Sanskar Shrikant Panse

College of Engineering

Works (5)

Updated: July 5th, 2023 15:08

2021 journal article

A numerical parametric study to enhance thermal hydraulic performance of a novel alternating offset oblique microchannel

Numerical Heat Transfer, Part A: Applications, 79(7), 489–512.

By: S. Panse n & S. Ekkad n 

co-author countries: United States of America 🇺🇸
Sources: Web Of Science, Crossref, ORCID
Added: February 15, 2021

2021 article

Effect of channel aspect ratio and fin geometry on fluid flow and heat transfer performance of sectional oblique fin microchannels

PROCEEDINGS OF THE TWENTIETH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2021), pp. 42–51.

By: V. Rudragoudar n, H. Chhatija n, S. Panse n & S. Ekkad n 

co-author countries: United States of America 🇺🇸
author keywords: enhanced micro-channel; heat sink; oblique fins; electronics cooling; aspect ratio; fin geometry
Sources: Web Of Science, ORCID
Added: October 18, 2021

2021 journal article

Forced convection cooling of additively manufactured single and double layer enhanced microchannels

International Journal of Heat and Mass Transfer, 168, 120881.

By: S. Panse n & S. Ekkad n 

co-author countries: United States of America 🇺🇸
author keywords: Direct metal laser sintering; Additive manufacturing; Enhanced microchannels; Forced convection heat transfer
Sources: Web Of Science, Crossref, ORCID
Added: May 10, 2021

2021 journal article

Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams

Journal of Electronic Packaging, 143(3).

By: V. Rajamuthu n, S. Panse n & S. Ekkad n 

co-author countries: United States of America 🇺🇸
Sources: Web Of Science, ORCID, Crossref
Added: August 16, 2021

2019 journal article

Thermal hydraulic performance augmentation by high-porosity thin aluminum foams placed in high aspect ratio ducts

Applied Thermal Engineering, 161, 114162.

By: S. Panse n, P. Singh n & S. Ekkad n 

co-author countries: United States of America 🇺🇸

Contributors: S. Panse n, P. Singh n & S. Ekkad n 

author keywords: Forced convective heat transfer; Metal foams; Electronics cooling
Sources: Web Of Science, ORCID, Crossref
Added: October 21, 2019

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