Works (121)

Updated: July 5th, 2023 15:56

2021 article

A Virtual Platform for Object Detection Systems

2021 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC).

By: Q. Zhao n & W. Davis n

co-author countries: United States of America 🇺🇸
author keywords: Object Detection System; CNN; Hardware Accelerator; Power; Performance; Architecture; Virtual Platform
Sources: Web Of Science, ORCID
Added: May 2, 2022

2021 article

An Instruction-Level Power and Energy Model for the Rocket Chip Generator

2021 IEEE/ACM INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN (ISLPED).

By: Z. Wang n & W. Davis n

co-author countries: United States of America 🇺🇸
author keywords: Rocket chip; RISC-V; Energy characterization; Instruction-level; Power model
Sources: Web Of Science, ORCID
Added: November 1, 2021

2021 conference paper

Bridging the Organization Gap for EDA Machine Learning Data

Kalafala, K., Fu, H., Davis, W. R., Aadithya, K., & Clevenger, L. A. (2021, August 16). Presented at the DesignCon.

By: K. Kalafala, H. Fu, W. Davis, K. Aadithya & L. Clevenger

Event: DesignCon on August 16-28, 2021

Source: NC State University Libraries
Added: July 1, 2022

2021 article

Fast and Accurate PPA Modeling with Transfer Learning

2021 ACM/IEEE 3RD WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD).

By: L. Francisco n, P. Franzon n & W. Davis n

co-author countries: United States of America 🇺🇸
author keywords: PPA; Machine Learning; Power; Performance; Area; Gradient Boost; Neural Network; Transfer Learning
Sources: Web Of Science, ORCID
Added: November 15, 2021

2021 conference paper

Fast and Accurate PPA Modeling with Transfer Learning

2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD). Presented at the 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD), Munich, Germany.

By: W. Davis n, P. Franzon n, L. Francisco n, B. Huggins n & R. Jain*

co-author countries: United States of America 🇺🇸

Event: 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD) at Munich, Germany on November 1-4, 2021

author keywords: PPA; Machine Learning; Power; Performance; Area; Gradient Boost; Neural Network; Transfer Learning; Surrogate Modeling
Sources: Web Of Science, ORCID
Added: February 21, 2022

2021 speech

FreePDK3: A Novel PDK for Physical Verification at the 3nm Node

Sadangi, S., Pasumarthy, V., Pitts, W. S., & Davis, W. R. (2021, May). Presented at the Synopsys Speaker Series.

By: S. Sadangi, V. Pasumarthy, W. Pitts & W. Davis

Event: Synopsys Speaker Series on May 18, 2021

Source: NC State University Libraries
Added: July 1, 2022

2021 conference paper

System-Level Power Analysis with IEEE 2416 Power Models

Frenkil, J., Dhanwada, N., Davis, R., & Ratchkov, D. (2021, March 1). Workshop presented at the Design and Verification Conference and Exhibition (DVCON).

By: J. Frenkil, N. Dhanwada, R. Davis & D. Ratchkov

Event: Design and Verification Conference and Exhibition (DVCON) on March 1, 2021

Source: NC State University Libraries
Added: July 1, 2022

2021 conference paper

UPM/IEEE 2416 Power Modeling Standard: A Practitioner’s Perspective

Dhanwada, N., Davis, R., Dhanwada, N., & Frenkil, J. (2021, July 28). Embedded Tutorial presented at the IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED).

By: N. Dhanwada, R. Davis, N. Dhanwada & J. Frenkil

Event: IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED) on July 28, 2021

Source: NC State University Libraries
Added: July 1, 2022

2021 speech

Views from the Cloud

Davis, W. R. (2021, August). Panel Discussion presented at the Si2 Annual Technical Forum.

By: W. Davis

Event: Si2 Annual Technical Forum on August 6, 2021

Source: NC State University Libraries
Added: July 1, 2022

2020 speech

A Gentle Introduction to the Open Model Interface for Reliability Simulations

Davis, W. R. (2020, April). Presented at the Si2 OpenAccess Live Forum.

By: W. Davis

Event: Si2 OpenAccess Live Forum on April 24, 2020

Source: NC State University Libraries
Added: July 1, 2022

2020 speech

An Industry-standard approach toward modeling device aging

Davis, W. R., & Shaw, C. (2020, April). Virtual session video presented at the International Reliability Physics Symposium.

By: W. Davis & C. Shaw

Event: International Reliability Physics Symposium on April 28 - May 30, 2020

Source: NC State University Libraries
Added: July 1, 2022

2020 article

Design Rule Checking with a CNN Based Feature Extractor

PROCEEDINGS OF THE 2020 ACM/IEEE 2ND WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD '20), pp. 9–14.

By: L. Francisco n, T. Lagare n, A. Jain n, S. Chaudhary n, M. Kulkarni n, D. Sardana n, W. Davis n, P. Franzon n

co-author countries: United States of America 🇺🇸
author keywords: Design Rule Checking; Machine Learning; IC Verification; Design for Manufacturing; Convolutional Neural Network; Deep Learning
Sources: Web Of Science, ORCID
Added: August 16, 2021

2020 conference paper

EDA Roadmap for Machine Learning & AI Standardization

Davis, W. R. (2020, January 30). EDA Roadmap for Machine Learning & AI Standardization. Panel Discussion, presented at the DesignCon, Santa Clara, CA.

By: W. Davis

Event: DesignCon at Santa Clara, CA on January 30, 2020

Source: NC State University Libraries
Added: July 1, 2022

2020 conference paper

How to write a compact reliability model with the Open Model Interface (OMI

2020 IEEE International Reliability Physics Symposium (IRPS). Presented at the 2020 IEEE International Reliability Physics Symposium (IRPS), Dallas, TX.

By: W. Davis n, C. Shaw & A. Hassan

co-author countries: United States of America 🇺🇸

Event: 2020 IEEE International Reliability Physics Symposium (IRPS) at Dallas, TX on April 28 - May 30, 2020

Sources: NC State University Libraries, ORCID
Added: July 1, 2022

2020 conference paper

System Level Power Analysis with UPM

Baker, A., Davis, W. R., Dhanwada, N., Frenkil, J., & Ratchkov, D. (2020, July 20). Virtual tutorial presented at the Design Automation Conference (DAC).

By: A. Baker, W. Davis, N. Dhanwada, J. Frenkil & D. Ratchkov

Event: Design Automation Conference (DAC) on July 20, 2020

Source: NC State University Libraries
Added: July 1, 2022

2019 journal article

3-D-DATE: A Circuit-Level Three-Dimensional DRAM Area, Timing, and Energy Model

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 66(2), 756–768.

