Works (429)
2025 article
3-D Stacking for AI Systems: Emulating Heterogeneous 3-D Architectures for AI
Kurshan, E., & Franzon, P. (2025, May 5). IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 15, pp. 1161–1169.
2025 article
3D Guard-Layer: An Integrated Agentic AI Safety System for Edge Artificial Intelligence
Kurshan, E., Xie, Y., & Franzon, P. D. (2025, January 1). SSRN Electronic Journal, Vol. 1.
open access via doi.org (repository)2025 article
3D Stacking for AI Systems: Emulating Heterogeneous 3D Architectures for AI
Kurshan, E., & Franzon, P. D. (2025, January 1). SSRN Electronic Journal, Vol. 1.
2025 journal article
A 27–30 GHz T/R Module With Reflection-Type Phase Shifting and Machine-Learned Calibration
IEEE Transactions on Circuits and Systems I: Regular Papers, 1, 1–12.
2025 article
A Conditional Diffusion Framework for Sample-Efficient Thermal Modeling in 3DICs
Dutta, S., Amin, F., Kashyap, P., Kannan, D., Panda, S., Rouf, N., & Franzon, P. D. (2025, October 19). (Vol. 10). Vol. 10.
2025 article
Q2SV: A High‐Level Synthesis Approach for State Vector Quantum Simulation
Bennakhi, A., Byrd, G. T., & Franzon, P. (2025, January 1). (S. Wei, Ed.). Quantum Engineering.
Ed(s): S. Wei
2024 article proceedings
Analyzing Quantum Circuit Depth Reduction with Ancilla Qubits in MCX Gates
2024 article proceedings
Can Low-Rank Knowledge Distillation in LLMs be Useful for Microelectronic Reasoning?
2024 article proceedings
High-Speed Receiver Transient Modeling with Generative Adversarial Networks
2024 article
RD-FAXID: Ransomware Detection with FPGA-Accelerated XGBoost
Gajjar, A., Kashyap, P., Aysu, A., Franzon, P., Choi, Y., Cheng, C., … Ignowski, J. (2024, August 12). ACM Transactions on Reconfigurable Technology and Systems, Vol. 8.
2024 article
Solving the B-SAT Problem Using Quantum Computing: Smaller Is Sometimes Better
Bennakhi, A., Byrd, G. T., & Franzon, P. (2024, October 18). Entropy, Vol. 26.
2024 article proceedings
Solving the B-SAT Problem Using Quantum Computing: Smaller is Sometimes Better
2024 article proceedings
Towards 3D AI Hardware: Fine-Grain Hardware Characterization of 3D Stacks for Heterogeneous System Integration & AI Systems
Towards 3D AI Hardware: Fine-Grain Hardware Characterization of 3D Stacks for Heterogeneous System Integration & AI Systems.
2024 article proceedings
Transformer Based Channel Identification
2023 article proceedings
Chiplet Set For Artificial Intelligence
2023 article proceedings
DepthGraphNet: Circuit Graph Isomorphism Detection via Siamese-Graph Neural Networks
2023 article proceedings
Generative Adversarial Network Based Adaptive Transmitter Modeling
2023 article proceedings
Generative Multi-Physics Models for System Power and Thermal Analysis Using Conditional Generative Adversarial Networks
2023 article proceedings
System Aware Floorplanning for Chip-Package Co-design
2023 article proceedings
Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package
2023 article proceedings
Thermal Estimation for 3D-ICs Through Generative Networks
2022 journal article
A Deep Transfer Learning Design Rule Checker With Synthetic Training
IEEE Design & Test, 40(1), 77–84.
2022 journal article
Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 30(9), 1230–1243.
2022 article proceedings
FAXID: FPGA-Accelerated XGBoost Inference for Data Centers using HLS
2022 article
High Dimensional Optimization for Electronic Design
Wen, Y., Dean, J., Floyd, B. A., & Franzon, P. D. (2022, September 6). MLCAD '22: PROCEEDINGS OF THE 2022 ACM/IEEE 4TH WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD), pp. 153–157.
2022 article proceedings
High Dimensional Optimization for Electronic Design
2022 article proceedings
Modeling of Adaptive Receiver Performance Using Generative Adversarial Networks
2022 article
RxGAN: Modeling High-Speed Receiver through Generative Adversarial Networks
Kashyap, P., Gajjar, A., Choi, Y., Wong, C.-W., Baron, D., Wu, T., … Franzon, P. (2022, September 6). MLCAD '22: PROCEEDINGS OF THE 2022 ACM/IEEE 4TH WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD).
Contributors: P. Kashyap n
2022 article proceedings
RxGAN: Modeling High-Speed Receiver through Generative Adversarial Networks
2022 chapter
Solving the Inverse Problem Through Optimization — Applications to Analog/RF IC Design
In Surrogate Modeling for High-Frequency Design (pp. 325–360).
2021 article
A 125 μm × 245 μm Mainly Digital UHF EPC Gen2 Compatible RFID Tag in 55 nm CMOS Process
Bhanushali, K., Zhao, W., Pitts, W. S., & Franzon, P. D. (2021, June 8). IEEE Journal of Radio Frequency Identification, Vol. 9.
2021 article
A Review of 3D-Dynamic Random-Access Memory based Near-Memory Computation
Ravichandiran, P. P., & Franzon, P. D. (2021, October 1). 2021 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC).
2021 article
A Scalable Cluster-based Hierarchical Hardware Accelerator for a Cortically Inspired Algorithm
Dey, S., Baker, L., Schabel, J., Li, W., & Franzon, P. D. (2021, June 30). ACM Journal on Emerging Technologies in Computing Systems, Vol. 10.
2021 article
Design Benefits of Hybrid Bonding for 3D Integration
Nigussie, T., Pan, T.-H., Lipa, S., Pitts, W. S., DeLaCruz, J., & Franzon, P. (2021, June 1). IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021).
2021 conference paper
Design Obfuscation through Smart Partitioning and 3D Integration – Experimental Results
Proceedings of Gomactech 2021. Presented at the Gomactech.
2021 article proceedings
Design for 3D Stacked Circuits
2021 conference paper
Embedded RFID for Chip Asset Tracking
Proceedings of Gomactech 2021. Presented at the Gomactech.
2021 article
Fast and Accurate PPA Modeling with Transfer Learning
Francisco, L., Franzon, P., & Davis, W. R. (2021, August 30). 2021 ACM/IEEE 3RD WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD).
2021 article proceedings
Fast and Accurate PPA Modeling with Transfer Learning
2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD), 1–8.
2021 article
Hardware Implementation of Hierarchical Temporal Memory Algorithm
Li, W., Franzon, P., Dey, S., & Schabel, J. (2021, October 22). ACM Journal on Emerging Technologies in Computing Systems, Vol. 18.
2021 article
High Speed Receiver Modeling Using Generative Adversarial Networks
Kashyap, P., Pitts, W. S., Baron, D., Wong, C.-W., Wu, T., & Franzon, P. D. (2021, October 17). IEEE 30TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2021).
2021 article
Multi-ANN embedded system based on a custom 3D-DRAM
Baker, L. B., Patti, R., & Franzon, P. (2021, October 1). 2021 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC).
2020 article
2Deep: Enhancing Side-Channel Attacks on Lattice-Based Key-Exchange via 2-D Deep Learning
Kashyap, P., Aydin, F., Potluri, S., Franzon, P. D., & Aysu, A. (2020, November 17). IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 6, pp. 1–1.
2020 article
Application of Quantum Machine Learning to VLSI Placement
Turtletaub, I., Li, G., Ibrahim, M., & Franzon, P. (2020, November 16). PROCEEDINGS OF THE 2020 ACM/IEEE 2ND WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD '20).
2020 article
Asymmetric Transformer Design With Multiband Frequency Response for Simultaneous Power and Data Transfer
Zannat, N., & Franzon, P. D. (2020, February 28). IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 10, pp. 644–653.
2020 article
CTLE Adaptation Using Deep Learning in High- speed SerDes Link
Li, B., Jiao, B., Chou, C.-H., Mayder, R., & Franzon, P. (2020, June 1). 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), pp. 952–955.
2020 article
Design Rule Checking with a CNN Based Feature Extractor
Francisco, L., Lagare, T., Jain, A., Chaudhary, S., Kulkarni, M., Sardana, D., … Franzon, P. (2020, November 16). PROCEEDINGS OF THE 2020 ACM/IEEE 2ND WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD '20).
2020 article
Machine learning and hardware security
Regazzoni, F., Bhasin, S., Pour, A. A., Alshaer, I., Aydin, F., Aysu, A., … Yli-Mäyry, V. (2020, November 2). 2020 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER AIDED-DESIGN (ICCAD), Vol. 11.
2020 article
Multi-Fidelity Surrogate-Based Optimization for Electromagnetic Simulation Acceleration
Wang, Y., Franzon, P. D., Smart, D., & Swahn, B. (2020, July 7). ACM Transactions on Design Automation of Electronic Systems, Vol. 25.
2020 conference paper
Self Evolution Cascade Deep Learning for SerDes Adaptive Equalization
Proceedings of DesignCon 2020. Presented at the DesignCon, San Jose, CA.
2020 article
Self-Evolution Cascade Deep Learning Model for High-Speed Receiver Adaptation
Li, B., Jiao, B., Chou, C.-H., Mayder, R., & Franzon, P. (2020, May 5). IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 10, pp. 1043–1053.
2019 article proceedings
An Application Specific Processor Architecture with 3D Integration for Recurrent Neural Networks
2019 article proceedings
Estimating Pareto Optimum Fronts to Determine Knob Settings in Electronic Design Automation Tools
20th International Symposium on Quality Electronic Design (ISQED), 304–310.
