2014 journal article
Adaptive and reliable clock distribution design for 3-D integrated circuits
IEEE Transactions on Components Packaging and Manufacturing Technology, 4(11), 1862–1870.
2014 conference paper
Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC
2014 IEEE International Conference on IC Design & Technology (ICICDT).
2014 journal article
Thermal pathfinding for 3-D ICs
IEEE Transactions on Components Packaging and Manufacturing Technology, 4(7), 1159–1168.
2013 conference paper
Design of controller for L2 cache mapped in Tezzaron stacked DRAM
2013 ieee international 3d systems integration conference (3dic).
2013 conference paper
Exploring early design tradeoffs in 3DIC
2013 ieee international symposium on circuits and systems (iscas), 545–549.
2013 conference paper
Hetero(2) 3d integration: A scheme for optimizing efficiency/cost of chip multiprocessors
Proceedings of the fourteenth international symposium on quality electronic design (ISQED 2013), 1–7.
2012 journal article
A transient electrothermal analysis of three-dimensional integrated circuits
IEEE Transactions on Components Packaging and Manufacturing Technology, 2(4), 660–667.
2012 journal article
Area-efficient antenna-scalable MIMO detector for K-best sphere decoding
Journal of Signal Processing Systems for Signal Image and Video Technology, 68(2), 171–182.
2012 journal article
Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels
IET Circuits, Devices & Systems, 6(1), 35.
2012 journal article
Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.
2012 journal article
Leakage power contributor modeling
IEEE Design & Test of Computers, 29(2), 71–78.
2012 journal article
Parallel transient simulation of multiphysics circuits using delay-based partitioning
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(10), 1522–1535.
2011 conference paper
3D specific systems: Design and CAD
2011 20th asian test symposium (ats), 470–473.
2011 conference paper
Adaptive clock distribution for 3D integrated circuits
Ieee conference on electrical performance of electronic packaging and, 91–94.
2011 journal article
Three-dimensional SRAM design with on-chip access time measurement
Electronics Letters, 47(8), 485–486.
2009 journal article
Application exploration for 3-D integrated circuits: TCAM, FIFO, and FFT case studies
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(4), 496–506.
2009 journal article
Automated design space exploration for DSP applications
Journal of Signal Processing Systems for Signal Image and Video Technology, 56(2-3), 199–216.
2009 conference paper
Delay analysis and design exploration for 3D SRAM
2009 IEEE International Conference on 3d Systems Integration, 244–247.
2009 journal article
Parallel merge algorithm for high-throughput signal processing applications
Electronics Letters, 45(3), 188–189.
2009 conference paper
The Benefits of 3D networks-on-chip as shown with LDPC decoding
2009 IEEE International Conference on 3d Systems Integration, 89–96.
conference paper
H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor
Srinivasan, V., Chowdhury, R. B. R., Forbes, E., Widialaksono, R., Zhang, Z. Q., Schabel, J., … Franzon, P. D. 2017 ieee 35th international conference on computer design (iccd), 145–152.
conference paper
Junction-level thermal extraction and simulation of 3DICs
Melamed, S., Thorolfsson, T., Srinivasan, A., Cheng, E., Franzon, P., & Davis, R. 2009 IEEE International Conference on 3d Systems Integration, 395–401.
conference paper
Thermal raman and IR measurement of heterogeneous integration stacks
Harris, T. R., Pavlidis, G., Wyers, E. J., Newberry, D. M., Graham, S., Franzon, P., & Davis, W. R. Intersociety conference on thermal and thermomechanical phenomena in, 1505–1510.
2015 - present
2008 - 2015
2002 - 2008