By: J. Park n, W. Davis n & P. Franzon n

co-author countries: United States of America 🇺🇸
author keywords: Dynamic random access memory (DRAM); area and energy and timing model; circuit level model
Sources: Web Of Science, ORCID
Added: February 18, 2019

2019 conference paper

Characterization of Fast, Accurate Leakage Power Models for IEEE P2416

20th International Symposium on Quality Electronic Design (ISQED). Presented at the 20th International Symposium on Quality Electronic Design (ISQED), Santa Clara, CA.

By: B. Gupta n & W. Davis n

co-author countries: United States of America 🇺🇸

Event: 20th International Symposium on Quality Electronic Design (ISQED) at Santa Clara, CA on March 6-7, 2019

Sources: NC State University Libraries, ORCID
Added: July 1, 2022

2019 conference paper

Development of FreePDK: An Open-Source Process Design Kit for Advanced Technology Nodes

Bhanushali, K., & Davis, W. R. (2019, March 14). Presented at the Free Silicon Conference (FSiC).

By: K. Bhanushali & W. Davis

Event: Free Silicon Conference (FSiC) on March 14-16, 2019

Source: NC State University Libraries
Added: July 1, 2022

2019 conference paper

Estimating Pareto Optimum Fronts to Determine Knob Settings in Electronic Design Automation Tools

20th International Symposium on Quality Electronic Design (ISQED). Presented at the 20th International Symposium on Quality Electronic Design (ISQED), Santa Clara, CA.

By: B. Huggins n, W. Davis n & P. Franzon n

co-author countries: United States of America 🇺🇸

Event: 20th International Symposium on Quality Electronic Design (ISQED) at Santa Clara, CA on March 6-7, 2019

Sources: NC State University Libraries, ORCID
Added: July 1, 2022

2019 conference paper

Is Your AI-based EDA Tool Production-Ready?

Davis, W. R. (2019, June 3). Panel discussion presented at the Design Automation Conference.

By: W. Davis

Event: Design Automation Conference on June 3, 2019

Source: NC State University Libraries
Added: July 1, 2022

2019 speech

OpenAccess Partitions: How Fast Can We Go?

Davis, W. R. (2019, October). Presented at the Si2 OpenAccess Live Forum.

By: W. Davis

Event: Si2 OpenAccess Live Forum on October 18, 2019

Source: NC State University Libraries
Added: July 1, 2022

2019 conference paper

OpenAccess Partitions: How Fast Can We Go?

Davis, W. R. (2019, June 5). Presented at the Design Automation Conference, Las Vegas, NV.

By: W. Davis

Event: Design Automation Conference at Las Vegas, NV on June 5, 2019

Source: NC State University Libraries
Added: July 1, 2022

2019 conference paper

Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages

2019 International 3D Systems Integration Conference (3DIC). Presented at the 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan.

By: T. Harris*, W. Davis n, S. Lipa n, W. Pitts n & P. Franzon n

co-author countries: United States of America 🇺🇸

Event: 2019 International 3D Systems Integration Conference (3DIC) at Sendai, Japan on October 8-10, 2019

Sources: NC State University Libraries, ORCID
Added: July 1, 2022

2018 speech

Physical Design of a Stacked Heterogeneous Multi-Core Processor

Davis, W. R. (2018, January). Presented at the ARM Research, Cambridge, UK.

By: W. Davis

Event: ARM Research at Cambridge, UK on January 22, 2018

Source: NC State University Libraries
Added: July 1, 2022

2017 conference paper

H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor

2017 IEEE International Conference on Computer Design (ICCD), 145–152.

By: V. Srinivasan n, R. Chowdhury*, E. Forbes*, R. Widialaksono*, Z. Zhang*, J. Schabel n, S. Ku*, S. Lipa n ...

co-author countries: United States of America 🇺🇸

Event: 2017 IEEE International Conference on Computer Design (ICCD) at Boston, MA on November 5-8, 2017

Sources: Web Of Science, ORCID
Added: August 6, 2018

2017 conference paper

Physical Design of a Stacked Heterogeneous Multi-Core Processor

Davis, W. R. (2017, September 19). Presented at the Oxford Circuits and Systems Conference, Oxford, UK.

By: W. Davis

Event: Oxford Circuits and Systems Conference at Oxford, UK on September 19, 2017

Source: NC State University Libraries
Added: July 1, 2022

2016 conference paper

Novel packaging and thermal measurement for 3D heterogeneous stacks

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing, Raleigh, NC.

By: T. Harris*, W. Davis* & P. Franzon*

co-author countries: China 🇨🇳

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing at Raleigh, NC on June 13-15, 2016

Sources: NC State University Libraries, ORCID, Crossref
Added: March 24, 2019

2016 conference paper

Physical Design of a 3D-Stacked Heterogeneous Multi-Core Processor

2016 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2016 IEEE International 3D Systems Integration Conference (3DIC), -San Francisco, CA.

By: R. Widialaksono n, R. Chowdhury n, Z. Zhang n, J. Schabel n, S. Lipa n, E. Rotenberg n, W. Davis n, P. Franzon n

co-author countries: United States of America 🇺🇸

Event: 2016 IEEE International 3D Systems Integration Conference (3DIC) at -San Francisco, CA on November 8-11, 2016

Sources: NC State University Libraries, Crossref, ORCID
Added: March 24, 2019

2016 conference paper

Thermal raman and IR measurement of heterogeneous integration stacks

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1505–1510.

By: T. Harris n, G. Pavlidis*, E. Wyers*, D. Newberry n, S. Graham*, P. Franzon n, W. Davis n

co-author countries: United States of America 🇺🇸

Event: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) at Las Vegas, NV on May 31 - June 3, 2016

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2015 conference paper

Computing in 3D

2015 International 3D Systems Integration Conference (3DIC). Presented at the 10.1109/3DIC.2015.7334571, Sendai, Japan.

By: P. Franzon n, E. Rotenberg n, W. Davis n, J. Tuck n, W. Davis, H. Zhou n, J. Schabel n, Z. Zhang n ...

co-author countries: United States of America 🇺🇸

Event: 10.1109/3DIC.2015.7334571 at Sendai, Japan on August 31 - September 2, 2015

Sources: NC State University Libraries, ORCID, Crossref
Added: March 24, 2019

2015 chapter

FreePDK15: An Open-Source Predictive Process Design Kit for 15nm FinFET Technology

In ISPD '15: Proceedings of the 2015 Symposium on International Symposium on Physical Design (pp. 165–170).

