Works (121)
Updated: April 4th, 2024 13:04
2021 article
A Virtual Platform for Object Detection Systems
2021 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC).
author keywords: Object Detection System; CNN; Hardware Accelerator; Power; Performance; Architecture; Virtual Platform
TL;DR:
This paper will offer an virtual platform for object detection systems, and each component in the system will be simulated by a proper power model and a behavior model to help designers optimizeobject detection systems.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
3. Good Health and Well-being
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: May 2, 2022
2021 article
An Instruction-Level Power and Energy Model for the Rocket Chip Generator
2021 IEEE/ACM INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN (ISLPED).
author keywords: Rocket chip; RISC-V; Energy characterization; Instruction-level; Power model
TL;DR:
An event-based power modeling methodology is discussed which is the foundation of the model and is compatible with emerging power- and energy-modeling standards such as IEEE-2416, and validation results show that the proposed instruction-level power model achieves less than 3% error on simple C program benchmarks.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: November 1, 2021
2021 conference paper
Bridging the Organization Gap for EDA Machine Learning Data
Kalafala, K., Fu, H., Davis, W. R., Aadithya, K., & Clevenger, L. A. (2021, August 16). Presented at the DesignCon.
Event: DesignCon on August 16-28, 2021
Source: NC State University Libraries
Added: July 1, 2022
2021 article
Fast and Accurate PPA Modeling with Transfer Learning
2021 ACM/IEEE 3RD WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD).
author keywords: PPA; Machine Learning; Power; Performance; Area; Gradient Boost; Neural Network; Transfer Learning
TL;DR:
This work presents a machine learning approach using gradient boost models and neural networks to fast and accurately predict the power, performance, and area of a System-on-Chip (SoC) by reducing the number of samples used to create the models.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: November 15, 2021
2021 conference paper
Fast and Accurate PPA Modeling with Transfer Learning
2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD). Presented at the 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD), Munich, Germany.
Event: 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD) at Munich, Germany on November 1-4, 2021
author keywords: PPA; Machine Learning; Power; Performance; Area; Gradient Boost; Neural Network; Transfer Learning; Surrogate Modeling
TL;DR:
The approach reached the same PPA solution as human designers in the same or fewer runs for a CORTEX-M0 system design, showing potential for automating the recipe optimization without needing more runs than a human designer would need.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
3. Good Health and Well-being
(Web of Science)
9. Industry, Innovation and Infrastructure
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: February 21, 2022
2021 speech
FreePDK3: A Novel PDK for Physical Verification at the 3nm Node
Sadangi, S., Pasumarthy, V., Pitts, W. S., & Davis, W. R. (2021, May). Presented at the Synopsys Speaker Series.
Event: Synopsys Speaker Series on May 18, 2021
Source: NC State University Libraries
Added: July 1, 2022
2021 conference paper
System-Level Power Analysis with IEEE 2416 Power Models
Frenkil, J., Dhanwada, N., Davis, R., & Ratchkov, D. (2021, March 1). Workshop presented at the Design and Verification Conference and Exhibition (DVCON).
Event: Design and Verification Conference and Exhibition (DVCON) on March 1, 2021
Source: NC State University Libraries
Added: July 1, 2022
2021 conference paper
UPM/IEEE 2416 Power Modeling Standard: A Practitioner’s Perspective
Dhanwada, N., Davis, R., Dhanwada, N., & Frenkil, J. (2021, July 28). Embedded Tutorial presented at the IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED).
Event: IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED) on July 28, 2021
Source: NC State University Libraries
Added: July 1, 2022
2021 speech
Views from the Cloud
Davis, W. R. (2021, August). Panel Discussion presented at the Si2 Annual Technical Forum.
Event: Si2 Annual Technical Forum on August 6, 2021
Source: NC State University Libraries
Added: July 1, 2022
2020 speech
A Gentle Introduction to the Open Model Interface for Reliability Simulations
Davis, W. R. (2020, April). Presented at the Si2 OpenAccess Live Forum.
Event: Si2 OpenAccess Live Forum on April 24, 2020
Source: NC State University Libraries
Added: July 1, 2022
2020 speech
An Industry-standard approach toward modeling device aging
Davis, W. R., & Shaw, C. (2020, April). Virtual session video presented at the International Reliability Physics Symposium.
Event: International Reliability Physics Symposium on April 28 - May 30, 2020
Source: NC State University Libraries
Added: July 1, 2022
2020 article
Design Rule Checking with a CNN Based Feature Extractor
PROCEEDINGS OF THE 2020 ACM/IEEE 2ND WORKSHOP ON MACHINE LEARNING FOR CAD (MLCAD '20), pp. 9–14.
author keywords: Design Rule Checking; Machine Learning; IC Verification; Design for Manufacturing; Convolutional Neural Network; Deep Learning
TL;DR:
The proof of feasibility for a fast interactive DRC engine that could be used during layout is established and the proposed model consists of a convolutional neural network trained to detect DRC violations.
(via Semantic Scholar)
arxiv.org (repository)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 16, 2021
2020 conference paper
EDA Roadmap for Machine Learning & AI Standardization
Davis, W. R. (2020, January 30). EDA Roadmap for Machine Learning & AI Standardization. Panel Discussion, presented at the DesignCon, Santa Clara, CA.
Event: DesignCon at Santa Clara, CA on January 30, 2020
Source: NC State University Libraries
Added: July 1, 2022
2020 conference paper
How to write a compact reliability model with the Open Model Interface (OMI
2020 IEEE International Reliability Physics Symposium (IRPS). Presented at the 2020 IEEE International Reliability Physics Symposium (IRPS), Dallas, TX.
Event: 2020 IEEE International Reliability Physics Symposium (IRPS) at Dallas, TX on April 28 - May 30, 2020
TL;DR:
Semiconductor foundries became aware of this need, and one of them came up with an approach to modify model parameters through an interface to the simulator called the TMI, which was licensed to the Compact Model Coalition, which expanded and extended it, releasing it as Open Model Interface (OMI) to be used as a common platform for all foundries and model developers.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: July 1, 2022
2020 conference paper
System Level Power Analysis with UPM
Baker, A., Davis, W. R., Dhanwada, N., Frenkil, J., & Ratchkov, D. (2020, July 20). Virtual tutorial presented at the Design Automation Conference (DAC).
