Sources: Crossref, ORCID
Added: March 9, 2019

1987 chapter

Franzon: Yield Modeling for Fault Tolerant VLSI

In W. Moore, A. McCabe, & R. Urquhart (Eds.), Systolic Arrays. Adam Hilger.

By: P. Franzon

Ed(s): W. Moore, A. McCabe & R. Urquhart

Source: NC State University Libraries
Added: March 9, 2019

1987 journal article

Fundamental Interconnection Issues

AT&T Technical Journal, 66(4), 13–30.

By: M. Hatamian, L. Hornak, T. Little, S. Tewksbury & P. Franzon

Sources: Crossref, ORCID
Added: March 9, 2019

1987 conference paper

`Chip Frame' scheme for reconfigurable mesh-connected arrays

In Proceedings of the 1987 International workshop on Wafer Scale Integration. Uxbridge, England.

By: P. Franzon & S. Tewksbury

Source: NC State University Libraries
Added: April 21, 2019

1986 conference paper

Interconnect Strategies for Fault Tolerant 2D VLSI Arrays

In Proceedings of the International Conference on Computer Design (pp. 230–234). Rye Town, NY.

By: P. Franzon

Event: at Rye Town, NY

Source: NC State University Libraries
Added: April 21, 2019

1986 conference paper

Through-Wafer Optical Interconnects for Multi-Wafer Wafer-Scale Integrated architectures

In Proceedings of SPIE 86. San Diego, California.

By: L. Hornak, S. Tewksbury, M. Hatamian, A. Ligtenberg, B. Sugla & P. Franzon

Event: SPIE 86 at San Diego, California

Source: NC State University Libraries
Added: June 9, 2019

1986 conference paper

Yield Modeling for Fault Tolerant VLSI

In Proceedings of the International Workshop on Systolic Arrays. England: University of Oxford.

By: P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

1985 conference paper

The Transform and Filter Brick: A new architecture for signal processing

In Proceedings of the VLSI 85. Tokyo, Japan.

By: K. Eshraghian, R. Bryant, A. Dickinson, D. Fensom, P. Franzon, M. Pope, J. Rockliff, G. Zyner

Event: VLSI 85 at Tokyo, Japan on August 25-28, 1985

Source: NC State University Libraries
Added: June 9, 2019

conference paper

A Robust calibration and supervised machine learning reliability framework for digitally-assisted self-healing RFICS

Wyers, E. J., Qi, W. Y., & Franzon, P. D. In 2017 ieee 60th international midwest symposium on circuits and systems (mwscas) (pp. 1138–1141).

By: E. Wyers, W. Qi & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

patent

Buried solder bumps for AC-coupled microelectronic interconnects

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

By: P. Franzon, S. Mick & J. Wilson

Source: NC State University Libraries
Added: August 6, 2018

conference paper

CAD Tools for the Automated Design of High Speed Multichip Modules

Franzon, P. In Proceedings of the 1990 International Packaging Symposium.

By: P. Franzon

Source: NC State University Libraries
Added: April 21, 2019

conference paper

CAD tools for Managing Signal Integrity and Congestion Simultaneously

Mehrotra, S., Franzon, P., Bilbro, G., & Steer, M. In Proceedings of the 1994 Topical Meeting on Electrical Performance of Electrical Packaging (pp. 30–32).

By: S. Mehrotra, P. Franzon, G. Bilbro & M. Steer

Source: NC State University Libraries
Added: April 21, 2019

conference paper

Comparative analysis of two 3D integration implementations of a SAR processor

Thorolfsson, T., Melamed, S., Charles, G., & Franzon, P. D. In 2009 IEEE International Conference on 3d Systems Integration (pp. 25–28).

By: T. Thorolfsson, S. Melamed, G. Charles & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

conference paper

Design and ASIC acceleration of cortical algorithm for text recognition

Dey, S., & Franzon, P. D. In 2016 29th IEEE International System-on-Chip Conference (SOCC) (pp. 114–119).

By: S. Dey & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

conference paper

Design and ASIC acceleration of cortical algorithm for text recognition

Dey, S., & Franzon, P. D. In 2016 29th IEEE International System-on-Chip Conference (SOCC) (pp. 114–119).

By: S. Dey & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

conference paper

H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor

Srinivasan, V., Chowdhury, R. B. R., Forbes, E., Widialaksono, R., Zhang, Z. Q., Schabel, J., … Franzon, P. D. In 2017 ieee 35th international conference on computer design (iccd) (pp. 145–152).

By: V. Srinivasan, R. Chowdhury, E. Forbes, R. Widialaksono, Z. Zhang, J. Schabel, S. Ku, S. Lipa ...

Source: NC State University Libraries
Added: August 6, 2018

conference paper

Hardware implementation of hierarchical temporal memory algorithm

Li, W. F., & Franzon, P. In 2016 29th IEEE International System-on-Chip Conference (SOCC) (pp. 133–138).