2019 book
Handbook of 3D Integration: Design, Test, and Thermal Management
(P. D. Franzon, E. Jan Marinissen, & M. S. Bakir, Eds.).
2019 article proceedings
Improved Numerical Methodologies on Power System Dynamic Simulation Using GPU Implementation
2019 article proceedings
Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages
2019 International 3D Systems Integration Conference (3DIC), 1–3.
2018 article
3-D-DATE: A Circuit-Level Three-Dimensional DRAM Area, Timing, and Energy Model
Park, J. B., Davis, W. R., & Franzon, P. D. (2018, September 26). IEEE Transactions on Circuits and Systems I Regular Papers, Vol. 66, pp. 756–768.
2018 chapter
3D Integration: Technology and Design
In K. Sakuma (Ed.), 3D Integration in VLSI Circuits.
Ed(s): K. Sakuma
2018 article proceedings
Design of a Rectifier-Free Near-Threshold UHF Gen2 RFID Tag using Dual-Phase RF-only Logic
2018 article
Exploring the Tradeoffs of Application-Specific Processing
Schabel, J. C., & Franzon, P. D. (2018, June 25). IEEE Journal on Emerging and Selected Topics in Circuits and Systems, Vol. 8, pp. 531–542.
2018 article proceedings
Multi-ANN embedded system based on a custom 3D-DRAM
2018 article proceedings
RFIC IP Redesign and Reuse Through Surrogate Based Machine Learning Method
2017 journal article
Appliance Identification Algorithm for a Non-Intrusive Home Energy Monitor Using Cogent Confabulation
IEEE Transactions on Smart Grid, 10(1), 714–721.
2017 journal article
Corrections to “Crosstalk-Canceling Multimode Interconnect Using Transmitter Encoding”[ Aug 13 1562-1567]
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 25(5), 1792–1792.
2017 conference paper
H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor
2017 IEEE International Conference on Computer Design (ICCD), 145–152.
2017 article
On Using the Volatile Mem-Capacitive Effect of TiO2 Resistive Random Access Memory to Mimic the Synaptic Forgetting Process
Sarkar, B., Mills, S., Lee, B., Pitts, W. S., Misra, V., & Franzon, P. D. (2017, November 20). Journal of Electronic Materials, Vol. 47, pp. 994–997.
2016 conference paper
Design and ASIC acceleration of cortical algorithm for text recognition
2016 29th IEEE International System-on-Chip Conference (SOCC). Presented at the 2016 29th IEEE International System-on-Chip Conference (SOCC).
2016 conference paper
Design of a rectifier-free UHF Gen-2 compatible RFID Tag using RF-only logic
2016 IEEE International Conference on RFID (RFID). Presented at the 2016 IEEE International Conference on RFID (RFID).
2016 conference paper
Hardware implementation of Hierarchical Temporal Memory algorithm
2016 29th IEEE International System-on-Chip Conference (SOCC). Presented at the 2016 29th IEEE International System-on-Chip Conference (SOCC).
2016 conference paper
Machine learning in physical design
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS). Presented at the 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
2016 article
Multimode High-Density Link Design Methodology and Implementation
Yan, Z., Aygun, K., Braunisch, H., & Franzon, P. D. (2016, July 19). IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 6, pp. 1251–1260.
2016 conference paper
Novel packaging and thermal measurement for 3D heterogeneous stacks
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing, Raleigh, NC.
2016 conference paper
Physical design of a 3D-stacked heterogeneous multi-core processor
2016 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2016 IEEE International 3D Systems Integration Conference (3DIC), -San Francisco, CA.
2016 conference paper
Processor-in-memory support for artificial neural networks
2016 IEEE International Conference on Rebooting Computing (ICRC). Presented at the 2016 IEEE International Conference on Rebooting Computing (ICRC).
2016 conference paper
RDL and interposer design for DiRAM4 interfaces
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS). Presented at the 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
2016 conference paper
Thermal raman and IR measurement of heterogeneous integration stacks
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1505–1510.
2015 journal article
A Generally Applicable Calibration Algorithm for Digitally Reconfigurable Self-Healing RFICs
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 24(3), 1151–1164.
2015 article
A Multitier Study on Various Stacking Topologies of TSV-Based PDN Systems Using On-Chip Decoupling Capacitor Models
Charles, G., & Franzon, P. D. (2015, April 1). IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 5, pp. 541–550.
2015 conference paper
Characterization of the Mechanical Stress Impact on Device Electrical Performance in the CMOS and III-V HEMT/HBT Heterogeneous Integration Environment
Proceedings Gomactech 2015.
2015 conference paper
Characterization of the mechanical stress impact on device electrical performance in the CMOS and III–V HEMT/HBT heterogeneous integration environment
2015 International 3D Systems Integration Conference (3DIC). Presented at the 2015 International 3D Systems Integration Conference (3DIC).
2015 chapter
Chip Package Codesign
In L. Scheffer, L. Lavagno, & G. Martin (Eds.), The Handbook for EDA of Electronic Circuits (Second). CRC Press.
Ed(s): L. Scheffer, L. Lavagno & G. Martin
2015 conference paper
Computing in 3D
2015 IEEE Custom Integrated Circuits Conference (CICC). Presented at the 2015 IEEE Custom Integrated Circuits Conference - CICC 2015.
2015 conference paper
Computing in 3D
2015 International 3D Systems Integration Conference (3DIC). Presented at the 10.1109/3DIC.2015.7334571, Sendai, Japan.
2015 conference paper
Computing in 3D
EDSSC. Presented at the EDSSC, Singapore.
2015 conference paper
Defense Applications of 3DIC
Proceedings Gomactech 2015.
2015 chapter
Optimization for Self-Calibrating Circuits
In Semiconductor Devices in Harsh Conditions. CRC.
2015 conference paper
Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks
2015 International 3D Systems Integration Conference (3DIC), 1–3.
2014 conference paper
3D-enabled customizable embedded computer (3DECC)
2014 International 3D Systems Integration Conference (3DIC). Presented at the 2014 International 3D Systems Integration Conference (3DIC).
2014 conference paper
A 0.65 mW/Gbps 30 Gbps capacitive coupled 10 mm serial link in 2.5D silicon interposer
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems. Presented at the 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS).
2014 journal article
A Generic and Scalable Architecture for a Large Acoustic Model and Large Vocabulary Speech Recognition Accelerator Using Logic on Memory
Bapat, O. A., Franzon, P. D., & Fastow, R. M. (2014, January 31). IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Vol. 22, pp. 2701–2712.
2014 article
Adaptive and Reliable Clock Distribution Design for 3-D Integrated Circuits
Chen, X., Zhu, T., Davis, W. R., & Franzon, P. (2014, October 20). IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 4, pp. 1862–1870.
2014 conference paper
Advances in TSVs and 3D interconnects
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems. Presented at the 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS).
2014 article
Dual Floating Gate Unified Memory MOSFET With Simultaneous Dynamic and Non-Volatile Operation
Sarkar, B., Ramanan, N., Jayanti, S., Spigna, N. D., Lee, B., Franzon, P., & Misra, V. (2014, January 1). IEEE Electron Device Letters, Vol. 35, pp. 48–50.
2014 conference paper
Leveraging 3D-IC for on-chip timing uncertainty measurements
2014 International 3D Systems Integration Conference (3DIC). Presented at the 2014 International 3D Systems Integration Conference (3DIC).
2014 article
Millimeter-Scale True 3-D Antenna-in-Package Structures for Near-Field Power Transfer
Gadfort, P., & Franzon, P. D. (2014, September 10). IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 4, pp. 1574–1581.
2014 conference paper
Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC
2014 IEEE International Conference on IC Design & Technology. Presented at the 2014 IEEE International Conference on IC Design & Technology (ICICDT).
2014 chapter
Storage Class Memories
In A. Chen, J. Hutchby, V. Zhrinov, & G. Bourianoff (Eds.), Emerging Nanoelectronic Devices. Wiley.
Ed(s): A. Chen, J. Hutchby, V. Zhrinov & G. Bourianoff
2014 article
Thermal Pathfinding for 3-D ICs
Priyadarshi, S., Davis, W. R., Steer, M. B., & Franzon, P. D. (2014, May 21). IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 4, pp. 1159–1168.
2014 conference paper
Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits
2014 International 3D Systems Integration Conference (3DIC). Presented at the 2014 International 3D Systems Integration Conference (3DIC).
2013 article
A Bounded and Discretized Nelder-Mead Algorithm Suitable for RFIC Calibration
Wyers, E. J., Steer, M. B., Kelley, C. T., & Franzon, P. D. (2013, June 11). IEEE Transactions on Circuits and Systems I Regular Papers, Vol. 60, pp. 1787–1799.
2013 article
A compact inductively coupled connector for mobile devices
Zhao, W., Gadfort, P., Erickson, E., & Franzon, P. D. (2013, May 1). 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), pp. 2385–2390.
2013 conference paper
Applications and design styles for 3DIC
2013 IEEE International Electron Devices Meeting. Presented at the 2013 IEEE International Electron Devices Meeting, Washington, DC.
2013 article
Circuit/channel co-design methodology for multimode signaling
Yan, Z., Franzon, P. D., Aygun, K., & Braunisch, H. (2013, May 1). 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), pp. 1356–1361.
2013 article
Crosstalk-Canceling Multimode Interconnect Using Transmitter Encoding
Kim, H. S., Won, C., & Franzon, P. D. (2013, February 5). IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Vol. 21, pp. 1562–1567.
2013 conference paper
Design and test of 2.5D and 3D stacked ICs
2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems. Presented at the 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
2013 article
Design of 60 GHz contactless probe system for RDL in passive silicon interposer
Suh, E. J., & Franzon, P. D. (2013, October 1). 2013 Ieee International 3d Systems Integration Conference (3dic).
