Zhiping Feng

Feng, Z., Lueck, M. R., Temple, D. S., & Steer, M. B. (2012). High-Performance Solenoidal RF Transformers on High-Resistivity Silicon Substrates for 3D Integrated Circuits. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 60(7), 2066–2072. https://doi.org/10.1109/tmtt.2012.2195026

Lam, P. G., Haridasan, V., Feng, Z., Steer, M. B., Kingon, A. I., & Maria, J.-P. (2012). Scaling Issues in Ferroelectric Barium Strontium Titanate Tunable Planar Capacitors. IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 59(2), 198–204. https://doi.org/10.1109/tuffc.2012.2179

Haridasan, V., Lam, P. G., Feng, Z., Fathelbab, W. M., Maria, J.-P., Kingon, A. I., & Steer, M. B. (2011). Tunable ferroelectric microwave bandpass filters optimised for system-level integration. IET MICROWAVES ANTENNAS & PROPAGATION, 5(10), 1234–1241. https://doi.org/10.1049/iet-map.2010.0461

Feng, Z., Fathelbab, W. M., Lam, P. G., Haridasan, V., Maria, J.-P., Kingon, A. I., & Steer, M. B. (2009). Narrowband Barium Strontium Titanate (BST) Tunable Bandpass Filters at X-band. 2009 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, VOLS 1-3, pp. 1061-+. https://doi.org/10.1109/mwsym.2009.5165883

Lam, P. G., Feng, Z., Haridasan, V., Kingon, A. I., Steer, M. B., & Maria, J.-P. (2009). The Impact of Metallization Thickness and Geometry for X-Band Tunable Microwave Filters. IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 56(5), 906–911. https://doi.org/10.1109/TUFFC.2009.1122

Chandrasekar, K., Wilson, J., Erickson, E., Feng, Z. P., Xu, J., Mick, S., & Franzon, P. (2008). Inductively coupled connectors and sockets for multi-Gb/s pulse signaling. IEEE Transactions on Advanced Packaging, 31(4), 749–758. https://doi.org/10.1109/tadvp.2008.2005465

Feng, Z. P., Fathelbab, W. M., Lam, P. G., Haridasan, V., Maria, J., Kingon, A. I., & Steer, M. B. A 6.2-7.5 GHz tunable bandpass filter with integrated barium strontium titanate (BST) interdigitated varactors utilizing silver/copper metallization. Rws: 2009 ieee radio and wireless symposium, 607–610.