2016 conference paper

Thermal raman and IR measurement of heterogeneous integration stacks

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1505–1510.

By: T. Harris, G. Pavlidis*, E. Wyers*, D. Newberry n, S. Graham*, P. Franzon, W. Davis n

Event: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) at Las Vegas, NV on May 31 - June 3, 2016

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2(4), 660–667.

By: T. Harris, S. Priyadarshi, S. Melamed, C. Ortega*, R. Manohar*, S. Dooley*, N. Kriplani, W. Davis n ...

author keywords: 3DIC; electrothermal effects; thermal management; transient analysis
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 journal article

Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2010 conference paper

Thermal analysis and verification of a mounted monolithic integrated circuit

Proceedings of the IEEE SoutheastCon 2010 (SoutheastCon), 37–40.

By: T. Harris, S. Melamed n, S. Luniya n, W. Davis n, M. Steer, L. Doxsee*, K. Obermiller*, C. Hawkinson*

Event: IEEE SoutheastCon 2010 (SoutheastCon) at Concord, NC on March 18-21, 2010

author keywords: MMIC; electrothermal; heat transfer; simulators; compact modeling; fREEDA
Sources: Web Of Science, ORCID
Added: August 6, 2018