2013 conference paper
Design of controller for L2 cache mapped in Tezzaron stacked DRAM
2013 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA.
2013 conference paper
Exploring early design tradeoffs in 3DIC
2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549.
2013 article
Face-to-face bus design with built-in self-test in 3D ICs
Zhang, Z., Noia, B., Chakrabarty, K., & Franzon, P. (2013, October 1).
2013 conference paper
Hetero(2) 3d integration: A scheme for optimizing efficiency/cost of chip multiprocessors
Proceedings of the fourteenth international symposium on quality electronic design (ISQED 2013), 1–7.
2013 article
Investigation of intermediate dielectric for dual floating gate MOSFET
Sarkar, B., Jayanti, S., Spigna, N. D., Lee, B., Misra, V., & Franzon, P. (2013, August 1). 2013 13th Non-Volatile Memory Technology Symposium (NVMTS).
2013 article
MOOCs, OOCs, flips and hybrids: The new world of higher education
Franzon, P. D. (2013, June 1). Proceedings Ieee International Conference on Microelectronic Systems, pp. 13–13.
2013 chapter book
Model-Based Variation-Aware Integrated Circuit Design
2013 article
Power comparison of 2D, 3D and 2.5D interconnect solutions and power optimization of interposer interconnects
Karim, M. A., Franzon, P. D., & Kumar, A. (2013, May 1). 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), pp. 860–866.
2013 conference paper
Rationale for a 3D heterogeneous multi-core processor
2013 IEEE 31st International Conference on Computer Design (ICCD), 154–168.
2013 chapter
Simulation and Experimental Characterization of a Unified Memory Device with Two Floating-Gates
In VLSI-SoC: From Algorithms to Circuits and System-on-Chip Design (pp. 217–233).
2013 article
TSV-based, modular and collision detectable face-to-back shared bus design
Zhang, Z., & Franzon, P. (2013, October 1).
2013 conference paper
Thermal requirements in future 3D processors
2013 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2013 IEEE International 3D Systems Integration Conference (3DIC).
2012 article
A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration
Thorolfsson, T., Lipa, S., & Franzon, P. D. (2012, September 1). 2012 Ieee Custom Integrated Circuits Conference (Cicc).
2012 article
A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits
Harris, T. R., Priyadarshi, S., Melamed, S., Ortega, C., Manohar, R., Dooley, S. R., … al. (2012, January 12). IEEE Transactions on Components Packaging and Manufacturing Technology, p. 1.
2012 journal article
A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits
IEEE Trans CPMT, P(99), 1.
2012 article
A compact dielectric elastomer tubular actuator for refreshable Braille displays
Chakraborti, P., Toprakci, H. A. K., Yang, P., Spigna, N. D., Franzon, P., & Ghosh, T. (2012, February 25). Sensors and Actuators A Physical, Vol. 179, pp. 151–157.
2012 conference paper
A novel double floating-gate unified memory device
2012 IEEE/IFIP 20th International Conference on VLSI and System-on-Chip (VLSI-SoC). Presented at the 2012 IEEE/IFIP 20th International Conference on VLSI and System-on-Chip (VLSI-SoC).
2012 article
An analysis of subthreshold SRAM bitcells for operation in low power RF-only technologies
Ledford, J., Gadfort, P., & Franzon, P. D. (2012, October 1). 2012 IEEE Subthreshold Microelectronics Conference (SUBVT).
2012 article
Comparison of TSV-based PDN-design effects using various stacking topology methods
Charles, G., & Franzon, P. D. (2012, October 1). Ieee Conference on Electrical Performance of Electronic Packaging And, pp. 83–86.
2012 conference paper
Coordinating 3D designs: Interface IP, standards or free form?
2011 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan.
2012 journal article
Demystifying Surrogate Modeling for Circuits and Systems
IEEE Circuits and Systems Magazine, 12(1), 45–63.
2012 article
Design, modeling, and fabrication of mm<sup>3</sup> three-dimensional integrated antennas
Gadfort, P., & Franzon, P. D. (2012, May 1). 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC), pp. 1794–1799.
2012 journal article
Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels
IET Circuits, Devices & Systems, 6(1), 35.
2012 article
Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring
Melamed, S., Thorolfsson, T., Harris, T. R., Priyadarshi, S., Franzon, P., Steer, M. B., & Davis, W. R. (2012, April 20). IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 31, pp. 676–689.
2012 article
Near threshold RF-only analog to digital converter
Gadfort, P., & Franzon, P. D. (2012, October 1). 2012 IEEE Subthreshold Microelectronics Conference (SUBVT).
2012 article
Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning
Priyadarshi, S., Saunders, C. S., Kriplani, N. M., Demircioglu, H., Davis, W. R., Franzon, P. D., & Steer, M. B. (2012, September 15). IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 31, pp. 1522–1535.
2012 conference paper
Pathfinder 3D: A flow for system-level design space exploration
Pathfinder 3D: A Flow for System-Level Design Space Exploration. 2011 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan.
2012 article
Process mismatch analysis based on reduced-order models
Yelten, M. B., Franzon, P. D., & Steer, M. B. (2012, March 1). 2012 13th International Symposium on Quality Electronic Design (Isqed), pp. 648–655.
2012 article
S-parameter based multimode signaling
Yan, Z., Won, C., Franzon, P. D., Aygun, K., & Braunisch, H. (2012, October 1). Ieee Conference on Electrical Performance of Electronic Packaging And, pp. 11–14.
2012 journal article
Surrogate Model-Based Self-Calibrated Design for Process and Temperature Compensation in Analog/RF Circuits
IEEE Design Test of Computers, 29(6), 74–83.
2012 article
Variation-Aware Circuit Macromodeling and Design Based on Surrogate Models
Zhu, T., Yelten, M. B., Steer, M. B., & Franzon, P. D. (2012, October 11). Advances in Intelligent Systems and Computing, Vol. 197, pp. 255–269.
2011 conference paper
3D specific systems design and CAD
2011 International Conference on Embedded Computer Systems: Architectures, Modeling and Simulation. Presented at the 2011 International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XI).
2011 conference paper
3D specific systems: Design and CAD
2011 Asian Test Symposium, 470–473.
2011 article
Accurate and Scalable IO Buffer Macromodel Based on Surrogate Modeling
Zhu, T., Steer, M. B., & Franzon, P. D. (2011, July 20). IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 1, pp. 1240–1249.
2011 conference paper
Adaptive clock distribution for 3D integrated circuits
2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, 91–94.
2011 article
Analog Negative-Bias-Temperature-Instability Monitoring Circuit
Yelten, M. B., Franzon, P. D., & Steer, M. B. (2011, December 5). IEEE Transactions on Device and Materials Reliability, Vol. 12, pp. 177–179.
2011 article
Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1<sup>st</sup>-Droop and resonant noise in 3DIC
Charles, G., Franzon, P. D., Kim, J., & Levin, A. (2011, October 1). Ieee Conference on Electrical Performance of Electronic Packaging And, pp. 267–270.
2011 article
Comparing Through-Silicon-Via (TSV) Void/Pinhole Defect Self-Test Methods
Lou, Y., Yan, Z., Zhang, F., & Franzon, P. D. (2011, November 2). Journal of Electronic Testing, Vol. 28, pp. 27–38.
2011 article
Comparison of modeling techniques in circuit variability analysis
Yelten, M. B., Franzon, P. D., & Steer, M. B. (2011, November 2). International Journal of Numerical Modelling Electronic Networks Devices and Fields, Vol. 25, pp. 288–302.
2011 conference paper
Design strategies for processor, chip/package co-design (M-VI)
2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems. Presented at the 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
2011 article
Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor
Thorolfsson, T., Moezzi-Madani, N., & Franzon, P. D. (2011, May 9). IET Computers & Digital Techniques, Vol. 5, pp. 198–204.
2011 article
SPICE-compatible physical model of nanocrystal floating gate devices for circuit simulation
Schinke, D., Priyadarshi, S., Pitts, W. S., Spigna, N. D., & Franzon, P. (2011, November 18). IET Circuits Devices & Systems, Vol. 5, pp. 477–483.
2011 journal article
Surrogate Model-Based Analysis of Analog Circuits – Part I. Variability Analysis
IEEE Transactions on Device and Materials Reliability, PP(99).
2010 conference paper
A zero power consumption Multi-Capacitor structure for voltage summing in high-speed FFE
19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems. Presented at the 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
2010 article
Computing with Novel Floating-Gate Devices
Schinke, D., Spigna, N. D., Shiveshwarkar, M., & Franzon, P. (2010, December 23). Computer, Vol. 44, pp. 29–36.
2010 conference paper
Creating 3D specific systems: Architecture, design and CAD
Creating 3D Specific Systems: Architecture, Design, and CAD. 2010 Design, Automation & Test in Europe Conference & Exhibition, 1684–1688.
2010 conference paper
Logic-on-logic 3D integration and placement
2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).
2010 article
Multimode transceiver for high-density interconnects: Measurement and validation
Choi, Y., Braunisch, H., Aygun, K., & Franzon, P. D. (2010, June 1). 2010 Proceedings 60th Electronic Components and Technology Conference (Ectc), pp. 1733–1738.
2010 conference paper
The NCSU Tezzaron design kit
2010 IEEE International 3D Systems Integration Conference (3DIC), 1–15.
2010 article
The integration of novel EAP-based Braille cells for use in a refreshable tactile display
Spigna, N. D., Chakraborti, P., Winick, D., Yang, P., Ghosh, T., & Franzon, P. (2010, March 25). Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE, Vol. 7642.
2010 conference paper
Thermal Investigatoin of Tier Swapping to Improve the Thermal Profile of Memory-on-Logic 3DICs
IEEE THERMINIC, 1–6.
