Xin Zhao

Works (1)

Updated: September 29th, 2025 08:11

2016 article

Design, package, and hardware verification of a high voltage current switch

De, A., Morgan, A., Iyer, V. M., Ke, H., Zhao, X., Vechalapu, K., … Hopkins, D. C. (2016, March 1). Apec 2016 31st Annual Ieee Applied Power Electronics Conference and Exposition, pp. 295–302.

By: A. De n, A. Morgan n, V. Iyer  n, H. Ke n, X. Zhao n, K. Vechalapu n, S. Bhattacharya n , D. Hopkins n 

Contributors: A. De n, A. Morgan n, V. Iyer  n, H. Ke n, X. Zhao n, K. Vechalapu n, S. Bhattacharya n , D. Hopkins n 

topics (OpenAlex): Silicon Carbide Semiconductor Technologies; Electromagnetic Compatibility and Noise Suppression; Multilevel Inverters and Converters
TL;DR: Detailed design considerations for packaging an HV current switch module are enumerated to minimize the parasitic inductance and low-voltage and HV converter prototypes are developed and tested to ensure thermal stability. (via Semantic Scholar)
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: NC State University Libraries, ORCID, NC State University Libraries
Added: August 6, 2018

Citation Index includes data from a number of different sources. If you have questions about the sources of data in the Citation Index or need a set of data which is free to re-distribute, please contact us.

Certain data included herein are derived from the Web of Science© and InCites© (2026) of Clarivate Analytics. All rights reserved. You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.