Works (2)
Updated: April 11th, 2023 10:13
2013 conference paper
Face-to-face bus design with built-in self-test in 3D ICS
2013 ieee international 3d systems integration conference (3dic).
TL;DR:
A new teleport-register-file structure and corresponding clock gating and switching techniques to synchronize data across multiple clock domains are proposed and Simultaneous bi-directional transfer is supported and 50% reduction of flip-flops compared with conventional synchronizer design.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
TSV-based, modular and collision detectable face-to-back shared bus design
2013 ieee international 3d systems integration conference (3dic).
TL;DR:
A shared backbone bus solution specially tuned for modular 3DIC post-silicon-stacking that allows multiple parallel TSV-based channels to be placed and shared among various stacked components, which is uniquely supported by the dense connection pitch of the Face-to-back TSV bonding technology.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018