2010 conference paper
Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications
2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).
2009 journal article
A 32-Gb/s On-Chip Bus With Driver Pre-Emphasis Signaling
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(9), 1267–1274.
2009 article
A low power 3D integrated FFT engine using hypercube memory division
Thorolfsson, T., Moezzi-Madani, N., & Franzon, P. D. (2009, August 19). ISLPED 09, pp. 231–236.
2009 article
An enhanced macromodeling approach for differential output drivers
Zhu, N. T., & Franzon, P. D. (2009, September 1). BMAS 2009: Proceedings of the 2009 IEEE International Behavioral Modeling and Simulation Workshop, pp. 54–59.
2009 article
Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies
Davis, W. R., Oh, E. C., Sule, A. M., & Franzon, P. D. (2009, March 19). IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Vol. 17, pp. 496–506.
2009 conference paper
Application of EAP materials toward a refreshable Braille display
In Y. Bar-Cohen & T. Wallmersperger (Eds.), Electroactive Polymer Actuators and Devices (EAPAD) 2009.
Ed(s): Y. Bar-Cohen & T. Wallmersperger
2009 article
Application of surrogate modeling to generate compact and PVT-sensitive IBIS models
Zhu, T., & Franzon, P. D. (2009, October 1). Electrical Performance of Electronic Packaging and Systems, pp. 77–80.
2009 conference paper
CAD and Design Application Exploration of 3DICs
Proceedings 2008 Gomactech.
2009 article
Controllable Molecular Modulation of Conductivity in Silicon-Based Devices
He, T., Corley, D. A., Lu, M., Spigna, N. H. D., He, J., Nackashi, D. P., … Tour, J. M. (2009, July 1). Journal of the American Chemical Society, Vol. 131, pp. 10023–10030.
2009 conference paper
CryptoFSM – Securing chips against reverse engineering
Proceedings 2008 Gomactech.
2009 conference paper
Design Automation of a 3DIC FFT Processor, for Synthetic Aperture Radar: A case study
Proceedings ACM/IEEE DAC 2009, 51–56.
2009 conference paper
Junction-level thermal extraction and simulation of 3DICs
2009 IEEE International Conference on 3d Systems Integration, 395–401.
2009 article
Low-power self-equalizing driver for silicon carrier interconnects with low bit error rate
Gadfort, P., & Franzon, P. D. (2009, October 1). Electrical Performance of Electronic Packaging and Systems, pp. 37–40.
2009 article
Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors
Erickson, E., Wilson, J., Chandrasekar, K., & Franzon, P. D. (2009, October 1). Electrical Performance of Electronic Packaging and Systems, pp. 121–124.
2009 article
Overview of RFID Technology and Its Applications in the Food Industry
Kumar, P., Reinitz, H. W., Simunovic, J., Sandeep, K. P., & Franzon, P. D. (2009, September 11). Journal of Food Science, Vol. 74, pp. R101–106.
2009 chapter
Use of AC Coupled Interconnect in Contactless Packaging
In R. Ho (Ed.), Coupled Data Communications. Springer-Verlag.
Ed(s): R. Ho
2008 conference paper
AC coupled backplane communication using embedded capacitor
2008 IEEE-EPEP Electrical Performance of Electronic Packaging. Presented at the 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP).
2008 conference paper
An 8192-point fast fourier transform 3D-IC case study
An 8192-point Fast Fourier Transform 3D-IC Case Study. 2008 51st Midwest Symposium on Circuits and Systems, 438–441.
2008 conference paper
Analysis of inter-bundle crosstalk in multimode signaling for high-density interconnects
2008 58th Electronic Components and Technology Conference. Presented at the 2008 58th Electronic Components and Technology Conference (ECTC 2008).
2008 conference paper
Application Specific Integrated Circuit Verification: An Illustration Based Approach
IEEE MSE.
2008 conference paper
Application and Design Exploration for 3D Integrated Circuits
VLSI Multi-level Interconnect Conference.
2008 conference paper
Autonomous Vision Processing and 3D Scene Reconstruction
GOMACTECH.
2008 conference paper
Computer-Aided Design and Application Exploration for 3D Integrated Circuits
GOMACTECH.
2008 conference paper
Design and CAD for 3D integrated circuits
Design and CAD for 3D Integrated Circuits. DAC '08: Proceedings of the 45th annual Design Automation Conference, 668–673.
2008 chapter
Design for 3-D Integration
In P. Garrou, P. Ramm, & C. Bower (Eds.), 3-D IC Integration: Technology and Applications. Wiley VCH.
Ed(s): P. Garrou, P. Ramm & C. Bower
2008 article
Editorial
Xie, Y., Cong, J., & Franzon, P. (2008, October 1). ACM Journal on Emerging Technologies in Computing Systems, Vol. 4.
2008 conference paper
Extreme Temperature Invariant Circuitry Through Adaptive Body Biasing
GOMACTECH.
2008 article
Foreword Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance Applications
Canavero, F., & Franzon, P. D. (2008, November 1). IEEE Transactions on Advanced Packaging, Vol. 31, pp. 662–663.
2008 article
Improving Behavioral IO Buffer Modeling Based on IBIS
Varma, A. K., Steer, M., & Franzon, P. D. (2008, November 1). IEEE Transactions on Advanced Packaging, Vol. 31, pp. 711–721.
2008 article
Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling
Chandrasekar, K., Wilson, J., Erickson, E., Feng, Z., Xu, J., Mick, S., & Franzon, P. (2008, November 1). IEEE Transactions on Advanced Packaging, Vol. 31, pp. 749–758.
2008 conference paper
Keeping hot chips cool
Proceedings of the 45th annual conference on Design automation - DAC '08. Presented at the the 45th annual conference.
2008 conference paper
Memory rich applications for 3D integration
In S. F. Al-Sarawi, V. K. Varadan, N. Weste, & K. Kalantar-Zadeh (Eds.), Smart Structures, Devices, and Systems IV.
Ed(s): S. Al-Sarawi, V. Varadan, N. Weste & K. Kalantar-Zadeh
2008 conference paper
Multimode signaling on non-ideal channels
2008 IEEE-EPEP Electrical Performance of Electronic Packaging, 51–54.
2008 article
Reversible Modulation of Conductance in Silicon Devices via UV/Visible‐Light Irradiation
He, T., Lu, M., Yao, J., He, J., Chen, B., Spigna, N. H. D., … Tour, J. M. (2008, October 20). Advanced Materials, Vol. 20, pp. 4541–4546.
2007 conference paper
Application and Design Exploration for 3D Integrated Circuits
VLSI Multi-level Interconnect Conference.
2007 conference paper
Design Considerations and Benefits of Three-Dimensional Ternary Content Addressable Memory
2007 IEEE Custom Integrated Circuits Conference. Presented at the 2007 IEEE 29th Custom Integrated Circuits Conference.
2007 conference paper
Design for 3D Integration and Applications
2007 International Symposium on Signals, Systems and Electronics, 263–266,
2007 article
Electronic Properties of Molecular Memory Circuits on a Nanoscale Scaffold
Blum, A. S., Soto, C. M., Wilson, C. D., Amsinck, C., Franzon, P., & Ratna, B. R. (2007, December 1). IEEE Transactions on NanoBioscience, Vol. 6, pp. 270–274.
2007 conference paper
Flexible Low Power Probability Density Estimation Unit For Speech Recognition
2007 IEEE International Symposium on Circuits and Systems. Presented at the 2007 IEEE International Symposium on Circuits and Systems.
2007 conference paper
FreePDK: An Open-Source Variation-Aware Design Kit
2007 IEEE International Conference on Microelectronic Systems Education (MSE'07). Presented at the 2007 IEEE International Conference on Microelectronic Systems Education (MSE'07), San Diego, CA.
2007 article
Fully Integrated AC Coupled Interconnect Using Buried Bumps
Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007, May 1). IEEE Transactions on Advanced Packaging, Vol. 30, pp. 191–199.
2007 conference paper
Hardware Architecture of a Parallel Pattern Matching Engine
2007 IEEE International Symposium on Circuits and Systems. Presented at the 2007 IEEE International Symposium on Circuits and Systems.
2007 conference paper
Molecular Electronics
2nd IEEE International Workshop on advances in sensors and interfaces.
2007 chapter
Molecular Electronics – Devices and Circuits Technology
In Vlsi-Soc: From Systems To Silicon. Springer Boston.
2007 article
SOI CMOS Implementation of a Multirate PSK Demodulator for Space Communications
Yuce, M. R., Liu, W., Damiano, J., Bharath, B., Franzon, P. D., & Dogan, N. S. (2007, February 1). IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications, Vol. 54, pp. 420–431.
2007 conference paper
System Design for 3D Multi-FPGA Packaging
2007 IEEE Electrical Performance of Electronic Packaging. Presented at the 2007 IEEE Electrical Performance of Electronic Packaging.
2007 conference paper
System level Validation of Improved IO Buffer Behavioral Modeling Methodology Based on IBIS
2007 IEEE Electrical Performance of Electronic Packaging. Presented at the 2007 IEEE Electrical Performance of Electronic Packaging.
2007 article
Uniformity analysis of wafer scale sub-25nm wide nanowire array nanoimprint mold fabricated by PEDAL process
Sonkusale, S. R., Spigna, N. H. D., & Franzon, P. D. (2007, February 10). Microelectronic Engineering, Vol. 84, pp. 1523–1527.
2007 article
Voltage-Mode Driver Preemphasis Technique For On-Chip Global Buses
Zhang, L., Wilson, J. M., Bashirullah, R., Luo, L., Xu, J., & Franzon, P. D. (2007, February 1). IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Vol. 15, pp. 231–236.
