College of Engineering
Displaying works 21 - 33 of 33 in total
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2000 conference paper
Deformation mechanisms in tin and tin-based electronic solder alloys
In T. Sakuma & K. Yagi (Eds.), Creep and fracture of engineering materials and structures: Proceedings of the ... International Conference held at the ..., 2000 (Vol. 171, pp. 655–662).
Ed(s): . T. Sakuma & K. Yagi