2016 conference paper
Thermal raman and IR measurement of heterogeneous integration stacks
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1505–1510.
Event: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) at Las Vegas, NV on May 31 - June 3, 2016
2012 journal article
A transient electrothermal analysis of three-dimensional integrated circuits
IEEE Transactions on Components Packaging and Manufacturing Technology, 2(4), 660–667.
2012 journal article
Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.
2010 conference paper
Thermal analysis and verification of a mounted monolithic integrated circuit
Ieee southeastcon 2010: energizing our future, 37–40.