By: K. Bhanushali n & W. Davis n

co-author countries: United States of America 🇺🇸

Event: 2015 Symposium on International Symposium on Physical Design at Monterey, CA

Sources: NC State University Libraries, ORCID
Added: July 1, 2022

2015 journal article

Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks

2015 International 3D Systems Integration Conference (3DIC), 1–3.

By: T. Harris n, E. Wyers*, L. Wang*, S. Graham*, G. Pavlidis*, P. Franzon n, W. Davis n

co-author countries: United States of America 🇺🇸

Event: 2015 International 3D Systems Integration Conference (3DIC) at Sendai, Japan on August 31 - September 2, 2015

Sources: NC State University Libraries, ORCID, Crossref
Added: March 24, 2019

2014 journal article

Adaptive and Reliable Clock Distribution Design for 3-D Integrated Circuits

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(11), 1862–1870.

By: . Chen n, T. Zhu n, W. Davis n & P. Franzon n

co-author countries: United States of America 🇺🇸
author keywords: 3-D integrated circuit (3-D IC); adaptive; clock distribution; deskew; optimization; process-voltage-temperature (PVT) variation; stacking; thermal profile; through-silicon-via (TSV); tunable-delay-buffer (TDB)
Sources: Web Of Science, ORCID
Added: August 6, 2018

2014 chapter

Electrothermal Simulation of Three Dimensional Integrated Circuits

In R. Sharma (Ed.), Design of 3D Integrated Circuits and Systems. Boca Raton, FL: CRC Press.

By: S. Priyadarshi, J. Hu, M. Steer, P. Franzon & W. Davis

Ed(s): R. Sharma

Source: NC State University Libraries
Added: July 1, 2022

2014 conference paper

Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC

2014 IEEE International Conference on IC Design & Technology. Presented at the 2014 IEEE International Conference on IC Design & Technology (ICICDT).

By: S. Priyadarshi n, W. Davis n & P. Franzon n

co-author countries: United States of America 🇺🇸

Event: 2014 IEEE International Conference on IC Design & Technology (ICICDT)

Sources: NC State University Libraries, ORCID, Crossref
Added: August 6, 2018

2014 journal article

Thermal Pathfinding for 3-D ICs

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(7), 1159–1168.

By: S. Priyadarshi n, W. Davis n, M. Steer n & P. Franzon n

co-author countries: United States of America 🇺🇸
author keywords: 3-D IC; electronic system-level (ESL); electrothermal simulation; pathfinding; through-silicon via (TSV); transaction-level simulation
Sources: Web Of Science, ORCID
Added: August 6, 2018

2014 conference paper

Towards a Standard Flow for System Level Power Modeling

2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD). Presented at the 2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, CA.

By: N. Dhanwada, R. Davis & J. Frenkil

Event: 2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) at San Jose, CA on November 2-6, 2014

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2013 conference paper

Applications and design styles for 3DIC

2013 IEEE International Electron Devices Meeting. Presented at the 2013 IEEE International Electron Devices Meeting, Washington, DC.

By: P. Franzon n, E. Rotenberg n, J. Tuck n, W. Davis n, H. Zhou n, J. Schabel n, Z. Zhang n, J. Park n ...

co-author countries: United States of America 🇺🇸

Event: 2013 IEEE International Electron Devices Meeting at Washington, DC on December 9-11, 2013

Sources: NC State University Libraries, ORCID, Crossref
Added: March 24, 2019

2013 conference paper

Design of controller for L2 cache mapped in Tezzaron stacked DRAM

2013 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA.

By: N. Tshibangu n, P. Franzon n, E. Rotenberg n & W. Davis n

co-author countries: United States of America 🇺🇸

Event: 2013 IEEE International 3D Systems Integration Conference (3DIC) at San Francisco, CA on October 2-4, 2013

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Exploring early design tradeoffs in 3DIC

2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549.

By: P. Franzon n, S. Priyadarshi n, S. Lipa n, W. Davis n & T. Thorolfsson*

co-author countries: United States of America 🇺🇸

Event: 2013 IEEE International Symposium on Circuits and Systems (ISCAS) at Beijing, China on May 19-23, 2013

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Hetero(2) 3d integration: A scheme for optimizing efficiency/cost of chip multiprocessors

Proceedings of the fourteenth international symposium on quality electronic design (ISQED 2013), 1–7.

By: S. Priyadarshi n, N. Choudhary n, B. Dwiel n, A. Upreti n, E. Rotenberg n, R. Davis n, P. Franzon n

co-author countries: United States of America 🇺🇸

Event: International Symposium on Quality Electronic Design (ISQED) at Santa Clara, CA on March 4-6, 2013

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Rationale for a 3D heterogeneous multi-core processor

2013 IEEE 31st International Conference on Computer Design (ICCD), 154–168.

By: E. Rotenberg n, B. Dwiel n, E. Forbes n, Z. Zhang n, R. Widialaksono n, R. Chowdhury n, N. Tshibangu n, S. Lipa n ...

co-author countries: United States of America 🇺🇸

Event: 2013 IEEE 31st International Conference on Computer Design (ICCD) at Asheville, NC on October 6-9, 2013

Sources: NC State University Libraries, ORCID, Crossref
Added: March 24, 2019

2012 journal article

A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2(4), 660–667.

By: T. Harris n, S. Priyadarshi n, S. Melamed n, C. Ortega*, R. Manohar*, S. Dooley*, N. Kriplani n, W. Davis n ...

co-author countries: United States of America 🇺🇸
author keywords: 3DIC; electrothermal effects; thermal management; transient analysis
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 journal article

Area-Efficient Antenna-Scalable MIMO Detector for K-best Sphere Decoding

JOURNAL OF SIGNAL PROCESSING SYSTEMS FOR SIGNAL IMAGE AND VIDEO TECHNOLOGY, 68(2), 171–182.

By: N. Moezzi-Madani n, T. Thorolfsson n, P. Chiang* & W. Davis n

co-author countries: United States of America 🇺🇸
author keywords: MIMO; K-best; Sphere decoder; VLSI
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 journal article

Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels

IET Circuits, Devices & Systems, 6(1), 35.