By: W. Li & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

conference paper

Hardware implementation of hierarchical temporal memory algorithm

Li, W. F., & Franzon, P. In 2016 29th IEEE International System-on-Chip Conference (SOCC) (pp. 133–138).

By: W. Li & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

patent

Inductively coupled electrical connectors

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

By: P. Franzon, S. Mick & J. Wilson

Source: NC State University Libraries
Added: August 6, 2018

conference paper

Junction-level thermal extraction and simulation of 3DICs

Melamed, S., Thorolfsson, T., Srinivasan, A., Cheng, E., Franzon, P., & Davis, R. In 2009 IEEE International Conference on 3d Systems Integration (pp. 395–401).

By: S. Melamed, T. Thorolfsson, A. Srinivasan, E. Cheng, P. Franzon & R. Davis

Source: NC State University Libraries
Added: August 6, 2018

conference paper

Machine learning in physical design

Li, B. W., & Franzon, P. D. In Ieee conference on electrical performance of electronic packaging and (pp. 147–149).

By: B. Li & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

patent

Methods and systems for fast binary network address lookups using parent node information stored in routing table entries

Mehrotra, P., & Franzon, P. D. Washington, DC: U.S. Patent and Trademark Office.

By: P. Mehrotra & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

patent

Methods and systems for fast packet forwarding

Mehrotra, P., & Franzon, P. D. Washington, DC: U.S. Patent and Trademark Office.

By: P. Mehrotra & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

conference paper

Processor-in-memory support for artificial neural networks

Schabel, J., Baker, L., Dey, S., Li, W. F., & Franzon, P. D. In 2016 IEEE International Conference on Rebooting Computing (icrc).

By: J. Schabel, L. Baker, S. Dey, W. Li & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

conference paper

RDL and interposer design for DiRAM4 interfaces

Nigussie, T., & Franzon, P. D. In Ieee conference on electrical performance of electronic packaging and (pp. 17–19).

By: T. Nigussie & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

journal article

RF-only logic: An area efficient logic family for RF-power harvesting applications

Zhao, W. X., Gadfort, P., Bhanushali, K., & Franzon, P. D. IEEE Transactions on Circuits and Systems. I, Regular Papers, 65(1), 406–418.

By: W. Zhao, P. Gadfort, K. Bhanushali & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

conference paper

Self-calibrating clock distribution with scheduled skews

Hsieh, H.-Y., Lui, W., Clements, M., & Franzon, P. In Proceedings of ISCAS'98 (Vol. 2 , pp. 470–473).

By: H. Hsieh, W. Lui, M. Clements & P. Franzon

Source: NC State University Libraries
Added: April 18, 2019

journal article

Storage class memory

Burr, G. W., & Franzon, P. Emerging Nanoelectronic Devices, 498–510.

By: G. Burr & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

journal article

Surrogate-model-based analysis of analog circuits-part I: Variability analysis

Yelten, M. B., Franzon, P. D., & Steer, M. B. IEEE Transactions on Device and Materials Reliability, 11(3), 466–473.

By: M. Yelten, P. Franzon & M. Steer

Source: NC State University Libraries
Added: August 6, 2018

journal article

Surrogate-model-based analysis of analog circuits-part II: Reliability analysis

Yelten, M. B., Franzon, P. D., & Steer, M. B. IEEE Transactions on Device and Materials Reliability, 11(3), 458–465.

By: M. Yelten, P. Franzon & M. Steer

Source: NC State University Libraries
Added: August 6, 2018

conference paper

Technology impact analysis for 3D TCAM

Oh, E. C., & Franzon, P. D. In 2009 IEEE International Conference on 3d Systems Integration (pp. 206–210).

By: E. Oh & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

conference paper

Thermal raman and IR measurement of heterogeneous integration stacks

Harris, T. R., Pavlidis, G., Wyers, E. J., Newberry, D. M., Graham, S., Franzon, P., & Davis, W. R. In Intersociety conference on thermal and thermomechanical phenomena in (pp. 1505–1510).

By: T. Harris, G. Pavlidis, E. Wyers, D. Newberry, S. Graham, P. Franzon, W. Davis

Source: NC State University Libraries
Added: August 6, 2018

conference paper

Through silicon Via(TSV) defect/pinhole self test circuit for 3D-IC

Tsai, M. L., Klooz, A., Leonard, A., Appel, J., & Franzon, P. In 2009 IEEE International Conference on 3d Systems Integration (pp. 170–177).

By: M. Tsai, A. Klooz, A. Leonard, J. Appel & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

book

Verilog styles for synthesis of digital systems

Smith, D. R., & Franzon, P. D. Upper Saddle River, NJ: Prentice Hall.

By: D. Smith & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018