Fabrication of 32×32 2 D CMUT Arrays on a Borosilicate Glass Substrate With Silicon- Through-Wafer Interconnects Using Non- Aligned and Aligned Anodic Bonding

Annayev, M., Biliroglu, A. O., Sennik, E., Yamaner, F. Y., & Oralkan, O. (2024, August 22). Fabrication of 32 x 32 2D CMUT Arrays on a Borosilicate Glass Substrate With Silicon-Through-Wafer Interconnects Using Non-Aligned and Aligned Anodic Bonding. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, Vol. 8.