Event: Design Automation Conference (DAC) on July 20, 2020
Source: NC State University Libraries
Added: July 1, 2022
2019 journal article
3-D-DATE: A Circuit-Level Three-Dimensional DRAM Area, Timing, and Energy Model
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 66(2), 756–768.
author keywords: Dynamic random access memory (DRAM); area and energy and timing model; circuit level model
TL;DR:
3-D-DATE is presented, a circuit-level dynamic random access memory (DRAM) area, timing, and energy model that models both the front and back end of 3-D integrated DRAM designs from 90–16 nm, across a broader range of emerging transistor devices and through-silicon vias.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: February 18, 2019
2019 conference paper
Characterization of Fast, Accurate Leakage Power Models for IEEE P2416
20th International Symposium on Quality Electronic Design (ISQED). Presented at the 20th International Symposium on Quality Electronic Design (ISQED), Santa Clara, CA.
Event: 20th International Symposium on Quality Electronic Design (ISQED) at Santa Clara, CA on March 6-7, 2019
TL;DR:
This paper presents the leakage power-model characterization approach in detail in the context of a simple four-gate circuit in order to bring accurate power-modeling capability to system-level digital design tools.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: July 1, 2022
2019 conference paper
Development of FreePDK: An Open-Source Process Design Kit for Advanced Technology Nodes
Bhanushali, K., & Davis, W. R. (2019, March 14). Presented at the Free Silicon Conference (FSiC).
Event: Free Silicon Conference (FSiC) on March 14-16, 2019
Source: NC State University Libraries
Added: July 1, 2022
2019 conference paper
Estimating Pareto Optimum Fronts to Determine Knob Settings in Electronic Design Automation Tools
20th International Symposium on Quality Electronic Design (ISQED). Presented at the 20th International Symposium on Quality Electronic Design (ISQED), Santa Clara, CA.
Event: 20th International Symposium on Quality Electronic Design (ISQED) at Santa Clara, CA on March 6-7, 2019
TL;DR:
This paper describes the use of estimated Pareto optimal trade-off sets to provide designers with the capability of visualizing the results of EDA tool configuration settings, or “knobs”, that will offer an optimal post detail route design based on two design metrics, critical path length and core area.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: July 1, 2022
2019 conference paper
Is Your AI-based EDA Tool Production-Ready?
Davis, W. R. (2019, June 3). Panel discussion presented at the Design Automation Conference.
Event: Design Automation Conference on June 3, 2019
Source: NC State University Libraries
Added: July 1, 2022
2019 speech
OpenAccess Partitions: How Fast Can We Go?
Davis, W. R. (2019, October). Presented at the Si2 OpenAccess Live Forum.
Event: Si2 OpenAccess Live Forum on October 18, 2019
Source: NC State University Libraries
Added: July 1, 2022
2019 conference paper
OpenAccess Partitions: How Fast Can We Go?
Davis, W. R. (2019, June 5). Presented at the Design Automation Conference, Las Vegas, NV.
Event: Design Automation Conference at Las Vegas, NV on June 5, 2019
Source: NC State University Libraries
Added: July 1, 2022
2019 conference paper
Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages
2019 International 3D Systems Integration Conference (3DIC). Presented at the 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan.
Event: 2019 International 3D Systems Integration Conference (3DIC) at Sendai, Japan on October 8-10, 2019
TL;DR:
This paper presents thermal measurement data of GaN HEMT on CMOS heterogeneous integration (HI) using a Diverse Accessible Heterogeneous Integration (DAHI) process and thermal T3ster measurements, a product and service available from Mentor are presented.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: July 1, 2022
2018 speech
Physical Design of a Stacked Heterogeneous Multi-Core Processor
Davis, W. R. (2018, January). Presented at the ARM Research, Cambridge, UK.
Event: ARM Research at Cambridge, UK on January 22, 2018
Source: NC State University Libraries
Added: July 1, 2022
2017 conference paper
H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor
2017 IEEE International Conference on Computer Design (ICCD), 145–152.
Event: 2017 IEEE International Conference on Computer Design (ICCD) at Boston, MA on November 5-8, 2017
TL;DR:
The H3 chip is presented, that uses 3D die stacking and novel microarchitecture to implement a heterogeneous multi-core processor (HMP) with low-latency fast thread migration capabilities and can reduce power consumption of benchmarks by up to 26%.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2017 conference paper
Physical Design of a Stacked Heterogeneous Multi-Core Processor
Davis, W. R. (2017, September 19). Presented at the Oxford Circuits and Systems Conference, Oxford, UK.
Event: Oxford Circuits and Systems Conference at Oxford, UK on September 19, 2017
Source: NC State University Libraries
Added: July 1, 2022
2016 conference paper
Novel packaging and thermal measurement for 3D heterogeneous stacks
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing, Raleigh, NC.
Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing at Raleigh, NC on June 13-15, 2016
Sources: NC State University Libraries, NC State University Libraries, Crossref
Added: March 24, 2019
2016 conference paper
Physical Design of a 3D-Stacked Heterogeneous Multi-Core Processor
2016 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2016 IEEE International 3D Systems Integration Conference (3DIC), -San Francisco, CA.
Event: 2016 IEEE International 3D Systems Integration Conference (3DIC) at -San Francisco, CA on November 8-11, 2016
TL;DR:
This paper presents a 3D-SIC physical design methodology for a multi-core processor using commercial off-the-shelf tools and indicates an order of magnitude decrease in wirelengths for critical inter-core components in the 3D implementation compared to 2D implementations.
(via Semantic Scholar)
Sources: NC State University Libraries, Crossref, NC State University Libraries
Added: March 24, 2019
2016 conference paper
Thermal raman and IR measurement of heterogeneous integration stacks
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1505–1510.
Event: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) at Las Vegas, NV on May 31 - June 3, 2016
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2015 conference paper
Computing in 3D
2015 International 3D Systems Integration Conference (3DIC). Presented at the 10.1109/3DIC.2015.7334571, Sendai, Japan.
Event: 10.1109/3DIC.2015.7334571 at Sendai, Japan on August 31 - September 2, 2015
TL;DR:
The concept of Fast Thread Migration using 3DIC technologies is introduced and the design of a power optimized SIMD unit in which over half of the power is employed in the FP units is presented.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries, Crossref
Added: March 24, 2019
2015 chapter
FreePDK15: An Open-Source Predictive Process Design Kit for 15nm FinFET Technology
In ISPD '15: Proceedings of the 2015 Symposium on International Symposium on Physical Design (pp. 165–170).