By: S. Priyadarshi n, T. Harris n, S. Melamed n, C. Otero*, N. Kriplani n, C. Christoffersen*, R. Manohar*, S. Dooley* ...

co-author countries: Canada 🇨🇦 United States of America 🇺🇸
Sources: Crossref, ORCID
Added: February 24, 2020

2012 journal article

Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.

co-author countries: Japan 🇯🇵 United States of America 🇺🇸
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Leakage Power Contributor Modeling

IEEE DESIGN & TEST OF COMPUTERS, 29(2), 71–78.

By: N. Dhanwada*, D. Hathaway*, J. Frenkil*, W. Davis n & H. Demircioglu n

co-author countries: United States of America 🇺🇸
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 conference paper

Modeling Power Variability (from Small to Large

Davis, W. R. (2012, October 9). Presented at the Silicon Integration Inititative (Si2) Conference.

By: W. Davis

Event: Silicon Integration Inititative (Si2) Conference on October 9, 2012

Source: NC State University Libraries
Added: July 1, 2022

2012 journal article

Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 31(10), 1522–1535.

co-author countries: Sweden 🇸🇪 United States of America 🇺🇸
author keywords: Delay element; electrothermal simulation; multicore; multiphysics; parallel simulation; parallelization; transient simulation
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 journal article

Pathfinder 3D: A Flow for System-Level Design Space Exploration

2011 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan.

By: S. Priyadarshi n, J. Hu n, W. Choi n, S. Melamed n, X. Chen n, W. Davis n, P. Franzon n

co-author countries: United States of America 🇺🇸

Event: 2011 IEEE International 3D Systems Integration Conference (3DIC) at Osaka, Japan on January 31 - February 2, 2011

Sources: NC State University Libraries, ORCID, Crossref
Added: March 24, 2019

2011 conference paper

3D specific systems: Design and CAD

2011 Asian Test Symposium, 470–473.

By: P. Franzon n, W. Davis n, T. Thorolfsson n & S. Melamed n

co-author countries: United States of America 🇺🇸

Event: 2011 Asian Test Symposium at New Delhi, India on November 20-23, 2011

author keywords: 3DIC; 3D IC; three dimensional IC; TSV; stacked memory; memory on logic; FFT
Sources: Web Of Science, ORCID
Added: August 6, 2018

2011 conference paper

Adaptive clock distribution for 3D integrated circuits

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, 91–94.

By: X. Chen n, W. Davis n & P. Franzon n

co-author countries: United States of America 🇺🇸

Event: 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems at San Jose, CA on October 23-26, 2011

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2011 conference paper

An energy-efficient 64-QAM MIMO detector for emerging wireless standards

2011 Design, Automation & Test in Europe. Presented at the 2011 Design, Automation & Test in Europe, Grenoble, France.

By: N. Moezzi-Madani n, T. Thorolfsson n, J. Crop*, P. Chiang* & W. Davis n

co-author countries: United States of America 🇺🇸

Event: 2011 Design, Automation & Test in Europe at Grenoble, France on March 14-18, 2011

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2011 speech

Architecture, Design, and CAD for 3D-ICs

Davis, W. R. (2011, October). Presented at the Institute of Microelectronics, Agency for Science, Technology, and Research (A*STAR), Singapore.

By: W. Davis

Event: Institute of Microelectronics, Agency for Science, Technology, and Research (A*STAR) at Singapore on October 3, 2011

Source: NC State University Libraries
Added: July 1, 2022

2011 journal article

Coordinating 3D designs: Interface IP, standards or free form?

2011 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan.

By: P. Franzon n, W. Davis n, Z. Zhou n, S. Priyadarshi n, M. Hogan*, T. Karnik*, G. Srinivas

co-author countries: United States of America 🇺🇸

Event: 2011 IEEE International 3D Systems Integration Conference (3DIC) at Osaka, Japan on January 31 - February 2, 2011

Sources: NC State University Libraries, ORCID, Crossref
Added: March 24, 2019

2011 chapter

Design and Computer Aided Design of 3DIC

In A. Sheibanyrad, F. Pétrot, & A. Jantsch (Eds.), 3D Integration for NoC-based SoC Architectures. Integrated Circuits and Systems (pp. 75–88).

By: P. Franzon n, W. Davis & T. Thorolfsson

co-author countries: United States of America 🇺🇸

Ed(s): A. Sheibanyrad, F. Pétrot & A. Jantsch

Sources: Web Of Science, ORCID
Added: July 9, 2022

2011 chapter

Predictive Process Design Kits

In Y. Cao (Ed.), Predictive Technology Model for Robust Nanoelectronic Design. Integrated Circuits and Systems (pp. 121–140).

By: W. Davis n & H. Demircioglu n

co-author countries: United States of America 🇺🇸

Ed(s): Y. Cao

Sources: Web Of Science, ORCID
Added: July 9, 2022

2011 conference paper

Test & Reliability Challenges in 3D NoCs

Davis, W. R. (2011, June 5). Test & Reliability Challenges in 3D NoCs. Presented at the Design Automation Conference (DAC) Workshop on Diagnostic Services in Networks-on-Chip: Test, Debug, & On-Line Monitoring.

By: W. Davis

Event: Design Automation Conference (DAC) Workshop on Diagnostic Services in Networks-on-Chip: Test, Debug, & On-Line Monitoring on June 5, 2011

Source: NC State University Libraries
Added: July 1, 2022

2011 journal article

Three-dimensional SRAM design with on-chip access time measurement

ELECTRONICS LETTERS, 47(8), 485–486.

By: X. Chen n, T. Zhu n & W. Davis n

co-author countries: United States of America 🇺🇸
Sources: Web Of Science, ORCID
Added: August 6, 2018

2010 conference paper

A Low-Area Flexible MIMO Detector for WiFi/WiMAX Standards

2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010). Presented at the 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010), Dresden, Germany.

By: N. Moezzi-Madani, T. Thorolfsson & W. Davis*

Event: 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) at Dresden, Germany on March 8-12, 2010

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2010 conference paper

Algorithm and hardware complexity reduction techniques for k-best sphere decoders

GLSVLSI '10: Proceedings of the 20th symposium on Great lakes symposium on VLSI, 471–476.

By: N. Moezzi-Madani n, T. Thorolfsson n & W. Davis n

co-author countries: United States of America 🇺🇸

Event: Great Lakes Symposium on VLSI (GLSVLSI

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2010 conference paper

Creating 3D Specific Systems: Architecture, Design and CAD

International Symposium on Microelectronics, 2010(1), 23–27.

