2012 journal article
A transient electrothermal analysis of three-dimensional integrated circuits
IEEE Transactions on Components Packaging and Manufacturing Technology, 2(4), 660–667.
2012 journal article
Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.
2010 conference paper
Thermal analysis and verification of a mounted monolithic integrated circuit
Ieee southeastcon 2010: energizing our future, 37–40.
conference paper
Thermal raman and IR measurement of heterogeneous integration stacks
Harris, T. R., Pavlidis, G., Wyers, E. J., Newberry, D. M., Graham, S., Franzon, P., & Davis, W. R. Intersociety conference on thermal and thermomechanical phenomena in, 1505–1510.