2006 conference paper
A 32Gb/s On-chip Bus with Driver Pre-emphasis Signaling
IEEE Custom Integrated Circuits Conference 2006. Presented at the Proceedings of the IEEE 2006 Custom Integrated Circuits Conference.
2006 conference paper
A 36Gb/s ACCI Multi-Channel Bus using a Fully Differential Pulse Receiver
IEEE Custom Integrated Circuits Conference 2006. Presented at the IEEE Custom Integrated Circuits Conference 2006.
2006 conference paper
AC Coupled Interconnect using Buried Bumps for Laminated Organic Packages
Proceedings Electronic Components and Technology, ECTC.
2006 conference paper
Architecture for Low Power Large Vocabulary Speech Recognition
2006 IEEE International SOC Conference. Presented at the 2006 IEEE International SOC Conference.
2006 conference paper
Considerations for Transmission Line Design on MCMs using AC Coupled Interconnect with Buried Solder Bumps
2006 IEEE Workship on Signal Propagation on Interconnects. Presented at the 2006 IEEE Workshop on Signal Propagation on Interconnects.
2006 article
Controlled Modulation of Conductance in Silicon Devices by Molecular Monolayers
He, T., He, J. L., Lu, M., Chen, B., Pang, H., Reus, W. F., … al. (2006, October 25). Journal of the American Chemical Society, Vol. 128, pp. 14537–14541.
2006 conference paper
Controlled nanowire fabrication by PEDAL process
2006 1st International Conference on Nano-Networks and Workshops. Presented at the 2006 1st International Conference on Nano-Networks and Workshops.
2006 article
Deterministic nanowire fanout and interconnect without any critical translational alignment
Spigna, N. H. D., Nackashi, D. P., Amsinck, C. J., Sonkusale, S. R., & Franzon, P. D. (2006, July 1). IEEE Transactions on Nanotechnology, Vol. 5, pp. 356–361.
2006 conference paper
Developing Improved IO Buffer Behavioral Modeling Methodology Based on IBIS
2006 IEEE Electrical Performane of Electronic Packaging. Presented at the 2006 IEEE Electrical Performane of Electronic Packaging.
2006 conference paper
Differential current-mode signaling for robust and power efficient on-chip global interconnects
IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. Presented at the IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.
2006 conference paper
Fine Pitch Inductively Coupled Connectors for Multi-Gbps Pulse Signaling
2006 IEEE Electrical Performane of Electronic Packaging. Presented at the 2006 IEEE Electrical Performane of Electronic Packaging.
2006 conference paper
High-Frequency Characterization of Printed CPW Lines on Textiles using a Custom Test Fixture
2006 IEEE Workship on Signal Propagation on Interconnects. Presented at the 2006 IEEE Workship on Signal Propagation on Interconnects.
2006 conference paper
Impact of SOI research Project on microelectronics education: a case study
Proceedings of the IEEE International Conference on Microelectronics systems education, 33–34.
2006 article
Physically based molecular device model in a transient circuit simulator
Kriplani, N. M., Nackashi, D. P., Amsinck, C. J., Spigna, N. H. D., Steer, M. B., Franzon, P. D., … Reimers, J. R. (2006, March 10). Chemical Physics, Vol. 326, pp. 188–196.
2006 conference paper
Pulse Signaling in Inductively Coupled Sockets and Connectors
SRC Student Symposium.
2006 conference paper
Sensors on textile substrates for home-based healthcare monitoring
Sensors on Textile Substrates for Home-Based Healthcare Monitoring. 1st Transdisciplinary Conference on Distributed Diagnosis and Home Healthcare, 2006. D2H2., 5–7.
2006 conference paper
Signal integrity and robustness of ACCI packaged systems
IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. Presented at the IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.
2006 conference paper
TCAM core design in 3D IC for low matchline capacitance and low power
In S. F. Al-Sarawi (Ed.), Smart Structures, Devices, and Systems III.
Ed(s): S. Al-Sarawi
2005 conference paper
2.8 Gb/s Inductively Coupled Interconnect for 3-D ICs
Japan VLSI Symposium.
2005 conference paper
2.8 Gbps inductively coupled interconnect for 3D ICs
Proceedings of the 2005 symposium on VLSI circuits, 352–355.
2005 journal article
3 Gb/s AC Coupled Chip-to-Chip Communication Using a Low Swing Pulse Receiver
IEEE Journal of Solid-State Circuits, 41(1), 287–296.
2005 conference paper
3Gb/s AC-coupled chip-to-chip communication using a low-swing pulse receiver
Proceedings of the 2005 International Solid State Circuits Conference. Presented at the 2005 International Solid State Circuits Conference, San Francisco, CA, USA.
2005 article
A tunable combline bandpass filter using barium strontium titanate interdigital varactors on an alumina substrate
Nath, J., Fathelbab, W., Franzon, P. D., Kingon, A. I., Ghosh, D., Maria, J.-P., & Steer, M. B. (2005, January 1). IEEE MTT-S International Microwave Symposium Digest, 2005., pp. 595–598.
2005 conference paper
AC Coupled Interconnect for Dense 3-D Systems
Proceedings of the IEEE Conference on Nuclear Science and Imaging. Presented at the 2003 IEEE Nuclear Science Symposium Conference, Portland, OR, USA.
2005 journal article
An Engineered Virus as a Scaffold for Three-Dimensional Self-Assembly on the Nanoscale
Small, 1(7), 702–706.
2005 article
An electronically tunable microstrip bandpass filter using thin-film Barium-Strontium-Titanate (BST) varactors
Nath, J., Ghosh, D., Maria, J.-P., Kingon, A. I., Fathelbab, W., Franzon, P. D., & Steer, M. B. (2005, September 1). IEEE Transactions on Microwave Theory and Techniques, Vol. 53, pp. 2707–2712.
2005 conference paper
An integrated self-masking technique for providing low-loss metallized RF MEMS devices in a polysilicon only MEMS process
Proceedings of the SPIE Micro Europe. Presented at the SPIE Micro Europe, Sevilla, Spain.
2005 conference paper
Automating Design for Signal Integrity
Proceedings 1992 IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 10–13.
2005 journal article
CAD Flows for Chip-Package CoVerification
IEEE Transactions on Advanced Packaging, 28(1), 194–202.
2005 article
CAD flows for chip-package coverification
Varma, A. K., Glaser, A., & Franzon, P. D. (2005, February 1). IEEE Transactions on Advanced Packaging, Vol. 28, pp. 194–202.
2005 chapter
Chip-Package Codesign
In L. Scheffer, L. Lavagno, & G. Martin (Eds.), The Handbook for EDA of Electronic Circuits. CRC Press.
Ed(s): L. Scheffer, L. Lavagno & G. Martin
2005 journal article
Configurable String Matching Hardware for Speeding Up Intrusion Detection
Aldwairi, M., Conte, T., & Franzon, P. (2005, March 1). Configurable string matching hardware for speeding up intrusion detection. ACM SIGARCH Computer Architecture News, Vol. 33, pp. 99–107.
2005 journal article
Cover Picture: An Engineered Virus as a Scaffold for Three-Dimensional Self-Assembly on the Nanoscale (Small 7/2005)
Small, 1(7), 669–669.
2005 journal article
Cover Picture: An Engineered Virus as a Scaffold for Three-Dimensional Self-Assembly on the Nanoscale (Small 7/2005)
Small, 1(7), 669–669.
2005 article
Demystifying 3D ICs: The Pros and Cons of Going Vertical
Davis, W. R., Wilson, J., Mick, S., Xu, J., Hua, H., Mineo, C., … Franzon, P. D. (2005, June 1). IEEE Design & Test of Computers, Vol. 22, pp. 498–510.
2005 conference paper
Differential current mode signalling for robust and power efficient on-chip global interconnect
Proceedings of EPEP, 315–318.
2005 conference paper
Drive circuit for a mode conversion rotary ultrasonic motor
31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005. Presented at the 31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005.
2005 conference paper
Driver pre-emphasis techniques for on-chip global buses
Proceedings of the 2005 international symposium on Low power electronics and design - ISLPED '05. Presented at the the 2005 international symposium.
2005 article
Fabrication of wafer scale, aligned sub-25nm nanowire and nanowire templates using planar edge defined alternate layer process
Sonkusale, S. R., Amsinck, C. J., Nackashi, D. P., Spigna, N. H. D., Barlage, D., Johnson, M., & Franzon, P. D. (2005, May 11). Physica E Low-Dimensional Systems and Nanostructures, Vol. 28, pp. 107–114.
2005 conference paper
Fabrication of wafer-scale, aligned Sub-25 nm nanowires and templates using Planar Edge Defined Alternate Layer (PEDAL) Process
Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show. Presented at the 2005 NSTI Nanotechnology Conference and Trade Show, Anaheim, CA.
2005 conference paper
Inductively Coupled Board to Board Connectors
ECTC’05, 1109–1113.
2005 conference paper
Inductively Coupled Board-to-Board Connectors
Proceedings Electronic Components and Technology, 2005. ECTC '05., 1109–1113.
2005 conference paper
Integrated dynamic body contact for H-gate PD-SOI MOSFETs for high performance/low power
2004 IEEE International SOI Conference (IEEE Cat. No.04CH37573). Presented at the 2004 IEEE International SOI Conference.
2005 conference paper
Microwave characterization of thin-film multi-chip module substrates and printed wiring boards accounting for frequency-dependent characteristic impedance
Proceedings of the IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 125–127.
2005 conference paper
Molecular electronic latches and memories
IEEE Nano, 819–822.
2005 conference paper
Molecular electronics – devices and circuits technology
Proceedings IFIP VLSI-SoC 2005, 57–63.
