Works (6)

Updated: September 15th, 2024 05:54

2024 journal article

Design, Fabrication, and Characterization of Capacitive Micromachined Ultrasonic Transducers for Transcranial, Multifocus Neurostimulation

Micromachines, 15(9), 1106.

By: T. Ibn Minhaj n, M. Annayev n, O. Adelegan n, A. Biliroğlu n, F. Yamaner n & Ö. Oralkan n

author keywords: neurostimulation; capacitive micromachined ultrasonic transducer (CMUT); single-element; large area transducer; fabrication; design; FEM; non-invasive; ultrasound; nonhuman primate model
Sources: ORCID, Crossref, NC State University Libraries, Web Of Science
Added: September 1, 2024

2023 journal article

Design and Fabrication of 1-D CMUT Arrays for Dual-Mode Dual-Frequency Acoustic Angiography Applications

IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 71(1), 191–201.

author keywords: Acoustic angiography (AA); capacitive micromachined ultrasonic transducer (CMUT); dual-mode dual-frequency array; glass substrate
TL;DR: A novel scheme with a capacitive micromachined ultrasonic transducer array to receive high-frequency microbubble harmonics in collapse mode and to transmit a low-frequency high-pressure pulse by releasing the CMUT plate from collapse and pull it back to collapse again in the same transmit-receive cycle. (via Semantic Scholar)
UN Sustainable Development Goal Categories
Sources: ORCID, Web Of Science, NC State University Libraries
Added: December 13, 2023

2021 article proceedings

Design and Fabrication of Single-Element CMUTs for Forming a Transcranial Array for Focused Beam Applications

Event: 2021 IEEE International Ultrasonics Symposium (IUS)

author keywords: ultrasound; focused; ultrasound; transducer; transcranial; fabrication; stimulation
UN Sustainable Development Goal Categories
Sources: Web Of Science, NC State University Libraries, ORCID, Crossref
Added: August 15, 2022

2021 journal article

Fabrication of 32 x 32 2D Capacitive Micromachined Ultrasonic Transducer (CMUT) Arrays on a Borosilicate Glass Substrate With Silicon-Through-Wafer Interconnects Using Sacrificial Release Process

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 30(6), 968–979.

author keywords: Capacitive micromachined ultrasonic transducer (CMUT); 2D arrays; glass substrate; silicon-through-glass-vias (Si-TGV); sacrificial release process
Sources: ORCID, Web Of Science, NC State University Libraries
Added: November 10, 2021

2020 journal article

In-Plane and Interfacial Thermal Conduction of Two-Dimensional Transition-Metal Dichalcogenides

Physical Review Applied, 13(3).

Sources: ORCID, Crossref, NC State University Libraries, Web Of Science
Added: April 20, 2020

2014 journal article

Effect of Mg on the microstructure and indentation hardness of as-cast Al-4.5Cu-3.4Fe in-situ composite

2014 9th International Forum on Strategic Technology (IFOST).

By: M. Kabir*, T. Minhaj*, M. Hossain* & A. Kurny*

Source: ORCID
Added: September 13, 2024

Employment

Updated: August 28th, 2024 22:53

2017 - 2024

NC State University Raleigh, NC, US
Graduate Research Assistant ECE

2015 - 2017

Missouri State University Springfield, US
Graduate Teaching Assistant Physics, Astronomy, and Materials Science

Education

Updated: August 28th, 2024 22:48

2017 - 2024

North Carolina State University Raleigh, US
Ph.D. Materials Science and Engineering

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