Dennis Charles Defevere

Works (1)

Updated: January 5th, 2026 12:55

2025 article

Compound semiconductor direct wafer bonding by crystal heterogeneous integration

Markham, K., Melkun, J. F., Rabbani, M., Winkler, C. R., Little, B., DeFevere, D. C., … Kish, F. (2025, December 22). Applied Physics Letters.

By: K. Markham n, J. Melkun n, M. Rabbani n, C. Winkler n, B. Little n, D. DeFevere n, D. Vanderwater n, F. Kish n

topics (OpenAlex): 3D IC and TSV technologies; GaN-based semiconductor devices and materials; Silicon Carbide Semiconductor Technologies
Source: NC State University Libraries
Added: December 24, 2025

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