By: P. Franzon n, W. Davis n, T. Thorolfsson n & S. Melamed n

co-author countries: United States of America 🇺🇸

Event: Intlernational Microelectronics and Packaging Society (iMAPS) Symposium at Raleigh, NC

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2010 conference paper

Creating 3D Specific Systems: Architecture, Design, and CAD

2010 Design, Automation & Test in Europe Conference & Exhibition, 1684–1688.

By: P. Franzon n, W. Davis n & T. Thorolfsson

co-author countries: United States of America 🇺🇸

Event: 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) at Dresden, Germany on March 8-12, 2010

Sources: NC State University Libraries, ORCID, Crossref
Added: March 24, 2019

2010 conference paper

Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICs

Melamed, S., Thorolfsson, T., Srinivasan, A., Cheng, E., Franzon, P., & Davis, W. R. (2010, October). Presented at the International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

By: S. Melamed, T. Thorolfsson, A. Srinivasan, E. Cheng, P. Franzon & W. Davis

Event: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) on October 6-8, 2010

Source: NC State University Libraries
Added: July 1, 2022

2010 journal article

Low Power Hypercube Divided Memory FFT Engine Using 3D Integration

ACM Transactions on Design Automation of Electronic Systems, 16(1), 1–25.

By: T. Thorolfsson n, S. Melamed n, W. Davis n & P. Franzon n

co-author countries: United States of America 🇺🇸
author keywords: Design; 3DIC; scaling; TSV; FFT
Sources: Web Of Science, ORCID
Added: July 9, 2022

2010 conference paper

Modeling Layout-Dependent Stress Effects: Opportunities for OpenDFM

Davis, W. R. (2010, June 13). Presented at the Design Automation Conference (DAC) Open Design-for-Manufacturability (OpenDFM) Workshop.

By: W. Davis

Event: Design Automation Conference (DAC) Open Design-for-Manufacturability (OpenDFM) Workshop on June 13, 2010

Source: NC State University Libraries
Added: July 1, 2022

2010 conference paper

Thermal Adaptive Clock Design for 3D Integrated Circuits

Chen, X., & Davis, W. R. (2010, September 13). Presented at the Semiconductor Research Corporation (SRC) TECHCON.

By: X. Chen & W. Davis

Event: Semiconductor Research Corporation (SRC) TECHCON on September 13-14, 2010

Source: NC State University Libraries
Added: July 1, 2022

2010 conference paper

Thermal analysis and verification of a mounted monolithic integrated circuit

Proceedings of the IEEE SoutheastCon 2010 (SoutheastCon), 37–40.

By: T. Harris n, S. Melamed n, S. Luniya n, W. Davis n, M. Steer n, L. Doxsee*, K. Obermiller n, C. Hawkinson n

co-author countries: United States of America 🇺🇸

Event: IEEE SoutheastCon 2010 (SoutheastCon) at Concord, NC on March 18-21, 2010

author keywords: MMIC; electrothermal; heat transfer; simulators; compact modeling; fREEDA
Sources: Web Of Science, ORCID
Added: August 6, 2018

2009 journal article

Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies

IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 17(4), 496–506.

By: W. Davis n, E. Oh n, A. Sule n & P. Franzon n

co-author countries: United States of America 🇺🇸
author keywords: Fast Fourier transform (FFT); first-in first-out (FIFO); ternary content-addressable memory (TCAM); 3-D integrated circuit (IC)
Sources: Web Of Science, ORCID
Added: August 6, 2018

2009 journal article

Automated Design Space Exploration for DSP Applications

JOURNAL OF SIGNAL PROCESSING SYSTEMS FOR SIGNAL IMAGE AND VIDEO TECHNOLOGY, 56(2-3), 199–216.

By: R. Hourani n, R. Jenkal n, W. Davis n & W. Alexander n

co-author countries: United States of America 🇺🇸
author keywords: Hardware design; VLSI; Synthesis; RTL; Area; Throughput; Power dissipation; DSP; FIR filter
Sources: Web Of Science, ORCID
Added: August 6, 2018

2009 conference paper

Delay analysis and design exploration for 3D SRAM

2009 IEEE International Conference on 3d Systems Integration, 244–247.

By: X. Chen n & W. Davis n

co-author countries: United States of America 🇺🇸
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 conference paper

High-Throughput Low-Complexity MIMO Detector Based on K-Best Algorithm

GLSVLSI '09: Proceedings of the 19th ACM Great Lakes symposium on VLSI, 451–456.

By: N. Moezzi-Madani & W. Davis

Event: Great Lakes Symposium on VLSI (GLSVLSI on May 10-12, 2009

Source: NC State University Libraries
Added: July 9, 2022

2009 conference paper

Junction-level thermal extraction and simulation of 3DICs

2009 IEEE International Conference on 3d Systems Integration, 395–401.

By: S. Melamed n, T. Thorolfsson n, A. Srinivasan*, E. Cheng*, P. Franzon n & R. Davis n

co-author countries: United States of America 🇺🇸

Event: 2009 IEEE International Conference on 3D System Integration at San Francisco, CA on September 28-30, 2009

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 journal article

Parallel merge algorithm for high-throughput signal processing applications

ELECTRONICS LETTERS, 45(3), 188–189.

By: N. Moezzi-Madani n & W. Davis n

co-author countries: United States of America 🇺🇸
Sources: Web Of Science, ORCID
Added: August 6, 2018

2009 speech

Prototyping in 3D-ICs: Design Flow Needs

Davis, W. R. (2009, October). Presented at the Silicon Integration Inititative (Si2) and Global Semiconductor Association (GSA) Workshop on Requirements for 3D Design Flow Interoperability Standards.

By: W. Davis

Event: Silicon Integration Inititative (Si2) and Global Semiconductor Association (GSA) Workshop on Requirements for 3D Design Flow Interoperability Standards on October 1, 2009

Source: NC State University Libraries
Added: July 1, 2022

2009 speech

Save Your Energy: A Fast and Accurate Approach to NoC Power Estimation

Mineo, C., & Davis, W. R. (2009, February). Presented at the Workshop on 3D Integration and Interconnect-Centric Architectures (in conjunction with the International Symposium on High Performance Computer Architecture.

By: C. Mineo & W. Davis

Event: Workshop on 3D Integration and Interconnect-Centric Architectures (in conjunction with the International Symposium on High Performance Computer Architecture on February 15, 2009

Source: NC State University Libraries
Added: July 1, 2022

2009 speech

The Benefits of 3D Networks-on-Chip

Davis, W. R. (2009, December). Presented at the Silicon Integration Initiative (Si2) Low-Power Coalition Technical Steering Group Web-Meeting.

