2016 conference paper

Thermal raman and IR measurement of heterogeneous integration stacks

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1505–1510.

By: T. Harris, G. Pavlidis, E. Wyers, D. Newberry, S. Graham, P. Franzon, W. Davis

Event: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) at Las Vegas, NV on May 31 - June 3, 2016

Source: NC State University Libraries
Added: August 6, 2018

2012 journal article

A transient electrothermal analysis of three-dimensional integrated circuits

IEEE Transactions on Components Packaging and Manufacturing Technology, 2(4), 660–667.

By: T. Harris, S. Priyadarshi, S. Melamed, C. Ortega, R. Manohar, S. Dooley, N. Kriplani, W. Davis, P. Franzon, M. Steer

Source: NC State University Libraries
Added: August 6, 2018

2012 journal article

Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.

Source: NC State University Libraries
Added: August 6, 2018

2010 conference paper

Thermal analysis and verification of a mounted monolithic integrated circuit

Ieee southeastcon 2010: energizing our future, 37–40.

By: T. Harris, S. Melamed, S. Luniya, W. Davis, M. Steer, L. Doxsee, K. Obermiller, C. Hawkinson

Source: NC State University Libraries
Added: August 6, 2018