2005 journal article
Optimal chip-package codesign for high-performance DSP
IEEE Transactions on Advanced Packaging, 28(2), 288–297.
2005 conference paper
SSN issues with IBIS models
Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging, 87–90.
2005 article
Scaling constraints in nanoelectronic random-access memories
Amsinck, C. J., Spigna, N. H. D., Nackashi, D. P., & Franzon, P. D. (2005, August 26). Nanotechnology, Vol. 16, pp. 2251–2260.
2004 article
A "defect level versus cost" system tradeoff for electronics manufacturing
Scheffler, M., Franzon, P. D., & Troster, G. (2004, January 1). IEEE Transactions on Electronics Packaging Manufacturing, Vol. 27, pp. 67–76.
2004 conference paper
A configurable classification engine for polymorphous chip architecture
Proceedings of the ACM BEACON Workshop. Presented at the ACM BEACON Workshop, Boston, MA.
2004 conference paper
A low power PSK receiver for space applications in 0.35 µm CMOS
Proceedings of the IEEE Custom Integrated Circuits Conference, 155–158.
2004 article
AC coupled interconnect for dense 3-D ICs
Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October 1). IEEE Transactions on Nuclear Science, Vol. 51, pp. 2156–2160.
2004 conference paper
Binary Search Schemes for Fast IP Lookups
Proceedings of the IEEE Globecom, 2005–2009.
2004 article
Buried Bump and AC Coupled Interconnection Technology
Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February 1). IEEE Transactions on Advanced Packaging, Vol. 27, pp. 121–125.
2004 article
Causal Reduced-Order Modeling of Distributed Structures in a Transient Circuit Simulator
Mohan, R., Choi, M. J., Mick, S. E., Hart, F. P., Chandrasekar, K., Cangellaris, A. C., … Steer, M. B. (2004, September 1). IEEE Transactions on Microwave Theory and Techniques, Vol. 52, pp. 2207–2214.
2004 article
Chip-Package Co-Implementation of a Triple DES Processor
Schaffer, T., Glaser, A., & Franzon, P. D. (2004, February 1). IEEE Transactions on Advanced Packaging, Vol. 27, pp. 194–202.
2004 journal article
Clustering Effects on Discontinuous Gold Film NanoCells
Journal of Nanoscience and Nanotechnology, 4(7), 907–917.
2004 conference paper
Configureable String matching hardware for speeding up intrusion detection
ACM Workshop on secure networking. Presented at the Boston.
2004 conference paper
Integration for Molecular Electronics
Proceedings of the Conference on Foundations of NanoScience. Presented at the Snowbird, UT.
2004 conference paper
Low power logical element for FPGA fabric
Proceedings of the IEEE International Conference on Microelectronics, 55–57.
2004 article proceedings
Simplified delay design guidelines for on-chip global interconnects
2004 conference paper
Simplified delay design guidelines for on-chip global interconnects
Zhang, L., Liu, W., Bashirullah, R., Wilson, J., & Franzon, P. (2004, April). 29–32.
2004 conference paper
Simultaneous switching noise in IBIS models
Proceedings of the 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559), 3, 1000–1004.
2004 article
The Design and Characterization of a Novel Piezoelectric Transducer-Based Linear Motor
Palmer, J. A., Dessent, B., Mulling, J. F., Usher, T., Grant, E., Eischen, J. W., … Franzon, P. D. (2004, June 1). IEEE/ASME Transactions on Mechatronics, Vol. 9, pp. 392–398.
2004 conference paper
The Design, Fabrication and Characterization of Millimeter Scale Motors for Miniature Direct Drive Robots
The design, fabrication, and characterization of millimeter scale motors for miniature direct drive robots. IEEE International Conference on Robotics and Automation, 2004. Proceedings. ICRA '04. 2004, 4668–4673.
2004 conference paper
The performance and experimental results of a multiple bit rate symbol timing recovery circuit for PSK receivers
Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571), 591–594.
2003 conference paper
4 Gbps AC Coupled Interconnection
Proceedings of the IEEE Custom Integrated Circuits Conference, 133–140.
2003 conference paper
AC Coupled Interconnect for High-Density High-Bandwidth Packaging
Extended Abstracts of the 2003 International Conference on Solid State Devices and Materials, 67–69.
2003 conference paper
Buried solder bump connections for high- density capacitive coupling
Proceedings of the IEEE Electrical Performance of Electronic Packaging, 205–208.
2003 conference paper
CAD flows for chip-package codesign
Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging, 11–14.
2003 conference paper
High Frequency, High Density Interconnect Using AC Coupling
Fall MRS Conference. Presented at the Boston, MA.
2003 journal article
Improved delay prediction for on-chip buses
Proceedings of the 1999 Design Automation Conference, 497–501.
2003 conference paper
Infrastructure and course progression for complex IC design education
Proceedings of the 1999 IEEE International Conference on Microelectronic Systems Education (MSE'99) `Systems Education in the 21st Century' (Cat.No.99-63794), 88–89.
2003 conference paper
Introducing the through-line deembedding procedure
1992 IEEE MTT-S International Microwave Symposium Digest. Presented at the Albuquerque, NM, USA.
2003 article
Molecular electronics: from devices and interconnect to circuits and architecture
Stan, M. R., Franzon, P. D., Goldstein, S. C., Lach, J. C., & Ziegler, M. M. (2003, October 31). Proceedings of the IEEE, Vol. 91, pp. 1940–1957.
2003 article
NanoCell Electronic Memories
Tour, J. M., Cheng, L., Nackashi, D. P., Yao, Y., Flatt, A. K., Angelo, S. K. S., … Franzon, P. D. (2003, October 1). Journal of the American Chemical Society, Vol. 125, pp. 13279–13283.
2003 conference paper
Novel Hardware Implementation for Fast Address Lookups
Proceedings of 2002 Workshop on High Performance Switching and Routing. Presented at the 2002 Workshop on High Performance Switching and Routing, Kobe, Japan.
2003 conference paper
The development of a macro-modeling tool to develop IBIS models
Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging, 177–280.
2002 conference paper
A Low-cost, High Performance Three-Dimensional Memory Module
Proceedings of the IEEE Memory Technology, Design and Testing Workshop. Presented at the San Jose, CA, USA.
2002 conference paper
A Signal Integrity Advisor for Automated Packaging Design
Proceedings of the 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging. Presented at the Monterey, CA, USA.
2002 conference paper
Accurate experimental characterization of three-ports
Proceedings of the 1991 IEEE MTT-S International Microwave Symposium Digest. Presented at the Boston, MA, USA.
2002 conference paper
Automatic A-Priori Generation of Delay and Noise Macromodels and Wiring Rules for MCMs
Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93. Presented at the Santa Cruz, CA, USA.
2002 conference paper
Experimental Electrical Characterization of On-Chip Interconnects
Proceedings of the IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 57–59.
2002 conference paper
Experimental characterization of interconnects and discontinuities in thin-film multichip module substrates
Proceedings of the 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging. Presented at the 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, USA.
2002 conference paper
Flip-chip Power Distribution
Proceedings of the IEEE 7th Topical Meeting on the Electrical Performance of Electronic Packaging, 39–41.
2002 conference paper
Hierarchical simulation of high speed digital interconnects using a packaging simulator
1994 Proceedings. 44th Electronic Components and Technology Conference. Presented at the 1994 Proceedings. 44th Electronic Components and Technology Conference.
2002 conference paper
High Speed Digital System Simulation using Frequency Dependent Transmission Line Network Modeling
Proceedings of the 1991 IEEE MTT-S International Microwave Symposium Digest. Presented at the Boston, MA, USA.
2002 conference paper
High displacement piezoelectric actuators: characterization at high load with controlled end conditions
Proceedings of the 12th IEEE International Symposium on Applications of Ferroelectrics, 745–748.
2002 conference paper
Issues in Chip-Package Codesign with MCM-D/Flip-Chip Technology
Proceedings of the IEEE International Symposium on Chip-Package Codesign, 88–92.
2002 conference paper
Issues in Partitioning Integrated Circuits for MCM-D/Flip-Chip Technology
Proceedings of the 1996 IEEE MultiChip Module Conference. Presented at the Santa Cruz, CA, USA.
2002 conference paper
Leveraging high density packaging for high performance DSP systems
Proceedings of the IEEE Electrical Performance on Electronic Packaging, 25–28.
2002 conference paper
Macromodels for Generating Signal Integrity and Timing Management Advice for Package Design
Proceedings of the IEEE 1993 ECTC Conference, 523–529.
2002 article
Nanocell logic gates for molecular computing
Tour, J. M., Zandt, W. L. V., Husband, C. P., Husband, S. M., Wilson, L. S., Franzon, P. D., & Nackashi, D. P. (2002, June 1). IEEE Transactions on Nanotechnology, Vol. 1, pp. 100–109.
2002 conference paper
Network Processor Design for Optical Burst Switched Networks
Proceedings of the 14th Annual IEEE International ASIC/SOC Conference, 296–300.
2002 journal article
Novel hardware architecture for fast address lookups
IEEE Communications Magazine, 40(11), 66–71.
2002 conference paper
Packaging Technology for AC Coupled Interconnection
IMAPS Flip-Chip Conference.
2002 conference paper
Performance Evaluation of Micromechanical Binary Phase-Only Holographic Optical Elements
Proceedings of the IEEE Electronic Technology and Components Conference, 419–424.
2002 conference paper
Pin Assignment for High-Performance MCM Systems
Proceedings of the 1996 IEEE ISCAS Conference, 771–774.
2002 conference paper
Scalable Molecular Circuit Architectures
2002 Engineering Foundation Conference on Molecular Computing. Presented at the Key West.
2002 conference paper
Simulation vs. Calculation of Crosstalk
Proceedings of the IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 131–134.