Event: 2015 Symposium on International Symposium on Physical Design at Monterey, CA
TL;DR:
Design rules and layout guidelines for an open source predictive process design kit (PDK) for multi-gate 15nm FinFET devices and additional design rules are introduced considering process variability, and challenges involved in fabrication beyond 20nm.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: July 1, 2022
2015 journal article
Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks
2015 International 3D Systems Integration Conference (3DIC), 1–3.
Event: 2015 International 3D Systems Integration Conference (3DIC) at Sendai, Japan on August 31 - September 2, 2015
TL;DR:
Preliminary results are presented which examine the thermal performance of the integration of materials such as GaN, InP, SiGe, and Si and two methods for building up the model of a test chip are compared.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries, Crossref
Added: March 24, 2019
2014 journal article
Adaptive and Reliable Clock Distribution Design for 3-D Integrated Circuits
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(11), 1862–1870.
author keywords: 3-D integrated circuit (3-D IC); adaptive; clock distribution; deskew; optimization; process-voltage-temperature (PVT) variation; stacking; thermal profile; through-silicon-via (TSV); tunable-delay-buffer (TDB)
TL;DR:
A novel active deskew technique to adaptively mitigate the cross-tier variations and the 3-D wiring asymmetry is proposed and a thermal profile-based optimization flow is developed to further improve the power efficiency and reduce design overhead.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2014 chapter
Electrothermal Simulation of Three Dimensional Integrated Circuits
In R. Sharma (Ed.), Design of 3D Integrated Circuits and Systems. Boca Raton, FL: CRC Press.
Ed(s): R. Sharma
Source: NC State University Libraries
Added: July 1, 2022
2014 conference paper
Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC
2014 IEEE International Conference on IC Design & Technology. Presented at the 2014 IEEE International Conference on IC Design & Technology (ICICDT).
Event: 2014 IEEE International Conference on IC Design & Technology (ICICDT)
TL;DR:
A CAD flow and associated framework called Pathfinder3D is presented, which facilitates physically-aware system-level thermal simulation of 3DICs and facilitates early thermal evaluation of possible 3D design choices and thermal management techniques.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries, Crossref
Added: August 6, 2018
2014 journal article
Thermal Pathfinding for 3-D ICs
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(7), 1159–1168.
author keywords: 3-D IC; electronic system-level (ESL); electrothermal simulation; pathfinding; through-silicon via (TSV); transaction-level simulation
TL;DR:
A pathfinding flow that integrates SystemC transaction-level electrical and dynamic thermal simulations to pass complex physical constraints to system architects in a convenient form is presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2014 conference paper
Towards a Standard Flow for System Level Power Modeling
2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD). Presented at the 2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, CA.
Event: 2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) at San Jose, CA on November 2-6, 2014
TL;DR:
This presentation will begin with an overview of existing gate level power modeling capabilities, using the Liberty modeling language as the example, and requirements beyond the existing gatelevel capabilities will be described.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: July 9, 2022
2013 conference paper
Applications and design styles for 3DIC
2013 IEEE International Electron Devices Meeting. Presented at the 2013 IEEE International Electron Devices Meeting, Washington, DC.
Event: 2013 IEEE International Electron Devices Meeting at Washington, DC on December 9-11, 2013
TL;DR:
3D technologies offer significant potential to improve raw performance and performance per unit power and the next frontier is to create more sophisticated solutions that promise further increases in power/performance beyond those attributable to memory interfaces alone.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries, Crossref
Added: March 24, 2019
2013 conference paper
Design of controller for L2 cache mapped in Tezzaron stacked DRAM
2013 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA.
Event: 2013 IEEE International 3D Systems Integration Conference (3DIC) at San Francisco, CA on October 2-4, 2013
TL;DR:
This paper investigates the implementation of such a cache controller using 3-layer 256 MB Tezzaron Octopus stacked DRAM, which provides a fast data access through burst-4 and burst-8 mode and has a low hit latency.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Exploring early design tradeoffs in 3DIC
2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549.
Event: 2013 IEEE International Symposium on Circuits and Systems (ISCAS) at Beijing, China on May 19-23, 2013
TL;DR:
This paper explores some of the approaches to creating 3D specific designs and the CAD tools that can help in that exploration, together with early results from a thermal pathfinding tool.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Hetero(2) 3d integration: A scheme for optimizing efficiency/cost of chip multiprocessors
Proceedings of the fourteenth international symposium on quality electronic design (ISQED 2013), 1–7.
Event: International Symposium on Quality Electronic Design (ISQED) at Santa Clara, CA on March 4-6, 2013
TL;DR:
This work proposes exploiting two complementary forms of heterogeneity to profitably exploit an immature technology for Chip Multiprocessors (CMP): 3D integration facilitates a technology alloy and application and microarchitectural heterogeneity is exploited to compensate for lower efficiency of old-technology cores.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Rationale for a 3D heterogeneous multi-core processor
2013 IEEE 31st International Conference on Computer Design (ICCD), 154–168.
Event: 2013 IEEE 31st International Conference on Computer Design (ICCD) at Asheville, NC on October 6-9, 2013
TL;DR:
Single-ISA heterogeneous multi-core processors are comprised of multiple core types that are functionally equivalent but microarchitecturally diverse.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries, Crossref
Added: March 24, 2019
2012 journal article
A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2(4), 660–667.
author keywords: 3DIC; electrothermal effects; thermal management; transient analysis
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2012 journal article
Area-Efficient Antenna-Scalable MIMO Detector for K-best Sphere Decoding
JOURNAL OF SIGNAL PROCESSING SYSTEMS FOR SIGNAL IMAGE AND VIDEO TECHNOLOGY, 68(2), 171–182.
author keywords: MIMO; K-best; Sphere decoder; VLSI
TL;DR:
A reconfigurable in-place architecture that is scalable to an arbitrary number of antennas at run-time, while reducing area significantly compared with other sphere decoders, and to improve the throughput of the in-place architecture without any degradation in BER performance is proposed.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2012 journal article
Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels
IET Circuits, Devices & Systems, 6(1), 35.
