Energy Collaborative

Power Packaging Techniques for Low and Higher Voltage Systems

17th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 17th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Dallas, Tx.

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

52nd Electronic Components and Technology Conference 2002 (Cat No 02CH37345) ECTC-02. Presented at the Proceedings of 52nd Electronic Components and Technology Conference.

Experimental Study on Reliability of Solder Joints under Electrical Stressing -Nano-indentation, Atomic Flux Measurement

SPIE proceedings series, 4828, 231–236. SPIE: Bellingham, Washington.

Measurement and Effects of High Electrical Current Stress in Solder Joints

Proceedings of the 35th International Symposium on Microelectronics, 427–432.

Synthesis of a new class of converters that utilize energy recirculation

Proceedings of 1994 Power Electronics Specialist Conference - PESC'94. Presented at the 1994 Power Electronics Specialist Conference - PESC'94, Taipei, Taiwan.

Packaging issues for next generation high voltage, high temperature power electronic modules

Proceedings of APEC 97 - Applied Power Electronics Conference. Presented at the APEC 97 - Applied Power Electronics Conference, Atlanta, GA.

A framework for developing power electronics packaging

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

Power packaging of a 12 kV, 240°C passive electronic module

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

A high speed pulser thyristor

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

Optimally selecting packaging technologies and circuit partitions based on cost and performance

APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058). Presented at the APEC 2000 - Applied Power Electronics Conference, New Orleans, LA.

Characterization of advanced materials for high voltage/high temperature power electronics packaging

APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181). Presented at the 16th Annual Applied Power Electronics Conference - APEC 2001, Anaheim, CA.

Mechanical Implications of High Current Densities in Flip Chip Solder Joints

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2002 International Mechanical Engineering Congress and Exposition.

Hydroclimatology of the United States

Arumugam, S. (2002, May). Presented at the International Research Institute for Climate and Society, Columbia University, New York.

From Interannual Streamflow Forecasts to New Water Management Strategies for Ceara, North East Brazil

Lall, U., Sharma, A., Arumugam, S., & Filho, F. S. (2002, December 12). Presented at the American Geophysical Union Fall Meeting, San Francisco, CA.

Annual hydroclimatology of the United States

Water Resources Research, 38(6).

Comment on the paper: “Basin hydrologic response relations to distributed physiographic descriptors and climate” by Karen Plaut Berger, Dara Entekhabi, 2001. Journal of Hydrology 247, 169–182

Journal of Hydrology, 263(1-4), 257–261.

Design and implementation of a series voltage sag compensator under practical utility conditions

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, 2, 1061–1067. http://www.scopus.com/inward/record.url?eid=2-s2.0-0036078253&partnerID=MN8TOARS

Laser micropyrolysis GC–MS of lignin

Journal of Analytical and Applied Pyrolysis, 62(2), 365–373.

Preliminary assessment of swine waste bioremediation using greenhouse tomatoes

XXVIth International Horticultural Congress & Exhibition (IHC 2002) : horticulture : art & science for life : Metro Toronto Convention Centre, August 11-17, 2002.

Expression of endoglucanase E1 in transgenic duckweed Lemna minor

Biotechnology for fuels and chemicals : proceedings of the Twenty-Fourth Symposium on Biotechnology for Fuels and Chemicals, held April 28-May 1, 2002, in Gatlinburg, TN.