T. Robert Harris

Works (4)

Updated: July 5th, 2023 15:47

2016 conference paper

Thermal raman and IR measurement of heterogeneous integration stacks

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1505–1510.

By: T. Harris n, G. Pavlidis *, E. Wyers*, D. Newberry n, S. Graham *, P. Franzon n , W. Davis n 

topics (OpenAlex): GaN-based semiconductor devices and materials; Semiconductor Lasers and Optical Devices; Semiconductor Quantum Structures and Devices
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2012 article

A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits

Harris, T. R., Priyadarshi, S., Melamed, S., Ortega, C., Manohar, R., Dooley, S. R., … al. (2012, January 12). IEEE Transactions on Components Packaging and Manufacturing Technology, p. 1.

By: T. Harris n, S. Priyadarshi n, S. Melamed n, C. Ortega*, R. Manohar *, S. Dooley*, N. Kriplani n, W. Davis n  ...

author keywords: 3DIC; electrothermal effects; thermal management; transient analysis
topics (OpenAlex): 3D IC and TSV technologies; Semiconductor materials and devices; Electromagnetic Compatibility and Noise Suppression
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Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2012 article

Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring

Melamed, S., Thorolfsson, T., Harris, T. R., Priyadarshi, S., Franzon, P., Steer, M. B., & Davis, W. R. (2012, April 20). IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 31, pp. 676–689.

By: S. Melamed*, T. Thorolfsson*, T. Harris*, S. Priyadarshi n, P. Franzon n , M. Steer n, W. Davis n 

topics (OpenAlex): 3D IC and TSV technologies; Electronic Packaging and Soldering Technologies; Silicon Carbide Semiconductor Technologies
TL;DR: This paper presents a resistive mesh-based approach that improves on the fidelity of prior approaches by constructing a thermal model of the full structure of 3DICs, including the interconnect, and introduces a method for dividing the thermal response caused by a heat load into a high fidelity “near response” and a lower fidelity” in order to implement Power Blurring high definition (HD). (via Semantic Scholar)
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Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2010 conference paper

Thermal analysis and verification of a mounted monolithic integrated circuit

Proceedings of the IEEE SoutheastCon 2010 (SoutheastCon). Presented at the IEEE SoutheastCon 2010 (SoutheastCon), Concord, NC.

By: T. Harris n, S. Melamed  n, S. Luniya n, W. Davis n , M. Steer n, L. Doxsee*, K. Obermiller*, C. Hawkinson*

author keywords: MMIC; electrothermal; heat transfer; simulators; compact modeling; fREEDA
topics (OpenAlex): Silicon Carbide Semiconductor Technologies; 3D IC and TSV technologies; Electromagnetic Compatibility and Noise Suppression
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7. Affordable and Clean Energy (Web of Science; OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

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