TL;DR:
The macromodel-based methodology enables robust and significantly faster dynamic electrothermal simulation over the long times required for thermal transients to subside and results in significant speed-up over transistor-level simulation for large-scale circuits.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Crossref, NC State University Libraries
Added: February 24, 2020
2012 journal article
Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.
TL;DR:
This paper presents a resistive mesh-based approach that improves on the fidelity of prior approaches by constructing a thermal model of the full structure of 3DICs, including the interconnect, and introduces a method for dividing the thermal response caused by a heat load into a high fidelity “near response” and a lower fidelity” in order to implement Power Blurring high definition (HD).
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2012 journal article
Leakage Power Contributor Modeling
IEEE DESIGN & TEST OF COMPUTERS, 29(2), 71–78.
TL;DR:
An alternative “power contributor”based approach to cell leakage characterization that exploits inherent separability of power consumption for different portions of a cell is described.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2012 conference paper
Modeling Power Variability (from Small to Large
Davis, W. R. (2012, October 9). Presented at the Silicon Integration Inititative (Si2) Conference.
Event: Silicon Integration Inititative (Si2) Conference on October 9, 2012
Source: NC State University Libraries
Added: July 1, 2022
2012 journal article
Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 31(10), 1522–1535.
author keywords: Delay element; electrothermal simulation; multicore; multiphysics; parallel simulation; parallelization; transient simulation
TL;DR:
A parallel delay-based iterative approach for interfacing delay-partitioned subcircuits is applied, which achieves the reasonable accuracy of nonparallel circuit simulation if both incorporate the same interblock delay.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2012 journal article
Pathfinder 3D: A Flow for System-Level Design Space Exploration
2011 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan.
Event: 2011 IEEE International 3D Systems Integration Conference (3DIC) at Osaka, Japan on January 31 - February 2, 2011
TL;DR:
A flow for fast system-level exploration useful for path finding studies and a free open source design kit compiler, FreePDK3D45, and a tool for fast floorplan evaluation of TSV-based digital architectures, Pathfinder3D.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries, Crossref
Added: March 24, 2019
2011 conference paper
3D specific systems: Design and CAD
2011 Asian Test Symposium, 470–473.
Event: 2011 Asian Test Symposium at New Delhi, India on November 20-23, 2011
author keywords: 3DIC; 3D IC; three dimensional IC; TSV; stacked memory; memory on logic; FFT
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2011 conference paper
Adaptive clock distribution for 3D integrated circuits
2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, 91–94.
Event: 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems at San Jose, CA on October 23-26, 2011
TL;DR:
A robust tunable-delay-buffer circuit and a novel active de-skew method are developed in order to handle the cross-die variations, thermal gradients, and wiring asymmetry in 3D ICs.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2011 conference paper
An energy-efficient 64-QAM MIMO detector for emerging wireless standards
2011 Design, Automation & Test in Europe. Presented at the 2011 Design, Automation & Test in Europe, Grenoble, France.
Event: 2011 Design, Automation & Test in Europe at Grenoble, France on March 14-18, 2011
TL;DR:
A new architecture for the K-best detector is proposed, which unlike the popular multi-stage architecture used for K- best detectors, implements just one core and reduces the total power consumption by 27%, without any noticeable performance degradation.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: July 9, 2022
2011 speech
Architecture, Design, and CAD for 3D-ICs
Davis, W. R. (2011, October). Presented at the Institute of Microelectronics, Agency for Science, Technology, and Research (A*STAR), Singapore.
Event: Institute of Microelectronics, Agency for Science, Technology, and Research (A*STAR) at Singapore on October 3, 2011
Source: NC State University Libraries
Added: July 1, 2022
2011 journal article
Coordinating 3D designs: Interface IP, standards or free form?
2011 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan.
Event: 2011 IEEE International 3D Systems Integration Conference (3DIC) at Osaka, Japan on January 31 - February 2, 2011
TL;DR:
This paper proposes that 3D chip stack management should be managed through an Interface IP approach Design blocks with associated properties that not only supports signaling and power delivery but also constraints that must be managed between chips both during design but also in-situ and as part of physical verification.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries, Crossref
Added: March 24, 2019
2011 chapter
Design and Computer Aided Design of 3DIC
In A. Sheibanyrad, F. Pétrot, & A. Jantsch (Eds.), 3D Integration for NoC-based SoC Architectures. Integrated Circuits and Systems (pp. 75–88).
Ed(s): A. Sheibanyrad, F. Pétrot & A. Jantsch
TL;DR:
This chapter reviews the process of 3DIC designing exploiting Through Silicon Via (TSV) technology and introduces the notion of re-architecting systems explicitly to exploit high density TSV processes.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2011 chapter
Predictive Process Design Kits
In Y. Cao (Ed.), Predictive Technology Model for Robust Nanoelectronic Design. Integrated Circuits and Systems (pp. 121–140).
Ed(s): Y. Cao
TL;DR:
For nearly half a century, semiconductor technology has continued to deliver exponential growth in the number of transistors on a chip, but the cracks are showing in the industry’s armor.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2011 conference paper
Test & Reliability Challenges in 3D NoCs
Davis, W. R. (2011, June 5). Test & Reliability Challenges in 3D NoCs. Presented at the Design Automation Conference (DAC) Workshop on Diagnostic Services in Networks-on-Chip: Test, Debug, & On-Line Monitoring.
Event: Design Automation Conference (DAC) Workshop on Diagnostic Services in Networks-on-Chip: Test, Debug, & On-Line Monitoring on June 5, 2011
Source: NC State University Libraries
Added: July 1, 2022
2011 journal article
Three-dimensional SRAM design with on-chip access time measurement
ELECTRONICS LETTERS, 47(8), 485–486.
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2010 conference paper
A Low-Area Flexible MIMO Detector for WiFi/WiMAX Standards
2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010). Presented at the 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010), Dresden, Germany.
Event: 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) at Dresden, Germany on March 8-12, 2010
TL;DR:
A very low area reconfigurable MIMO detector which achieves a high throughput of 103Mbps and uses 27 Kilo Gates when implemented in a commercial 180nm CMOS process.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: July 9, 2022
2010 conference paper
Algorithm and hardware complexity reduction techniques for k-best sphere decoders
GLSVLSI '10: Proceedings of the 20th symposium on Great lakes symposium on VLSI, 471–476.
