Mohammad Fozlay Rabbani

College of Engineering

Works (2)

Updated: January 5th, 2026 12:55

2025 article

Compound semiconductor direct wafer bonding by crystal heterogeneous integration

Markham, K., Melkun, J. F., Rabbani, M., Winkler, C. R., Little, B., DeFevere, D. C., … Kish, F. (2025, December 22). Applied Physics Letters.

By: K. Markham n, J. Melkun n, M. Rabbani n, C. Winkler n, B. Little n, D. DeFevere n, D. Vanderwater n, F. Kish n

topics (OpenAlex): 3D IC and TSV technologies; GaN-based semiconductor devices and materials; Silicon Carbide Semiconductor Technologies
Source: NC State University Libraries
Added: December 24, 2025

2025 article

Visible-spectrum (405–505 nm) low-temperature-deposited deuterated (D) SiNx-SiOy waveguides

Markham, K., Rabbani, M., Hsiao, F.-C., Wierer, J., & Kish, F. (2025, January 27). Applied Physics Letters, Vol. 126.

By: K. Markham n, M. Rabbani n, F. Hsiao n, J. Wierer n  & F. Kish n

topics (OpenAlex): Photonic and Optical Devices; Silicon Nanostructures and Photoluminescence; Semiconductor materials and devices
Sources: Web Of Science, ORCID
Added: January 27, 2025

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