By: W. Davis

Event: Silicon Integration Initiative (Si2) Low-Power Coalition Technical Steering Group Web-Meeting on December 10, 2009

Source: NC State University Libraries
Added: July 1, 2022

2009 conference paper

The Benefits of 3D networks-on-chip as shown with LDPC decoding

2009 IEEE International Conference on 3d Systems Integration, 89–96.

By: C. Mineo n & W. Davis n

co-author countries: United States of America 🇺🇸
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2008 conference paper

An 8192-point Fast Fourier Transform 3D-IC Case Study

2008 51st Midwest Symposium on Circuits and Systems, 438–441.

By: W. Davis n, A. Sule* & P. Franzon n

co-author countries: United States of America 🇺🇸

Event: 2008 51st Midwest Symposium on Circuits and Systems at Knoxville, TN on August 10-13, 2008

Sources: Web Of Science, ORCID, Crossref
Added: March 24, 2019

2008 speech

An Architecture Evaluator for Three-Dimensional Integrated Circuits

Davis, W. R. (2008, May). Presented at the Stanford University ECE Department Seminar.

By: W. Davis

Event: Stanford University ECE Department Seminar on May 22, 2008

Source: NC State University Libraries
Added: July 1, 2022

2008 conference paper

An Efficient VLSI Implementation for the 1D Convolutional Discreet Wavelet Transform

2008 51st Midwest Symposium on Circuits and Systems. Presented at the 2008 51st Midwest Symposium on Circuits and Systems, Knoxville, TN.

By: R. Hourani n, I. Dalal n, W. Davis n, C. Doss* & W. Alexander n

co-author countries: United States of America 🇺🇸

Event: 2008 51st Midwest Symposium on Circuits and Systems at Knoxville, TN on August 10-13, 2008

Sources: Web Of Science, ORCID
Added: July 9, 2022

2008 speech

Automation and Back-End Design within the FreePDK OpenAccess 45nm PDK and Cell Libraries for University Flows

Davis, W. R. (2008, June). Presented at the Semiconductor Research Corporation (SRC) e-Workshop.

By: W. Davis

Event: Semiconductor Research Corporation (SRC) e-Workshop on June 26, 2008

Source: NC State University Libraries
Added: July 1, 2022

2008 conference paper

Computer-Aided Design and Application Exploration for 3D Integrated Circuits

Proceedings of the Government Microcircuit Applications & Critical Technology (GOMACTech) Conference. Presented at the Government Microcircuit Applications & Critical Technology (GOMACTech) Conference.

By: P. Franzon, W. Davis, M. Steer, H. Hua, S. Lipa, S. Luniya, C. Mineo, J. Oh ...

Event: Government Microcircuit Applications & Critical Technology (GOMACTech) Conference on March 17-20, 2008

Source: NC State University Libraries
Added: July 1, 2022

2008 conference paper

Design and CAD for 3D Integrated Circuits

DAC '08: Proceedings of the 45th annual Design Automation Conference, 668–673.

By: P. Franzon n, W. Davis n, M. Steer n, S. Lipa n, E. Oh n, T. Thorolfsson n, S. Melamed n, S. Luniya n ...

co-author countries: United States of America 🇺🇸

Event: Design Automation Conference (DAC)

Sources: NC State University Libraries, ORCID, Crossref
Added: March 24, 2019

2008 speech

FreePDK: A Free OpenAccess 45nm PDK and Cell Library for Universities

Davis, W. R. (2008, October). Presented at the Semiconductor Research Corporation (SRC) e-Workshop.

By: W. Davis

Event: Semiconductor Research Corporation (SRC) e-Workshop on October 3, 2008

Source: NC State University Libraries
Added: July 1, 2022

2008 conference paper

Inter-Die Signaling in Three Dimensional Integrated Circuits

2008 IEEE Custom Integrated Circuits Conference. Presented at the 008 IEEE Custom Integrated Circuits Conference, San Jose, CA.

By: C. Mineo n, R. Jenkal n, S. Melamed n & W. Davis n

co-author countries: United States of America 🇺🇸

Event: 008 IEEE Custom Integrated Circuits Conference at San Jose, CA on September 21-24, 2008

Sources: Web Of Science, ORCID
Added: July 9, 2022

2007 journal article

3D Interconnect Device Design: Theory vs. Reality

Future Fab International, (23), 38–40.

By: W. Davis, A. Sule & K. Schoenfliess

Source: NC State University Libraries
Added: July 1, 2022

2007 speech

3D-IC Design: Theory vs. Reality

Davis, W. R. (2007, June). Presented at the University of Utah ECE Department Seminar, Salt Lake City, UT.

By: W. Davis

Event: University of Utah ECE Department Seminar at Salt Lake City, UT on June 21, 2007

Source: NC State University Libraries
Added: July 1, 2022

2007 conference paper

An Architecture for Energy Efficient Sphere Decoding

ISLPED '07: Proceedings of the 2007 international symposium on Low power electronics and design, 244–249.

By: R. Jenkal n & W. Davis n

co-author countries: United States of America 🇺🇸

Event: International Symposium on Low Power Electronics and Design (ISLPED on August 27-29, 2007

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2007 conference paper

Design for 3D Integration and Applications

2007 International Symposium on Signals, Systems and Electronics, 263–266,

By: P. Franzon n, W. Davis n, M. Steer n, H. Hao n, S. Lipa n, S. Luniya n, C. Mineo n, J. Oh n ...

co-author countries: United States of America 🇺🇸

Event: 2007 International Symposium on Signals, Systems and Electronics at Montreal, Quebec, Canada on July 30 - August 2, 2007

Sources: NC State University Libraries, ORCID, Crossref
Added: March 24, 2019

2007 conference paper

Designing FIFO Buffers using 3DIC Technology

VLSI Multilevel Interconnection (VMIC) Conference, 267–272.

By: A. Sule & W. Davis

Event: VLSI Multilevel Interconnection (VMIC) Conference on September 25-28, 2007

Source: NC State University Libraries
Added: July 1, 2022

2007 speech

Energy-Efficient Sphere Decoding (and other research efforts

Davis, W. R. (2007, September). Presented at the DARPA/OSD Trusted Foundry Circuit Designers Meeting, Essex Junction, VT.

By: W. Davis

Event: DARPA/OSD Trusted Foundry Circuit Designers Meeting at Essex Junction, VT on September 13, 2007

Source: NC State University Libraries
Added: July 1, 2022

2007 conference paper

FreePDK: An Open Source, OpenAccess Design Kit

Davis, W. R. (2007, November 5). Presented at the OpenAccess Conference.