Event: Great Lakes Symposium on VLSI (GLSVLSI
TL;DR:
This work introduces three techniques to reduce the power consumption of MIMO detectors and increase their data rate, and decreases the complexity of the K-best sphere decoder effectively by using the MMSE-SQRD channel processing technique.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: July 9, 2022
2010 conference paper
Creating 3D Specific Systems: Architecture, Design and CAD
International Symposium on Microelectronics, 2010(1), 23–27.
Event: Intlernational Microelectronics and Packaging Society (iMAPS) Symposium at Raleigh, NC
TL;DR:
This abstract explores application drivers, design and CAD for 3D ICs, and critical areas that need better solutions are explored, including design planning, test management, and thermal management.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: July 9, 2022
2010 conference paper
Creating 3D Specific Systems: Architecture, Design, and CAD
2010 Design, Automation & Test in Europe Conference & Exhibition, 1684–1688.
Event: 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) at Dresden, Germany on March 8-12, 2010
Sources: NC State University Libraries, NC State University Libraries, Crossref
Added: March 24, 2019
2010 conference paper
Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICs
Melamed, S., Thorolfsson, T., Srinivasan, A., Cheng, E., Franzon, P., & Davis, W. R. (2010, October). Presented at the International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Event: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) on October 6-8, 2010
Source: NC State University Libraries
Added: July 1, 2022
2010 journal article
Low Power Hypercube Divided Memory FFT Engine Using 3D Integration
ACM Transactions on Design Automation of Electronic Systems, 16(1), 1–25.
author keywords: Design; 3DIC; scaling; TSV; FFT
TL;DR:
A floating point FFT processor is demonstrated that leverages both 3D integration and a unique hypercube memory division scheme to reduce the power consumption of a 1024 point F FT down to 4.227μJ.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2010 conference paper
Modeling Layout-Dependent Stress Effects: Opportunities for OpenDFM
Davis, W. R. (2010, June 13). Presented at the Design Automation Conference (DAC) Open Design-for-Manufacturability (OpenDFM) Workshop.
Event: Design Automation Conference (DAC) Open Design-for-Manufacturability (OpenDFM) Workshop on June 13, 2010
Source: NC State University Libraries
Added: July 1, 2022
2010 conference paper
Thermal Adaptive Clock Design for 3D Integrated Circuits
Chen, X., & Davis, W. R. (2010, September 13). Presented at the Semiconductor Research Corporation (SRC) TECHCON.
Event: Semiconductor Research Corporation (SRC) TECHCON on September 13-14, 2010
Source: NC State University Libraries
Added: July 1, 2022
2010 conference paper
Thermal analysis and verification of a mounted monolithic integrated circuit
Proceedings of the IEEE SoutheastCon 2010 (SoutheastCon), 37–40.
Event: IEEE SoutheastCon 2010 (SoutheastCon) at Concord, NC on March 18-21, 2010
author keywords: MMIC; electrothermal; heat transfer; simulators; compact modeling; fREEDA
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(Web of Science; OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2009 journal article
Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 17(4), 496–506.
author keywords: Fast Fourier transform (FFT); first-in first-out (FIFO); ternary content-addressable memory (TCAM); 3-D integrated circuit (IC)
TL;DR:
This paper presents physical-design case studies of ternary content-addressable memories, first-in first-out (FIFO) memories, and a 8192-point fast Fourier transform (FFT) processor in order to quantify the benefit of the through-silicon vias in an available 180-nm 3-D process.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2009 journal article
Automated Design Space Exploration for DSP Applications
JOURNAL OF SIGNAL PROCESSING SYSTEMS FOR SIGNAL IMAGE AND VIDEO TECHNOLOGY, 56(2-3), 199–216.
author keywords: Hardware design; VLSI; Synthesis; RTL; Area; Throughput; Power dissipation; DSP; FIR filter
TL;DR:
This work aims at performing hardware optimizations at the architectural and arithmetic levels, relieving the user from manually describing the designs at the register transfer level and iteratively varying the hardware structures.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2009 conference paper
Delay analysis and design exploration for 3D SRAM
2009 IEEE International Conference on 3d Systems Integration, 244–247.
TL;DR:
This paper presents a physical based delay analysis approach to explore 3D SRAM design options and shows that the optimized 3D sub-array provides up to 20% extra improvement for SRAM access time reduction.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2009 conference paper
High-Throughput Low-Complexity MIMO Detector Based on K-Best Algorithm
GLSVLSI '09: Proceedings of the 19th ACM Great Lakes symposium on VLSI, 451–456.
Event: Great Lakes Symposium on VLSI (GLSVLSI on May 10-12, 2009
Source: NC State University Libraries
Added: July 9, 2022
2009 conference paper
Junction-level thermal extraction and simulation of 3DICs
2009 IEEE International Conference on 3d Systems Integration, 395–401.
Event: 2009 IEEE International Conference on 3D System Integration at San Francisco, CA on September 28-30, 2009
TL;DR:
It was found that lowering the simulation resolution and using composite thermal conductivities failed to accurately predict the location of these tentpoles, so large isolated temperature spikes were found near groups of clock buffers at the edge of the SRAMs on the middle tier.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2009 journal article
Parallel merge algorithm for high-throughput signal processing applications
ELECTRONICS LETTERS, 45(3), 188–189.
TL;DR:
A parallel merge algorithm is proposed that results in a smaller critical-path delay than all of the other merge algorithms explored, which effectively increases the throughput of VLSI signal processing systems.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2009 speech
Prototyping in 3D-ICs: Design Flow Needs
Davis, W. R. (2009, October). Presented at the Silicon Integration Inititative (Si2) and Global Semiconductor Association (GSA) Workshop on Requirements for 3D Design Flow Interoperability Standards.
Event: Silicon Integration Inititative (Si2) and Global Semiconductor Association (GSA) Workshop on Requirements for 3D Design Flow Interoperability Standards on October 1, 2009
Source: NC State University Libraries
Added: July 1, 2022
2009 speech
Save Your Energy: A Fast and Accurate Approach to NoC Power Estimation
Mineo, C., & Davis, W. R. (2009, February). Presented at the Workshop on 3D Integration and Interconnect-Centric Architectures (in conjunction with the International Symposium on High Performance Computer Architecture.
