2013 conference paper

Face-to-face bus design with built-in self-test in 3D ICS

2013 ieee international 3d systems integration conference (3dic).

By: Z. Zhang n, B. Noia*, K. Chakrabarty* & P. Franzon n

TL;DR: A new teleport-register-file structure and corresponding clock gating and switching techniques to synchronize data across multiple clock domains are proposed and Simultaneous bi-directional transfer is supported and 50% reduction of flip-flops compared with conventional synchronizer design. (via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

TSV-based, modular and collision detectable face-to-back shared bus design

2013 ieee international 3d systems integration conference (3dic).

By: Z. Zhang n & P. Franzon n

TL;DR: A shared backbone bus solution specially tuned for modular 3DIC post-silicon-stacking that allows multiple parallel TSV-based channels to be placed and shared among various stacked components, which is uniquely supported by the dense connection pitch of the Face-to-back TSV bonding technology. (via Semantic Scholar)
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

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