@article{shin_ahn_mun_lee_zaghari_park_park_ryu_jang_2024, title={Deep Neural Network-Based Temperature Mapping Technique for Heat Sink on Electronic Devices Using Local Thermocouple Sensors}, volume={38}, ISSN={["1087-6545"]}, DOI={10.1080/08839514.2024.2389374}, number={1}, journal={APPLIED ARTIFICIAL INTELLIGENCE}, author={Shin, Jaehee and Ahn, Hyun and Mun, Gwang-Hyeon and Lee, Jeongmin and Zaghari, Pouria and Park, Young-Min and Park, Jinhyoung and Ryu, Jong Eun and Jang, Dong-Won}, year={2024}, month={Dec} }
 @article{al shibli_chaturvedi_kanagaraj_zaghari_choi_ryu_2024, title={Sol-gel fabricated one-dimensional LiFePO<sub>4</sub> microstructures for carbon nanotube-based nanocomposite freestanding sheet as cathode material for Li ion batteries}, volume={1}, ISSN={["1530-793X"]}, url={https://doi.org/10.1177/00219983231225703}, DOI={10.1177/00219983231225703}, abstractNote={ Lithium Iron Phosphate (LiFePO4) microstructures have been synthesized using the sol-gel process. One-dimensional (1D) LiFePO4 microstructures were fabricated using tissue paper as a template under different temperatures to form pure phase microstructures. XRD analysis confirmed the single phase nature of orthorhombic olivine-structured LiFePO4 with Pnma space group. SEM analysis authenticated the formation of 1D LiFePO4 microstructures along with some clusters of particles. LiFePO4-multi-walled carbon nanotubes (MWCNT) freestanding sheets were prepared using a tape-casting process. Further, the electrochemical properties of LiFePO4-MWCNT freestanding sheet were analyzed through electrochemical impedance spectroscopy, cyclic voltammetry, and galvanostatic charge-discharge analysis. }, journal={JOURNAL OF COMPOSITE MATERIALS}, author={Al Shibli, Hamda and Chaturvedi, Prerna and Kanagaraj, Amarsingh Bhabu and Zaghari, Pouria and Choi, Daniel S. and Ryu, Jong Eun}, year={2024}, month={Jan} }
 @inproceedings{zaghari_sinha_ryu_franzon_hopkins_2023, title={Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package}, ISSN={["2164-0157"]}, url={http://dx.doi.org/10.1109/3dic57175.2023.10154901}, DOI={10.1109/3DIC57175.2023.10154901}, abstractNote={Thermal reliability is a critical factor in ensuring the performance and efficiency of GaN-based electronic devices. In this paper, the fatigue life assessment of a laterally conducting GaN power package that uses a two-solder hierarchy of SAC305 and Sn63/Pb37 on a 120μm thick dielectric for device attach was conducted using an FEA. The double-sided package structure also introduced thick Cu as integrated baseplate layers for mechanical mounting into higher packaging levels while providing surfaces for double-sided cooling. The internal structure varied spacer thicknesses for planarization and inclusion of package-integrated decoupling capacitors. The solder materials were simulated by using the Anand viscoplastic constitutive model. Coffin-Manson, Engelmaier, and Solomon empirical strain-based models were utilized to predict the cyclic life of the package. Based on the results, the critical solder joint location was predicted in the Sn63/Pb37 solder layer between the GaN and Cu spacer, with a strain range of 0.02797. The worst-case life prediction for the module was 150 cycles using the Coffin-Manson model.}, booktitle={2023 IEEE International 3D Systems Integration Conference (3DIC)}, publisher={IEEE}, author={Zaghari, Pouria and Sinha, Sourish S. and Ryu, Jong Eun and Franzon, Paul D. and Hopkins, Douglas C.}, year={2023}, month={May} }