Event: Workshop on 3D Integration and Interconnect-Centric Architectures (in conjunction with the International Symposium on High Performance Computer Architecture on February 15, 2009
Source: NC State University Libraries
Added: July 1, 2022
2009 speech
The Benefits of 3D Networks-on-Chip
Davis, W. R. (2009, December). Presented at the Silicon Integration Initiative (Si2) Low-Power Coalition Technical Steering Group Web-Meeting.
Event: Silicon Integration Initiative (Si2) Low-Power Coalition Technical Steering Group Web-Meeting on December 10, 2009
Source: NC State University Libraries
Added: July 1, 2022
2009 conference paper
The Benefits of 3D networks-on-chip as shown with LDPC decoding
2009 IEEE International Conference on 3d Systems Integration, 89–96.
TL;DR:
The core is a fast, high level transaction-based NoC simulator, which accesses carefully compiled power, timing, and area models for basic NoC componets built from detailed circuit simulation.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2008 conference paper
An 8192-point Fast Fourier Transform 3D-IC Case Study
2008 51st Midwest Symposium on Circuits and Systems, 438–441.
Event: 2008 51st Midwest Symposium on Circuits and Systems at Knoxville, TN on August 10-13, 2008
TL;DR:
This paper presents a case studies of an 8192-point fast Fourier transform (FFT) processor in order to quantify the benefit of the through-silicon vias in an available 180 nm 3D process.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries, Crossref
Added: March 24, 2019
2008 speech
An Architecture Evaluator for Three-Dimensional Integrated Circuits
Davis, W. R. (2008, May). Presented at the Stanford University ECE Department Seminar.
Event: Stanford University ECE Department Seminar on May 22, 2008
Source: NC State University Libraries
Added: July 1, 2022
2008 conference paper
An Efficient VLSI Implementation for the 1D Convolutional Discreet Wavelet Transform
2008 51st Midwest Symposium on Circuits and Systems. Presented at the 2008 51st Midwest Symposium on Circuits and Systems, Knoxville, TN.
Event: 2008 51st Midwest Symposium on Circuits and Systems at Knoxville, TN on August 10-13, 2008
TL;DR:
The proposed architecture combines several optimizations that improve the performance of the hardware design in terms of throughput and power dissipation and an analytical comparison with other existing DWT implementations illustrates a two fold improvement in throughput.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2008 speech
Automation and Back-End Design within the FreePDK OpenAccess 45nm PDK and Cell Libraries for University Flows
Davis, W. R. (2008, June). Presented at the Semiconductor Research Corporation (SRC) e-Workshop.
Event: Semiconductor Research Corporation (SRC) e-Workshop on June 26, 2008
Source: NC State University Libraries
Added: July 1, 2022
2008 conference paper
Computer-Aided Design and Application Exploration for 3D Integrated Circuits
Proceedings of the Government Microcircuit Applications & Critical Technology (GOMACTech) Conference. Presented at the Government Microcircuit Applications & Critical Technology (GOMACTech) Conference.
Event: Government Microcircuit Applications & Critical Technology (GOMACTech) Conference on March 17-20, 2008
Source: NC State University Libraries
Added: July 1, 2022
2008 conference paper
Design and CAD for 3D Integrated Circuits
DAC '08: Proceedings of the 45th annual Design Automation Conference, 668–673.
Event: Design Automation Conference (DAC)
TL;DR:
This paper presents several case studies that are uniquely enhanced through 3D implementation, including a 3D CAM, an FFT processor, and a SAR processor, which requires higher fidelity thermal modeling than 2DIC design.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries, Crossref
Added: March 24, 2019
2008 speech
FreePDK: A Free OpenAccess 45nm PDK and Cell Library for Universities
Davis, W. R. (2008, October). Presented at the Semiconductor Research Corporation (SRC) e-Workshop.
Event: Semiconductor Research Corporation (SRC) e-Workshop on October 3, 2008
Source: NC State University Libraries
Added: July 1, 2022
2008 conference paper
Inter-Die Signaling in Three Dimensional Integrated Circuits
2008 IEEE Custom Integrated Circuits Conference. Presented at the 008 IEEE Custom Integrated Circuits Conference, San Jose, CA.
Event: 008 IEEE Custom Integrated Circuits Conference at San Jose, CA on September 21-24, 2008
TL;DR:
This work discusses a three dimensional network on chip (3D NoC) fabricated in the 0.18 mum MIT Lincoln Laboratories 3D FDSOI 1.5 V process, and establishes the need for a 3D network simulator to quantify the advantage 3D circuit implementations have over 2D.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2007 journal article
3D Interconnect Device Design: Theory vs. Reality
Future Fab International, (23), 38–40.
Source: NC State University Libraries
Added: July 1, 2022
2007 speech
3D-IC Design: Theory vs. Reality
Davis, W. R. (2007, June). Presented at the University of Utah ECE Department Seminar, Salt Lake City, UT.
Event: University of Utah ECE Department Seminar at Salt Lake City, UT on June 21, 2007
Source: NC State University Libraries
Added: July 1, 2022
2007 conference paper
An Architecture for Energy Efficient Sphere Decoding
ISLPED '07: Proceedings of the 2007 international symposium on Low power electronics and design, 244–249.
Event: International Symposium on Low Power Electronics and Design (ISLPED on August 27-29, 2007
TL;DR:
This work proposes an improved architecture that aims to exploit a combination of a deeper pipeline and the use of single-port read and write memories to increase the energy efficiency ofSphere decoding.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: July 9, 2022
2007 conference paper
Design for 3D Integration and Applications
2007 International Symposium on Signals, Systems and Electronics, 263–266,
Event: 2007 International Symposium on Signals, Systems and Electronics at Montreal, Quebec, Canada on July 30 - August 2, 2007
TL;DR:
This paper explores application drivers and computer aided design (CAD) for 3D ICs in order to provide system advantages equivalent to up to two technology nodes of scaling.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries, Crossref
Added: March 24, 2019
2007 conference paper
Designing FIFO Buffers using 3DIC Technology
VLSI Multilevel Interconnection (VMIC) Conference, 267–272.
