2024 journal article
Investigation of High Current Fine Grain Power Delivery for 3-D Heterogeneous Integration
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 14(12), 2258–2270.
author keywords: Inductors; Capacitors; Substrates; Switches; Buck converters; Topology; Switching frequency; Glass; Three-dimensional printing; Micromechanical devices; 3-D heterogeneous integration (3-DHI) half-bridge power stage; interleaved buck converter; system-level packaging; thin glass substrate; ultralow parasitics
Source: Web Of Science
Added: January 13, 2025