By: W. Davis

Event: OpenAccess Conference on November 5, 2007

Source: NC State University Libraries
Added: July 1, 2022

2007 conference paper

FreePDK: An Open-Source Variation-Aware Design Kit

2007 IEEE International Conference on Microelectronic Systems Education (MSE'07). Presented at the 2007 IEEE International Conference on Microelectronic Systems Education (MSE'07), San Diego, CA.

By: J. Stine*, I. Castellanos*, M. Wood*, J. Henson*, F. Love*, W. Davis n, P. Franzon n, M. Bucher n ...

co-author countries: United States of America 🇺🇸

Event: 2007 IEEE International Conference on Microelectronic Systems Education (MSE'07) at San Diego, CA on June 3-4, 2007

Sources: Web Of Science, ORCID, Crossref
Added: March 24, 2019

2006 conference paper

Architecture for Energy Efficient Sphere Decoding

2006 IEEE International SOC Conference, 267–270.

By: R. Jenkal n, H. Hua n, A. Sule n & W. Davis n

co-author countries: United States of America 🇺🇸

Event: 2006 IEEE International SOC Conference at Austin, TX on September 24-27, 2006

Sources: Web Of Science, ORCID
Added: July 9, 2022

2006 chapter

Automated Architectural Exploration for Signal Processing Algorithms

In 2006 IEEE Workshop on Signal Processing Systems Design and Implementation (pp. 274–279,).

By: R. Hourani n, R. Jenkal n, W. Davis n & W. Alexander n

co-author countries: United States of America 🇺🇸

Event: 2006 IEEE Workshop on Signal Processing Systems Design and Implementation at Banff, AB, Canada on October 2-4, 2006

Sources: Web Of Science, ORCID
Added: July 9, 2022

2006 conference paper

Breaking Rent’s Rule: Opportunities for 3D Interconnect Networks

VLSI Multilevel Interconnection (VMIC) Conference, 228–233.

By: W. Davis & C. Mineo

Event: VLSI Multilevel Interconnection (VMIC) Conference on September 26-28, 2006

Source: NC State University Libraries
Added: July 1, 2022

2006 conference paper

Compact Electrothermal Modeling of an X-band MMIC

2006 IEEE MTT-S International Microwave Symposium Digest, 651–654.

By: S. Luniya n, W. Batty*, V. Caccamesi*, M. Garcia*, C. Christoffersen*, S. Melamed n, W. Davis n, M. Steer n

co-author countries: Canada 🇨🇦 United Kingdom of Great Britain and Northern Ireland 🇬🇧 United States of America 🇺🇸

Event: 2006 IEEE MTT-S International Microwave Symposium at San Francisco, CA on June 11-16, 2006

author keywords: MMIC; electrothermal effects; circuit simulation; modeling
Sources: Web Of Science, ORCID
Added: July 9, 2022

2006 speech

Demystifying 3D ICs: The Pros and Cons of Going Vertical

Davis, W. R. (2006, April). Presented at the Virginia Tech ECE Department Seminar, Blacksburg, VA.

By: W. Davis

Event: Virginia Tech ECE Department Seminar at Blacksburg, VA on April 14, 2006

Source: NC State University Libraries
Added: July 1, 2022

2006 conference paper

Exploring Compromises among Timing, Power and Temperature in Three-Dimensional Integrated Circuits

DAC '06: Proceedings of the 43rd annual Design Automation Conference, 997–1002.

By: H. Hua n, C. Mineo n, K. Schoenfliess n, A. Sule n, S. Melamed n, R. Jenkal n, W. Davis n

co-author countries: United States of America 🇺🇸

Event: Design Automation Conference (DAC)

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2006 conference paper

Performance Trend in Three-Dimensional Integrated Circuits

2006 International Interconnect Technology Conference, 45–47.

By: H. Hua n, C. Mineo n, K. Schoenfliess n, A. Sule n, S. Melamed n & W. Davis n

co-author countries: United States of America 🇺🇸

Event: 2006 International Interconnect Technology Conference at Burlingame, CA on June 5-7, 2006

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2006 speech

Tool Integration for Signal Processing Architectural Exploration

Hourani, R., Jenkal, R., Davis, R., & Alexander, W. (2006, April). Presented at the Electronic Design Process (EDP) Workshop.

By: R. Hourani, R. Jenkal, R. Davis & W. Alexander

Event: Electronic Design Process (EDP) Workshop

Source: NC State University Libraries
Added: July 1, 2022

2005 journal article

Demystifying 3D ICs: The procs and cons of going vertical

IEEE DESIGN & TEST OF COMPUTERS, 22(6), 498–510.

By: W. Davis n, J. Wilson n, S. Mick n, M. Xu*, H. Hua*, C. Mineo n, A. Sule n, M. Steer n, P. Franzon n

co-author countries: United States of America 🇺🇸
Sources: Web Of Science, ORCID
Added: August 6, 2018

2005 conference paper

OpenAccess Tools for 3D Integration

Davis, W. R. (2005, November 10). Presented at the OpenAccess Conference, San Jose, CA.

By: W. Davis

Event: OpenAccess Conference at San Jose, CA on November 10, 2005

Source: NC State University Libraries
Added: July 1, 2022

2005 conference paper

Pre-route Net Classing for Crosstalk Avoidance

Hua, H., Sule, A., Mineo, C., & Davis, W. R. (2005, September 12). Presented at the Cadence Designer Network Live Conference (CDNLive), San Jose, CA.

By: H. Hua, A. Sule, C. Mineo & W. Davis

Event: Cadence Designer Network Live Conference (CDNLive) at San Jose, CA on September 12-13, 2005

Source: NC State University Libraries
Added: July 1, 2022

2005 conference paper

Wire-Delay Reduction Analysis of a 3-Tier, 8-Point Fast Fourier Transform 3D-IC

VLSI Multilevel Interconnection (VMIC) Conference, 474–479.

By: W. Davis, H. Hua, A. Sule, C. Mineo, S. Melamed, M. Steer, P. Franzon

Event: VLSI Multilevel Interconnection (VMIC) Conference

Source: NC State University Libraries
Added: July 1, 2022

2004 conference paper

Multi-Parameter Power Minimization of Synthesized Datapaths

IEEE Computer Society Annual Symposium on VLSI, 151–157.