Event: VLSI Multilevel Interconnection (VMIC) Conference on September 25-28, 2007
Source: NC State University Libraries
Added: July 1, 2022
2007 speech
Energy-Efficient Sphere Decoding (and other research efforts
Davis, W. R. (2007, September). Presented at the DARPA/OSD Trusted Foundry Circuit Designers Meeting, Essex Junction, VT.
Event: DARPA/OSD Trusted Foundry Circuit Designers Meeting at Essex Junction, VT on September 13, 2007
Source: NC State University Libraries
Added: July 1, 2022
2007 conference paper
FreePDK: An Open Source, OpenAccess Design Kit
Davis, W. R. (2007, November 5). Presented at the OpenAccess Conference.
Event: OpenAccess Conference on November 5, 2007
Source: NC State University Libraries
Added: July 1, 2022
2007 conference paper
FreePDK: An Open-Source Variation-Aware Design Kit
2007 IEEE International Conference on Microelectronic Systems Education (MSE'07). Presented at the 2007 IEEE International Conference on Microelectronic Systems Education (MSE'07), San Diego, CA.
Event: 2007 IEEE International Conference on Microelectronic Systems Education (MSE'07) at San Diego, CA on June 3-4, 2007
TL;DR:
An open source, variation aware Process Design Kit (PDK), based on Scalable CMOS design rules, down to 45 nm, for use in VLSI research, education and small businesses is discussed.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(OpenAlex)
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries, Crossref
Added: March 24, 2019
2006 conference paper
Architecture for Energy Efficient Sphere Decoding
2006 IEEE International SOC Conference, 267–270.
Event: 2006 IEEE International SOC Conference at Austin, TX on September 24-27, 2006
TL;DR:
An improved architecture forSphere Decoding is provided which aims to increase overall energy efficiency (b/s/mW) of the decoder and is based on a novel implementation which combines the use of a deeply pipelined data-path and "multi symbol vector" based approach to exploit the pipeline.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
11. Sustainable Cities and Communities
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2006 chapter
Automated Architectural Exploration for Signal Processing Algorithms
In 2006 IEEE Workshop on Signal Processing Systems Design and Implementation (pp. 274–279,).
Event: 2006 IEEE Workshop on Signal Processing Systems Design and Implementation at Banff, AB, Canada on October 2-4, 2006
TL;DR:
This paper presents the view of a framework that combines common electronic design automation (EDA) tools to alleviate the designer from manually constructing the hardware models and analyzing their performance, and uses this framework to efficiently implement design optimizations that improve the performance of the overall hardware architectures.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2006 conference paper
Breaking Rent’s Rule: Opportunities for 3D Interconnect Networks
VLSI Multilevel Interconnection (VMIC) Conference, 228–233.
Event: VLSI Multilevel Interconnection (VMIC) Conference on September 26-28, 2006
Source: NC State University Libraries
Added: July 1, 2022
2006 conference paper
Compact Electrothermal Modeling of an X-band MMIC
2006 IEEE MTT-S International Microwave Symposium Digest, 651–654.
Event: 2006 IEEE MTT-S International Microwave Symposium at San Francisco, CA on June 11-16, 2006
author keywords: MMIC; electrothermal effects; circuit simulation; modeling
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(Web of Science; OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2006 speech
Demystifying 3D ICs: The Pros and Cons of Going Vertical
Davis, W. R. (2006, April). Presented at the Virginia Tech ECE Department Seminar, Blacksburg, VA.
Event: Virginia Tech ECE Department Seminar at Blacksburg, VA on April 14, 2006
Source: NC State University Libraries
Added: July 1, 2022
2006 conference paper
Exploring Compromises among Timing, Power and Temperature in Three-Dimensional Integrated Circuits
DAC '06: Proceedings of the 43rd annual Design Automation Conference, 997–1002.
Event: Design Automation Conference (DAC)
TL;DR:
Physical design experiments were performed on a low-power and a high-performance design in an existing 3DIC technology, and it is shown that thermal-vias offer no performance benefit for the low- power system and only marginal benefit forThe high- performance system.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: July 9, 2022
2006 conference paper
Performance Trend in Three-Dimensional Integrated Circuits
2006 International Interconnect Technology Conference, 45–47.
Event: 2006 International Interconnect Technology Conference at Burlingame, CA on June 5-7, 2006
TL;DR:
This work develops an automated design flow with 2D CAD tools to design 3DICs with the MIT Lincoln Lab 0.18mum three-tier fully depleted silicon on insulator (FDSOI) process, showing that the performance of3DIC shows up to two-generation advantage over its 2D counterpart with only three tiers.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: July 9, 2022
2006 speech
Tool Integration for Signal Processing Architectural Exploration
Hourani, R., Jenkal, R., Davis, R., & Alexander, W. (2006, April). Presented at the Electronic Design Process (EDP) Workshop.
Event: Electronic Design Process (EDP) Workshop
Source: NC State University Libraries
Added: July 1, 2022
2005 journal article
Demystifying 3D ICs: The procs and cons of going vertical
IEEE DESIGN & TEST OF COMPUTERS, 22(6), 498–510.
TL;DR:
A practical introduction to the design trade-offs of the currently available 3D IC technology options is provided, with an analysis relating the number of transistors on a chip to the vertical interconnect density using estimates based on Rent's rule.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2005 conference paper
OpenAccess Tools for 3D Integration
Davis, W. R. (2005, November 10). Presented at the OpenAccess Conference, San Jose, CA.
Event: OpenAccess Conference at San Jose, CA on November 10, 2005
Source: NC State University Libraries
Added: July 1, 2022
2005 conference paper
Pre-route Net Classing for Crosstalk Avoidance
Hua, H., Sule, A., Mineo, C., & Davis, W. R. (2005, September 12). Presented at the Cadence Designer Network Live Conference (CDNLive), San Jose, CA.
Event: Cadence Designer Network Live Conference (CDNLive) at San Jose, CA on September 12-13, 2005
Source: NC State University Libraries
Added: July 1, 2022
2005 conference paper
Wire-Delay Reduction Analysis of a 3-Tier, 8-Point Fast Fourier Transform 3D-IC
VLSI Multilevel Interconnection (VMIC) Conference, 474–479.
Event: VLSI Multilevel Interconnection (VMIC) Conference
Source: NC State University Libraries
Added: July 1, 2022
2004 conference paper
Multi-Parameter Power Minimization of Synthesized Datapaths
IEEE Computer Society Annual Symposium on VLSI, 151–157.