2002 journal article
Single force measurements on 3D collagen matrix
Biophysical Journal, 82(1).
2002 conference paper
System Design Optimization for MCM
Proceedings of the 1995 IEEE MultiChip Module Conference. Presented at the Santa Cruz, CA, USA.
2001 conference paper
Design of rotating MEMS tunable capacitors for use at RF and Microwave frequencies
Proceedings of the SPIE International Symposium on Microelectronics and MEMS. Presented at the Adelaide, Australia.
2001 conference paper
Improving Interconnect Characteristics of Thin Film MEMS Processes
Proceedings of the SPIE International Symposium on Microelectronics and MEMS. Presented at the Adelaide, Australia.
2001 article
Load characterization of high displacement piezoelectric actuators with various end conditions
Mulling, J., Usher, T., Dessent, B., Palmer, J., Franzon, P., Grant, E., & Kingon, A. (2001, October 1). Sensors and Actuators A Physical, Vol. 94, pp. 19–24.
2001 conference paper
Moletronics: A circuit design perspective
Proceedings of the SPIE 4236, Smart Electronics and MEMS II, 4236, 80–88.
2001 conference paper
Multi-gigahertz low-power low-skew rotary clock scheme
Proceedings International Conference On Solid State Circuits, 400–401, 470.
2001 conference paper
Smart sensors to monitor warp tension and breaks on a loom
2001 conference paper
The Future of Molecular Electronics
Proceedings of the International Conference on Computer Aided Design of Integrated Circuits. Panel Session.
2000 conference paper
Application of micromachines to textiles: Using smart sensors to monitor warp tension and breaks during formation of woven fabrics
Proceedings of the International Mechanical Engineering Congress & Exposition, ASME, Orlando (FL), November 2000. New York: ASME.
2000 conference paper
Micromachines and textiles: Matching two industries
2000 journal article
Micromachines and textiles: Matching two industries
Textile Asia, 31, 58–66.
1999 conference paper
Accuracy Issues in Full-Chip Extraction
DAC 1999.
1999 conference paper
Design Automation and Design Challenges for Package/Systems
Proceedings of the IEEE Asia Design Automation Conference, 372.
1999 conference paper
Dynamically Programmable Cache, Evaluation and Virtualization
Proceedings ACM/SIGDA FPGA 99, 246.
1999 article
High frequency loss and electromagnetic field distribution for striplines and microstrips [MCM packages]
Lo, H. L., Kauffman, J. F., & Franzon, P. D. (1999, January 1). IEEE Transactions on Advanced Packaging, Vol. 22, pp. 16–25.
1999 conference paper
MEMS-based switches for Digital and RF Switching
Proceedings Advanced Research in VLSI, 369–377.
1999 conference paper
Methodology for Design of Electrostatic MEMS Devices Using the SUMMiT Process
Proceedings of the 45th International Instrumentation Symposium, 511–520.
1999 conference paper
Programmable MEMS Capacitor Arrays
Proceedings SPIE International Symposium on Microelectronics and Micromechanical Systems.
1999 conference paper
Three Dimensional MCM Package Assembly and Analysis
Proceedings of the IEEE/IMAPS Conference on High Density Packaging and MCMS, 188–192.
1998 article
A review of 3-D packaging technology
Al-Sarawi, S. F., Abbott, D., & Franzon, P. D. (1998, January 1). IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Vol. 21, pp. 2–14.
1998 conference paper
Accurate Lumped-Parameter modeling for dynamic simulation of electrostatic MEMS Actuators
Proceedings International Workshop on Modeling of MEMS Systems.
1998 conference paper
Dynamically Programmable Cache
Proceedings of the SPIE Conference on Reconfigurable Computing, 218–226.
1998 conference paper
MEMS-based diffractive optical beam steering system
Proceedings SPIE 3276, Miniaturized Systems with Micro-Optics and Micromechanics III, 3276, 81–87.
1998 conference paper
Power Reduction by low activity datapath design and SRAM energy models
Proceedings Workshop on Low Power Techniques, ISCA98.
1998 conference paper
The NCSU Design Kit for IC Fabrication Through MOSIS
Proceedings 1998 International Cadence User Group Conference, 71–80.
1997 conference paper
An accurate, computationally efficient crosstalk model for routing high-speed MCMs
Proceedings ASIC Conference and Exhibit, 110–114.
1997 article
Clocking Optimization and Distribution in Digital Systems with Scheduled Skews
Hsieh, H.-Y., Liu, W., Franzon, P., & Cavin, R., III. (1997, June 1). The Journal of VLSI Signal Processing Systems for Signal Image and Video Technology, Vol. 16, pp. 131–147.
1997 journal article
Clocking Optimization and Distribution of Digital Systems with Scheduled Skews
International Journal of VLSI Signal Processing, 16, 19–36.
1997 conference paper
Low Power Data Processing by Elimination of Redundant Computations
Proceedings 1997 International Symposium on Low Power Electronics and Design, 259–264.
1997 conference paper
MCM Implementation of a Data Encryption Standard (DES) Processor
Proceedings of the 1997 IEEE MCM Conference, 13–17.
1997 conference paper
MIDAS Flip-Chip Service
Proceedings of the 1997 IEEE MCM Conference, 133–135.
1997 conference paper
Thermal/mechanical analysis and design of three dimensional high density MCM package
Proceedings of the Next Generation Package Design Workshop.
1996 conference paper
Computer Design Strategy for MCM-D/Flip-Chip Technology
Proceedings of the 1996 Topical Meeting on Electrical Performance of Electronic Packaging, 6–8.
1996 conference paper
Computer Design Strategy for MCM-D/Flip-Chip Technology
Proceedings of the 1996 ASIC Conference, 35–39.
1996 journal article
Experimental Characterization of Transmission Lines in Thin-Film Multichip Modules
IEEE Trans. on Components Hybrids and Manufacturing Technology Part A, 19(1), 74–82.
1996 book
High Performance Design Automation for Multi-Chip Modules and Packages
World Scientific.
1996 conference paper
High Speed Bus Design Using HSPICE Optimization Techniques Based on Worst Case Design Approach
Proceedings of the 1996 Topical Meeting on Electrical Performance of Electronic Packaging, 93–96.
1996 chapter
Multichip Module Technology
In J. Whitaker (Ed.), The Electronic Handbook. CRC Press.
Ed(s): J. Whitaker
1996 conference paper
System Design Optimization With Multichip Module Technology
Proceedings 1996 Conference of the Brazilian Microelectronics Society. Presented at the 1996 Conference of the Brazilian Microelectronics Society.
1995 conference paper
A Micro-machined Approach to Optical Interconnect
Proceedings 1995 Electronic Components and Technology Conference, 620–627.
1995 journal article
Energy consumption modeling and optimization for SRAM's
IEEE Journal of Solid-State Circuits, 30(5), 571–579.
1995 conference paper
Measurement of on-IC Capacitance Structures
Proceedings of the 1995 IEEE Topical Meeting on Electrical Performance of Electronic Packaging.
1995 conference paper
Optimal System Design with MultiChip Module Technology
Proceedings of Microeletronics'95.
1995 chapter
Performance Driven Global Routing and Wiring Rule Generation for High Speed PCBs and MCMs
In M. Pecht (Ed.), Advanced Routing of Electronic Modules. Kluwer.
Ed(s): M. Pecht
1995 conference paper
Performance Driven Global Routing and Wiring Rule Generation for High Speed PCBs and MCMs
Proceedings 1995 Design Automation Conference, 36–40.
1995 journal article
Simulation of high speed interconnects using a convolution-based hierarchical packaging simulator
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 18(1), 74–82.
1995 journal article
System design optimization for MCM-D/flip-chip
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 18(4), 620–627.
1994 conference paper
Applications of MEMS to Reconfigurable Free Space Optical Interconnect
Proceedings NSF Optical Packaging Workshop. Presented at the NSF Optical Packaging Workshop, Breckenridge, CO.
1994 conference paper
Control of Crosstalk Noise
Proceedings of the 1994 ECTC Conference.
1994 journal article
Delay and reflection noise macromodeling for signal integrity management of PCBs and MCMs
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 17(1), 15–21.
1994 journal article
Energy control and accurate delay estimation in the design of CMOS buffers
IEEE Journal of Solid-State Circuits, 29(9), 1150–1153.
1994 journal article
SABSA: Switching-Activity Based State Assignment
International Journal of High Speed Electronics and Systems, 5(2), 203–212.
1994 conference paper
Skew and Delay Minimization of High Speed CMOS Circuits using Stochastic Optimization
Proceedings of the 1994 Custom Integrated Circuits Conference, 45–48.
1994 conference paper
Stochastic OptimizationApproach to Transistor Sizing for CMOS Circuits
Proceedings of the 1994 IEEE Design Automation Conference, 36–40.
1994 journal article
The Case for MCMs
Semiconductor International, 85–86.
1993 journal article
A layout-driven yield predictor and fault generator for VLSI
IEEE Transactions on Semiconductor Manufacturing, 6(1), 77–82.
1993 conference paper
A simple method for noise tolerance characterization of digital circuits
Proceedings 1993 Great Lakes VLSI Conference.
1993 journal article
An MCM Design Process with Application to a Laptop Computer Design
IEEE Computer Magazine, 26(4), 41–49.
1993 journal article
Comparison of methods for determining the capacitance of planar transmission lines with application to multichip module characterization
IEEE Trans. on Components Hybrids and Manufacturing Technology/Advanced Packaging.
1993 conference paper
Design advice systems for concurrent engineering: A constraint-based approach
Bowen, J., Bahler, D., & Franzon, P. (1993, January). Presented at the NSF Grantees Conference, Charlotte, NC.
