Xin Zhao

Works (1)

Updated: April 11th, 2023 10:13

2016 conference paper

Design, package, and hardware verification of a high voltage current switch

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, 2016-May, 295–302.

By: A. De n, A. Morgan n, V. Iyer  n, H. Ke n, X. Zhao n, K. Vechalapu n, S. Bhattacharya n , D. Hopkins n 

Contributors: A. De n, A. Morgan n, V. Iyer  n, H. Ke n, X. Zhao n, K. Vechalapu n, S. Bhattacharya n , D. Hopkins n 

TL;DR: Detailed design considerations for packaging an HV current switch module are enumerated to minimize the parasitic inductance and low-voltage and HV converter prototypes are developed and tested to ensure thermal stability. (via Semantic Scholar)
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Sources: NC State University Libraries, ORCID, NC State University Libraries
Added: August 6, 2018

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