Works (22)

2014 journal article

Adaptive and reliable clock distribution design for 3-D integrated circuits

IEEE Transactions on Components Packaging and Manufacturing Technology, 4(11), 1862–1870.

By: X. Chen, T. Zhu, W. Davis & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2014 conference paper

Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC

2014 IEEE International Conference on IC Design & Technology (ICICDT).

By: S. Priyadarshi, W. Davis & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2014 journal article

Thermal pathfinding for 3-D ICs

IEEE Transactions on Components Packaging and Manufacturing Technology, 4(7), 1159–1168.

Source: NC State University Libraries
Added: August 6, 2018

2013 conference paper

Design of controller for L2 cache mapped in Tezzaron stacked DRAM

2013 ieee international 3d systems integration conference (3dic).

Source: NC State University Libraries
Added: August 6, 2018

2013 conference paper

Exploring early design tradeoffs in 3DIC

2013 ieee international symposium on circuits and systems (iscas), 545–549.

Source: NC State University Libraries
Added: August 6, 2018

2013 conference paper

Hetero(2) 3d integration: A scheme for optimizing efficiency/cost of chip multiprocessors

Proceedings of the fourteenth international symposium on quality electronic design (ISQED 2013), 1–7.

Source: NC State University Libraries
Added: August 6, 2018

2012 journal article

A transient electrothermal analysis of three-dimensional integrated circuits

IEEE Transactions on Components Packaging and Manufacturing Technology, 2(4), 660–667.

By: T. Harris, S. Priyadarshi, S. Melamed, C. Ortega, R. Manohar, S. Dooley, N. Kriplani, W. Davis, P. Franzon, M. Steer

Source: NC State University Libraries
Added: August 6, 2018

2012 journal article

Area-efficient antenna-scalable MIMO detector for K-best sphere decoding

Journal of Signal Processing Systems for Signal Image and Video Technology, 68(2), 171–182.

By: N. Moezzi-Madani, T. Thorolfsson, P. Chiang & W. Davis

Source: NC State University Libraries
Added: August 6, 2018

2012 journal article

Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.

Source: NC State University Libraries
Added: August 6, 2018

2012 journal article

Leakage power contributor modeling

IEEE Design & Test of Computers, 29(2), 71–78.

By: N. Dhanwada, D. Hathaway, J. Frenkil, W. Davis & H. Demircioglu

Source: NC State University Libraries
Added: August 6, 2018

2012 journal article

Parallel transient simulation of multiphysics circuits using delay-based partitioning

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(10), 1522–1535.

Source: NC State University Libraries
Added: August 6, 2018

2011 conference paper

3D specific systems: Design and CAD

2011 20th asian test symposium (ats), 470–473.

By: P. Franzon, W. Davis, T. Thorolfsson & S. Melamed

Source: NC State University Libraries
Added: August 6, 2018

2011 conference paper

Adaptive clock distribution for 3D integrated circuits

Ieee conference on electrical performance of electronic packaging and, 91–94.

By: X. Chen, W. Davis & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2011 journal article

Three-dimensional SRAM design with on-chip access time measurement

Electronics Letters, 47(8), 485–486.

By: X. Chen, T. Zhu & W. Davis

Source: NC State University Libraries
Added: August 6, 2018

2009 journal article

Application exploration for 3-D integrated circuits: TCAM, FIFO, and FFT case studies

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(4), 496–506.

By: W. Davis, E. Oh, A. Sule & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2009 journal article

Automated design space exploration for DSP applications

Journal of Signal Processing Systems for Signal Image and Video Technology, 56(2-3), 199–216.

By: R. Hourani, R. Jenkal, W. Davis & W. Alexander

Source: NC State University Libraries
Added: August 6, 2018

2009 conference paper

Delay analysis and design exploration for 3D SRAM

2009 IEEE International Conference on 3d Systems Integration, 244–247.

By: X. Chen & W. Davis

Source: NC State University Libraries
Added: August 6, 2018

2009 journal article

Parallel merge algorithm for high-throughput signal processing applications

Electronics Letters, 45(3), 188–189.

By: N. Moezzi-Madani & W. Davis

Source: NC State University Libraries
Added: August 6, 2018

2009 conference paper

The Benefits of 3D networks-on-chip as shown with LDPC decoding

2009 IEEE International Conference on 3d Systems Integration, 89–96.

By: C. Mineo & W. Davis

Source: NC State University Libraries
Added: August 6, 2018

conference paper

H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor

Srinivasan, V., Chowdhury, R. B. R., Forbes, E., Widialaksono, R., Zhang, Z. Q., Schabel, J., … Franzon, P. D. 2017 ieee 35th international conference on computer design (iccd), 145–152.

By: V. Srinivasan, R. Chowdhury, E. Forbes, R. Widialaksono, Z. Zhang, J. Schabel, S. Ku, S. Lipa ...

Source: NC State University Libraries
Added: August 6, 2018

conference paper

Junction-level thermal extraction and simulation of 3DICs

Melamed, S., Thorolfsson, T., Srinivasan, A., Cheng, E., Franzon, P., & Davis, R. 2009 IEEE International Conference on 3d Systems Integration, 395–401.

By: S. Melamed, T. Thorolfsson, A. Srinivasan, E. Cheng, P. Franzon & R. Davis

Source: NC State University Libraries
Added: August 6, 2018

conference paper

Thermal raman and IR measurement of heterogeneous integration stacks

Harris, T. R., Pavlidis, G., Wyers, E. J., Newberry, D. M., Graham, S., Franzon, P., & Davis, W. R. Intersociety conference on thermal and thermomechanical phenomena in, 1505–1510.

By: T. Harris, G. Pavlidis, E. Wyers, D. Newberry, S. Graham, P. Franzon, W. Davis

Source: NC State University Libraries
Added: August 6, 2018