Works (5)

Updated: April 11th, 2023 10:13

2016 conference paper

Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module

Apec 2016 31st annual ieee applied power electronics conference and exposition, 2141–2146.

By: A. Morgan n, Y. Xu n, D. Hopkins n , I. Husain n & W. Yu n 

co-author countries: United States of America 🇺🇸
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

Design methodology for a planarized high power density EV/HEV traction drive using SiC power modules

2016 ieee energy conversion congress and exposition (ecce).

By: D. Rahman n, A. Morgans, Y. Xu n, R. Gao n, W. Yu n , D. Hopkins n , I. Husain n

co-author countries: United States of America 🇺🇸
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

Development of an ultra-high density power chip on bus (PCoB) module

2016 ieee energy conversion congress and exposition (ecce).

By: Y. Xu n, I. Husain n, H. West n, W. Yu n  & D. Hopkins n 

co-author countries: United States of America 🇺🇸
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

FEA-based thermal-mechanical optimization for DBC based power modules

2016 International Symposium on 3d Power Electronics Integration and Manufacturing (3d-PEIM).

By: Y. Xu & D. Hopkins 

Source: NC State University Libraries
Added: August 6, 2018

2014 conference paper

Misconception of thermal spreading angle and misapplication to IGBT power modules

2014 twenty-ninth annual ieee applied power electronics conference and exposition (apec), 545–551.

By: Y. Xu n & D. Hopkins n 

co-author countries: United States of America 🇺🇸
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

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