Stephen Mick

Chandrasekar, K., Wilson, J., Erickson, E., Feng, Z. P., Xu, J., Mick, S., & Franzon, P. (2008). Inductively coupled connectors and sockets for multi-Gb/s pulse signaling. IEEE Transactions on Advanced Packaging, 31(4), 749–758. https://doi.org/10.1109/tadvp.2008.2005465

Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007, May). Fully integrated AC coupled interconnect using buried bumps. IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 30, pp. 191–199. https://doi.org/10.1109/TADVP.2007.896920

Davis, W. R., Wilson, J., Mick, S., Xu, M., Hua, H., Mineo, C., … Franzon, P. D. (2005). Demystifying 3D ICs: The procs and cons of going vertical. IEEE DESIGN & TEST OF COMPUTERS, 22(6), 498–510. https://doi.org/10.1109/MDT.2005.136

Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October). AC coupled interconnect for dense 3-D ICs. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, Vol. 51, pp. 2156–2160. https://doi.org/10.1109/TNS.2004.834712

Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February). Buried bump and AC coupled interconnection technology. IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 121–125. https://doi.org/10.1109/TADVP.2004.825482

Mohan, R., Choi, M. J., Mick, S. E., Hart, F. P., Chandrasekar, K., Cangellaris, A. C., … Steer, M. B. (2004). Causal reduced-order modeling of distributed structures in a transient circuit simulator. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 52(9), 2207–2214. https://doi.org/10.1109/TMTT.2004.834588

Franzon, P. D., Mick, S. E., & Wilson, J. M. Buried solder bumps for AC-coupled microelectronic interconnects. Washington, DC: U.S. Patent and Trademark Office.

Franzon, P. D., Mick, S. E., & Wilson, J. M. Inductively coupled electrical connectors. Washington, DC: U.S. Patent and Trademark Office.