Works (4)
2016 conference paper
Thermal raman and IR measurement of heterogeneous integration stacks
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1505–1510.
2012 journal article
A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits
IEEE Trans CPMT, P(99), 1.

2012 journal article
Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.

2010 conference paper
Thermal analysis and verification of a mounted monolithic integrated circuit
Proceedings of the IEEE SoutheastCon 2010 (SoutheastCon), 37–40.