1993 conference paper
LISAS: A Language for Instruction Set Architecture Specification
Proceedings 1993 ICCD Conference, 552–557.
1993 journal article
Method for automated waveform analysis of transient in digital circuits
Electronics Letters, 29(8), 681–693.
1993 book
Multichip Modules: Basics and Alternatives
Van Nostrand Rheinhold.
1993 chapter
Tools and Techniques for the Design of High Speed Multichip Modules, Chapter 7
In J. Morris (Ed.), Electronics Packaging Forum (Vol. 3). IEEE Press.
Ed(s): J. Morris
1992 conference paper
An efficient table-driven decoder for one-half rate convolutional codes
ACM-SE 30 Proceedings of the 30th annual Southeast regional conference, 116–123.
1992 journal article
Comment on an accurate measurement technique for line properties, junction effects and dielectric and magnetic parameters
IEEE Transactions on Microwave Theory Tech.
1992 conference paper
Cost/performance issues in multichip module packaging
Proceedings of the Japan International Conference on Microelectronics.
1992 conference paper
Tools to aid in Wiring Rule Generation for High Speed Interconnects
Proceedings 1992 Design Automation Conference, 466–471.
1991 conference paper
Automating Design for Signal Integrity
Topical Meeting on Electrical Performance of Electronic Packaging. Tucson, Arizona.
1991 conference paper
Experimental electrical characterization of high speed interconnects
Proceedings of the 41st Electronic Components and Technology Conference.
1991 journal article
Experimental electrical characterization of interconnects and discontinuities in high-speed digital systems
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 14(4), 761–765.
1991 conference paper
Interconnect Modeling and Simulation for High Speed MCM
Proceedings Multichip Module Workshop, 122–129.
1991 conference paper
Microwave characterization of thin-film multi-chip module substrates and printed wiring boards accounting for frequency-dependent characteristic impedance
Topical Meeting on Electrical Performance of Electronic Packaging. Tucson, Arizona.
1991 conference paper
The NCSU Design Center
Proceedings of the 1991 Microsystems Educators Conference. Presented at the San Jose, CA.
1991 conference paper
Tools and Techniques for the Design of High Speed Multichip Modules
Proceedings of the Third Annual Electronics Packaging Symposium. Presented at the Third Annual Electronics Packaging Symposium, Binghamton, NY.
1991 conference paper
Tools and techniques for the Design of High Speed Multichip Modules
Proceedings Japan IEMT.
1990 conference paper
Circuit Simulation with Distributed Elements
Proceedings of the Workshop on Circuit and Process Simulation. Presented at the Workshop on Circuit and Process Simulation, Microelectronics Center of North Carolina, Research Triangle Park.
1990 conference paper
Defect tolerant implementations for feed-forward and recurrent neural networks
Proceedings of 1990 International Conference on Wafer-Scale Integration, 160–166.
1990 conference paper
McYield: A CAD Tool for Functional Yield Projections for VLSI
1990 International Workshop on Defect and Fault Tolerance in VLSI Systems.
1990 journal article
Scalable VLSI implementations for neural networks
Journal of VLSI Signal Processing Systems for Signal, Image and Video Technology, 1(4), 367–385.
1989 journal article
Achieving ULSI through defect tolerance
International Journal of Computer Aided VLSI Design, 1(1), 73–90.
1989 chapter
Comparison of Reconfiguration Schemes for Defect Tolerant Mesh Arrays
In V. K. Jain (Ed.), Defect and Fault Tolerance in VLSI Systems (Vol. 2). Plenum.
Ed(s): V. Jain
1989 conference paper
Comparison of Reconfiguration Schemes for Defect Tolerant Mesh Arrays
Proceedings of the 1989 Workshop on Defect Tolerance. Presented at the Tampa, Florida.
1989 chapter
Fundamental interconnection issues
In Electronic Materials Handbook: Vol. 1: Packaging (pp. 1–11). ASM International.
1989 journal article
Modeling interconnect yield in reconfigurable circuits
Electronics Letters, 25(18), 1225–1226.
1988 chapter
'Chip Frame’ scheme for reconfigurable mesh-connected arrays
In R. M. Lea (Ed.), Water Scale Integration II. North Holland.
Ed(s): R. Lea
1987 journal article
FIR digital filters for high sample rate applications
IEEE Communications Magazine, 25(7), 62–72.
1987 chapter
Franzon: Yield Modeling for Fault Tolerant VLSI
In W. Moore, A. McCabe, & R. Urquhart (Eds.), Systolic Arrays. Adam Hilger.
Ed(s): W. Moore, A. McCabe & R. Urquhart
1987 journal article
Fundamental Interconnection Issues
AT&T Technical Journal, 66(4), 13–30.
1987 conference paper
`Chip Frame' scheme for reconfigurable mesh-connected arrays
Proceedings of the 1987 International workshop on Wafer Scale Integration. Uxbridge, England.
1986 conference paper
Interconnect Strategies for Fault Tolerant 2D VLSI Arrays
Proceedings of the International Conference on Computer Design, 230–234.
1986 conference paper
Through-Wafer Optical Interconnects for Multi-Wafer Wafer-Scale Integrated architectures
Proceedings of SPIE 86. Presented at the SPIE 86, San Diego, California.
1986 conference paper
Yield Modeling for Fault Tolerant VLSI
Proceedings of the International Workshop on Systolic Arrays. England: University of Oxford.
1985 conference paper
The Transform and Filter Brick: A new architecture for signal processing
Proceedings of the VLSI 85. Presented at the VLSI 85, Tokyo, Japan.
conference paper
A Robust calibration and supervised machine learning reliability framework for digitally-assisted self-healing RFICS
Wyers, E. J., Qi, W. Y., & Franzon, P. D. 2017 ieee 60th international midwest symposium on circuits and systems (mwscas), 1138–1141.
patent
Buried solder bumps for AC-coupled microelectronic interconnects
Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.
conference paper
CAD Tools for the Automated Design of High Speed Multichip Modules
Franzon, P. Proceedings of the 1990 International Packaging Symposium.
conference paper
CAD tools for Managing Signal Integrity and Congestion Simultaneously
Mehrotra, S., Franzon, P., Bilbro, G., & Steer, M. Proceedings of the 1994 Topical Meeting on Electrical Performance of Electrical Packaging, 30–32.
conference paper
Comparative analysis of two 3D integration implementations of a SAR processor
Thorolfsson, T., Melamed, S., Charles, G., & Franzon, P. D. 2009 IEEE International Conference on 3d Systems Integration, 25–28.
conference paper
Design and ASIC acceleration of cortical algorithm for text recognition
Dey, S., & Franzon, P. D. 2016 29th IEEE International System-on-Chip Conference (SOCC), 114–119.
conference paper
Design and ASIC acceleration of cortical algorithm for text recognition
Dey, S., & Franzon, P. D. 2016 29th IEEE International System-on-Chip Conference (SOCC), 114–119.
conference paper
Hardware implementation of hierarchical temporal memory algorithm
Li, W. F., & Franzon, P. 2016 29th IEEE International System-on-Chip Conference (SOCC), 133–138.
conference paper
Hardware implementation of hierarchical temporal memory algorithm
Li, W. F., & Franzon, P. 2016 29th IEEE International System-on-Chip Conference (SOCC), 133–138.
patent
Inductively coupled electrical connectors
Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.
conference paper
Machine learning in physical design
Li, B. W., & Franzon, P. D. Ieee conference on electrical performance of electronic packaging and, 147–149.
patent
Methods and systems for fast binary network address lookups using parent node information stored in routing table entries
Mehrotra, P., & Franzon, P. D. Washington, DC: U.S. Patent and Trademark Office.
patent
Methods and systems for fast packet forwarding
Mehrotra, P., & Franzon, P. D. Washington, DC: U.S. Patent and Trademark Office.
conference paper
Processor-in-memory support for artificial neural networks
Schabel, J., Baker, L., Dey, S., Li, W. F., & Franzon, P. D. 2016 IEEE International Conference on Rebooting Computing (icrc).
conference paper
RDL and interposer design for DiRAM4 interfaces
Nigussie, T., & Franzon, P. D. Ieee conference on electrical performance of electronic packaging and, 17–19.
journal article
RF-only logic: An area efficient logic family for RF-power harvesting applications
Zhao, W. X., Gadfort, P., Bhanushali, K., & Franzon, P. D. IEEE Transactions on Circuits and Systems. I, Regular Papers, 65(1), 406–418.
conference paper
Self-calibrating clock distribution with scheduled skews
Hsieh, H.-Y., Lui, W., Clements, M., & Franzon, P. Proceedings of ISCAS'98, 2 , 470–473.
journal article
Storage class memory
Burr, G. W., & Franzon, P. Emerging Nanoelectronic Devices, 498–510.
journal article
Surrogate-model-based analysis of analog circuits-part I: Variability analysis
Yelten, M. B., Franzon, P. D., & Steer, M. B. IEEE Transactions on Device and Materials Reliability, 11(3), 466–473.
journal article
Surrogate-model-based analysis of analog circuits-part II: Reliability analysis
Yelten, M. B., Franzon, P. D., & Steer, M. B. IEEE Transactions on Device and Materials Reliability, 11(3), 458–465.
conference paper
Technology impact analysis for 3D TCAM
Oh, E. C., & Franzon, P. D. 2009 IEEE International Conference on 3d Systems Integration, 206–210.
conference paper
Through silicon Via(TSV) defect/pinhole self test circuit for 3D-IC
Tsai, M. L., Klooz, A., Leonard, A., Appel, J., & Franzon, P. 2009 IEEE International Conference on 3d Systems Integration, 170–177.
book
Verilog styles for synthesis of digital systems
Smith, D. R., & Franzon, P. D. Upper Saddle River, NJ: Prentice Hall.