Steven Lipa

Nigussie, T., Schabel, J. C., Lipa, S., McIlrath, L., Patti, R., & Franzon, P. (2022). Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning. IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 30(9), 1230–1243. https://doi.org/10.1109/TVLSI.2022.3179304

Nigussie, T., Pan, T.-H., Lipa, S., Pitts, W. S., DeLaCruz, J., & Franzon, P. (2021). Design Benefits of Hybrid Bonding for 3D Integration. IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1876–1881. https://doi.org/10.1109/ECTC32696.2021.00296

Franzon, P., Davis, W., Rotenberg, E., Stevens, J., Lipa, S., Nigussie, T., … Li, W. (2021). Design for 3D Stacked Circuits. 2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM). https://doi.org/10.1109/IEDM19574.2021.9720553

Srinivasan, V., Chowdhury, R. B. R., Forbes, E., Widialaksono, R., Zhang, Z. Q., Schabel, J., … Franzon, P. D. (2017). H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor. 2017 IEEE International Conference on Computer Design (ICCD), 145–152. https://doi.org/10.1109/ICCD.2017.30

Franzon, P. D., Priyadarshi, S., Lipa, S., Davis, W. R., & Thorolfsson, T. (2013). Exploring early design tradeoffs in 3DIC. 2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549. https://doi.org/10.1109/iscas.2013.6571901

Thorolfsson, T., Lipa, S., & Franzon, P. (2012). A 10.35 mW/GFlop Stacked SAR DSP unit using fine-grain partitioned 3D integration. 2012 ieee custom integrated circuits conference (cicc). https://doi.org/10.1109/cicc.2012.6330589

Shenderova, O., Tyler, T., Cunningham, G., Ray, M., Walsh, J., Casulli, M., … Lipa, S. (2007). Nanodiamond and onion-like carbon polymer nanocomposites. DIAMOND AND RELATED MATERIALS, Vol. 16, pp. 1213–1217. https://doi.org/10.1016/j.diamond.2006.11.086

Shenderova, O., Tyler, T., Cunningham, G., Ray, M., Walsh, J., Casulli, M., … Lipa, S. (2007, September). Nanodiamond and onion-like carbon polymer nanocomposites (vol 16, pg 1213, 2007). DIAMOND AND RELATED MATERIALS, Vol. 16, pp. 1770–1770. https://doi.org/10.1016/s0925-9635(07)00337-8

Wood, J., Edwards, T. C., & Lipa, S. (2001). Rotary traveling-wave oscillator arrays: A new clock technology. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 36(11), 1654–1665. https://doi.org/10.1109/4.962285