Energy Collaborative

Development of probabilistic emission inventory of air toxics for jacksonville, Florida

Proceedings of the Air and Waste Management Association's Annual Meeting and Exhibition, 3101–3114. http://www.scopus.com/inward/record.url?eid=2-s2.0-18944389363&partnerID=MN8TOARS

Power Packaging Techniques and High Current Applications

19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA.

Comparison of microkinetics and Langmuir-Hinshelwood models of the partial oxidation of methane to synthesis gas

In Studies in Surface Science and Catalysis (Vol. 147, pp. 235–240). http://www.scopus.com/inward/record.url?eid=2-s2.0-9444252816&partnerID=MN8TOARS

Deformation of Solder Joints Under Current Stressing: Experimental Measurement and Numerical Simulation

Presented at the 21st International Congress of Theoretical and Applied Mechanics, Warsaw, Poland.

Diffusion limitation in fast transient experiments

Chemical Engineering Science, 59(22-23), 5615–5622.

Characterization of single-wall carbon nanotubes by N2 adsorption

Carbon, 42(12-13), 2375–2383.

Damage mechanics of microelectronics solder joints under high current densities

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). Presented at the 2004 54th Electronic Components and Technology Conference, Las Vegas, NV.

Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

International Journal of Solids and Structures, 41(9-10), 2743–2755.

Deformation of solder joint under current stressing and numerical simulation––II

International Journal of Solids and Structures, 41(18-19), 4959–4973.

Deformation of solder joint under current stressing and numerical simulation––I

International Journal of Solids and Structures, 41(18-19), 4939–4958.

Mechanical Implications of High Current Densities in Flip-chip Solder Joints

International Journal of Damage Mechanics, 13(4), 335–345.

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

Journal of Electronic Packaging, 127(2), 157–163.

To What Extent can Climate Information Contribute to Solving Problems

Clivar Exchanges, 9(2), 5–8.

Utility of Climate Information Based Streamflow Forecasts towards Annual Water Allocation in Jaguaribe-Metropolitan Hydro (JMH) System, Ceara, NE Brazil

Arumugam, S. (2004, March). Presented at the International Research Institute for Climate and Society, Columbia University, New York.

Improved Water Allocation using Climate Information Based Streamflow Forecasts: An Assessment from System Perspective

Arumugam, S. (2004, March). Presented at the Penn State University, State College, PA.

Improved Water Allocation using Climate Information Based Streamflow Forecasts: An Assessment from System Perspective

Arumugam, S. (2004, April). Presented at the University of Arizona, Tucson, AZ.

Better Management through Better Decisions – Use of Climate Forecasts

Arumugam, S. (2004, October). Presented at the Lamont-Doherty Earth Observatory Open House, Palisades, NY.

Multimodel Probabilistic Hydroclimatic Ensemble Forecasts

Arumugam, S., Lall, U., & Robertson, A. W. (2004, May 17). Presented at the American Geophysical Union Spring Meeting, Montreal, Quebec.

Operational Streamflow Forecasts Development Using GCM Predicted Precipitation Fields

Arumugam, S., & Lall, U. (2004, December 12). Presented at the American Geophysical Union Fall Meeting, San Francisco, CA.

Is Commissioning Once Enough?

Energy Engineering, 101(4), 7–19.