T. Robert Harris

Works (4)

Updated: July 5th, 2023 15:47

2016 conference paper

Thermal raman and IR measurement of heterogeneous integration stacks

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1505–1510.

By: T. Harris n, G. Pavlidis *, E. Wyers*, D. Newberry n, S. Graham *, P. Franzon n , W. Davis n 

Event: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) at Las Vegas, NV on May 31 - June 3, 2016

Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2012 journal article

A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2(4), 660–667.

By: T. Harris n, S. Priyadarshi n, S. Melamed n, C. Ortega*, R. Manohar *, S. Dooley*, N. Kriplani n, W. Davis n  ...

author keywords: 3DIC; electrothermal effects; thermal management; transient analysis
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Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2012 journal article

Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.

By: S. Melamed*, T. Thorolfsson*, T. Harris*, S. Priyadarshi n, P. Franzon n , M. Steer n, W. Davis n 

TL;DR: This paper presents a resistive mesh-based approach that improves on the fidelity of prior approaches by constructing a thermal model of the full structure of 3DICs, including the interconnect, and introduces a method for dividing the thermal response caused by a heat load into a high fidelity “near response” and a lower fidelity” in order to implement Power Blurring high definition (HD). (via Semantic Scholar)
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Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2010 conference paper

Thermal analysis and verification of a mounted monolithic integrated circuit

Proceedings of the IEEE SoutheastCon 2010 (SoutheastCon), 37–40.

By: T. Harris n, S. Melamed  n, S. Luniya n, W. Davis n , M. Steer n, L. Doxsee*, K. Obermiller*, C. Hawkinson*

Event: IEEE SoutheastCon 2010 (SoutheastCon) at Concord, NC on March 18-21, 2010

author keywords: MMIC; electrothermal; heat transfer; simulators; compact modeling; fREEDA
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Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

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