Event: IEEE Computer Society Annual Symposium on VLSI at Lafayette, LA on February 19-20, 2004
TL;DR:
The possibility of using convex optimization to solve the multi-parameter optimization problem is explored and a case-study of an 8-bit multiply-accumulate block, which is optimized in 250nm and 70nm technologies is presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2003 journal article
500 Mb/s Soft Output Viterbi Decoder
IEEE Journal of Solid State Circuits, 38(7), 1234–1241.
author keywords: iterative decoders; turbo codes; Viterbi decoder; VLSI
TL;DR:
Two 8-state, 7-bit soft output Viterbi decoders matched to an EPR4 channel and a rate-8/9 convolutional code are implemented in 0.18µm CMOS technology, which has been demonstrated to achieve information rates very close to the Shannon limit.
(via Semantic Scholar)
Source: Web Of Science
Added: July 9, 2022
2003 conference paper
Automated Design Flows for High-Performance Systems
Davis, W. R. (2003, February 11). Presented at the OpenAccess Conference, San Jose, CA.
Event: OpenAccess Conference at San Jose, CA on February 11, 2003
Source: NC State University Libraries
Added: July 1, 2022
2003 conference paper
Getting High-Performance Silicon from System-Level Design
IEEE Computer Society Annual Symposium on VLSI, 2003. Proceedings., 238–243.
Event: IEEE Computer Society Annual Symposium on VLSI at Tampa, FL on February 20-21, 2003
TL;DR:
This paper presents a brief summary of Platform-based design, SystemC, and Chip-in-a-day, in order to propose that more system-level abstraction of physical performance is needed to make these techniques more useful.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2003 chapter
Real-Time System-on-a-Chip Emulation
In G. Martin & H. Chang (Eds.), Winning the SoC Revolution (pp. 229–253).
Ed(s): G. Martin* & H. Chang *
TL;DR:
A comprehensive design flow for digital systems from high-level algorithmic specifications to FPGA-based emulation and final ASIC implementation is presented, enabling rapid system development and easing the verification burden.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: July 9, 2022
2003 speech
System-Level Design: Past, Present, and Future
Davis, W. R. (2003, February). Presented at the University of Tennessee ECE Department Seminar, Knoxville, TN.
Event: University of Tennessee ECE Department Seminar at Knoxville, TN
Source: NC State University Libraries
Added: July 1, 2022
2002 conference paper
500 Mb/s Soft Output Viterbi Decoder
European Solid-State Circuits Conference (ESSCIRC), 523–526,
Event: European Solid-State Circuits Conference (ESSCIRC)
Source: NC State University Libraries
Added: July 1, 2022
2002 journal article
A Design Environment for High-Throughput, Low-Power Dedicated Signal Processing Systems
IEEE Journal of Solid State Circuits, 37(3), 420–431.
author keywords: application specific integrated circuits; design automation; design methodology; integrated circuit design; parallel architectures; system analysis and design
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2002 thesis
A Hierarchical, Automated Design Flow for Low-Power, High-Throughput Digital Signal Processing IC’s
(PhD Thesis). Electrical Engineering Department, University of California, Berkeley.
Source: NC State University Libraries
Added: July 1, 2022
2002 conference paper
Implementation of high throughput soft output viterbi decoders
IEEE Workshop on Signal Processing Systems, 146–151.
Event: IEEE Workshop on Signal Processing Systems at San Diego, CA on October 16-18, 2002
TL;DR:
The architectural considerations for VLSI implementations of soft output Viterbi decoders are presented, and structural transformation of the add-compare-select structures provides high throughput with small area overhead.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2001 conference paper
A Design Environment for High Throughput, Low Power Dedicated Signal Processing Systems
Proceedings of the IEEE 2001 Custom Integrated Circuits Conference, 545–548.
Event: IEEE 2001 Custom Integrated Circuits Conference at San Diego, CA on May 9, 2001
TL;DR:
A hierarchical automated design flow for low-energy direct-mapped signal processing integrated circuits is presented, and automatic characterization of layout improves system-level estimates.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
2001 conference paper
An Automated Design Flow for Low-Power, High-Throughput Dedicated Signal Processing Systems
Conference Record of Thirty-Fifth Asilomar Conference on Signals, Systems and Computers, 475–480.
Event: Thirty-Fifth Asilomar Conference on Signals, Systems and Computers at Pacific Grove, CA on November 4-7, 2001
TL;DR:
A system-level perspective of a hierarchical automated design flow for low-energy direct-mapped signal processing integrated circuits and a detailed example of the design process for a DS SS TDMA baseband receiver are presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Source: Web Of Science
Added: July 9, 2022
2001 speech
An Automated Design Flow for Low-Power, High-Throughput Dedicated Signal Processing Systems
Davis, W. R. (2001, December). Presented at the MathWorks, Inc. seminar Innovation First: System Level Design for DSP and Communications, Waltham, MA.
Event: MathWorks, Inc. seminar Innovation First: System Level Design for DSP and Communications at Waltham, MA on December 4, 2001
Source: NC State University Libraries
Added: July 1, 2022
2001 speech
Design Technology for Low Power Radio Systems
Davis, W. R. (2001, September). Presented at the Computer Aided Network Design Workshop (CANDE), Grand Teton, WY.
Event: Computer Aided Network Design Workshop (CANDE) at Grand Teton, WY on September 20-22, 2001
Source: NC State University Libraries
Added: July 1, 2022
2001 conference paper
Wireless systems-on-a-chip design
2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers, 45–48.
Event: 2001 International Symposium on VLSI Technology, Systems, and Applications. at Hsinchu, Taiwan
TL;DR:
A design infrastructure which achieves this is described, which has a particular emphasis on methods for high level specification and estimation, that provides a fully automated chip design flow.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: July 9, 2022
Employment
Updated: November 12th, 2020 11:53
2015 - present
North Carolina State University Raleigh, North Carolina, US
Professor
Electrical and Computer Engineering
2008 - 2015
North Carolina State University Raleigh, North Carolina, US
Associate Professor
Electrical and Computer Engineering
2002 - 2008
North Carolina State University Raleigh, North Carolina, US
Assistant Professor
Electrical and Computer Engineering
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