By: W. Davis n, A. Sule n & H. Hua n

co-author countries: United States of America 🇺🇸

Event: IEEE Computer Society Annual Symposium on VLSI at Lafayette, LA on February 19-20, 2004

Sources: Web Of Science, ORCID
Added: July 9, 2022

2003 journal article

500 Mb/s Soft Output Viterbi Decoder

IEEE Journal of Solid State Circuits, 38(7), 1234–1241.

By: E. Yeo*, S. Augsburger, W. Davis* & B. Nikolić

co-author countries: United States of America 🇺🇸
author keywords: iterative decoders; turbo codes; Viterbi decoder; VLSI
Source: Web Of Science
Added: July 9, 2022

2003 conference paper

Automated Design Flows for High-Performance Systems

Davis, W. R. (2003, February 11). Presented at the OpenAccess Conference, San Jose, CA.

By: W. Davis

Event: OpenAccess Conference at San Jose, CA on February 11, 2003

Source: NC State University Libraries
Added: July 1, 2022

2003 conference paper

Getting High-Performance Silicon from System-Level Design

IEEE Computer Society Annual Symposium on VLSI, 2003. Proceedings., 238–243.

By: W. Davis n

co-author countries: United States of America 🇺🇸

Event: IEEE Computer Society Annual Symposium on VLSI at Tampa, FL on February 20-21, 2003

Sources: Web Of Science, ORCID
Added: July 9, 2022

2003 chapter

Real-Time System-on-a-Chip Emulation

In G. Martin & H. Chang (Eds.), Winning the SoC Revolution (pp. 229–253).

By: K. Kuusilinna*, C. Chang*, H. Bluethgen*, W. Davis n, B. Richards*, B. Nikolić*, R. Brodersen*

co-author countries: Germany 🇩🇪 United States of America 🇺🇸

Ed(s): G. Martin* & H. Chang*

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2003 speech

System-Level Design: Past, Present, and Future

Davis, W. R. (2003, February). Presented at the University of Tennessee ECE Department Seminar, Knoxville, TN.

By: W. Davis

Event: University of Tennessee ECE Department Seminar at Knoxville, TN

Source: NC State University Libraries
Added: July 1, 2022

2002 conference paper

500 Mb/s Soft Output Viterbi Decoder

European Solid-State Circuits Conference (ESSCIRC), 523–526,

By: E. Yeo, S. Augsburger, W. Davis & B. Nikolić

Event: European Solid-State Circuits Conference (ESSCIRC)

Source: NC State University Libraries
Added: July 1, 2022

2002 journal article

A Design Environment for High-Throughput, Low-Power Dedicated Signal Processing Systems

IEEE Journal of Solid State Circuits, 37(3), 420–431.

By: W. Davis*, N. Zhang, K. Camera*, D. Marković*, T. Smilkstein*, M. Ammer*, E. Yeo*, S. Augsburger*, B. Nikolić*, R. Brodersen*

co-author countries: United States of America 🇺🇸
author keywords: application specific integrated circuits; design automation; design methodology; integrated circuit design; parallel architectures; system analysis and design
Sources: Web Of Science, ORCID
Added: July 9, 2022

2002 thesis

A Hierarchical, Automated Design Flow for Low-Power, High-Throughput Digital Signal Processing IC’s

(PhD Thesis). Electrical Engineering Department, University of California, Berkeley.

By: W. Davis

Source: NC State University Libraries
Added: July 1, 2022

2002 conference paper

Implementation of high throughput soft output viterbi decoders

IEEE Workshop on Signal Processing Systems, 146–151.

By: E. Yeo*, S. Augsburger*, W. Davis* & B. Nikolić*

co-author countries: United States of America 🇺🇸

Event: IEEE Workshop on Signal Processing Systems at San Diego, CA on October 16-18, 2002

Sources: Web Of Science, ORCID
Added: July 9, 2022

2001 conference paper

A Design Environment for High Throughput, Low Power Dedicated Signal Processing Systems

Proceedings of the IEEE 2001 Custom Integrated Circuits Conference, 545–548.

By: W. Davis*, N. Zhang, K. Camera, F. Chen, D. Marković, N. Chan, B. Nikolic, R. Brodersen

Event: IEEE 2001 Custom Integrated Circuits Conference at San Diego, CA on May 9, 2001

Sources: Web Of Science, ORCID
Added: July 9, 2022

2001 conference paper

An Automated Design Flow for Low-Power, High-Throughput Dedicated Signal Processing Systems

Conference Record of Thirty-Fifth Asilomar Conference on Signals, Systems and Computers, 475–480.

By: W. Davis*, N. Zhang*, K. Camera*, D. Marković*, T. Smilkstein*, N. Chan*, M. Ammer*, E. Yeo*, B. Nikolić*, R. Brodersen*

co-author countries: United States of America 🇺🇸

Event: Thirty-Fifth Asilomar Conference on Signals, Systems and Computers at Pacific Grove, CA on November 4-7, 2001

Source: Web Of Science
Added: July 9, 2022

2001 speech

An Automated Design Flow for Low-Power, High-Throughput Dedicated Signal Processing Systems

Davis, W. R. (2001, December). Presented at the MathWorks, Inc. seminar Innovation First: System Level Design for DSP and Communications, Waltham, MA.

By: W. Davis

Event: MathWorks, Inc. seminar Innovation First: System Level Design for DSP and Communications at Waltham, MA on December 4, 2001

Source: NC State University Libraries
Added: July 1, 2022

2001 speech

Design Technology for Low Power Radio Systems

Davis, W. R. (2001, September). Presented at the Computer Aided Network Design Workshop (CANDE), Grand Teton, WY.

By: W. Davis

Event: Computer Aided Network Design Workshop (CANDE) at Grand Teton, WY on September 20-22, 2001

Source: NC State University Libraries
Added: July 1, 2022

2001 conference paper

Wireless systems-on-a-chip design

2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers, 45–48.

By: R. Brodersen*, W. Davis*, D. Yee & N. Zhang

co-author countries: United States of America 🇺🇸

Event: 2001 International Symposium on VLSI Technology, Systems, and Applications. at Hsinchu, Taiwan

Sources: Web Of Science, ORCID
Added: July 9, 2022

Employment

Updated: November 12th, 2020 11:53

2015 - present

North Carolina State University Raleigh, North Carolina, US
Professor Electrical and Computer Engineering

2008 - 2015

North Carolina State University Raleigh, North Carolina, US
Associate Professor Electrical and Computer Engineering

2002 - 2008

North Carolina State University Raleigh, North Carolina, US
Assistant Professor Electrical and Computer Engineering